EP1455558A3 - Printed wiring boards having capacitors and methods of making thereof - Google Patents

Printed wiring boards having capacitors and methods of making thereof Download PDF

Info

Publication number
EP1455558A3
EP1455558A3 EP20040005340 EP04005340A EP1455558A3 EP 1455558 A3 EP1455558 A3 EP 1455558A3 EP 20040005340 EP20040005340 EP 20040005340 EP 04005340 A EP04005340 A EP 04005340A EP 1455558 A3 EP1455558 A3 EP 1455558A3
Authority
EP
Grant status
Application
Patent type
Prior art keywords
electrodes
printed
electrode
capacitors
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20040005340
Other languages
German (de)
French (fr)
Other versions
EP1455558A2 (en )
Inventor
William Borland
David R. Mcgregor
Saul Ferguson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
E I du Pont de Nemours and Co
Original Assignee
E I du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0183Dielectric layers
    • H05K2201/0195Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09509Blind vias, i.e. vias having one side closed
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718Clearance holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763Printed component having superposed conductors, but integrated in one circuit layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/429Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/43Electric condenser making
    • Y10T29/435Solid dielectric type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base

Abstract

In a printed wiring board, a plurality of stacked innerlayer panels 100, 200, 300 have capacitors 105, 205, 305 connected in parallel by connecting a first electrode 110 of a first panel with a first electrode 210 of a second panel, and similarly connecting second electrodes 120, 220 of the first and second panels. The innerlayer panel having capacitors connected in parallel provides a high capacitance in a small x-y area. An alternative printed wiring board has a capacitor having a first foil electrode 101, and second and third electrodes located on opposite sides of the first foil electrode. Yet another printed wiring board has capacitors formed as an array of discrete foil electrodes spaced from an array of discrete printed electrodes. Forming discrete interconnected electrodes allows the electrodes to be fired without excessive thermal coefficient of expansion stresses damaging the electrodes.
EP20040005340 2003-03-07 2004-03-05 Printed wiring boards having capacitors and methods of making thereof Withdrawn EP1455558A3 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US45312903 true 2003-03-07 2003-03-07
US453129P 2003-03-07
US725888 2003-12-02
US10725888 US20040231885A1 (en) 2003-03-07 2004-02-04 Printed wiring boards having capacitors and methods of making thereof

Publications (2)

Publication Number Publication Date
EP1455558A2 true EP1455558A2 (en) 2004-09-08
EP1455558A3 true true EP1455558A3 (en) 2007-03-21

Family

ID=33456785

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20040005340 Withdrawn EP1455558A3 (en) 2003-03-07 2004-03-05 Printed wiring boards having capacitors and methods of making thereof

Country Status (3)

Country Link
US (1) US20040231885A1 (en)
EP (1) EP1455558A3 (en)
KR (1) KR100562812B1 (en)

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US7441329B2 (en) * 2004-06-07 2008-10-28 Subtron Technology Co. Ltd. Fabrication process circuit board with embedded passive component
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US7186919B2 (en) * 2004-08-16 2007-03-06 Samsung Electro-Mechanics Co., Ltd. Printed circuit board including embedded capacitors and method of manufacturing the same
US7561438B1 (en) * 2004-12-22 2009-07-14 Revera Incorporated Electronic device incorporating a multilayered capacitor formed on a printed circuit board
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US20060289976A1 (en) * 2005-06-23 2006-12-28 Intel Corporation Pre-patterned thin film capacitor and method for embedding same in a package substrate
JP4671829B2 (en) * 2005-09-30 2011-04-20 富士通株式会社 Method of manufacturing an interposer and an electronic device
US8707552B2 (en) * 2005-10-14 2014-04-29 Ibiden Co., Ltd. High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof
US20070109720A1 (en) * 2005-10-27 2007-05-17 Kyocera Corporation Dielectric paste, capacitor-embedded glass-ceramic multilayer substrate, electronic component and method of manufacturing capacitor-embedded glass-ceramic multilayer substrate
KR101248738B1 (en) 2005-12-07 2013-03-28 엔지케이 스파크 플러그 캄파니 리미티드 Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structure
US8110896B2 (en) * 2005-12-27 2012-02-07 Unimicron Technology Corp. Substrate structure with capacitor component embedded therein and method for fabricating the same
US8623737B2 (en) * 2006-03-31 2014-01-07 Intel Corporation Sol-gel and mask patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same
KR100764741B1 (en) * 2006-06-08 2007-10-08 삼성전자주식회사 Semiconductor device and method for forming the same
US7746661B2 (en) 2006-06-08 2010-06-29 Sandisk Corporation Printed circuit board with coextensive electrical connectors and contact pad areas
US7572709B2 (en) * 2006-06-29 2009-08-11 Intel Corporation Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor
US20080010798A1 (en) * 2006-07-14 2008-01-17 Borland William J Thin film dielectrics with co-fired electrodes for capacitors and methods of making thereof
US7818855B2 (en) * 2006-11-10 2010-10-26 E. I. Du Pont De Nemours And Company Method of making thin-film capacitors on metal foil using thick top electrodes
US8256106B2 (en) * 2007-01-25 2012-09-04 Unimicron Technology Corp. Method for fabricating circuit board structure with capacitors embedded therein
US20080180878A1 (en) * 2007-01-31 2008-07-31 Advanced Semiconductor Engineering, Inc. Package structure with embedded capacitor, fabricating process thereof and applications of the same
JP4694519B2 (en) * 2007-02-28 2011-06-08 富士通株式会社 Microstructure and microstructure manufacturing method
KR100861618B1 (en) * 2007-03-02 2008-10-07 삼성전기주식회사 Printed circuit board for improving tolerance of embedded capacitors, and process for manufacturing the same
US7958627B2 (en) * 2007-09-24 2011-06-14 Kemet Electronics Corporation Method of attaching an electronic device to an MLCC having a curved surface
JP2009094333A (en) * 2007-10-10 2009-04-30 Nippon Mektron Ltd Capacitor-embedded printed wiring board, and method of manufacturing the same
KR20090050664A (en) * 2007-11-16 2009-05-20 삼성전기주식회사 Manufactuirng method of multi-layer ceramic condenser
US8921705B2 (en) * 2008-11-28 2014-12-30 Ibiden Co., Ltd. Wiring board and fabrication method therefor
US20100142115A1 (en) * 2008-12-05 2010-06-10 Electronics And Telecommunications Research Institute Buried capacitor, method of manufacturing the same, and method of changing capacitance thereof
US20100139967A1 (en) * 2008-12-08 2010-06-10 Ibiden Co., Ltd. Wiring board and fabrication method therefor
CN102356703B (en) * 2009-03-19 2015-05-13 株式会社村田制作所 Circuit board and mother laminated body
DE102009041359A1 (en) * 2009-09-11 2011-03-24 Michalk, Manfred, Dr. Circuit arrangement having a predetermined electrical capacity
JP5352437B2 (en) * 2009-11-30 2013-11-27 ルネサスエレクトロニクス株式会社 A method of manufacturing a semiconductor device
US8558228B2 (en) * 2010-10-29 2013-10-15 Taiwan Semiconductor Manufacturing Company, Ltd. Four-terminal metal-over-metal capacitor design kit
GB2502971B (en) * 2012-06-11 2017-10-04 Knowles (Uk) Ltd A capacitive structure
US9955568B2 (en) * 2014-01-24 2018-04-24 Dell Products, Lp Structure to dampen barrel resonance of unused portion of printed circuit board via
WO2015125928A1 (en) * 2014-02-21 2015-08-27 三井金属鉱業株式会社 Copper-clad laminate for forming integrated capacitor layer, multilayer printed wiring board, and production method for multilayer printed wiring board

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Publication number Priority date Publication date Assignee Title
EP0409668A2 (en) * 1989-07-21 1991-01-23 Omron Corporation Mixed circuit boards and a method for manufacture thereof
EP0451500A2 (en) * 1990-04-09 1991-10-16 International Business Machines Corporation Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
US5636099A (en) * 1994-05-31 1997-06-03 Matsushita Electric Industrial Co., Ltd. Variable capacitor formed by multilayer circuit board
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EP1265466A2 (en) * 2001-06-05 2002-12-11 D.T. Circuit Technology Co. Ltd. Method for fabrication wiring board provided with passive element and wiring board provided with passive element

Also Published As

Publication number Publication date Type
US20040231885A1 (en) 2004-11-25 application
KR20040081016A (en) 2004-09-20 application
KR100562812B1 (en) 2006-03-21 grant
EP1455558A2 (en) 2004-09-08 application

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