EP0919644A1 - Process for obtaining a metallic composite band - Google Patents

Process for obtaining a metallic composite band Download PDF

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Publication number
EP0919644A1
EP0919644A1 EP98121473A EP98121473A EP0919644A1 EP 0919644 A1 EP0919644 A1 EP 0919644A1 EP 98121473 A EP98121473 A EP 98121473A EP 98121473 A EP98121473 A EP 98121473A EP 0919644 A1 EP0919644 A1 EP 0919644A1
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EP
European Patent Office
Prior art keywords
tin
layer
silver
alloy
coating
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Granted
Application number
EP98121473A
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German (de)
French (fr)
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EP0919644B1 (en
Inventor
Udo Dipl.-Ing. Adler
Klaus Dipl.-Ing. Schleicher
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Stolberger Metallwerke GmbH and Co KG
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Stolberger Metallwerke GmbH and Co KG
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/26—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36—Elongated material
    • C23C2/40—Plates; Strips
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver

Definitions

  • the invention relates to a method for producing a with a tin-silver alloy coated composite tape for the production of electrical contact components.
  • Tin-silver is a very good contact material. He is characterized above all by his low electrical resistance, its hardness and its abrasion resistance.
  • US-A-5 514 261 discloses in this context a way to galvanize a silver-tin alloy deposit from a cyanide-free bath.
  • the bath is made using silver as a nitrate or diamine complex, tin as a soluble tin (II) or tin (IV) compound and mercaptoalkane carboxylic acids and sulfonic acids. From this bathroom layers of silver-tin alloys with a silver content of about Separate 20% by weight to 99% by weight.
  • the silver content of a coating produced in this way is relatively high. Layers with a lower silver content cannot be achieved. Furthermore, the electroplated layer fine-celled with a slight micro-roughness. The layer is brittle and only tolerates low bending stresses.
  • the invention is based on the object Process to demonstrate which is the production of a high quality tin-silver coating on an electrically conductive base material.
  • the base material is then coated in a first coating step made of tin or a tin alloy.
  • a silver layer is deposited thereon.
  • the resulting diffusion processes create a tin-silver alloy layer. This points towards the initially heterogeneous one Layers improved properties.
  • the coating has a high electrical Conductivity and very good mechanical properties. It is abrasion resistant and hard. The thermal conductivity is also high.
  • the coating ensures effective corrosion protection and forms at the same time a soldering aid. This is particularly the case with electrical or electronic components advantageous.
  • the tin layer can be melted and the silver layer galvanically be applied, as provided for in claim 2. Furthermore, both the tin layer and the silver layer are applied galvanically (claim 3).
  • a Another advantageous procedure according to claim 4 is the tin layer in the hot-dip process and then the silver layer by sputtering, the so-called sputtering. It is also possible apply both the tin layer and the silver layer by sputtering (Claim 5).
  • a composite tape can be produced, which is high mechanical and physical requirements for the manufacture of electrical Contact components are sufficient.
  • the tin-silver alloy coating can also the temperature resistance under operating conditions compared to a conventional one Tin or tin-lead coating can be improved.
  • the composite tape is easy to process by punching, cutting, bending or deep drawing. Also has it has high strength with good spring properties.
  • the electrical Conductivity is high and solder wettability is good.
  • the coating applied is even in structure and thickness. Furthermore, it is non-porous. Thanks to the tin-silver alloy coating the base material is reliable against oxidation and Corrosion protected.
  • heat treatment in particular as diffusion annealing, can be provided be (claim 6).
  • the heat treatment ensures a reliable one Compensation for possible differences in concentration in the layer structure of the applied coating.
  • the heat treatment is preferably carried out of the composite tape in a continuous process with a temperature between 140 ° C and 180 ° C.
  • Chemical passivation can be used to protect against tarnishing before the heat treatment the surface using conventional inhibitors.
  • heat treatment can also be carried out on the tinned starting strip become.
  • a temperature range between 140 is also advantageous here and 180 ° C to look at.
  • the silver coating is applied in a further manufacturing step.
  • tin layer applied in the first coating step there is also tin proven a tin alloy with portions of lead.
  • the tin layer becomes molten
  • a tin alloy has also proven advantageous, the 0.1 to 10% by weight of at least one of the elements from the group silver, Aluminum, silicon, copper, magnesium, iron, nickel, manganese, zinc, zirconium, Contains antimony, rhodium, palladium and platinum.
  • the rest is made of tin including unavoidable impurities and low deoxidation and processing additives.
  • a cobalt-containing tin alloy with a cobalt content can also be used between 0.001 to 5.0% by weight. Furthermore, this tin alloy can be 0.1 to 10% by weight bismuth and / or 0.1 to 10% by weight indium may be added.
  • cobalt leads to the formation of a fine-grained, uniform intermetallic Funded phase between base material and coating. Further the overall layer hardness is increased while the bendability is improved. Furthermore the shear strength can be improved and the elastic modulus reduced. bismuth and indium lead to an additional increase in hardness through mixed crystal hardening.
  • the invention enables the production of one in its mechanical and physical Properties of high quality coating made of a tin-silver alloy the initial volume.
  • the tin layer in a thickness between 0.5 microns and 10.0 microns applied, preferably between 0.8 ⁇ m and 3.0 ⁇ m.
  • the subsequent silver layer has a thickness between 0.1 ⁇ m and 3.5 ⁇ m, preferably between 0.2 ⁇ m and 1.0 ⁇ m. This heterogeneous layers then homogenize by diffusion into a tin-silver alloy layer.
  • the composite tape according to the invention is therefore particularly good for the production of electrical contact components suitable, which bending and shear stresses are exposed, for example from electrical plug or clamp connectors.
  • electrical plug or clamp connectors Such Connectors can be inserted and removed several times without the contact resistance changes significantly.
  • composite material produced according to the invention can also be used for production of electromechanical and electro-optical components or semiconductor components and the like are used.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Laminated Bodies (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Coating With Molten Metal (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
  • Wire Processing (AREA)
  • Manufacture Of Switches (AREA)
  • Continuous Casting (AREA)

Abstract

A strip consisting of an electrically conductive base material is first provided with a layer of tin or a tin alloy, and subsequently a layer of silver is precipitated onto this layer.

Description

Die Erfindung betrifft ein Verfahren zur Herstellung eines mit einer Zinn-Silber-Legierung beschichteten Verbundbands zur Fertigung von elektrischen Kontaktbauteilen.The invention relates to a method for producing a with a tin-silver alloy coated composite tape for the production of electrical contact components.

Zinn-Silber ist ein sehr guter Kontaktwerkstoff. Er zeichnet sich vor allem durch seinen geringen elektrischen Widerstand, seine Härte und seine Abriebfestigkeit aus.Tin-silver is a very good contact material. He is characterized above all by his low electrical resistance, its hardness and its abrasion resistance.

Die Möglichkeiten, einen elektrisch leitfähigen Basiswerkstoff galvanisch mit einer Zinn-Silber-Legierung zu überziehen, sind jedoch begrenzt. Die US-A-5 514 261 offenbart in diesem Zusammenhang einen Weg, eine Silber-Zinn-Legierung galvanisch aus einem cyanidfreien Bad abzuscheiden. Das Bad wird unter Verwendung von Silber als Nitrat oder Diammin-Komplex, Zinn als lösliche Zinn(II)- oder Zinn(IV)-Verbindung und Mercaptoalkancarbonsäuren und -sulfonsäuren zubereitet. Aus diesem Bad lassen sich Schichten aus Silber-Zinn-Legierungen mit einem Silbergehalt von etwa 20 Gew.% bis 99 Gew.% abscheiden.The possibilities of galvanically using an electrically conductive base material However, tin-silver alloy plating is limited. US-A-5 514 261 discloses in this context a way to galvanize a silver-tin alloy deposit from a cyanide-free bath. The bath is made using silver as a nitrate or diamine complex, tin as a soluble tin (II) or tin (IV) compound and mercaptoalkane carboxylic acids and sulfonic acids. From this bathroom layers of silver-tin alloys with a silver content of about Separate 20% by weight to 99% by weight.

Der Silberanteil einer auf diese Weise hergestellten Beschichtung ist relativ hoch. Schichten mit geringeren Silberanteilen können nicht erzielt werden. Ferner ist die galvanisch erzeugte Schicht feinzellig mit einer leichten Mikrorauhigkeit. Die Schicht ist spröde und verträgt nur geringe Biegebeanspruchungen.The silver content of a coating produced in this way is relatively high. Layers with a lower silver content cannot be achieved. Furthermore, the electroplated layer fine-celled with a slight micro-roughness. The layer is brittle and only tolerates low bending stresses.

Der Erfindung liegt ausgehend vom Stand der Technik die Aufgabe zugrunde, ein Verfahren aufzuzeigen, welches die Herstellung einer qualitativ hochwertigen Zinn-Silber-Beschichtung auf einem elektrisch leitfähigen Basiswerkstoff ermöglicht. Based on the prior art, the invention is based on the object Process to demonstrate which is the production of a high quality tin-silver coating on an electrically conductive base material.

Die Lösung dieser Aufgabe besteht nach der Erfindung in den Merkmalen des Anspruchs 1.This object is achieved according to the invention in the features of the claim 1.

Danach wird der Basiswerkstoff in einem ersten Beschichtungsschritt mit einer Beschichtung aus Zinn oder einer Zinnlegierung versehen. In einem zweiten Beschichtungsschritt wird hierauf eine Silberschicht abgeschieden.The base material is then coated in a first coating step made of tin or a tin alloy. In a second coating step a silver layer is deposited thereon.

Durch die sich einstellenden Diffusionsvorgänge entsteht eine Zinn-Silber-Legierungsschicht. Diese weist gegenüber den zunächst heterogen aufgebrachten Schichten verbesserte Eigenschaften auf. Die Beschichtung besitzt eine hohe elektrische Leitfähigkeit und sehr gute mechanische Eigenschaften. Sie ist abriebfest und hart. Auch die Wärmeleitfähigkeit ist hoch.The resulting diffusion processes create a tin-silver alloy layer. This points towards the initially heterogeneous one Layers improved properties. The coating has a high electrical Conductivity and very good mechanical properties. It is abrasion resistant and hard. The thermal conductivity is also high.

Die Beschichtung sichert einen wirksamen Korrosionsschutz und bildet gleichzeitig eine Löthilfe. Dies ist insbesondere bei elektrischen oder elektronischen Komponenten von Vorteil.The coating ensures effective corrosion protection and forms at the same time a soldering aid. This is particularly the case with electrical or electronic components advantageous.

Vorteilhafte Weiterbildungen der Erfindung ergeben sich aus den abhängigen Ansprüchen 2 bis 8.Advantageous developments of the invention result from the dependent claims 2 to 8.

Als Basiswerkstoff können grundsätzlich alle für elektrotechnische Anwendungen übliche Metalle und Metalllegierungen mit guter elektrischer Leitfähigkeit eingesetzt werden, wobei Kupfer und Kupferlegierungen besonders bevorzugt sind (Anspruch 8). Kupferwerkstoffe zeichnen sich durch ihre hohe elektrische Leitfähigkeit aus. Zum Schutz gegen Korrosion und Verschleiß sowie zur Erhöhung der Oberflächenhärte ist es üblich, den Kupferwerkstoff mit einem metallischen Überzug zu versehen. In diesem Zusammenhang zählt es zum Stand der Technik, ein Band aus einem Kupferwerkstoff entweder galvanisch mit Zinn zu beschichten oder auf ein Kupferband in einem Schmelzbad Zinn oder eine Zinn-Blei-Legierung aufzubringen. Basically, all common for electrical engineering applications can be used Metals and metal alloys with good electrical conductivity are used, copper and copper alloys being particularly preferred (claim 8). Copper materials are characterized by their high electrical conductivity. To the Protection against corrosion and wear and to increase the surface hardness it is customary to provide the copper material with a metallic coating. In this Context, it is part of the state of the art, a band made of a copper material either galvanically coated with tin or on a copper tape apply tin or a tin-lead alloy to a weld pool.

Neben Kupfer ist aber auch die Verwendung von Zinnbronze, Messing oder niedrig legierten Kupferlegierungen, beispielsweise CuFe2, als Basiswerkstoff möglich.In addition to copper, there is also the use of tin bronze, brass or low-alloy Copper alloys, for example CuFe2, are possible as the base material.

Die Zinnschicht kann auf schmelzflüssigem Wege und die Silberschicht galvanisch aufgebracht werden, wie dies Anspruch 2 vorsieht. Ferner können sowohl die Zinnschicht als auch die Silberschicht galvanisch aufgebracht werden (Anspruch 3). Eine weitere vorteilhafte Vorgehensweise besteht nach Anspruch 4 darin, die Zinnschicht im Schmelztauchverfahren und die Silberschicht anschließend durch Kathodenzerstäubung, dem sogenannten Sputtern, aufzubringen. Möglich ist es desweiteren, sowohl die Zinnschicht als auch die Silberschicht durch Sputtern aufzutragen (Anspruch 5).The tin layer can be melted and the silver layer galvanically be applied, as provided for in claim 2. Furthermore, both the tin layer and the silver layer are applied galvanically (claim 3). A Another advantageous procedure according to claim 4 is the tin layer in the hot-dip process and then the silver layer by sputtering, the so-called sputtering. It is also possible apply both the tin layer and the silver layer by sputtering (Claim 5).

Speziell durch die Kombination der schmelzflüssigen Verzinnung (Feuerverzinnung) des Ausgangsbands in einer Schichtdicke von 0,5 µm bis 10,0 µm und anschließender galvanischer Nachversilberung mit einer Dicke der aufgebrachten Silberschicht zwischen 0,1 µm bis 3,5 µm kann ein Verbundband hergestellt werden, welches hohen mechanischen und physikalischen Anforderungen zur Fertigung von elektrischen Kontaktbauteilen genügt. Durch die Zinn-Silber-Legierungsbeschichtung kann auch die Temperaturbeständigkeit unter Betriebsbedingungen im Vergleich zu einer herkömmlichen Zinn- oder Zinn-Blei-Beschichtung verbessert werden. Das Verbundband ist gut verarbeitbar durch Stanzen, Schneiden, Biegen oder Tiefziehen. Ferner verfügt es über eine hohe Festigkeit mit guten Federeigenschaften. Die elektrische Leitfähigkeit ist hoch und die Lotbenetzbarkeit gut. Der aufgebrachte Überzug ist gleichmäßig in Struktur und Dicke. Desweiteren ist er porenfrei. Durch die Zinn-Silber-Legierungsbeschichtung wird der Basiswerkstoff zuverlässig gegen Oxidation und Korrosion geschützt.Especially through the combination of molten tinning (hot-dip tinning) of the starting strip in a layer thickness of 0.5 µm to 10.0 µm and subsequent galvanic silver plating with a thickness of the applied silver layer Between 0.1 µm and 3.5 µm, a composite tape can be produced, which is high mechanical and physical requirements for the manufacture of electrical Contact components are sufficient. The tin-silver alloy coating can also the temperature resistance under operating conditions compared to a conventional one Tin or tin-lead coating can be improved. The composite tape is easy to process by punching, cutting, bending or deep drawing. Also has it has high strength with good spring properties. The electrical Conductivity is high and solder wettability is good. The coating applied is even in structure and thickness. Furthermore, it is non-porous. Thanks to the tin-silver alloy coating the base material is reliable against oxidation and Corrosion protected.

Zusätzlich kann eine Wärmebehandlung, insbesondere als Diffusionsglühung, vorgesehen werden (Anspruch 6). Die Wärmebehandlung gewährleistet einen zuverlässigen Ausgleich von möglicherweise noch vorhandenen Konzentrationsunterschieden im Schichtaufbau des aufgebrachten Überzugs. Vorzugsweise erfolgt die Wärmebehandlung des Verbundbands in einem Durchlaufprozeß mit einer Temperatur zwischen 140° C und 180° C.In addition, heat treatment, in particular as diffusion annealing, can be provided be (claim 6). The heat treatment ensures a reliable one Compensation for possible differences in concentration in the layer structure of the applied coating. The heat treatment is preferably carried out of the composite tape in a continuous process with a temperature between 140 ° C and 180 ° C.

Vor der Wärmebehandlung kann zum Schutz gegen Anlaufen eine chemische Passivierung der Oberfläche mittels üblicher Inhibitoren erfolgen.Chemical passivation can be used to protect against tarnishing before the heat treatment the surface using conventional inhibitors.

Grundsätzlich kann auch eine Wärmebehandlung am verzinnten Ausgangsband vorgenommen werden. Als vorteilhaft ist auch hier ein Temperaturbereich zwischen 140 und 180° C anzusehen. Im Anschluß an die Wärmebehandlung des verzinnten Ausgangsbands wird in einem weiteren Fertigungsschritt die Silberbeschichtung aufgetragen.In principle, heat treatment can also be carried out on the tinned starting strip become. A temperature range between 140 is also advantageous here and 180 ° C to look at. Following the heat treatment of the tinned starting strip the silver coating is applied in a further manufacturing step.

Für die im ersten Beschichtungsschritt aufgetragene Zinnschicht hat sich neben Zinn eine Zinnlegierung mit Anteilen von Blei bewährt. Wird die Zinnschicht auf schmelzflüssigem Wege aufgebracht, hat sich ferner eine Zinnlegierung als vorteilhaft erwiesen, die 0,1 bis 10 Gew.% mindestens eines der Elemente aus der Gruppe Silber, Aluminium, Silizium, Kupfer, Magnesium, Eisen, Nickel, Mangan, Zink, Zirkonium, Antimon, Rhodium, Palladium und Platin enthält. Der Rest besteht aus Zinn einschließlich unvermeidbarer Verunreinigungen und geringer Desoxidations- und Verarbeitungszusätze.For the tin layer applied in the first coating step, there is also tin proven a tin alloy with portions of lead. The tin layer becomes molten A tin alloy has also proven advantageous, the 0.1 to 10% by weight of at least one of the elements from the group silver, Aluminum, silicon, copper, magnesium, iron, nickel, manganese, zinc, zirconium, Contains antimony, rhodium, palladium and platinum. The rest is made of tin including unavoidable impurities and low deoxidation and processing additives.

Ferner kann eine kobalthaltige Zinnlegierung verwendet werden mit einem Kobaltanteil zwischen 0,001 bis 5,0 Gew.%. Desweiteren können dieser Zinnlegierung 0,1 bis 10 Gew.% Wismut und/oder 0,1 bis 10 Gew.% Indium zulegiert sein.A cobalt-containing tin alloy with a cobalt content can also be used between 0.001 to 5.0% by weight. Furthermore, this tin alloy can be 0.1 to 10% by weight bismuth and / or 0.1 to 10% by weight indium may be added.

Durch einen Kobaltzusatz wird die Ausbildung einer feinkörnigen gleichmäßigen intermetallischen Phase zwischen Basiswerkstoff und Beschichtung gefördert. Ferner wird die Gesamtschichthärte bei Verbesserung der Biegbarkeit erhöht. Desweiteren kann die Scherfestigkeit verbessert und der Elastizitätsmodul verringert werden. Wismut und Indium führen zu einer zusätzlichen Härtesteigerung durch Mischkristallhärtung. The addition of cobalt leads to the formation of a fine-grained, uniform intermetallic Funded phase between base material and coating. Further the overall layer hardness is increased while the bendability is improved. Furthermore the shear strength can be improved and the elastic modulus reduced. bismuth and indium lead to an additional increase in hardness through mixed crystal hardening.

Die Erfindung ermöglicht die Herstellung eines in ihren mechanischen und physikalischen Eigenschaften hochwertigen Überzugs aus einer Zinn-Silber-Legierung auf dem Ausgangsband. Gemäß den Merkmalen des Anspruchs 7 wird die Zinnschicht in einer Dicke zwischen 0,5 µm und 10,0 µm aufgebracht, wobei sie vorzugsweise zwischen 0,8 µm und 3,0 µm liegt. Die nachfolgende Silberschicht weist eine Dicke zwischen 0,1 µm und 3,5 µm auf, vorzugsweise zwischen 0,2 µm und 1,0 µm. Diese heterogenen Schichten homogenisieren anschließend durch Diffusion zu einer Zinn-Silber-Legierungsschicht.The invention enables the production of one in its mechanical and physical Properties of high quality coating made of a tin-silver alloy the initial volume. According to the features of claim 7, the tin layer in a thickness between 0.5 microns and 10.0 microns applied, preferably between 0.8 µm and 3.0 µm. The subsequent silver layer has a thickness between 0.1 µm and 3.5 µm, preferably between 0.2 µm and 1.0 µm. This heterogeneous layers then homogenize by diffusion into a tin-silver alloy layer.

Das erfindungsgemäße Verbundband ist daher besonders gut für die Fertigung von elektrischen Kontaktbauteilen geeignet, welche Biege- und Scherbeanspruchungen ausgesetzt sind, beispielsweise von elektrischen Steck- oder Klemmverbindern. Solche Verbinder können mehrfach gesteckt und gelöst werden, ohne daß sich der Kontaktwiderstand nennenswert ändert.The composite tape according to the invention is therefore particularly good for the production of electrical contact components suitable, which bending and shear stresses are exposed, for example from electrical plug or clamp connectors. Such Connectors can be inserted and removed several times without the contact resistance changes significantly.

Ferner kann das erfindungsgemäß hergestellte Verbundmaterial auch für die Fertigung von elektromechanischen und elektrooptischen Bauelementen oder Halbleiterbauelementen und ähnlichem Verwendung finden.Furthermore, the composite material produced according to the invention can also be used for production of electromechanical and electro-optical components or semiconductor components and the like are used.

Claims (8)

Verfahren zur Herstellung eines metallischen Verbundbands zur Fertigung von elektrischen Kontaktbauteilen, bei welchem ein Ausgangsband aus einem elektrisch leitfähigen Basiswerkstoff zunächst mit einer Schicht aus Zinn oder einer Zinnlegierung versehen und anschließend hierauf eine Schicht aus Silber abgeschieden wird.Process for the production of a metallic composite tape for the production of electrical contact components, in which an output band from an electrical conductive base material first with a layer of tin or a Tin alloy and then deposited a layer of silver becomes. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Zinnschicht schmelzflüssig und die Silberschicht galvanisch aufgebracht werden.A method according to claim 1, characterized in that the tin layer is molten and the silver layer is applied galvanically. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Zinnschicht und die Silberschicht galvanisch aufgebracht werden.A method according to claim 1, characterized in that the tin layer and the silver layer are applied galvanically. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Zinnschicht schmelzflüssig und die Silberschicht durch Kathodenzerstäubung (Sputtern) aufgebracht werden.A method according to claim 1, characterized in that the tin layer is molten and the silver layer is applied by sputtering. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Zinnschicht und die Silberschicht durch Kathodenzerstäubung (Sputtern) aufgebracht werden.A method according to claim 1, characterized in that the tin layer and the silver layer are applied by sputtering. Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß am Verbundband eine Wärmebehandlung, insbesondere ein Diffusionsglühen, vorgenommen wird.Method according to one of claims 1 to 5, characterized in that a heat treatment, in particular diffusion annealing, is carried out on the composite strip. Verfahren nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß die Zinnschicht in einer Dicke zwischen 0,5 µm und 10,0 µm und die Silberschicht in einer Dicke zwischen 0,1 µm und 3,5 µm aufgebracht werden. Method according to one of claims 1 to 6, characterized in that the tin layer is applied in a thickness between 0.5 µm and 10.0 µm and the silver layer in a thickness between 0.1 µm and 3.5 µm. Verfahren nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß als Basiswerkstoff Kupfer oder eine Kupferlegierung verwendet wird.Method according to one of claims 1 to 7, characterized in that copper or a copper alloy is used as the base material.
EP98121473A 1997-11-26 1998-11-11 Process for obtaining a metallic composite band Expired - Lifetime EP0919644B1 (en)

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DE19752329A DE19752329A1 (en) 1997-11-26 1997-11-26 Process for the production of a metallic composite tape
DE19752329 1997-11-26

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US6207035B1 (en) 2001-03-27
JPH11222659A (en) 1999-08-17
US20010004048A1 (en) 2001-06-21
DK0919644T3 (en) 2002-06-10
PT919644E (en) 2002-07-31
KR19990045402A (en) 1999-06-25
US6495001B2 (en) 2002-12-17
ATE213508T1 (en) 2002-03-15
EP0919644B1 (en) 2002-02-20
DE59803128D1 (en) 2002-03-28
DE19752329A1 (en) 1999-05-27

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