EP0360396A3 - Force delivery system for improved precision membrane probe - Google Patents

Force delivery system for improved precision membrane probe Download PDF

Info

Publication number
EP0360396A3
EP0360396A3 EP19890307836 EP89307836A EP0360396A3 EP 0360396 A3 EP0360396 A3 EP 0360396A3 EP 19890307836 EP19890307836 EP 19890307836 EP 89307836 A EP89307836 A EP 89307836A EP 0360396 A3 EP0360396 A3 EP 0360396A3
Authority
EP
European Patent Office
Prior art keywords
delivery system
test
improved precision
force delivery
membrane probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19890307836
Other languages
German (de)
French (fr)
Other versions
EP0360396A2 (en
Inventor
Richard E. Huff
Brian Leslie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of EP0360396A2 publication Critical patent/EP0360396A2/en
Publication of EP0360396A3 publication Critical patent/EP0360396A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film

Abstract

Disclosed is a test probe [10] for testing a test device [not shown], also known as a device under test, while precisely controlling the force exerted by the test probe [10] on the test device. Included is a translation means [18] as well as a support means [12] formed to have at least a first side and a second side. The support means [12] is coupled to the translation means [18]. Also included is at least one compression means [14] for delivering a force to a test device; the compression means [14] is coupled to the first side of the support means. A planar means [16] is coupled to the second side of the support means. Finally, at least one signal conducting means [24] is mounted on the planar means [16] for communicating an electric current between the test probe [10] and the test device [not shown].
EP19890307836 1988-09-23 1989-08-02 Force delivery system for improved precision membrane probe Withdrawn EP0360396A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US249481 1988-09-23
US07/249,481 US4980637A (en) 1988-03-01 1988-09-23 Force delivery system for improved precision membrane probe

Publications (2)

Publication Number Publication Date
EP0360396A2 EP0360396A2 (en) 1990-03-28
EP0360396A3 true EP0360396A3 (en) 1991-02-06

Family

ID=22943635

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19890307836 Withdrawn EP0360396A3 (en) 1988-09-23 1989-08-02 Force delivery system for improved precision membrane probe

Country Status (3)

Country Link
US (1) US4980637A (en)
EP (1) EP0360396A3 (en)
JP (1) JPH02126159A (en)

Families Citing this family (51)

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JPH07109840B2 (en) * 1989-03-10 1995-11-22 松下電器産業株式会社 Semiconductor IC test apparatus and test method
US5264787A (en) * 1991-08-30 1993-11-23 Hughes Aircraft Company Rigid-flex circuits with raised features as IC test probes
US5422574A (en) * 1993-01-14 1995-06-06 Probe Technology Corporation Large scale protrusion membrane for semiconductor devices under test with very high pin counts
US5412866A (en) * 1993-07-01 1995-05-09 Hughes Aircraft Company Method of making a cast elastomer/membrane test probe assembly
US5469072A (en) * 1993-11-01 1995-11-21 Motorola, Inc. Integrated circuit test system
KR0140034B1 (en) 1993-12-16 1998-07-15 모리시다 요이치 Semiconductor wafer case, connection method and apparatus, and inspection method for semiconductor integrated circuit, probe card, and its manufacturing method
US5600259A (en) * 1993-12-17 1997-02-04 International Business Machines Corporation Method and apparatus for reducing interference in a pin array
DE4418679A1 (en) * 1994-05-28 1995-11-30 Telefunken Microelectron Integrated circuit interconnect system for wafer test
JPH10506459A (en) * 1994-09-09 1998-06-23 マイクロモジュール・システムズ Circuit membrane probe
JPH10505162A (en) * 1994-09-09 1998-05-19 マイクロモジュール・システムズ Circuit membrane probe
JP2978720B2 (en) 1994-09-09 1999-11-15 東京エレクトロン株式会社 Probe device
WO1996013967A1 (en) * 1994-10-28 1996-05-09 Micromodule Systems Programmable high density electronic testing device
US5629630A (en) * 1995-02-27 1997-05-13 Motorola, Inc. Semiconductor wafer contact system and method for contacting a semiconductor wafer
US5773986A (en) * 1995-04-03 1998-06-30 Motorola, Inc Semiconductor wafer contact system and method for contacting a semiconductor wafer
US5621333A (en) * 1995-05-19 1997-04-15 Microconnect, Inc. Contact device for making connection to an electronic circuit device
TW300954B (en) * 1995-07-14 1997-03-21 Tokyo Electron Co Ltd The probe card used in prober
US6046599A (en) * 1996-05-20 2000-04-04 Microconnect, Inc. Method and device for making connection
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US5973405A (en) 1997-07-22 1999-10-26 Dytak Corporation Composite electrical contact structure and method for manufacturing the same
US5990695A (en) * 1998-01-16 1999-11-23 Packard Hughes Interconnect Co. Membrane test probe
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6343369B1 (en) * 1998-09-15 2002-01-29 Microconnect, Inc. Methods for making contact device for making connection to an electronic circuit device and methods of using the same
US6084420A (en) * 1998-11-25 2000-07-04 Chee; Wan Soo Probe assembly for testing
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6838890B2 (en) * 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6496026B1 (en) 2000-02-25 2002-12-17 Microconnect, Inc. Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground
DE10143173A1 (en) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafer probe has contact finger array with impedance matching network suitable for wide band
JP2003004765A (en) * 2001-06-22 2003-01-08 Soushiyou Tec:Kk Press contact structure of probe unit
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
US7015707B2 (en) * 2002-03-20 2006-03-21 Gabe Cherian Micro probe
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
GB0412728D0 (en) * 2004-06-08 2004-07-07 Cooke Michael Novel electroplated IC probe card designs
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7764076B2 (en) * 2007-02-20 2010-07-27 Centipede Systems, Inc. Method and apparatus for aligning and/or leveling a test head
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
JP5325085B2 (en) * 2009-12-24 2013-10-23 日本碍子株式会社 Connection device
US9435855B2 (en) 2013-11-19 2016-09-06 Teradyne, Inc. Interconnect for transmitting signals between a device and a tester
US9594114B2 (en) 2014-06-26 2017-03-14 Teradyne, Inc. Structure for transmitting signals in an application space between a device under test and test electronics
US9977052B2 (en) 2016-10-04 2018-05-22 Teradyne, Inc. Test fixture
US10677815B2 (en) 2018-06-08 2020-06-09 Teradyne, Inc. Test system having distributed resources
US11363746B2 (en) 2019-09-06 2022-06-14 Teradyne, Inc. EMI shielding for a signal trace
US11862901B2 (en) 2020-12-15 2024-01-02 Teradyne, Inc. Interposer
CN114019201A (en) * 2021-09-29 2022-02-08 杭州长川科技股份有限公司 Module testing device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0230348A2 (en) * 1986-01-07 1987-07-29 Hewlett-Packard Company Test probe
EP0259163A2 (en) * 1986-09-05 1988-03-09 Tektronix, Inc. Semiconductor wafer probe
EP0283219A2 (en) * 1987-03-11 1988-09-21 Hewlett-Packard Company Apparatus for automatically scrubbing a surface
EP0331282A1 (en) * 1988-03-01 1989-09-06 Hewlett-Packard Company Membrane-based IC test probe with precisely positioned contacts

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4636722A (en) * 1984-05-21 1987-01-13 Probe-Rite, Inc. High density probe-head with isolated and shielded transmission lines
US4758785A (en) * 1986-09-03 1988-07-19 Tektronix, Inc. Pressure control apparatus for use in an integrated circuit testing station

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0230348A2 (en) * 1986-01-07 1987-07-29 Hewlett-Packard Company Test probe
EP0259163A2 (en) * 1986-09-05 1988-03-09 Tektronix, Inc. Semiconductor wafer probe
EP0283219A2 (en) * 1987-03-11 1988-09-21 Hewlett-Packard Company Apparatus for automatically scrubbing a surface
EP0331282A1 (en) * 1988-03-01 1989-09-06 Hewlett-Packard Company Membrane-based IC test probe with precisely positioned contacts

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEW FRONTIERS IN TESTING, INTERNATIONAL TEST CONFERENCE PROCEEDINGS, Washington, DC, 12th - 14th September 1988, cat. no. 88CH2610-4, pages 601-607, IEEE, New York, US; B. LESLIE et al.: "Membrane probe card technology" *

Also Published As

Publication number Publication date
JPH02126159A (en) 1990-05-15
EP0360396A2 (en) 1990-03-28
US4980637A (en) 1990-12-25

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