EP1261077B1 - Reception device for a backplane - Google Patents
Reception device for a backplane Download PDFInfo
- Publication number
- EP1261077B1 EP1261077B1 EP02006872A EP02006872A EP1261077B1 EP 1261077 B1 EP1261077 B1 EP 1261077B1 EP 02006872 A EP02006872 A EP 02006872A EP 02006872 A EP02006872 A EP 02006872A EP 1261077 B1 EP1261077 B1 EP 1261077B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- contact
- tongue
- contact elements
- segment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/6485—Electrostatic discharge protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
Definitions
- the invention relates to a device for receiving a printed circuit board, in particular a housing rear wall forming a printed circuit board, in a housing comprising electrical and / or electronic components, wherein the device comprises contact means for contacting the printed circuit board with the housing, wherein as contact means in the direction of a screen surface of the printed circuit board are provided resiliently projecting contact elements, wherein the contact elements are arranged on one of the screen surface of the circuit board facing the plant side of the device, and wherein the contact elements each have a tongue-shaped portion whose free end is curved such that the end of the plane defined by the contact side resiliently protrudes.
- the device is formed as a fixedly connected to the respective housing mechanically and electrically connected metal carrier, which usually contacted by screws designed as a equipotential surface shield surface of the circuit board, so that the screen surface of the circuit board is in electrically conductive connection to both the metal support and the housing. Accordingly, the screen surface and thus the corresponding backplane is EMC-shielded.
- the distances between the screws which also serve for the mechanical attachment of the circuit board to the metal support, and thus reduce the number of screws, a plurality of impressed in the metal support warts are instead provided in this prior art as a contact means.
- a shield for a radio communication terminal is known in which the shield is formed from a cup-shaped shield housing.
- the shield housing has a screen edge, on which resiliently projecting metal springs are formed. These metal springs face an installation side on the circuit board. They have a free end which projects resiliently from the plane defined by the abutment side.
- This shield device With this shield device, a small area on the circuit board can be effectively shielded.
- the shielding is to cover a larger area on the printed circuit board, not all metal springs have a reliable contact with the contact side on the printed circuit board, so that the shielding effect is impaired.
- the invention is based on the object to provide a device which allows sufficient EMC shielding of a backplane even when the backplane is curved, the number of screws used is limited to a minimum.
- the device according to the invention uses contact elements with tongue-shaped sections, that the tongue-shaped sections are formed by approximately U-shaped incisions in a contact portion of the device or are connected via a laterally on the associated anchoring portion away standing connecting web with a contact portion, that the tongue-shaped sections are each connected via an anchoring section to an abutment section associated with the abutment side, and that the tongue-shaped sections have a smaller width than the respective anchoring sections.
- An advantageous embodiment of the invention provides that the anchoring portions are formed embossed.
- the contact elements assigned to each contact section are sequentially aligned such that their tongue-shaped sections are arranged in alignment with one another.
- the contact elements respectively associated with a contact portion are substantially evenly spaced from each other. Because of this and because of the elasticity of bending Characteristics of the contact elements is the printed circuit board on the sprung arranged contact elements, so that only relatively few screws for mechanical attachment of the circuit board to the device according to the invention are required.
- Fig. 1 shows in a frontal view a section of a generally designated 10 device whose body 10 'is formed as a substantially rectangular metal frame.
- the side boundary edges 11 of the body 10 ' have right-angled bends 12, with which the metal frame 10' is brought to the side walls 13 of a housing 14 for attachment and secured there.
- the border 15 of the metal frame 10 ' has a plurality of contact elements 17, which protrude with their ends 17' from the contact plane of the border 15 and protrude in the direction of the circuit board 16.
- Each contact element 17 has a tongue-shaped portion 17 '', wherein the respective end 17 'of the formed by the incision tongue-shaped portion 17''is curved so that it is bent to the formed as a shield or ground surface contact side of the circuit board 16 out.
- a first embodiment of the contact elements 17 is realized in that for the formation of the tongue-shaped portions 17 '' each U-shaped incisions in the respective abutment portions 15 ', 15''of the border 15 are stamped, wherein the respective incisions of the curved ends 17 'of the tongue-shaped portions 17''extend to an anchoring portion 19, the curved end 17' side facing away from the associated bearing portion 15 ', 15''is integrally connected.
- these are integrally connected to the associated contact section 15 '''of the border 15 via a web 20 extending transversely to the longitudinal extension of the respective contact element 17 and extending laterally away from the anchoring section 19.
- the individual contact elements 17 act with their resiliently projecting ends 17' of the tongue-shaped portions 17 '' the contact side of the circuit board 16 in the region of the side edges. Since the ends 17 'of the tongue-shaped portions 17''are resilient, the ends 17' engage in the relatively soft copper coating on the contact side of the circuit board 16 and thereby form a good and lasting contact between the metal frame 10 'and the shield surface Plant side of the circuit board 16.
- Fig. 2 shows the device 10 in a likewise frontal view, wherein in the region of the folds 12 of the metal frame 10 'arranged latching projections 18 are provided, which are formed by U-shaped cuts in the folds 12; the latching projections 18 are each bent away from the associated folds 12 and the installation level of the metal frame 10 'facing so that they each form an abutment for an abutment against the system level printed circuit board 16 and thereby press the circuit board 16 against the contact elements 17 and hold.
- Fig. 3 shows in a cutaway magnification several contact elements 17 of the device 10, a group on a according to Fig. 1 and 2 form the left side arranged abutment portion 15 '''of the border 15.
- Each contact element 17 of this group has an anchoring portion 19, which is integrally connected via an approximately transversely to the longitudinal extension of the respective contact element 17 arranged web 20 with the border 15 of the metal frame 10 '.
- the anchoring portion 19 opens into the tongue-shaped portion 17 '', which has a smaller width relative to the anchoring portion 19.
- the ends 17 'of the tongue-shaped portions 17'' are curved so that they protrude from the contact plane of the border 15.
- the individual contact elements 17 are uniformly spaced at the border 15 so arranged that the curved end 17 'of a contact element 17''the anchoring portion 19 of the immediately adjacent contact element 17 faces and between a small gap is formed.
- Fig. 4 shows in a further enlarged detail a single contact element 17, wherein the length of the anchoring portion 19 corresponds approximately to the length of the tongue-shaped portion 17 ''.
- the anchoring portions 19 are embossed formed in order to improve the elastic properties of the contact elements 17 due to the material compression or cross-sectional thinning achieved thereby.
- the end 17 'of the contact element 17 has a relatively sharp edge, which scratches when pressing the circuit board 16 whose relatively soft copper coating and thereby penetrates any oxide layers.
- a sharp edge can be formed, for example, by punching the contact element 17.
- Fig. 5 illustrates the metal frame 10 'in one opposite Fig. 1 and 2 rear full view, wherein the opposite abutment portions or longitudinal beams 15 'and 15''' of the metal frame 10 'via a cross member 15''are interconnected to give the structure a higher mechanical stability and an additional abutment portion 15''for to form a group of contact elements 17.
- the cross member 15 '' lies in the contact plane and has along its transverse extension continuously arranged contact elements 17, whose longitudinal extent with the transverse extent of the cross member 15 '' are aligned.
- Fig. 6 also illustrates in a rear view the in Fig. 5 shown metal frame 10 'with a printed circuit board 16 attached thereto, wherein the locking projections 18 provided in the projecting from the plane perpendicular protrusions 12 engage the surface facing away from the screen surface of the circuit board 16 and press against the contact elements 17.
Description
Die Erfindung betrifft eine Vorrichtung zur Aufnahme einer Leiterplatte, insbesondere einer eine Gehäuserückwand bildenden Leiterplatte, in einem elektrische und/oder elektronische Baugruppen umfassenden Gehäuse, wobei die Vorrichtung Kontaktmittel zur Kontaktierung der Leiterplatte mit dem Gehäuse aufweist, wobei als Kontaktmittel in Richtung einer Schirmfläche der Leiterplatte federnd vorstehende Kontaktelemente vorgesehen sind, wobei die Kontaktelemente an einer der Schirmfläche der Leiterplatte zugewandten Anlageseite der Vorrichtung angeordnet sind, und wobei die Kontaktelemente jeweils einen zungenförmigen Abschnitt aufweisen, dessen freies Ende derart gekrümmt ist, dass das Ende aus der durch die Anlageseite definierten Ebene federnd vorsteht.The invention relates to a device for receiving a printed circuit board, in particular a housing rear wall forming a printed circuit board, in a housing comprising electrical and / or electronic components, wherein the device comprises contact means for contacting the printed circuit board with the housing, wherein as contact means in the direction of a screen surface of the printed circuit board are provided resiliently projecting contact elements, wherein the contact elements are arranged on one of the screen surface of the circuit board facing the plant side of the device, and wherein the contact elements each have a tongue-shaped portion whose free end is curved such that the end of the plane defined by the contact side resiliently protrudes.
In vielen Bereichen der Elektrotechnik, insbesondere im Bereich der Kommunikationstechnik, tritt das Problem der Abschirmung elektromagnetischer Felder auf. Insbesondere ist es häufig erforderlich, in einem elektrische oder elektronische Baugruppen tragenden Gehäuse darin aufgenommene Backplane- oder Rückwandleiterplatten im Hinblick auf ihre elektromagnetische Verträglichkeit (EMV) abzuschirmen.In many fields of electrical engineering, especially in the field of communications technology, the problem of shielding electromagnetic fields arises. In particular, it is often necessary to shield in a housing carrying electrical or electronic components housed therein backplane or backplane in terms of their electromagnetic compatibility (EMC).
Bei diesen Vorrichtungen handelt es sich darum, mittels einer derartigen Vorrichtung eine als Rückwand eines Gehäuses ausgebildete Leiterplatte mit dem Gehäuse in Kontakt zu bringen; dazu ist die Vorrichtung als fest mit dem jeweiligen Gehäuse mechanisch und elektrisch verbundener Metallträger ausgebildet, der üblicherweise mittels Schrauben eine als Äquipotenzialfläche ausgebildete Schirmfläche der Leiterplatte kontaktiert, so dass sich die Schirmfläche der Leiterplatte in elektrisch leitender Verbindung sowohl zum Metallträger als auch zum Gehäuse befindet. Demgemäß ist die Schirmfläche und somit die entsprechende Rückwandleiterplatte EMV-technisch abgeschirmt. Um aus Kostengründen die Abstände zwischen den Schrauben, die auch zur mechanischen Befestigung der Leiterplatte am Metallträger dienen, zu vergrößern und somit die Schraubenzahl zu reduzieren, sind stattdessen bei diesem Stand der Technik als Kontaktmittel eine Vielzahl von im Metallträger eingeprägten Warzen vorgesehen. Unbefriedigend bei diesem Stand der Technik ist jedoch, dass lediglich relativ wenige dieser Warzen in Punktkontakt zum Metallrahmen stehenden, da sich die an dem starren Metallrahmen anliegende auf Grund ihrer Materialbeschaffenheit demgegenüber er relativ biegeweiche Leiterplatten bogenförmig verwölbt, so dass sich im Extremfall nur zwei benachbart angeordnete Warzen in Kontakt zur Leiterplatte befinden können. Da sich in diesem Fall die übrigen Warzen außer Eingriff befinden, ist die Leiterplatte in EMV-technischer Hinsicht nicht mehr ausreichend abgeschirmt, so es nur begrenzt möglich ist, die Schraubabstände zu vergrößern.These devices are to bring by means of such a device designed as a rear wall of a housing circuit board in contact with the housing; For this purpose, the device is formed as a fixedly connected to the respective housing mechanically and electrically connected metal carrier, which usually contacted by screws designed as a equipotential surface shield surface of the circuit board, so that the screen surface of the circuit board is in electrically conductive connection to both the metal support and the housing. Accordingly, the screen surface and thus the corresponding backplane is EMC-shielded. In order to increase for cost reasons, the distances between the screws, which also serve for the mechanical attachment of the circuit board to the metal support, and thus reduce the number of screws, a plurality of impressed in the metal support warts are instead provided in this prior art as a contact means. Unsatisfactory in this prior art, however, is that only relatively few of these warts are in point contact with the metal frame, since the voltage applied to the rigid metal frame due to their material composition in contrast he relatively curved soft circuit boards arched, so that in an extreme case only two adjacent arranged Warts may be in contact with the circuit board. Since in this case the remaining warts are disengaged, the circuit board is no longer adequately shielded in terms of EMC technology, so that it is only possible to increase the screw spacing to a limited extent.
Aus der
Aus
Der Erfindung liegt die Aufgabe zu Grunde, eine Vorrichtung zu schaffen, die eine ausreichende EMV-Abschirmung einer Rückwandleiterplatte auch dann ermöglicht, wenn die Rückwandleiterplatte gewölbt ist, wobei die Zahl der verwendeten Schrauben auf ein geringstmögliches Maß beschränkt ist.The invention is based on the object to provide a device which allows sufficient EMC shielding of a backplane even when the backplane is curved, the number of screws used is limited to a minimum.
Gelöst wird diese Aufgabe dadurch, dass die erfindungsgemäße Vorrichtung Kontaktelemente mit zungenförmigen Abschnitten einsetzt, dass die zungenförmigen Abschnitte durch etwa U-förmige Einschnitte in einem Anlageabschnitt der Vorrichtung gebildet sind oder über einen seitlich am zugeordneten Verankerungsabschnitt weg stehenden Verbindungssteg mit einem Anlageabschnitt verbunden sind, dass die zungenförmigen Abschnitte jeweils über einen Verankerungsabschnitt mit einem der Anlageseite zugehörigen Anlageabschnitt verbunden sind, und dass die zungenförmigen Abschnitte eine geringere Breite als die jeweiligen Verankerungsabschnitte aufweisen.This object is achieved in that the device according to the invention uses contact elements with tongue-shaped sections, that the tongue-shaped sections are formed by approximately U-shaped incisions in a contact portion of the device or are connected via a laterally on the associated anchoring portion away standing connecting web with a contact portion, that the tongue-shaped sections are each connected via an anchoring section to an abutment section associated with the abutment side, and that the tongue-shaped sections have a smaller width than the respective anchoring sections.
Dadurch sind Verbiegungen oder Verwölbungen der Leiterplatte durch federelastisches Nachgeben oder Nachführen der jeweiligen Kontaktelemente ausgleichbar. Durch die elastische Eigenschaft der Kontaktelemente können die Abstände zwischen den verwendeten Schrauben deutlich vergrößert und somit deren Anzahl reduziert werden.As a result, bends or warping of the circuit board by resilient yielding or tracking of the respective contact elements are compensated. Due to the elastic property of the contact elements, the distances between the screws used can be significantly increased and thus their number can be reduced.
Eine vorteilhafte Ausgestaltungen der Erfindung sieht vor, dass die Verankerungsabschnitte angeprägt ausgebildet sind.An advantageous embodiment of the invention provides that the anchoring portions are formed embossed.
Um einen möglichst gleichmäßigen Kontaktdruck zu erzielen, sind die einem Anlageabschnitt jeweils zugeordneten Kontaktelemente sequenziell so ausgerichtet, dass deren zungenförmige Abschnitte zueinander fluchtend angeordnet sind.In order to achieve a contact pressure which is as uniform as possible, the contact elements assigned to each contact section are sequentially aligned such that their tongue-shaped sections are arranged in alignment with one another.
Ferner sind die einem Anlageabschnitt jeweils zugeordneten Kontaktelemente im wesentlichen gleichmäßig beabstandet zueinander. Dadurch und auf Grund der biegeelastischen Eigenschaften der Kontaktelemente liegt die Leiterplatte gefedert auf den aufgereiht angeordneten Kontaktelementen auf, so dass nur relativ wenige Schrauben zur mechanischen Befestigung der Leiterplatte an der erfindungsgemäßen Vorrichtung erforderlich sind.Furthermore, the contact elements respectively associated with a contact portion are substantially evenly spaced from each other. Because of this and because of the elasticity of bending Characteristics of the contact elements is the printed circuit board on the sprung arranged contact elements, so that only relatively few screws for mechanical attachment of the circuit board to the device according to the invention are required.
Weitere vorteilhafte Ausgestaltungen der Erfindung sind den Unteransprüchen zu entnehmen.Further advantageous embodiments of the invention can be found in the dependent claims.
Anhand der beigefügten Zeichnung soll nachstehend eine Ausführungsform der Erfindung näher erläutert werden. In teilweise stark schematischen Ansichten zeigen:
-
Fig. 1 eine perspektivische Teilansicht der in einem Gehäuse aufgenommenen erfindungsgemäßen Vorrichtung mit einer daran befestigten Leiterplatte, wobei die Vorrichtung eine Vielzahl sequentiell angeordneter Kontaktelemente aufweist, -
Fig. 2 die erfindungsgemäße Vorrichtung ohne Leiterplatte in einer Ansicht wieFig. 1 , -
Fig. 3 einen stark vergrößerten Ausschnitt der Vorrichtung mit den Kontaktelementen gemäßFig. 2 , -
Fig. 4 eine gegenüberFig. 3 nochmals vergrößerte Darstellung der Vorrichtung mit einem Kontaktelement, -
Fig. 5 eine andere perspektivische Darstellung der Vorrichtung ohne Leiterplatte, sowie -
Fig. 6 die Vorrichtung in einer Darstellung wieFig. 5 mit daran befestigter Leiterplatte.
-
Fig. 1 3 a perspective partial view of the device according to the invention accommodated in a housing with a printed circuit board attached thereto, wherein the device has a multiplicity of sequentially arranged contact elements, -
Fig. 2 the device according to the invention without a circuit board in a view likeFig. 1 . -
Fig. 3 a greatly enlarged section of the device with the contact elements according toFig. 2 . -
Fig. 4 one oppositeFig. 3 again enlarged view of the device with a contact element, -
Fig. 5 another perspective view of the device without a circuit board, as well -
Fig. 6 the device in a presentation likeFig. 5 with attached circuit board.
Zu Befestigungszwecken weist der Metallrahmen 10' der Vorrichtung 10 in den Anlageabschnitten und den Abkantungen Durchgangslöcher zur Aufnahme von Schrauben auf, so daß die Leiterplatte 16 an der Vorrichtung 10 und die Vorrichtung 10 an zugeordneten Gehäuseteilen befestigbar ist.For fastening purposes, the metal frame 10 'of the
Vorzugsweise weist das Ende 17' des Kontaktelements 17 eine verhältnismäßig scharfe Kante auf, die bei Andrücken der Leiterplatte 16 deren relativ weiche Kupferbeschichtung einritzt und dabei etwaige Oxidschichten durchdringt. Eine solche scharfe Kante kann beispielsweise durch Stanzen des Kontaktelements 17 gebildet werden.Preferably, the end 17 'of the
Claims (6)
- Device for holding a printed circuit board (16), in particular a printed circuit board forming a housing rear wall, in a housing encompassing electrical and/or electronic modules, with the device (10) having contact means (17) for establishing contact between the printed circuit board and the housing, with contact elements (17) projecting in a resilient manner in the direction of a shielding surface of the printed circuit board (16) being provided as contact means (17), with the contact elements (17) being disposed on a bearing side of the device (10) facing the shielding surface of the printed circuit board (16) and with the contact elements (17) respectively having a tongue-shaped segment (17"), the free end (17') of which is curved in such a manner that the end (17') projects in a resilient manner from the plane defined by the bearing side, characterised in that
the tongue-shaped segments (17") are formed by roughly U-shaped notches in a bearing segment (15', 15") of the device (10) or are connected to a bearing segment (15") by way of a connecting web (20) standing away to the side of the assigned anchoring segment (19),
the tongue-shaped segments (17") are connected respectively by way of an anchoring segment (19) to a bearing segment (15', 15" , 15" ') associated with the bearing side and
the tongue-shaped segments (17") have a narrower width than the respective anchoring segments (19). - Device according to claim 1, characterised in that the anchoring segments (19) are configured by embossing.
- Device according to claim 1 or 2, characterised in that the contact elements (17) assigned respectively to a bearing segment (15', 15" , 15"') are oriented sequentially in such a manner that their tongue-shaped segments (17") are disposed in alignment with each other.
- Device according to claim 3, characterised in that the contact elements (17) assigned respectively to a bearing segment (15', 15" , 15"') are essentially spaced at regular intervals from each other.
- Device according to one of claims 1 to 4, characterised in that the device (10) has chamfers (12) at its side limiting edges (11), on which chamfers (12) latching projections (18) facing the bearing side are configured.
- Device according to one of claims 1 to 5, characterised in that the device (10) is configured as an essentially rectangular metal frame (10'), which is produced from a single cut.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10124814A DE10124814B4 (en) | 2001-05-21 | 2001-05-21 | Device for receiving a printed circuit board |
DE10124814 | 2001-05-21 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1261077A2 EP1261077A2 (en) | 2002-11-27 |
EP1261077A3 EP1261077A3 (en) | 2006-08-23 |
EP1261077B1 true EP1261077B1 (en) | 2008-06-11 |
Family
ID=7685642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02006872A Expired - Fee Related EP1261077B1 (en) | 2001-05-21 | 2002-03-26 | Reception device for a backplane |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP1261077B1 (en) |
DE (2) | DE10124814B4 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06275979A (en) * | 1993-03-19 | 1994-09-30 | Nec Kansai Ltd | Structure for grounding high frequency unit |
DE29713412U1 (en) * | 1997-07-28 | 1997-09-25 | Siemens Ag | Shielding |
DE29808620U1 (en) * | 1998-05-13 | 1998-08-06 | Siemens Ag | Shielding for a radio-operated communication terminal |
DE19823651C1 (en) * | 1998-05-27 | 1999-10-28 | Schaefer Gehaeusesysteme Gmbh | Electromagnetic screening connection between metal components, e.g. for electronic apparatus casing |
-
2001
- 2001-05-21 DE DE10124814A patent/DE10124814B4/en not_active Expired - Fee Related
-
2002
- 2002-03-26 DE DE50212354T patent/DE50212354D1/en not_active Expired - Lifetime
- 2002-03-26 EP EP02006872A patent/EP1261077B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE10124814B4 (en) | 2005-12-08 |
DE50212354D1 (en) | 2008-07-24 |
EP1261077A3 (en) | 2006-08-23 |
EP1261077A2 (en) | 2002-11-27 |
DE10124814A1 (en) | 2002-12-05 |
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