EP0685838A3 - - Google Patents
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- Publication number
- EP0685838A3 EP0685838A3 EP95303383A EP95303383A EP0685838A3 EP 0685838 A3 EP0685838 A3 EP 0685838A3 EP 95303383 A EP95303383 A EP 95303383A EP 95303383 A EP95303383 A EP 95303383A EP 0685838 A3 EP0685838 A3 EP 0685838A3
- Authority
- EP
- European Patent Office
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
- G11B5/60—Fluid-dynamic spacing of heads from record-carriers
- G11B5/6005—Specially adapted for spacing from a rotating disc using a fluid cushion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B21/00—Head arrangements not specific to the method of recording or reproducing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B21/00—Head arrangements not specific to the method of recording or reproducing
- G11B21/16—Supporting the heads; Supporting the sockets for plug-in heads
- G11B21/20—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier
- G11B21/21—Supporting the heads; Supporting the sockets for plug-in heads while the head is in operative position but stationary or permitting minor movements to follow irregularities in surface of record carrier with provision for maintaining desired spacing of head from record carrier, e.g. fluid-dynamic spacing, slider
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
- G11B5/3106—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
- G11B5/3173—Batch fabrication, i.e. producing a plurality of head structures in one batch
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/58—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head for the purpose of maintaining alignment of the head relative to the record carrier during transducing operation, e.g. to compensate for surface irregularities of the latter or for track following
- G11B5/60—Fluid-dynamic spacing of heads from record-carriers
- G11B5/6005—Specially adapted for spacing from a rotating disc using a fluid cushion
- G11B5/6082—Design of the air bearing surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
- Y10T29/49032—Fabricating head structure or component thereof
- Y10T29/49048—Machining magnetic material [e.g., grinding, etching, polishing]
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US248281 | 1994-05-23 | ||
US08/248,281 US5739048A (en) | 1994-05-23 | 1994-05-23 | Method for forming rows of partially separated thin film elements |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0685838A2 EP0685838A2 (en) | 1995-12-06 |
EP0685838A3 true EP0685838A3 (en) | 1996-01-03 |
Family
ID=22938444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP95303383A Withdrawn EP0685838A2 (en) | 1994-05-23 | 1995-05-22 | Method of producing thin film elements |
Country Status (7)
Country | Link |
---|---|
US (1) | US5739048A (en) |
EP (1) | EP0685838A2 (en) |
JP (1) | JP3098394B2 (en) |
KR (1) | KR100207878B1 (en) |
CN (1) | CN1099134C (en) |
MY (1) | MY125591A (en) |
TW (1) | TW275153B (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2322226B (en) * | 1996-02-15 | 1999-06-23 | Tdk Corp | Magnetic head apparatus |
US6360428B1 (en) * | 1998-04-16 | 2002-03-26 | Seagate Technology Llc | Glide heads and methods for making glide heads |
SG93218A1 (en) * | 1998-05-06 | 2002-12-17 | Tdk Corp | Thin-film magnetic head material and method of manufacturing same and method of manufacturing thin-film magnetic heads |
FR2781916B1 (en) * | 1998-07-28 | 2000-09-08 | Commissariat Energie Atomique | METHOD FOR THE COLLECTIVE REALIZATION OF INTEGRATED MAGNETIC HEADS WITH A SUPPORTING SURFACE OBTAINED BY PHOTOLITHOGRAPHY |
US6663817B1 (en) * | 1999-03-26 | 2003-12-16 | Hitachi Global Storage Technologies Netherlands, B.V. | Method for manufacture of sliders |
US6312313B1 (en) | 1999-10-06 | 2001-11-06 | Intenational Business Machines Corporation | Non-linear transducer lay-out of thin film head wafer for fabrication of high camber and crown sliders |
JP3332222B2 (en) * | 1999-10-21 | 2002-10-07 | ティーディーケイ株式会社 | Method for manufacturing slider material, method for manufacturing slider, and material for slider |
US6255621B1 (en) | 2000-01-31 | 2001-07-03 | International Business Machines Corporation | Laser cutting method for forming magnetic recording head sliders |
US6710295B1 (en) * | 2000-06-15 | 2004-03-23 | Hitachi Global Storage Technologies Netherlands, B.V. | Slider curvature modification by substrate melting effect produced with a pulsed laser beam |
KR100525568B1 (en) * | 2000-07-13 | 2005-11-03 | 시게이트 테크놀로지 엘엘씨 | Process and apparatus for finishing a magnetic slider |
US6676878B2 (en) | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
US7157038B2 (en) | 2000-09-20 | 2007-01-02 | Electro Scientific Industries, Inc. | Ultraviolet laser ablative patterning of microstructures in semiconductors |
US20060091126A1 (en) * | 2001-01-31 | 2006-05-04 | Baird Brian W | Ultraviolet laser ablative patterning of microstructures in semiconductors |
JP2004532013A (en) * | 2001-03-01 | 2004-10-21 | エピゲノミクス アーゲー | Methods, systems and computer program products for determining the biological effect and / or activity of a drug, chemical and / or pharmaceutical composition based on its effect on DNA methylation |
US6798931B2 (en) * | 2001-03-06 | 2004-09-28 | Digital Optics Corp. | Separating of optical integrated modules and structures formed thereby |
US20030066816A1 (en) * | 2001-09-17 | 2003-04-10 | Schultz Gary A. | Uniform patterning for deep reactive ion etching |
JP3793125B2 (en) * | 2002-07-18 | 2006-07-05 | 富士通株式会社 | Device chip manufacturing method |
US8053279B2 (en) * | 2007-06-19 | 2011-11-08 | Micron Technology, Inc. | Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpieces |
US7662669B2 (en) * | 2007-07-24 | 2010-02-16 | Northrop Grumman Space & Mission Systems Corp. | Method of exposing circuit lateral interconnect contacts by wafer saw |
US9165573B1 (en) | 2009-11-12 | 2015-10-20 | Western Digital (Fremont), Llc | Method for controlling camber on air bearing surface of a slider |
JP5701804B2 (en) * | 2012-03-23 | 2015-04-15 | 株式会社東芝 | Magnetic head slider inspection method, inspection program, and magnetic head manufacturing method |
US9242340B1 (en) | 2013-03-12 | 2016-01-26 | Western Digital Technologies, Inc. | Method to stress relieve a magnetic recording head transducer utilizing ultrasonic cavitation |
CN104647615A (en) * | 2013-11-15 | 2015-05-27 | 台湾暹劲股份有限公司 | Wafer cutting device and cutting method thereof |
EP3165615B1 (en) * | 2014-07-03 | 2022-12-21 | Nippon Steel Corporation | Use of a laser processing apparatus for refining magnetic domains of a grain-oriented electromagnetic steel sheet |
CN107188111A (en) * | 2017-05-27 | 2017-09-22 | 龙微科技无锡有限公司 | The splinter method of MEMS sensor wafer, MEMS sensor wafer |
CN115831736B (en) * | 2023-02-13 | 2023-05-05 | 成都万应微电子有限公司 | Cutting method of semiconductor material product |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4226018A (en) * | 1978-02-27 | 1980-10-07 | Nippon Telegraph And Telephone Public Corporation | Method for manufacturing a floating type thin film magnetic head |
JPS61181177A (en) * | 1985-02-07 | 1986-08-13 | Toshiba Corp | Semiconductor light-emitting element |
US4624048A (en) * | 1983-08-17 | 1986-11-25 | International Business Machines | Method of making magnetic head sliders |
JPH03222346A (en) * | 1990-01-26 | 1991-10-01 | Nec Corp | Manufacture of semiconductor element |
JPH04276645A (en) * | 1991-03-04 | 1992-10-01 | Toshiba Corp | Dicing method of compound semiconductor wafer |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3970819A (en) * | 1974-11-25 | 1976-07-20 | International Business Machines Corporation | Backside laser dicing system |
DE2730130C2 (en) * | 1976-09-14 | 1987-11-12 | Mitsubishi Denki K.K., Tokyo | Method for manufacturing semiconductor components |
IN154896B (en) * | 1980-07-10 | 1984-12-22 | Westinghouse Electric Corp | |
US4333229A (en) * | 1980-07-21 | 1982-06-08 | Memorex Corporation | Method of manufacturing thin film magnetic head/slider combination |
US4644641A (en) * | 1985-12-30 | 1987-02-24 | Memorex Corporation | Fabrication of "Delta" magnetic head-sliders |
US5196378A (en) * | 1987-12-17 | 1993-03-23 | Texas Instruments Incorporated | Method of fabricating an integrated circuit having active regions near a die edge |
US5095613A (en) * | 1990-06-29 | 1992-03-17 | Digital Equipment Corporation | Thin film head slider fabrication process |
US5272114A (en) * | 1990-12-10 | 1993-12-21 | Amoco Corporation | Method for cleaving a semiconductor crystal body |
US5418190A (en) * | 1993-12-30 | 1995-05-23 | At&T Corp. | Method of fabrication for electro-optical devices |
-
1994
- 1994-05-23 US US08/248,281 patent/US5739048A/en not_active Expired - Lifetime
-
1995
- 1995-01-25 TW TW084100654A patent/TW275153B/zh not_active IP Right Cessation
- 1995-03-16 JP JP07057499A patent/JP3098394B2/en not_active Expired - Fee Related
- 1995-04-14 MY MYPI95000973A patent/MY125591A/en unknown
- 1995-04-17 CN CN95105045A patent/CN1099134C/en not_active Expired - Lifetime
- 1995-05-22 KR KR1019950012726A patent/KR100207878B1/en not_active IP Right Cessation
- 1995-05-22 EP EP95303383A patent/EP0685838A2/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4226018A (en) * | 1978-02-27 | 1980-10-07 | Nippon Telegraph And Telephone Public Corporation | Method for manufacturing a floating type thin film magnetic head |
US4624048A (en) * | 1983-08-17 | 1986-11-25 | International Business Machines | Method of making magnetic head sliders |
JPS61181177A (en) * | 1985-02-07 | 1986-08-13 | Toshiba Corp | Semiconductor light-emitting element |
JPH03222346A (en) * | 1990-01-26 | 1991-10-01 | Nec Corp | Manufacture of semiconductor element |
JPH04276645A (en) * | 1991-03-04 | 1992-10-01 | Toshiba Corp | Dicing method of compound semiconductor wafer |
US5314844A (en) * | 1991-03-04 | 1994-05-24 | Kabushiki Kaisha Toshiba | Method for dicing a semiconductor wafer |
Non-Patent Citations (3)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 011, no. 004 (E - 468) 7 January 1987 (1987-01-07) * |
PATENT ABSTRACTS OF JAPAN vol. 015, no. 506 (E - 1148) 20 December 1991 (1991-12-20) * |
PATENT ABSTRACTS OF JAPAN vol. 017, no. 075 (E - 1320) 15 February 1993 (1993-02-15) * |
Also Published As
Publication number | Publication date |
---|---|
CN1099134C (en) | 2003-01-15 |
CN1122518A (en) | 1996-05-15 |
TW275153B (en) | 1996-05-01 |
MY125591A (en) | 2006-08-30 |
EP0685838A2 (en) | 1995-12-06 |
JPH07320249A (en) | 1995-12-08 |
KR100207878B1 (en) | 1999-07-15 |
JP3098394B2 (en) | 2000-10-16 |
US5739048A (en) | 1998-04-14 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): DE FR GB |
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AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): DE FR GB |
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K1C1 | Correction of patent application (title page) published |
Effective date: 19951206 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
17P | Request for examination filed |
Effective date: 19960308 |
|
18W | Application withdrawn |
Withdrawal date: 19960412 |