EP1518447A1 - Printed board for electronic devices controlling a motor vehicle - Google Patents

Printed board for electronic devices controlling a motor vehicle

Info

Publication number
EP1518447A1
EP1518447A1 EP03735624A EP03735624A EP1518447A1 EP 1518447 A1 EP1518447 A1 EP 1518447A1 EP 03735624 A EP03735624 A EP 03735624A EP 03735624 A EP03735624 A EP 03735624A EP 1518447 A1 EP1518447 A1 EP 1518447A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
melting
conductor tracks
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03735624A
Other languages
German (de)
French (fr)
Inventor
Andreas Heise
Jochen Beuss
Roberto Schlenker
Phillip Herbst
Markus Becker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Continental Teves AG and Co OHG
Original Assignee
Conti Temic Microelectronic GmbH
Continental Teves AG and Co OHG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH, Continental Teves AG and Co OHG filed Critical Conti Temic Microelectronic GmbH
Publication of EP1518447A1 publication Critical patent/EP1518447A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/04—Bases; Housings; Mountings
    • H01H2037/046—Bases; Housings; Mountings being soldered on the printed circuit to be protected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/0241—Structural association of a fuse and another component or apparatus
    • H01H2085/0275—Structural association with a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H85/463—Circuit arrangements not adapted to a particular application of the protective device with printed circuit fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing

Definitions

  • the invention relates to a printed circuit board with conductor tracks for electronic circuits and connections for a voltage supply, which is equipped with at least one SMD component and further electronic and / or electromechanical components using a suitable solder, the voltage supply being connected to one or more supply conductor tracks. It also relates to a method for producing such a printed circuit board.
  • circuit boards can be provided in particular for use in electronic control units, for example in vehicle dynamics controllers or ABS controllers. If there were component or manufacturing-related errors in the circuits applied to such circuit boards, the permissible circuit board temperature could be exceeded locally. This in turn could result in errors in further circuit components or even additional heating of circuit components due to increased power loss, which could result in the failure of individual circuit components or even entire assemblies.
  • the invention is therefore based on the object of specifying a printed circuit board of the type mentioned above, in which undesired further heating is reliably avoided even when component- or component-related errors occur. Furthermore, a method for producing such a printed circuit board is to be specified.
  • this object is achieved according to the invention in that at least one of the supply conductor tracks has an interruption which is conductively bridged with a melting bridge, the melting bridge containing or consisting of a base material which ches has a melting point which is lower than the melting point of the material from which the conductor tracks are made.
  • the invention is based on the consideration that the causes of possible overheating should be combated in a targeted manner in order to provide an assembly which is particularly protected against component errors.
  • Local overheating can occur, for example, if an electronic component causes excessive local heat development due to a defect. In some cases, this local heat development can lead to a soldering of the component. If such a component short-circuits live, in particular wide, conductor track areas on the printed circuit board, the heat development due to the high flowing current can lead to greater component damage. In order to prevent this effectively, the circuit board should be protected against the effects of heat from any source.
  • the circuit board is provided with special elements which, in contrast to fuses, do not reliably prevent further current supply to the circuit board and thus the potential occurrence of additional heat sources, not as a result of locally occurring current densities, but rather as a result of locally occurring temperature increases.
  • the circuit board in the area of the supply conductor tracks is provided with bridged interruptions in the manner of predetermined breaking points, the bridging in the manner of a thermal reaction to the heat released in a fire is designed for targeted melting in the event of a fire.
  • the melting point of the base mat forming the bridge is selected as suitable.
  • the circuit carriers can be simple printed circuit boards or those with multiple wiring levels, such as two, four, or multiple layers.
  • a melting bridge When assembling the printed circuit board with so-called “surface mounted devices” (also known as SMD components) (eg solder paste printing with subsequent assembly of the SMD components and subsequent soldering), such a melting bridge can be inserted in a deliberately attached interruption in the supply conductor track his.
  • the melting bridge can preferably be arranged in the vicinity of the supply voltage connection (eg connecting plug).
  • the melting bridge is preferably a solid piece of a high-melting material, in particular a suitable solder, or a suitably designed area of solder material, the solder having approximately the same melting point as the solder used or, in the latter case, in particular consisting of the same material as the solder ,
  • the melting bridges are advantageously designed to be mountable using conventional soldering methods.
  • the material of the melting bridge preferably has a melting point which is higher than that of the solder used to fasten the components.
  • the melting bridge is advantageously not melted during the soldering process. In this way, the fusible link can also be fastened at corresponding points in the area of the interruption of the conductor track by the solder during the conventional soldering process.
  • the respective melting bridge advantageously consists entirely of a metallic material, preferably tin or one Tin alloy.
  • the respective melting bridge is conductively connected to the material of the conductor track in a further or alternative advantageous embodiment by the solder used in a soldering process.
  • the melting bridge is advantageously designed in such a way that it can be used in an automated assembly process.
  • the melting bridge is advantageously shaped in such a way that it can be taped or magazine-fed to a conventional automatic pick and place machine like SMD components known per se.
  • a particularly simple construction of the melting bridge can be achieved by advantageously producing it by cutting it off from a wire or sheet metal strip.
  • Particularly favorable electrical conductivity properties of the melting bridge and in particular a particularly favorable solderability using conventional solder materials can be achieved by advantageously coating the base material for producing the melting bridge with a coating, in particular made of tin, a tin alloy, gold or passivated copper.
  • the above-mentioned object is achieved in that the melt bridges are produced immediately before the printed circuit board is equipped, preferably by cutting off a wire or sheet metal strip. This is a particularly simple way to provide the needs-based and situation-adapted required melt bridges ensured immediately when assembling the circuit board.
  • the advantages achieved with the invention consist in particular in that the overheating of the printed circuit board is effectively prevented by the melting bridges.
  • a suitably designed layout of the printed circuit board also ensures that the heat always spreads towards the melting bridge. If the heat reaches the area of the melting bridge, the melting point of the bridge material is usually exceeded and the power supply is effectively interrupted. The resulting interruption in the flow of electricity causes the heating to stop.
  • the circuit board is therefore equipped with a thermal fuse that, unlike conventional power fuses, also withstands increased current intensities or densities over certain periods of time, and which interrupts the current flow in response to temperatures of more than a predetermined limit temperature.
  • Fig. 1 is a circuit board with a number of conductor tracks
  • Fig. 2 shows an alternative embodiment of a circuit board.
  • the circuit board 1 shown schematically in FIG. 1 is intended in particular for use in electronic control devices, such as in vehicle dynamics controllers, ABS controllers or other vehicle control devices.
  • the printed circuit board 1 is equipped with a number of SMD components (not shown in more detail) and further electronic and / or electromechanical components, which are produced using a suitable solder mounted on the circuit board 1 and electrically connected to each other via a variety of conductor tracks, not shown.
  • the printed circuit board 1 can be designed as a simple printed circuit board or also as a printed circuit board with a plurality of wiring levels, such as, for example, as a two, four or multiple layers.
  • the printed circuit board 1 also has a number of supply conductor tracks 2, which are particularly suitable for connecting an external voltage supply.
  • the supply conductor tracks 2 are selected in a suitable manner, in particular with regard to their material and their dimensions.
  • the circuit board 1 is designed for a particularly high level of operational safety even when component-related errors occur. For this purpose, the targeted suppression of the spread of locally entered heat on the surface of the printed circuit board 1 is provided.
  • the supply conductor tracks 2 are provided with interruptions or gaps, each of which is bridged by an associated melting bridge 6.
  • the fusible links 6, which, as shown in the exemplary embodiment, can be cylindrical or cuboid, are formed from electrically conductive material, in particular metal, the melting point of their base material being chosen to be lower than the melting point of the material forming the supply conductor tracks 2. Due to the heat development in the case of a locally damaged component, the respective melting bridge 6 melts before further damage to the supply conductor tracks 2 or other conductor tracks, so that the electrical contact is interrupted across the respective interruption or gap. This means that the current or voltage supply is automatically interrupted in the vicinity of a component, so that no further heating requirements can arise due to the supplied electrical energy.
  • An example of a voltage or power supply interrupted in this way is shown for the middle of the supply conductor tracks 2 shown, in which 8 melting beads 10 from the remnants of the originally existing melting bridge are shown on both sides of the gap that has arisen.
  • the melting bridges 6 are also designed in such a way that the melting point of their base material is higher than the melting point of the solder used to populate the printed circuit board 1. This ensures that it is also possible to attach the melting bridges 6 to the printed circuit board 1 using conventional mounting methods and using conventional soldering processes.
  • the fusible links 6 are connected to the material of the respectively assigned supply conductor track 2 by the solder used in the soldering process.
  • the melting bridges 6 can be produced in particular by cutting off a wire or sheet metal strip.
  • the base material of the respective melting bridges 6 is coated with a coating that requires solderability, in particular made of tin, a tin alloy, gold or made of passivated copper, plated.
  • the printed circuit board 1 ⁇ shown there is provided with a number of recesses 12, of which in Fig. 2 only one is shown.
  • the recesses 12 separate adjacent supply conductor tracks 2 from one another. other, so that due to the reduced thermal conductivity in the direction between the supply conductor tracks 2, an overlap of the local fire is at least made more difficult.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Fuses (AREA)

Abstract

Disclosed is a printed board (1, 1') comprising strip conductors for electronic circuits, connections for a voltage supply unit, and at least one SMD component as well as additional electronic and/or electromechanical parts that are soldered in a suitable manner, said voltage supply unit being connected to one or several supplying strip conductors (2). The aim of the invention is to protect said printed board (1, 1') to a special degree from heat generation by using simple means. Said aim is achieved by providing at least one of the supplying strip conductors (2) with a break that is bridged in a conductive manner by means of a fuse bridge (6) containing or made of a basic material, the melting point of which is lower than the melting point of the material of which the strip conductors are made.

Description

Leiterplatte für elektronische Kraftfahrzeugs euergeratePrinted circuit board for electronic motor vehicles
Die Erfindung betrifft eine Leiterplatte mit Leiterbahnen für elektronische Schaltungen und Anschlüssen für eine Spannungsversorgung, welche mit mindestens einem SMD-Bauelement und weiteren elektronischen und/oder elektromechanischen Bauteilen unter Verwendung eines geeigneten Lots bestückt ist, wobei die Spannungsversorgung mit einer oder mehreren Versorgungsleiterbahnen verbunden ist. Sie bezieht sich weiter auf ein Verfahren zur Herstellung einer derartigen Leiterplatte .The invention relates to a printed circuit board with conductor tracks for electronic circuits and connections for a voltage supply, which is equipped with at least one SMD component and further electronic and / or electromechanical components using a suitable solder, the voltage supply being connected to one or more supply conductor tracks. It also relates to a method for producing such a printed circuit board.
Derartige Leiterplatten können insbesondere für einen Einsatz in elektronischen Steuergeraten, beispielsweise in Fahrdynamikreglern oder ABS-Reglern, vorgesehen sein. Falls in den auf derartigen Leiterplatten aufgebrachten Schaltungen bauteil- oder herstellungsbedingte Fehler vorhanden sein sollten, konnte es zu einer lokalen Überschreitung der zulassigen Leiterplattentemperatur kommen. Dadurch konnten wiederum Fehler in weiteren Schaltungskomponenten oder auch eine noch zusätzliche Erwärmung von Schaltungskomponenten durch erhöhte Verlustleistung resultieren, die den Ausfall einzelner Schaltungskomponenten oder sogar ganzer Baugruppen zur Folge haben konnten.Such circuit boards can be provided in particular for use in electronic control units, for example in vehicle dynamics controllers or ABS controllers. If there were component or manufacturing-related errors in the circuits applied to such circuit boards, the permissible circuit board temperature could be exceeded locally. This in turn could result in errors in further circuit components or even additional heating of circuit components due to increased power loss, which could result in the failure of individual circuit components or even entire assemblies.
Der Erfindung liegt daher die Aufgabe zugrunde, eine Leiterplatte der oben genannten Art anzugeben, bei der selbst beim Auftreten bauteil- oder komponentenbedingter Fehler eine ungewollte weitere Erwärmung zuverlässig vermieden ist. Des Weiteren soll ein Verfahren zur Herstellung einer derartigen Leiterplatte angegeben werden.The invention is therefore based on the object of specifying a printed circuit board of the type mentioned above, in which undesired further heating is reliably avoided even when component- or component-related errors occur. Furthermore, a method for producing such a printed circuit board is to be specified.
Bezüglich der Leiterplatte wird diese Aufgabe erfindungsgemaß dadurch gelost, dass mindestens eine der Versorgungsleiterbahnen eine Unterbrechung aufweist, welche mit einer Schmelzbrucke leitend überbrückt ist, wobei die Schmelzbrucke ein Basismaterial enthalt oder aus diesem besteht, wel- ches einen Schmelzpunkt aufweist, welcher niedriger ist als der Schmelzpunkt des Materials, aus dem die Leiterbahnen bestehen .With regard to the printed circuit board, this object is achieved according to the invention in that at least one of the supply conductor tracks has an interruption which is conductively bridged with a melting bridge, the melting bridge containing or consisting of a base material which ches has a melting point which is lower than the melting point of the material from which the conductor tracks are made.
Die Erfindung geht dabei von der Überlegung aus, dass zur Bereitstellung einer in besonderem Maße gegen Bauteilfehler abgesicherten Baugruppe Ursachen einer möglichen Überhitzung gezielt bekämpft werden sollten. Eine lokale Uberhitzung kann beispielsweise dann auftreten, wenn ein elektronisches Bauteil aufgrund eines Defekts für eine übermäßige lokale Wärmeentwicklung sorgt. Diese lokale Wärmeentwicklung kann in einigen Fallen zu einem Losloten des Bauteils fuhren. Schließt ein solches Bauteil auf der Leiterplatte spannungsführende, insbesondere breite Leiterbahnbereiche kurz, so kann die Wärmeentwicklung aufgrund des hohen fließenden Stroms durchaus zu größeren Bauteilschaden fuhren. Um dies wirkungsvoll zu unterbinden, sollte die Leiterplatte gegen aus beliebigen Quellen einwirkenden Warmeemtragen abgesichert sein. Dazu ist die Leiterplatte mit Spezialelementen versehen, die im Gegensatz zu Schmelzsicherungen nicht infolge lokal auftretender Stromdichten, sondern vielmehr infolge von lokal auftretenden Temperaturerhöhungen eine weitere Stromzufuhr in die Leiterplatte und damit das potenzielle Auftreten zusätzlicher Wärmequellen zuverlässig unterbinden .The invention is based on the consideration that the causes of possible overheating should be combated in a targeted manner in order to provide an assembly which is particularly protected against component errors. Local overheating can occur, for example, if an electronic component causes excessive local heat development due to a defect. In some cases, this local heat development can lead to a soldering of the component. If such a component short-circuits live, in particular wide, conductor track areas on the printed circuit board, the heat development due to the high flowing current can lead to greater component damage. In order to prevent this effectively, the circuit board should be protected against the effects of heat from any source. For this purpose, the circuit board is provided with special elements which, in contrast to fuses, do not reliably prevent further current supply to the circuit board and thus the potential occurrence of additional heat sources, not as a result of locally occurring current densities, but rather as a result of locally occurring temperature increases.
Um eine derartige bedarfsgerechte Unterbrechung der Spannungsversorgung in der Art eines passiven, selbsttätigen Systems ohne aktive äußere Einflussnahme sicherzustellen, ist die Leiterplatte im Bereich der Versorgungsleiterbahnen in der Art von Sollbruchstellen mit überbrückten Unterbrechungen versehen, wobei die Uberbruckungen in der Art einer thermischen Reaktion auf die bei einem Brand freigesetzte Warme für ein gezieltes Abschmelzen im Brandfall ausgelegt sind. Im Hinblick darauf ist der Schmelzpunkt des die Sch elzbrucken bildenden Basismatenals geeignet gewählt. Die Schaltungstrager können einfache Leiterplatten oder solche mit mehrere Verdrahtungsebenen sein, wie Zwei-, Vier-, oder Mehrfachlayer .In order to ensure such a need-based interruption of the voltage supply in the manner of a passive, automatic system without active external influence, the circuit board in the area of the supply conductor tracks is provided with bridged interruptions in the manner of predetermined breaking points, the bridging in the manner of a thermal reaction to the heat released in a fire is designed for targeted melting in the event of a fire. In view of this, the melting point of the base mat forming the bridge is selected as suitable. The circuit carriers can be simple printed circuit boards or those with multiple wiring levels, such as two, four, or multiple layers.
Bei der Bestückung der Leiterplatte mit auch als SMD-Bautei- len bezeichneten so genannten "Surface Mounted Devices" (z. B. Lotpastendruck mit nachfolgender Bestückung der SMD- Bauteile sowie nachfolgendem Loten) kann in einer bewusst angebrachten Unterbrechung der Versorgungsleiterbahn eine derartige Schmelzbrucke eingefugt sein. Die Schmelzbrucke kann bevorzugt in der Nahe des Versorgungsspannungsanschlus- ses (z. B. Anschlussstecker) angeordnet sein. Die Schmelzbrucke ist vorzugsweise ein festes Stuck eines hoherschmel- zenden Materials, insbesondere ein geeignetes Lötzinn, oder ein geeignet ausgeführter Lotmaterialbereich, wobei das Lot in etwa den gleichen Schmelzpunkt wie das eingesetzte Lot hat oder im letzten Fall insbesondere aus dem gleichen Material wie das Lot besteht.When assembling the printed circuit board with so-called “surface mounted devices” (also known as SMD components) (eg solder paste printing with subsequent assembly of the SMD components and subsequent soldering), such a melting bridge can be inserted in a deliberately attached interruption in the supply conductor track his. The melting bridge can preferably be arranged in the vicinity of the supply voltage connection (eg connecting plug). The melting bridge is preferably a solid piece of a high-melting material, in particular a suitable solder, or a suitably designed area of solder material, the solder having approximately the same melting point as the solder used or, in the latter case, in particular consisting of the same material as the solder ,
Für einen besonders geringen Herstellungsaufwand der Leiterplatte sind die Schmelzbrucken vorteilhafterweise für eine Montierbarkeit unter Ruckgriff auf übliche Lotverfahren ausgeführt. Dazu weist das Material der Schmelzbrucke bevorzugt einen Schmelzpunkt auf, welcher hoher ist als der des zur Befestigung der Bauelemente verwendeten Lots. Hierdurch wird vorteilhafterweise wahrend des Lotprozesses die Schmelzbrucke nicht aufgeschmolzen. Die Schmelzbrucke kann auf diese Weise an entsprechenden Stellen im Bereich der Unterbrechung der Leiterbahn ebenfalls durch das Lot wahrend des herkömmlichen Lotprozesses befestigt werden.For a particularly low manufacturing cost of the printed circuit board, the melting bridges are advantageously designed to be mountable using conventional soldering methods. For this purpose, the material of the melting bridge preferably has a melting point which is higher than that of the solder used to fasten the components. As a result, the melting bridge is advantageously not melted during the soldering process. In this way, the fusible link can also be fastened at corresponding points in the area of the interruption of the conductor track by the solder during the conventional soldering process.
Zur Sicherstellung einer ausreichend hohen Leitfähigkeit der Schmelzbrucken im Normal-Betπebszustand besteht die jeweilige Schmelzbrucke vorteilhafterweise vollständig aus einem metallischen Material, vorzugsweise aus Zinn oder einer Zinnlegierung . Um weiterhin einen zur Übertragung der Versorgungsspannung ausreichend hochwertigen elektrischen Kontakt zu den Leiterbahnen sicher zu stellen, ist die jeweilige Schmelzbrucke in weiterer oder alternativer vorteilhafter Ausgestaltung durch das in einem Lotprozess verwendete Lot mit Material der Leiterbahn leitend verbunden.In order to ensure a sufficiently high conductivity of the melting bridges in the normal operating state, the respective melting bridge advantageously consists entirely of a metallic material, preferably tin or one Tin alloy. In order to further ensure high-quality electrical contact to the conductor tracks for the transmission of the supply voltage, the respective melting bridge is conductively connected to the material of the conductor track in a further or alternative advantageous embodiment by the solder used in a soldering process.
Um für einen besonders geringen Herstellungsaufwand bei der Produktion der Leiterplatten auf herkömmliche und kostengünstige Bestuckungskonzepte zurückgreifen zu können, ist die Schmelzbrucke vorteilhafterweise derart gestaltet, dass sie in einem automatisierten Bestuckungsprozess einsetzbar ist. Dazu ist die Schmelzbrucke vorteilhafterweise derart geformt, dass sie wie an sich bekannte SMD-Bauteile gegurtet oder magaziniert einem herkömmlichen Bestuckungsautomat zugeführt werden kann.In order to be able to fall back on conventional and inexpensive assembly concepts for a particularly low manufacturing expenditure in the production of the printed circuit boards, the melting bridge is advantageously designed in such a way that it can be used in an automated assembly process. For this purpose, the melting bridge is advantageously shaped in such a way that it can be taped or magazine-fed to a conventional automatic pick and place machine like SMD components known per se.
Eine besonders einfache Bauweise der Schmelzbrucke ist erreichbar, indem diese vorteilhafterweise durch Abtrennen von einem Draht oder Blechstreifen hergestellt ist.A particularly simple construction of the melting bridge can be achieved by advantageously producing it by cutting it off from a wire or sheet metal strip.
Besonders gunstige elektrische Leiteigenschaften der Schmelzbrucke und insbesondere eine besonders gunstige Lot- barkeit unter Verwendung üblicher Lotmaterialien sind erreichbar, indem das Basismaterial zur Herstellung der Schmelzbrucke vorteilhafterweise mit einer Beschichtung, insbesondere aus Zinn, einer Zinnlegierung, Gold oder aus passiviertem Kupfer, überzogen ist.Particularly favorable electrical conductivity properties of the melting bridge and in particular a particularly favorable solderability using conventional solder materials can be achieved by advantageously coating the base material for producing the melting bridge with a coating, in particular made of tin, a tin alloy, gold or passivated copper.
Bezuglich des Verfahrens zur Herstellung der Leiterplatte wird die genannte Aufgabe gelost, indem die Schmelzbrucken unmittelbar vor der Bestückung der Leiterplatte, vorzugsweise durch Abtrennen von einem Draht oder Blechstreifen, hergestellt werden. Damit ist auf besonders einfache Weise die bedarfsgerechte und situationsangepasste Bereitstellung der erforderlichen Schmelzbrucken unmittelbar bei der Bestückung der Leiterplatte sichergestellt.With regard to the method for producing the printed circuit board, the above-mentioned object is achieved in that the melt bridges are produced immediately before the printed circuit board is equipped, preferably by cutting off a wire or sheet metal strip. This is a particularly simple way to provide the needs-based and situation-adapted required melt bridges ensured immediately when assembling the circuit board.
Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, dass durch die Schmelzbrucken wirkungsvoll die Uberhitzung der Leiterplatte verhindert ist. Durch ein geeignet ausgeführtes Layout der Leiterplatte ist zudem erreichbar, dass die Warme sich immer in Richtung auf die Schmelzbrucke zu ausbreitet. Erreicht die Warme den Bereich der Schmelzbrucke, wird m der Regel der Schmelzpunkt des Bruckenmaterials überschritten und die Stromversorgung somit wirkungsvoll unterbrochen. Durch die entstehende Unterbrechung des Stromflusses kommt es zu einem Stillstand der Erwärmung. Die Leiterplatte ist somit mit einer thermischen Sicherung ausgestattet, die anders als herkömmliche Stromsicherungen über gewisse Zeitspannen hinweg auch erhöhten Stromstarken oder -dichten standhalt, und die in Reaktion auf Temperaturen von mehr als einer vorgegebenen Grenztemperatur den Stromfluss unterbricht.The advantages achieved with the invention consist in particular in that the overheating of the printed circuit board is effectively prevented by the melting bridges. A suitably designed layout of the printed circuit board also ensures that the heat always spreads towards the melting bridge. If the heat reaches the area of the melting bridge, the melting point of the bridge material is usually exceeded and the power supply is effectively interrupted. The resulting interruption in the flow of electricity causes the heating to stop. The circuit board is therefore equipped with a thermal fuse that, unlike conventional power fuses, also withstands increased current intensities or densities over certain periods of time, and which interrupts the current flow in response to temperatures of more than a predetermined limit temperature.
Ein Ausfuhrungsbeispiel der Erfindung wird anhand einer Zeichnung naher erläutert. Darin zeigen:An exemplary embodiment of the invention is explained in more detail with reference to a drawing. In it show:
Fig. 1 eine Leiterplatte mit einer Anzahl von Leiterbahnen, undFig. 1 is a circuit board with a number of conductor tracks, and
Fig. 2 eine alternative Ausfuhrungsform einer Leiterplatte.Fig. 2 shows an alternative embodiment of a circuit board.
Die in Fig. 1 schematisch dargestellte Leiterplatte 1 ist insbesondere zum Einsatz in elektronischen Steuergeraten, wie beispielsweise in Fahrdynamikreglern, ABS-Reglern oder anderen Fahrzeugsteuergeraten, vorgesehen. Dazu ist die Leiterplatte 1 mit einer Anzahl nicht naher dargestellter SMD- Bauelemente und weiteren elektronischen und/oder elektromechanischen Bauteilen bestuckt, die unter Verwendung eines geeigneten Lots auf der Leiterplatte 1 montiert und über eine Vielzahl nicht naher dargestellter Leiterbahnen elektrisch geeignet miteinander verbunden sind. Die Leiterplatte 1 kann dabei als einfache Leiterplatte oder auch als Leiterplatte mit mehreren Verdrahtungsebenen, wie beispielsweise als Zwei-, Vier- oder Mehrfachlayer, ausgestaltet sein. Zur Bespeisung der aktiven Komponenten mit Spannung und/oder Strom weist die Leiterplatte 1 zudem eine Anzahl von Versorgungsleiterbahnen 2 auf, die insbesondere zum Anschluss einer externen Spannungsversorgung geeignet ausgestaltet sind. Im Hinblick auf diesen Einsatzzweck sind die Versorgungsleiterbahnen 2 insbesondere hinsichtlich ihres Materials und ihrer Dimensionierung geeignet gewählt.The circuit board 1 shown schematically in FIG. 1 is intended in particular for use in electronic control devices, such as in vehicle dynamics controllers, ABS controllers or other vehicle control devices. For this purpose, the printed circuit board 1 is equipped with a number of SMD components (not shown in more detail) and further electronic and / or electromechanical components, which are produced using a suitable solder mounted on the circuit board 1 and electrically connected to each other via a variety of conductor tracks, not shown. The printed circuit board 1 can be designed as a simple printed circuit board or also as a printed circuit board with a plurality of wiring levels, such as, for example, as a two, four or multiple layers. In order to supply the active components with voltage and / or current, the printed circuit board 1 also has a number of supply conductor tracks 2, which are particularly suitable for connecting an external voltage supply. With regard to this purpose, the supply conductor tracks 2 are selected in a suitable manner, in particular with regard to their material and their dimensions.
Die Leiterplatte 1 ist für eine besonders hohe betriebliche Sicherheit selbst beim Auftreten bauteilbedingter Fehler ausgestaltet. Dazu ist die gezielte Unterdrückung einer Ausbreitung lokal eingetragener Warme auf der Oberflache der Leiterplatte 1 vorgesehen.The circuit board 1 is designed for a particularly high level of operational safety even when component-related errors occur. For this purpose, the targeted suppression of the spread of locally entered heat on the surface of the printed circuit board 1 is provided.
Zu diesem Zweck sind die Versorgungsleiterbahnen 2 mit Unterbrechungen oder Lucken versehen, die jeweils durch eine zugeordnete Schmelzbrucke 6 überbrückt sind. Die Schmelzbrucken 6, die wie im Ausfuhrungsbeispiel gezeigt beispielsweise zylinder- oder quaderformig ausgestaltet sein können, sind dabei aus elektrisch leitfahigem Material, insbesondere Metall, gebildet, wobei der Schmelzpunkt ihres Basismateri- als niedriger gewählt ist als der Schmelzpunkt des die Versorgungsleiterbahnen 2 bildenden Materials. Durch die Wärmeentwicklung bei einem lokal beschädigten Bauteil erfolgt somit vor einer weiteren Beschädigung der Versorgungsleiterbahnen 2 oder anderer Leiterbahnen ein Durchschmelzen der jeweiligen Schmelzbrucke 6, so dass der elektrische Kontakt über die jeweilige Unterbrechung oder Lücke hinweg unterbrochen wird. Damit erfolgt selbsttätig in der Nahe eines Bauteils die Unterbrechung der Strom- oder Spannungsversorgung, so dass durch zugefuhrte elektrische Energie keine weitere Forderung der Erwärmung mehr eintreten kann. Ein Beispiel für eine derartig unterbrochene Spannungs- oder Stromversorgung ist für die mittlere der gezeigten Versorgungsleiterbahnen 2 dargestellt, bei der beidseitig der entstandenen Lücke 8 Schmelzperlen 10 aus den Resten der ursprunglich vorhandenen Schmelzbrucke dargestellt sind.For this purpose, the supply conductor tracks 2 are provided with interruptions or gaps, each of which is bridged by an associated melting bridge 6. The fusible links 6, which, as shown in the exemplary embodiment, can be cylindrical or cuboid, are formed from electrically conductive material, in particular metal, the melting point of their base material being chosen to be lower than the melting point of the material forming the supply conductor tracks 2. Due to the heat development in the case of a locally damaged component, the respective melting bridge 6 melts before further damage to the supply conductor tracks 2 or other conductor tracks, so that the electrical contact is interrupted across the respective interruption or gap. This means that the current or voltage supply is automatically interrupted in the vicinity of a component, so that no further heating requirements can arise due to the supplied electrical energy. An example of a voltage or power supply interrupted in this way is shown for the middle of the supply conductor tracks 2 shown, in which 8 melting beads 10 from the remnants of the originally existing melting bridge are shown on both sides of the gap that has arisen.
Die Schmelzbrucken 6 sind darüber hinaus derart ausgestaltet, dass der Schmelzpunkt ihres Basismaterials hoher ist als der Schmelzpunkt des zur Bestückung der Leiterplatte 1 verwendeten Lots. Damit ist gewährleistet, dass auch unter Verwendung herkömmlicher Bestuckungsverfahren und unter Verwendung herkömmlicher Lotprozesse die Anbringung der Schmelzbrucken 6 an der Leiterplatte 1 möglich ist. Die Schmelzbrucken 6 sind dabei durch das im Lotprozess verwendete Lot mit dem Material der jeweils zugeordneten Versorgungsleiterbahn 2 verbunden. Die Herstellung der Schmelzbrucken 6 kann dabei insbesondere durch Abtrennen von einem Draht oder Blechstreifen erfolgen.The melting bridges 6 are also designed in such a way that the melting point of their base material is higher than the melting point of the solder used to populate the printed circuit board 1. This ensures that it is also possible to attach the melting bridges 6 to the printed circuit board 1 using conventional mounting methods and using conventional soldering processes. The fusible links 6 are connected to the material of the respectively assigned supply conductor track 2 by the solder used in the soldering process. The melting bridges 6 can be produced in particular by cutting off a wire or sheet metal strip.
Um eine besonders gute Verarbeitbarkeit der Schmelzbrucken 6 gerade in Verbindung mit dem bei der Bestückung der Leiterplatte 1 verwendeten Lotprozess sicher zu stellen, ist das Basismaterial der jeweiligen Schmelzbrucke 6 mit einer die Lotbarkeit fordernden Beschichtung, insbesondere aus Zinn, einer Zinnlegierung, aus Gold oder aus passiviertem Kupfer, überzogen .In order to ensure particularly good processability of the melting bridges 6, especially in connection with the soldering process used in the assembly of the printed circuit board 1, the base material of the respective melting bridges 6 is coated with a coating that requires solderability, in particular made of tin, a tin alloy, gold or made of passivated copper, plated.
Um darüber hinaus aber auch ein Ubersprechen lokaler Warme von einer Versorgungsleiterbahn 2 auf eine benachbarte Ver- sorgungsleiterbahn 2 wirksam zu unterbinden, ist im Ausfuh- rungsbeispiel nach Fig. 2 die dort dargestellte Leiterplatte lλ mit einer Anzahl von Ausnehmungen 12 versehen, von denen in Fig. 2 lediglich eine gezeigt ist. Die Ausnehmungen 12 trennen dabei benachbarte Versorgungsleiterbahnen 2 vonein- ander, so dass aufgrund der in Richtung zwischen den Versorgungsleiterbahnen 2 verminderten Wärmeleitfähigkeit ein Übergreifen der lokalen Brande zumindest erschwert ist. Durch eine gezielte Anbringung derartiger Ausnehmungen 12 ist es im Übrigen möglich, die Warmeleitung und -ausbreitung im Grundkorper 4 der Leiterplatte 1 λ derart zu kanalisieren und auszurichten, dass auch bei der Entstehung eines Bau- teilfehlers in einem lateral entfernten Bereich der Leiterplatte 1 eine gezielte Warmeeinleitung in den Bereich der in Fig. 2 dargestellten Schmelzbrucke 6 erfolgt. Somit kann auch bei lateral entfernt entstehenden Branden durch die gezielte Warmeeinleitung ein frühzeitiger Ausfall der Schmelzbrucke 6 gewahrleistet werden, so dass selbst für entfernte Brande eine zuverlässige Unterbrechung der Strom- oder Spannungsversorgung in der Art eines passiven Systems gewährleistet ist. In order to also effectively prevent crosstalk of local heat from a supply conductor track 2 to an adjacent supply conductor track 2, in the exemplary embodiment according to FIG. 2 the printed circuit board 1 λ shown there is provided with a number of recesses 12, of which in Fig. 2 only one is shown. The recesses 12 separate adjacent supply conductor tracks 2 from one another. other, so that due to the reduced thermal conductivity in the direction between the supply conductor tracks 2, an overlap of the local fire is at least made more difficult. By making such recesses 12 in a targeted manner, it is also possible to channel and align the heat conduction and propagation in the base body 4 of the circuit board 1 λ in such a way that even when a component defect occurs in a laterally distant region of the circuit board 1, a targeted one Heat is introduced into the area of the melting bridge 6 shown in FIG. 2. Thus, in the event of fires occurring laterally at a distance, the targeted introduction of heat can ensure that the melting bridge 6 fails prematurely, so that even for distant fires a reliable interruption of the current or voltage supply is ensured in the manner of a passive system.
Bezugs zeichenlisteReference character list
1, ι λ Leiterplatte1, ι λ printed circuit board
2 Versorgungsleiterbahnen2 supply tracks
4 Grundkorper4 basic bodies
6 Schmelzbrucke6 melting bridges
8 Lücke8 gap
10 Schmelzperlen10 beads
12 Ausnehmung 12 recess

Claims

Patentansprüche claims
1. Leiterplatte (1, lλ) mit Leiterbahnen für elektronische Schaltungen und mit Anschlüssen für eine Spannungsversorgung, welche mit mindestens einem SMD-Bauelement und weiteren elektronischen und/oder elektromechanischen Bauteilen unter Verwendung eines geeigneten Lots bestückt ist, wobei die Spannungsversorgung mit einer oder mehreren Versorgungsleiterbahnen (2) verbunden ist, dadurch gekennzeichnet, dass mindestens eine der Versorgungsleiterbahnen (2) eine Unterbrechung aufweist, welche mit einer Schmelzbrücke (6) leitend überbrückt ist, wobei die Schmelzbrücke (6) ein Basismaterial enthält oder aus diesem besteht, welches einen Schmelzpunkt aufweist, welcher niedriger ist als der Schmelzpunkt des Materials, aus dem die Leiterbahnen bestehen.1. Printed circuit board (1, l λ ) with conductor tracks for electronic circuits and with connections for a voltage supply, which is equipped with at least one SMD component and further electronic and / or electromechanical components using a suitable solder, the voltage supply having one or is connected to a plurality of supply conductor tracks (2), characterized in that at least one of the supply conductor tracks (2) has an interruption which is conductively bridged by a fusible link (6), the fusible link (6) containing or consisting of a base material which is a Has melting point, which is lower than the melting point of the material from which the conductor tracks are made.
2. Leiterplatte (1, 1Λ) nach Anspruch 1, dadurch gekennzeichnet, dass der Schmelzpunkt des Basismaterials gleich hoch oder höher ist als der Schmelzpunkt des zur Bestückung der Leiterplatte (1) verwendeten Lots.2. Printed circuit board (1, 1 Λ ) according to claim 1, characterized in that the melting point of the base material is equal to or higher than the melting point of the solder used to populate the printed circuit board (1).
3. Leiterplatte (1, lx) nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Schmelzbrücke (6) vollständig aus einem metallischen Material besteht.3. Printed circuit board (1, l x ) according to claim 1 or 2, characterized in that the melting bridge (6) consists entirely of a metallic material.
4. Leiterplatte (1, 1*) nach Anspruch 3, dadurch gekennzeichnet, dass das metallische Material Zinn oder eine Zinnlegierung enthält oder ganz aus diesem besteht.4. Printed circuit board (1, 1 *) according to claim 3, characterized in that the metallic material contains tin or a tin alloy or consists entirely of this.
5. Leiterplatte (1, l ) nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass die Schmelzbrücke (6) durch das in einem Lotprozess verwendete Lot mit Material der Leiterbahn leitend verbunden ist.5. Printed circuit board (1, l) according to one of claims 1 to 4, characterized in that the fusible link (6) is conductively connected to the material of the conductor track by the solder used in a soldering process.
6. Leiterplatte (1, lλ) nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass die Schmelzbrucke (6) so geformt ist, dass sie wie ein an sich bekanntes SMD-Bau- teil gegurtet oder magaziniert einem herkömmlichen Be- stuckungsautomat zugeführt werden kann.6. Printed circuit board (1, l λ ) according to one of claims 1 to 5, characterized in that the fusible link (6) is shaped in such a way that it can be taped or magazined like a conventional SMD component or fed to a conventional automatic placement machine.
7. Leiterplatte (1, 1Λ) nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass die Schmelzbrucke (6) durch Abtrennen von einem Draht oder Blechstreifen hergestellt7. Printed circuit board (1, 1 Λ ) according to any one of claims 1 to 6, characterized in that the melting bridge (6) is produced by cutting off a wire or sheet metal strip
8. Leiterplatte (1, 1') nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass das Basismaterial zur Herstellung der Schmelzbrucke (6) mit einer Beschichtung, insbesondere aus Zinn oder einer Zmnlegierung oder aus Gold oder aus passiviertem Kupfer, überzogen ist.8. Printed circuit board (1, 1 ') according to one of claims 1 to 7, characterized in that the base material for the production of the melting bridge (6) is coated with a coating, in particular made of tin or a tin alloy or made of gold or passivated copper ,
9. Leiterplatte (lλ) nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass benachbarte Versorgungsleiterbahnen (2) durch Ausnehmungen (12) voneinander getrennt sind.9. Printed circuit board (l λ ) according to one of claims 1 to 8, characterized in that adjacent supply conductor tracks (2) are separated from one another by recesses (12).
10. Verfahren zur Herstellung einer Leiterplatte (1, 1 ) nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass die Schmelzbrucken (6) unmittelbar vor der Bestückung der Leiterplatte (1, lλ) insbesondere durch Abtrennen von einem Draht oder Blechstreifen, hergestellt werden. 10. A method for producing a printed circuit board (1, 1) according to any one of claims 1 to 9, characterized in that the melting bridges (6) immediately before the assembly of the printed circuit board (1, l λ ) in particular by cutting off a wire or sheet metal strip, getting produced.
EP03735624A 2002-06-21 2003-06-14 Printed board for electronic devices controlling a motor vehicle Withdrawn EP1518447A1 (en)

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JP2006511930A (en) 2006-04-06
DE10392979D2 (en) 2005-07-14
US20060102385A1 (en) 2006-05-18
WO2004002202A1 (en) 2003-12-31

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