EP1261077A3 - Reception device for a backplane - Google Patents

Reception device for a backplane Download PDF

Info

Publication number
EP1261077A3
EP1261077A3 EP02006872A EP02006872A EP1261077A3 EP 1261077 A3 EP1261077 A3 EP 1261077A3 EP 02006872 A EP02006872 A EP 02006872A EP 02006872 A EP02006872 A EP 02006872A EP 1261077 A3 EP1261077 A3 EP 1261077A3
Authority
EP
European Patent Office
Prior art keywords
backplane
reception
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP02006872A
Other languages
German (de)
French (fr)
Other versions
EP1261077B1 (en
EP1261077A2 (en
Inventor
Martin Duen
Roland Plabst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE10124814 priority Critical
Priority to DE10124814A priority patent/DE10124814B4/en
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP1261077A2 publication Critical patent/EP1261077A2/en
Publication of EP1261077A3 publication Critical patent/EP1261077A3/en
Application granted granted Critical
Publication of EP1261077B1 publication Critical patent/EP1261077B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/6485Electrostatic discharge protection
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581Shield structure
    • H01R13/6582Shield structure with resilient means for engaging mating connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members

Abstract

Die Erfindung betrifft eine Vorrichtung (10) zur Aufnahme einer Leiterplatte (16), insbesondere einer eine Gehäuserückwand bildende Leiterplatte, in einem elektrische und/oder elektronische Baugruppen umfassenden Gehäuse, wobei die Vorrichtung (10) Kontaktmittel (17) zur Kontaktierung der Leiterplatte (16) mit dem Gehäuse aufweist. Die Erfindung sieht vor, daß als Kontaktmittel (17) in Richtung einer Schirmfläche der Leiterplatte federnd vorstehende Kontaktelemente vorgesehen sind, welche Kontaktelemente (17) jeweils einen zungenförmigen Abschnitt (17'') aufweisen, dessen freies Ende (17') derart gekrümmt ist, daß das Ende (17) aus der durch die Anlageseite definierten Ebene federnd vorsteht.
Figure imgaf001
The invention relates to a device (10) for accommodating a printed circuit board (16), in particular a printed circuit board forming a housing rear wall, in a housing comprising electrical and / or electronic components, wherein the device (10) comprises contact means (17) for contacting the printed circuit board (16 ) with the housing. The invention relates to a device (10) for accommodating a printed circuit board (16), in particular a printed circuit board forming a housing rear wall, in a housing comprising electrical and / or electronic components, wherein the device (10) comprises contact means (17) for contacting the printed circuit board (16) with the housing. The invention provides that as a contact means (17) are provided in the direction of a screen surface of the circuit board resiliently projecting contact elements, which contact elements (17) each have a tongue-shaped portion (17 '') whose free end (17 ') is curved in such a way that the end (17) protrudes resiliently from the plane defined by the contact side. The invention provides that as a contact means (17) are provided in the direction of a screen surface of the circuit board resiliently projecting contact elements, which contact elements (17) each have a tongue-shaped portion (17 '') whose free end (17 ') is curved in such a way that the end (17) protrudes resiliently from the plane defined by the contact side.
EP02006872A 2001-05-21 2002-03-26 Reception device for a backplane Expired - Fee Related EP1261077B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE10124814 2001-05-21
DE10124814A DE10124814B4 (en) 2001-05-21 2001-05-21 Device for receiving a printed circuit board

Publications (3)

Publication Number Publication Date
EP1261077A2 EP1261077A2 (en) 2002-11-27
EP1261077A3 true EP1261077A3 (en) 2006-08-23
EP1261077B1 EP1261077B1 (en) 2008-06-11

Family

ID=7685642

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02006872A Expired - Fee Related EP1261077B1 (en) 2001-05-21 2002-03-26 Reception device for a backplane

Country Status (2)

Country Link
EP (1) EP1261077B1 (en)
DE (2) DE10124814B4 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275979A (en) * 1993-03-19 1994-09-30 Nec Kansai Ltd Structure for grounding high frequency unit
DE29808620U1 (en) * 1998-05-13 1998-08-06 Siemens Ag Shielding for a radio-operated communication terminal

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29713412U1 (en) * 1997-07-28 1997-09-25 Siemens Ag Shielding
DE19823651C1 (en) * 1998-05-27 1999-10-28 Schaefer Gehaeusesysteme Gmbh Electromagnetic screening connection between metal components, e.g. for electronic apparatus casing

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275979A (en) * 1993-03-19 1994-09-30 Nec Kansai Ltd Structure for grounding high frequency unit
DE29808620U1 (en) * 1998-05-13 1998-08-06 Siemens Ag Shielding for a radio-operated communication terminal

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 687 26 December 1994 (1994-12-26) *

Also Published As

Publication number Publication date
EP1261077A2 (en) 2002-11-27
DE10124814A1 (en) 2002-12-05
DE10124814B4 (en) 2005-12-08
EP1261077B1 (en) 2008-06-11
DE50212354D1 (en) 2008-07-24

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