EP0936485A1 - Elément optoélectronique - Google Patents

Elément optoélectronique Download PDF

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Publication number
EP0936485A1
EP0936485A1 EP98440023A EP98440023A EP0936485A1 EP 0936485 A1 EP0936485 A1 EP 0936485A1 EP 98440023 A EP98440023 A EP 98440023A EP 98440023 A EP98440023 A EP 98440023A EP 0936485 A1 EP0936485 A1 EP 0936485A1
Authority
EP
European Patent Office
Prior art keywords
optical
optoelectronic component
component according
optoelectronic
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP98440023A
Other languages
German (de)
English (en)
Inventor
Alwin Göth
Klaus Adam
Werner Dr. Rehm
Matjaz Dr. Florjancic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oclaro North America Inc
Original Assignee
Alcatel CIT SA
Alcatel SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel CIT SA, Alcatel SA filed Critical Alcatel CIT SA
Priority to EP98440023A priority Critical patent/EP0936485A1/fr
Publication of EP0936485A1 publication Critical patent/EP0936485A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4262—Details of housings characterised by the shape of the housing
    • G02B6/4265—Details of housings characterised by the shape of the housing of the Butterfly or dual inline package [DIP] type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4272—Cooling with mounting substrates of high thermal conductivity

Definitions

  • the invention relates to an optoelectronic component with at least an electrical and at least one optical connection.
  • Such an optoelectronic component can be produced inexpensively and can be easily installed.
  • electro-optical component which is an interface between Contains optics and electronics, i.e. the component is with a Optical fiber can be coupled, the optical signals in the component in electrical signals are converted.
  • the component contains a housing 1, which is provided with external contacts 2.
  • the housing 1 shown is in SMD technology trained, i.e. it can be printed on a flat circuit board can be put on and the external contacts 2 with conductor tracks of the printed circuit.
  • the housing 1 protruding ends of the external contacts 2 is one Printed circuit board 3 connected, one for the operation of the optical Component required electronic circuit 4 contains.
  • a part of the inner ends of the external contacts 2 can also be connected to a be thermally well conductive plate or the like. Connected and the derivative serve the heat from a component arranged above it.
  • the socket 5 is fixed, in which the end of the optical fiber 6 is guided.
  • the socket 5 is the counterpart to an MT connector.
  • MT connectors are known. she are for example from the company EUROPTlCS Ltd., Winston, Merseyside L35 IRZ, England.
  • MT connectors are designed to at least one optical fiber to another, also one Coupling device containing optical fibers. For this purpose the optical fiber is attached in such a way in a bore of the MT connector that its end is flush with the outer surface of the MT connector. For exact The MT connector is guided and adjusted on the outer surface, at which the optical fiber ends, two guide pins.
  • the optical waveguide 6 ends at an optical component 7, For example, a laser diode in which the fiber optic transmitted optical vibrations into electrical vibrations being transformed.
  • Fig. 2 the parts are identical to the parts shown in Fig. 1 are provided with the same reference numerals. It can also be seen that in the socket 5, a substrate 8 is attached, on which the The end of the optical waveguide 6 is guided and the optical component 7 as well as the electrical components required for its operation are arranged.
  • Fig. 3 is the substrate 8 with the optical arranged thereon Component 7 and the optical waveguide 6 coupled to it detect.
  • the optical waveguide 6 is, for example, in a V-shaped groove attached in the substrate 8.
  • the substrate 8 is in a recess 9 in the Plug 5 inserted and attached so that the free end of the Optical waveguide 6 in one of the recess 9 to the front side 10 of the Socket 5 extending bore 11 lies and its end flush with the outer surface of the end face 10 ends.
  • the socket 5 is also provided with the ends 12 on the end face 10, which for Take up the guide pin of the MT connector.
  • the end of the plug socket 5 facing away from the end face 10 is on the side and provided at the bottom with steps 13, the corresponding depressions 14th correspond in the housing 1. These are used for positive fastening the socket 5 in the housing 1.
  • the socket 5 can additionally be glued to the housing 1. It is also possible to connect the socket 5 only to be glued to the housing.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
EP98440023A 1998-02-12 1998-02-12 Elément optoélectronique Withdrawn EP0936485A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP98440023A EP0936485A1 (fr) 1998-02-12 1998-02-12 Elément optoélectronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP98440023A EP0936485A1 (fr) 1998-02-12 1998-02-12 Elément optoélectronique

Publications (1)

Publication Number Publication Date
EP0936485A1 true EP0936485A1 (fr) 1999-08-18

Family

ID=8235657

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98440023A Withdrawn EP0936485A1 (fr) 1998-02-12 1998-02-12 Elément optoélectronique

Country Status (1)

Country Link
EP (1) EP0936485A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001089275A2 (fr) * 2000-05-18 2001-11-22 Infineon Technologies North America Corp. Circuits integres et transducteurs electriquement connectes
US6550982B2 (en) 2000-07-18 2003-04-22 Infineon Technologies Ag Optoelectronic surface-mountable module and optoelectronic coupling unit
WO2003079098A2 (fr) * 2002-03-14 2003-09-25 Intel Corporation Boitier optique compact comprenant un connecteur optique modulaire
EP1535098A1 (fr) * 2002-09-05 2005-06-01 Telefonaktiebolaget LM Ericsson (publ) Encapsulation de puce optique en plastique

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994001987A1 (fr) * 1992-07-06 1994-01-20 Telefonaktiebolaget Lm Ericsson Module a composants
US5357672A (en) * 1993-08-13 1994-10-25 Lsi Logic Corporation Method and system for fabricating IC packages from laminated boards and heat spreader
US5590232A (en) * 1995-02-16 1996-12-31 Motorola, Inc. Optical package and method of making
WO1997005514A1 (fr) * 1995-08-02 1997-02-13 Cts Corporation Connecteur amovible pour fibres optiques, avec sous-ensemble optique et tete ameliores
US5647042A (en) * 1995-07-05 1997-07-08 Fujitsu Limited Optical link module connection system
US5689600A (en) * 1995-01-20 1997-11-18 Minnesota Mining And Manufacturing Company Electronic circuit structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994001987A1 (fr) * 1992-07-06 1994-01-20 Telefonaktiebolaget Lm Ericsson Module a composants
US5357672A (en) * 1993-08-13 1994-10-25 Lsi Logic Corporation Method and system for fabricating IC packages from laminated boards and heat spreader
US5689600A (en) * 1995-01-20 1997-11-18 Minnesota Mining And Manufacturing Company Electronic circuit structure
US5590232A (en) * 1995-02-16 1996-12-31 Motorola, Inc. Optical package and method of making
US5647042A (en) * 1995-07-05 1997-07-08 Fujitsu Limited Optical link module connection system
WO1997005514A1 (fr) * 1995-08-02 1997-02-13 Cts Corporation Connecteur amovible pour fibres optiques, avec sous-ensemble optique et tete ameliores

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001089275A2 (fr) * 2000-05-18 2001-11-22 Infineon Technologies North America Corp. Circuits integres et transducteurs electriquement connectes
WO2001089275A3 (fr) * 2000-05-18 2002-04-04 Infineon Technologies Corp Circuits integres et transducteurs electriquement connectes
US6969265B2 (en) 2000-05-18 2005-11-29 Infineon Technologies Ag Electrically connecting integrated circuits and transducers
US6550982B2 (en) 2000-07-18 2003-04-22 Infineon Technologies Ag Optoelectronic surface-mountable module and optoelectronic coupling unit
WO2003079098A2 (fr) * 2002-03-14 2003-09-25 Intel Corporation Boitier optique compact comprenant un connecteur optique modulaire
US6860642B2 (en) 2002-03-14 2005-03-01 Intel Corporation Compact optical package with modular optical connector
WO2003079098A3 (fr) * 2002-03-14 2006-04-06 Intel Corp Boitier optique compact comprenant un connecteur optique modulaire
EP1535098A1 (fr) * 2002-09-05 2005-06-01 Telefonaktiebolaget LM Ericsson (publ) Encapsulation de puce optique en plastique

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