EP1023736A1 - Radio interference suppression choke - Google Patents
Radio interference suppression chokeInfo
- Publication number
- EP1023736A1 EP1023736A1 EP98958180A EP98958180A EP1023736A1 EP 1023736 A1 EP1023736 A1 EP 1023736A1 EP 98958180 A EP98958180 A EP 98958180A EP 98958180 A EP98958180 A EP 98958180A EP 1023736 A1 EP1023736 A1 EP 1023736A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- alloy
- choke according
- magnetic tape
- choke
- connecting wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F37/00—Fixed inductances not covered by group H01F17/00
Definitions
- the invention relates to a choke for radio interference suppression and a method for its production.
- Single-wire chokes are chokes for radio interference suppression, which are designed as ring-shaped magnetic tape cores that can be plugged onto a wire or a connecting pin of a circuit component.
- Such chokes for radio interference suppression are known from the data book of Toshiba Corporation, Material & Components, Technical Data, "Amorphous Noise Suppressor, AMOBEAD TM, Serial No. E-63001, January 30, 1988.
- Single-line chokes have the advantage of large inductances even with large choke currents and a broadband interference suppression effect in the range from 10 kHz to 30 MHz compared to other components for radio interference suppression, such as an RC low-pass filter. Furthermore, they have a particularly high insertion loss even in the lower frequency range. After all, they have low overall losses and small component sizes.
- so-called single-core chokes in the form of small wound magnetic tape cores made of amorphous alloys, in particular based on cobalt, are specified. The wound magnetic tape cores are pushed or plugged onto the current-carrying conductor of the component causing the fault. There they act as saturable chokes, with the help of which high-frequency interference can be effectively combatted during a switching operation. Following the switching process, however, the saturation of the magnetic material of the magnetic tape core no longer influences the circuit to be protected.
- the tape to be entangled is usually fastened to a winding shaft made of tool steel, as a rule by spot welding. After welding, the magnetic tape core is wound with the desired geometric data. Finally, the end of the tape is again attached to the outer circumference of the magnetic tape core by spot welding. After the welding process has been completed, the magnetic tape core is sheared off the winding shaft. The resulting annular magnetic tape core can then be processed in a known manner. In particular, the magnetic tape core is subjected to a heat treatment and then covered with a passivation layer.
- Single-conductor chokes of this type are, however, in production, since the ring-shaped components have to be attached manually via the connecting pins, for example a transistor or a diode.
- the adjustment of the ring-shaped single-conductor choke around the connecting pins plays a major role and requires additional assembly effort.
- Another significant disadvantage arises from the very poor thermal contact of the magnetic tape core with the connection pins of the circuit and the resulting poor dissipation of the heat loss from the magnetic tape core. For example, the loss of heat that occurs during magnetization up to saturation at frequencies in the range of a few hundred kilohertz generally leads to component heating of over 100 ° C.
- the object of the present invention is therefore to provide a choke for radio interference suppression which can be produced with the least possible assembly effort and which has very good thermal contact of the magnetic tape core with the circuit for dissipating the heat loss from the magnetic tape core.
- a choke for radio interference suppression which is characterized by the following features:
- the choke for radio interference suppression according to the invention both avoids the mentioned installation difficulties and solves the problem of the thermal coupling of the choke to the rest of the circuit. All other advantages mentioned, in particular the very good damping properties, remain unrestricted.
- a connecting wire is used for the production of magnetic tape cores, which serves as a winding shaft for the magnetic tape core.
- the material of the connecting wire is made of an alloy that is both spot weldable for welding the magnetic tape to be entangled and soft solderable for later assembly of the component.
- the connecting wire used as the winding shaft of the magnetic tape core remains in connection with the core winding in the magnetic tape core and then serves as the electrical conductor of the component.
- the magnetic tape cores are optionally subjected to a heat treatment to adjust the magnetic properties. Subsequently, a wrapping of the magnetic tape core, for example with a common lacquer or a shrink tube, is appropriate. An epoxy powder coating can then be used as the coating. However, it would also be conceivable to encase the magnetic tape core with a thermoplastic or thermosetting molding compound.
- the component that is then present can be compared externally to a conventional resistor and, of course, can be further processed like such by means of appropriate automatic placement machines, as are customary in printed circuit board manufacture. It is particularly advantageous if the chokes according to the invention for radio interference suppression are designed as SMD components.
- Figure 1 shows a single-line choke according to the invention, which is designed as a donated component
- Figure 2 shows a single-line choke according to the invention, which is designed as an SMD component
- FIG. 3 shows a temperature-time diagram which shows the heating of the components of a single-line choke (b) according to the invention in comparison to a single-line choke according to the prior art (a).
- 1 denotes a connecting wire.
- the connecting wire 1 can have a circular, rectangular, or similar cross section. It would also be conceivable that the connecting wire 1 is designed in the form of a band.
- a magnetic tape core 2 is arranged around the connecting wire 1.
- the magnetic tape core 2 typically consists of a thin tape or a thin film which is wound around the connecting wire 1 in a coil-like manner.
- a protective coating 3 can advantageously be provided in the area of the magnetic tape core 2 to protect the magnetic tape core 2.
- the connecting wire 1, the magnetic tape core 2 and the protective coating 3 then form a single-conductor choke 4.
- the ends of the connecting wire 1 can serve as a connector. Typically, however, the ends of the lead wire 1 are soldered into the circuit of an integrated circuit.
- FIG. 2 shows a further single-inductor 4, which is designed here as a so-called SMD component (surface ounted device component).
- SMD component surface ounted device component
- the single-line choke 4 in FIG. 2 differs from that in FIG. 1 essentially by the housing design.
- the SMD component shown here is suitable for surface mounting on a circuit board.
- the connecting wire 1 is angled in an L-shape in the area not covered by the magnetic tape core 2. It would also be conceivable, as shown in the example in FIG. 2, that the regions of the connecting wire 1 which are not covered by the magnetic tape core 2 are angled several times in an L-shape.
- a circuit board is designated by 5 in FIG.
- the inductor 4 is connected to the L-shaped ends of the connecting wire 1 via a solder connection 6 to the circuit board 5.
- a wire is cut to a predetermined length, which then forms the connecting wire 1.
- an amorphous thin tape or a thin magnetic film is first welded onto the connecting wire 1 at one end.
- This thin tape is then wound in a coil-like manner around the connecting wire 1 to form a magnetic tape core 2.
- the second end of the tape is then if attached to the outer circumference of the wound coil by spot welding.
- an annular magnetic tape core (2) is typically obtained. It is particularly advantageous if the annular magnetic tape core (2) is designed as a closed ring.
- a heat treatment step then typically follows.
- the heat treatment is typically carried out continuously.
- the throughput speed is selected so that the thin strip is heated to a temperature of 450 ° C. ⁇ T ⁇ 550 ° C. for a heat treatment time of 0.5 seconds ⁇ t ⁇ 120 seconds.
- This heat treatment step serves, among other things, for the mechanical relaxation treatment of the magnetic tape core 2.
- the permeability and thus also the insertion loss correlated with it can thus be optimized in the desired manner.
- the magnetic tape core 2 is treated in a magnetic field in order to set the desired hysteresis.
- the protective coating 3 serves in particular for the mechanical protection of the magnetic tape core 2.
- An epoxy powder coating or a thermoplastic or thermosetting molding compound can serve as protective coating 3.
- the material of the connecting wire 1 is both weldable and solderable. Furthermore, it is essential that the material used for the connecting wire 1 has a sufficiently high electrical conductivity as well as a high thermal conductivity. Besides, it's Quite necessary that the material of the connecting wire 1 itself is non-ferromagnetic. Otherwise, in the application of the single-core chokes 4, eddy current effects could lead to extreme heating of the connecting wire 1.
- connection wire 1 requirements for the material of the connecting wire 1 are ideally met by copper-based alloys.
- Resistance-increasing elements such as nickel, beryllium, chromium, zirconium, manganese or similar elements have been alloyed to achieve spot weldability.
- the most common are commercially available resistance alloys such as copper-nickel alloys or copper-manganese alloys.
- a sufficiently good spot weldability of the lead wire 1 with the ferromagnetic materials of the magnetic tape core 2 is achieved with an alloy for the lead wire, which is derived from the formula (a + b) Ni a Mn b.
- a and b are given in% by weight and meet the following conditions: 6 ⁇ a ⁇ 80 and 0 ⁇ b ⁇ 12.
- the best results are achieved with a relatively low alloyed nickel content of approx. 6% by weight or manganese content of approx. 3% by weight.
- the upper limit of the nickel content of these alloys is on the one hand due to the lower electrical conductivity as the nickel content increases and on the other hand due to the achievement of ferro-magnetic compositions.
- the preferred composition is in the range of approx. 6-50% by weight) nickel with additions of 0-6% by weight) manganese.
- the commercial alloy CuMn3 from the copper manganese system can be used.
- Another alloy for the lead wire 1 with good spot weldability is achieved with an alloy which is composed of the formula CU_QO- (a + b) Mn a Ge b. there a and b are also given in% by weight and satisfy the following conditions: 3 ⁇ a ⁇ and 0 b ⁇ 6.
- the connecting wire 1 also offers the use of simple copper wires, which are provided with a spot-weldable and solderable surface coating.
- a coating with these properties can be produced, for example, by nickel plating.
- a layer thickness of the nickel coating in the range of approximately 2 to 30 ⁇ m is sufficient to ensure the required good spot weldability and solderability.
- this variant offers both the most favorable electrical properties and the most advantageous thermal conductivity.
- Nickel plating in a reasonable frame. It is also advantageous to partially remove the nickel coating in the areas that are not covered by the magnetic tape core 2 after coating the magnetic tape core 2 in an etching solution.
- the material of the magnetic tape core 2 consists of an amorphous or nanocrystalline, highly permeable, ferromagnetic alloy. It is particularly advantageous if this alloy consists of soft magnetic material.
- amorphous cobalt-based alloy or a nanocrystalline iron base alloy is used. These alloys typically have a saturation magnetostriction
- the simplest form of execution of the protective coating 3 of the single-core chokes 4 is provided by the casing.
- the component is coated in the area of the magnetic tape core 2 by means of a powder coating.
- comparable designs are obtained externally to conventional resistors, which are applied and soldered in printed form on the printed circuit board 5 during assembly.
- Another design that is very interesting for later assembly can be realized by overmolding the area of the magnetic tape core 2 with a thermoplastic or thermosetting molding compound in a cuboid shape and then cutting and embossing the conductor.
- so-called SMD components are obtained, which lead to a significant reduction in the technical outlay during component assembly and can be manufactured more cost-effectively.
- copper-nickel connecting wires of different compositions were produced using an amorphous cobalt alloy.
- alternating field permeabilities at 1 kHz of approx. 3000 are achieved.
- the alternating field permeability drops to values around 1700.
- the magnetic tape cores 2 are subjected to a heat treatment, the magnetic properties improve significantly.
- the change Selfield permeabilities rise to values of approx. 250,000 (1 kHz) or 7,000 (1 MHz).
- FIG. 3 shows a temperature-time diagram that shows the component heating of a single-wire choke (b) according to the invention in comparison to a single-wire choke according to the prior art (a).
- a single-wire choke
- the single-line throttle according to the prior art reached a final temperature of 8 ° C., while the single-line throttle according to the invention warms up to a maximum of 68 ° C.
- the proposed design also ensures optimal thermal contact of the magnetic tape core 2 via the connecting wire 1 designed as a current-carrying conductor to the printed circuit board 5.
- an excess temperature occurring in the magnetic tape core 2 can be reduced to values which are compatible with the alloys used. In this way, the problem of aging, which is functionally dependent on the temperature, can be drastically minimized.
- circuit board 5 circuit board, circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
- Soft Magnetic Materials (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19745390 | 1997-10-14 | ||
DE19745390 | 1997-10-14 | ||
PCT/DE1998/002914 WO1999019889A1 (en) | 1997-10-14 | 1998-09-30 | Radio interference suppression choke |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1023736A1 true EP1023736A1 (en) | 2000-08-02 |
EP1023736B1 EP1023736B1 (en) | 2002-05-29 |
Family
ID=7845527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98958180A Expired - Lifetime EP1023736B1 (en) | 1997-10-14 | 1998-09-30 | Radio interference suppression choke |
Country Status (5)
Country | Link |
---|---|
US (1) | US6310534B1 (en) |
EP (1) | EP1023736B1 (en) |
JP (2) | JP4308426B2 (en) |
DE (1) | DE59804260D1 (en) |
WO (1) | WO1999019889A1 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19949298A1 (en) * | 1999-10-13 | 2001-04-19 | Meto International Gmbh | Security elements encased in a layer of powder coating for securing goods, as well as cast or injection-molded parts that contain such parts to protect against theft |
US20020036085A1 (en) * | 2000-01-24 | 2002-03-28 | Bass Ronald Marshall | Toroidal choke inductor for wireless communication and control |
KR100866057B1 (en) * | 2001-03-30 | 2008-10-31 | 니폰 케미콘 가부시키가이샤 | Inductance element and case |
US7023313B2 (en) * | 2003-07-16 | 2006-04-04 | Marvell World Trade Ltd. | Power inductor with reduced DC current saturation |
US7489219B2 (en) * | 2003-07-16 | 2009-02-10 | Marvell World Trade Ltd. | Power inductor with reduced DC current saturation |
US7307502B2 (en) | 2003-07-16 | 2007-12-11 | Marvell World Trade Ltd. | Power inductor with reduced DC current saturation |
US7872454B2 (en) * | 2003-08-21 | 2011-01-18 | Marvell World Trade Ltd. | Digital low dropout regulator |
US7760525B2 (en) * | 2003-08-21 | 2010-07-20 | Marvell World Trade Ltd. | Voltage regulator |
US8324872B2 (en) | 2004-03-26 | 2012-12-04 | Marvell World Trade, Ltd. | Voltage regulator with coupled inductors having high coefficient of coupling |
US7190152B2 (en) * | 2004-07-13 | 2007-03-13 | Marvell World Trade Ltd. | Closed-loop digital control system for a DC/DC converter |
JP4877455B2 (en) * | 2005-03-28 | 2012-02-15 | ミツミ電機株式会社 | Secondary battery protection module and lead mounting method |
US8018310B2 (en) | 2006-09-27 | 2011-09-13 | Vishay Dale Electronics, Inc. | Inductor with thermally stable resistance |
CN101877440A (en) * | 2009-04-29 | 2010-11-03 | 深圳富泰宏精密工业有限公司 | Radiation shield connecting line |
WO2014125895A1 (en) | 2013-02-13 | 2014-08-21 | 株式会社村田製作所 | Electronic component |
KR101400458B1 (en) * | 2013-08-02 | 2014-05-27 | 금오공과대학교 산학협력단 | Choke coil manufacturing apparatus |
JP6326615B2 (en) * | 2013-12-24 | 2018-05-23 | 北川工業株式会社 | Noise filter terminal |
JP6610388B2 (en) * | 2016-04-01 | 2019-11-27 | 日立金属株式会社 | Power distribution member and magnetic core fixing structure |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4958134A (en) | 1987-09-04 | 1990-09-18 | Kabushiki Kaisha Toshiba | Noise suppression device comprising a toroid winding |
JP2637114B2 (en) * | 1987-09-22 | 1997-08-06 | 株式会社東芝 | Inductance element |
JPH02292805A (en) * | 1989-05-02 | 1990-12-04 | Toshiba Corp | Magnetic part |
JP2850640B2 (en) * | 1992-04-28 | 1999-01-27 | 株式会社デンソー | Hybrid integrated circuit device |
JPH07201610A (en) * | 1993-11-25 | 1995-08-04 | Mitsui Petrochem Ind Ltd | Inductance element and assembled element using this element |
JPH08172019A (en) * | 1994-12-19 | 1996-07-02 | Toshiba Corp | Inductance element |
-
1998
- 1998-09-30 US US09/529,399 patent/US6310534B1/en not_active Expired - Lifetime
- 1998-09-30 DE DE59804260T patent/DE59804260D1/en not_active Expired - Lifetime
- 1998-09-30 WO PCT/DE1998/002914 patent/WO1999019889A1/en active IP Right Grant
- 1998-09-30 JP JP2000516361A patent/JP4308426B2/en not_active Expired - Fee Related
- 1998-09-30 EP EP98958180A patent/EP1023736B1/en not_active Expired - Lifetime
-
2008
- 2008-05-20 JP JP2008132389A patent/JP4452808B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO9919889A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP1023736B1 (en) | 2002-05-29 |
DE59804260D1 (en) | 2002-07-04 |
US6310534B1 (en) | 2001-10-30 |
WO1999019889A1 (en) | 1999-04-22 |
JP2008263213A (en) | 2008-10-30 |
JP2001524746A (en) | 2001-12-04 |
JP4452808B2 (en) | 2010-04-21 |
JP4308426B2 (en) | 2009-08-05 |
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