EP0325701A1 - Antenna structure - Google Patents
Antenna structure Download PDFInfo
- Publication number
- EP0325701A1 EP0325701A1 EP88117439A EP88117439A EP0325701A1 EP 0325701 A1 EP0325701 A1 EP 0325701A1 EP 88117439 A EP88117439 A EP 88117439A EP 88117439 A EP88117439 A EP 88117439A EP 0325701 A1 EP0325701 A1 EP 0325701A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- elements
- antenna
- conducting
- heat
- electromagnetic wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/28—Adaptation for use in or on aircraft, missiles, satellites, or balloons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
Definitions
- the weight factor is of crucial importance for aerospace applications.
- high dimensional stability is always required for both applications. This means that the antenna must be resistant to deformation against loads (aerodynamic loads, acceleration at start), against low-frequency vibrations or the thermal loads that occur in space.
- the integration of elements that conduct electromagnetic waves can relate, for example, to the field of low-frequency currents.
- An example of this are feed lines. These are realized by embedding conductive wires or conductive strips in or on the structures made of non-conductive plastic.
- An advantage is the elimination of additional weights due to insulation and connecting elements.
- the integration can also be carried out to such an extent that entire parts of the supporting structure are designed as electronic boards. This can be done, for example, by producing the relevant structural parts from non-conductive high-performance fibers such as SiC, aramid or PE.
- the conductor tracks and fastenings of the components can be carried out using customary techniques.
- the advantage is, in turn, the additional weight savings due to the elimination boards.
- signal lines can be made by embedding the line together with an insulating jacket in a CFRP structure.
- the insulation is designed, for example, as a load-bearing element with a reinforcement made of non-conductive fibers.
- the structure can be, for example, like a coaxial cable or like a waveguide. If the screening effect of the CFRP is not sufficient, the insulation can be done, for example, with metallized fibers with high high-frequency conductivity, whereby these fibers can also be designed to be load-bearing.
- electromagnetic wave guiding elements can also relate to the optical wave range.
- own fiber optic cables as optical signal lines are superfluous.
- this is done by embedding the signal-carrying glass fiber in the structure, which consists of fiber-reinforced plastics.
- the implementation can be facilitated, for example, by incorporating the glass fiber into rovings or fabric made from the supporting fibers. Again, additional weight due to the sheaths of the glass fiber cable is advantageously eliminated.
Abstract
Description
Die Erfindung betrifft eine tragende Struktur einer Antenne für Luft- und Raumfahrtanwendungen, insbesondere für eine aktive Mikrowellenantenne aus faserverstärktem Kunststoff.The invention relates to a supporting structure of an antenna for aerospace applications, in particular for an active microwave antenna made of fiber-reinforced plastic.
Für Luft- und Raumfahrtanwendungen kommt dem Faktor des Gewichts eine entscheidende Bedeutung zu. Für beiden Anwendungen ist daneben stets eine hohe Dimensionsstabilität gefordert. Das heißt, die Antenne muß gegenüber den Lasten (aerodynamische Lasten, Beschleunigung beim Start), gegenüber niederfrequenten Schwingungen oder den thermischen Belastungen, wie sie im Weltall auftreten, verformungsstabil sein.The weight factor is of crucial importance for aerospace applications. In addition, high dimensional stability is always required for both applications. This means that the antenna must be resistant to deformation against loads (aerodynamic loads, acceleration at start), against low-frequency vibrations or the thermal loads that occur in space.
Aufgabe der Erfindung ist es daher, eine faserverstärkte tragende Struktur zu schaffen, die es erlaubt, eine dimensionsstabile Antenne, insbesondere eine aktive Antenne, noch leichter zu bauen als bisher.The object of the invention is therefore to create a fiber-reinforced supporting structure which allows a dimensionally stable antenna, in particular an active antenna, to be built even more easily than before.
Diese Aufgabe wird erfindungsgemäß gelöst durch eine Integration vom wärmeleitenden und/oder elektromagnetische Wellen leitenden Elementen in die tragende Struktur.This object is achieved according to the invention by integrating heat-conducting and / or electromagnetic wave-conducting elements into the supporting structure.
Ausführungen der Erfindung sind Gegenstände von Unteran sprüchen.Embodiments of the invention are subjects of Unteran sayings.
Die Integration wärmeleitender Schichten in die tragende Struktur kann dadurch erfolgen, daß wärmeleitende Schichten, die ebenfalls aus faserverstärkten Materialen wie CFK bestehen, in die tragende Struktur integriert werden oder diese bilden. Die bisher üblichen wärmeabführenden Elemente, wie Wärmerohre, Dopplerbleche oder Strahlungsflächen entfallen, wodurch Gewicht gespart wird. Durch breite Versteifungsstege und durchgehende Fasern wird die Wärmeleitung erhöht. Eine Verteilung "heißer" Bauteile über die ganze Antennenfläche fördert die Abstrahlung bei relativ gleichmäßiger Temperatur. Durch Beschichtung mit Thermallack kann der Wärmeaustausch durch Strahlung innerhalb der hohlen Räume zwischen den Stegen vergrößert werden.The integration of heat-conducting layers in the supporting structure can take place by integrating or forming heat-conducting layers, which likewise consist of fiber-reinforced materials such as CFRP, in the supporting structure. The previously usual heat-dissipating elements, such as heat pipes, Doppler plates or radiation surfaces, are no longer required, which saves weight. The heat conduction is increased by wide stiffening webs and continuous fibers. A distribution of "hot" components over the entire antenna area promotes radiation at a relatively uniform temperature. By coating with thermal lacquer, the heat exchange by radiation within the hollow spaces between the webs can be increased.
Die Integration von Elementen, die elektromagnetische Wellen leiten, kann sich zum Beispiel auf das Gebiet der niederfrequenten Ströme beziehen. Ein Beispiel dafür sind Speiseleitungen. Diese werden realisiert durch Einbettung von leitfähigen Drähten oder von leitfähigen Streifen in oder auf die aus nichtleitendem Kunststoff bestehenden Strukturen. Als Vorteil ist der Wegfall von Zusatzgewichten durch Isolation und Verbindungselemente zu nennen. Die Integration kann auch so weit geführt werden, daß ganze Teile der tragenden Struktur als Elektronikplatinen ausgeführt werden.
Dies kann zum Beispiel dadurch erfolgen, daß die relevanten Strukturteile aus nichtleitenden Hochleistungsfasern wie zum Beispiel SiC, Aramid oder PE hergestellt werden. Die Leiterbahnen und Befestigungen der Bauelemente können mit üblichen verfügbaren Techniken erfolgen. Der Vorteil ist wiederum die Gewichtsersparnis durch den Wegfall zusätz licher Platinen.
Ein weiteres Beispiel einer erfindungsgemäßen Integration ist der Einbau von hochfrequenz-leitenden Strukturen in die tragende Struktur. So können zum Beispiel Signalleitungen durch Einbettung der Leitung samt einer isolierenden Umhüllung in eine CFK-Struktur erfolgen. Die Isolierung wird zum Beispiel als mittragendes Element mit einer Verstärkung aus nichtleitenden Fasern ausgelegt. Der Aufbau kann zum Beispiel wie ein Koaxkabel oder wie ein Hohlleiter sein. Falls die Abschirmwirkung des CFK nicht ausreicht, kann die Isolierung zum Beispiel mit metallisierten Fasern hoher Hochfrequenzleitfähigkeit erfolgen., wobei diese Fasern auch wieder mittragend ausgelegt werden können.The integration of elements that conduct electromagnetic waves can relate, for example, to the field of low-frequency currents. An example of this are feed lines. These are realized by embedding conductive wires or conductive strips in or on the structures made of non-conductive plastic. An advantage is the elimination of additional weights due to insulation and connecting elements. The integration can also be carried out to such an extent that entire parts of the supporting structure are designed as electronic boards.
This can be done, for example, by producing the relevant structural parts from non-conductive high-performance fibers such as SiC, aramid or PE. The conductor tracks and fastenings of the components can be carried out using customary techniques. The advantage is, in turn, the additional weight savings due to the elimination boards.
Another example of an integration according to the invention is the installation of high-frequency conductive structures in the supporting structure. For example, signal lines can be made by embedding the line together with an insulating jacket in a CFRP structure. The insulation is designed, for example, as a load-bearing element with a reinforcement made of non-conductive fibers. The structure can be, for example, like a coaxial cable or like a waveguide. If the screening effect of the CFRP is not sufficient, the insulation can be done, for example, with metallized fibers with high high-frequency conductivity, whereby these fibers can also be designed to be load-bearing.
Ein weiteres Beispiel für die Integration ist zum Beispiel der Einbau eines gehäuselosen Gerätes, wie eines Senders oder Empfängers, in ein durch die Struktur gebildetes abgeschlossenes Fach, dessen Innenseite mit einer dünnen Beschichtung (zum Beispiel 10 µm) mit einem hochleitfähigem Metall (zum Beispiel Gold) versehen ist. Als Vorteil ergibt sich wiederum eine Gewichtsersparnis.Another example of integration is, for example, the installation of a housing-free device, such as a transmitter or receiver, in a compartment formed by the structure, the inside of which is coated with a thin coating (for example 10 µm) with a highly conductive metal (for example gold) ) is provided. Another advantage is a weight saving.
Die Integration von elektromagnetische Wellen leitenden Elementen kann sich auch auf den optischen Wellenbereich beziehen. In diesem Fall werden eigene Glasfaserkabel als optische Signalleitungen überflüssig. Erfindungsgemäß erfolgt dies durch Einbettung der signalführenden Glasfaser in die Struktur, die aus faserverstärkten Kunststoffen besteht. Die Durchführung kann zum Beispiel dadurch erleichtert werden, daß die Glasfaser in Rovings oder Gewebe aus den tragenden Fasern eingearbeitet ist. Vorteilhaft fällt hier wiederum Zusatzgewicht durch die Umhüllungen des Glasfaserkabels weg.The integration of electromagnetic wave guiding elements can also relate to the optical wave range. In this case, own fiber optic cables as optical signal lines are superfluous. According to the invention, this is done by embedding the signal-carrying glass fiber in the structure, which consists of fiber-reinforced plastics. The implementation can be facilitated, for example, by incorporating the glass fiber into rovings or fabric made from the supporting fibers. Again, additional weight due to the sheaths of the glass fiber cable is advantageously eliminated.
Die Integration kann auch soweit gehen, daß ganze Hochfrequenzkomponenten in die tragende Struktur integriert werden. Als Beispiel wird eine ganze Mikrostripantenne in Mesa- oder Wannenbauweise in die Struktur integriert. In dieser Ausführung kann das Mikrostrip- oder Antennendielektrikum in faserverstärktem Kunststoff hoher Festigkeit und Steifigkeit ausgeführt sein (zum Beispiel aus polyethylen- faserverstärktem Polyethylen) und selbst eine Außenseite des, sich dann selber tragenden, Hohlkastens bilden.The integration can also go so far that entire high-frequency components are integrated into the supporting structure. As an example, an entire microstrip antenna in mesa or trough construction is integrated into the structure. In this embodiment, the microstrip or antenna dielectric can be made of fiber-reinforced plastic of high strength and rigidity (for example made of polyethylene-fiber-reinforced polyethylene) and itself form an outside of the box, which is then self-supporting.
Die Erfindung wird anhand von zwei Figuren näher erläutert
Figur 1 zeigt eine Ausführung einer Antenne für ein Synthetik-Apertur-Radar (SAR) mit ihrem Träger. Die Antenne besteht hier aus derAntennenaußenschicht 1 mit Strahlerelementen (patches), einem elektrisch isolierenden Substrat 2 (mit ε r≈ 1), in das Zuleitungen (Mikrostrips) integriert sind und einer elektrischleitenden Grundplatte 3. Die elektrische Verbindung zwischen dem Strahlerelement und der Zuleitung kann zum Beispiel durch lokale Erhöhung von εr imSubstrat 2 im Bereich zwischen diesen beiden Elementen erfolgen. Dietragende Struktur 4 ist hier in Kastenbauweise mit denHohlräumen 5 realisiert. In denHohlräumen 5 könnenelektrische Module 6 undElektronikplatinen 7 enthalten sein. Dietragende Struktur 4 ist hier aus kohlefaserverstärktem Kunststoff ausgeführt, der an seiner Oberseite zur elektrischen Abschirmung metallisiert ist. Die wärmeabgebenden Bauteile wie dieelektrischen Module 6 und dieElektronikplatinen 7 sind bevorzugt über die gesamte Antennenfläche verteilt und an den Trägern, die zur Antennenvorderseite führen, wärmeleitend angeschlossen. Die in derStruktur 4 gezeigten Pfeile zeigen den Fluß der Wärme durch das aus wärmeleitendem Kunststoffhergestellte Trägermaterial 4.Figur 2 zeigt eine Ausführung mit Integration von elektromagnetische Wellen leitenden Elementen in derStruktur 4, die hier aus CFK bestehen kann, das an seiner Oberseite metallisiert ist. Auf der Außenseite derStruktur 4 befindet sich dieAntenne 8, die zum Beispiel Substratdicken im Bereich eines mm und Erhebungen im mm-Bereich aufweist. Innerhalb derStruktur 4 sindelektronische Module 6 undElektronikplatinen 7 angeordnet. Integriert in dietragende Struktur 4 ist auch einPhasenschiebernetzwerk 9, das direkt unter jedem einzelnen Strahlerelement (patch) derGruppenantenne 8 angeordnet ist. Integriert ist ebenso die Zuleitung (microstrip) 10 zu jedem einzelnen Strahlerelement (patch) oder dieelektrische Zuleitung 12 zu denBauteilen 6 und 7. Gezeichnet ist weiter dieGlasfaser 11, die daselektrische Modul 6 als Signalleitung mit einer nicht gezeigten Zentralelektronik verbindet.Leitung 11 ist hier ein kurzes Stück diskret gezeigt und verläuft dann als Glasfaser in derStruktur 4 integriert (durch den dickeren Strich angedeutet). Die Pfeile in derStruktur 4 deuten die Wärmeleitung an.
- Figure 1 shows an embodiment of an antenna for a synthetic aperture radar (SAR) with its carrier. The antenna here consists of the antenna
outer layer 1 with radiator elements (patches), an electrically insulating substrate 2 (with ε r ≈ 1), in which leads (microstrips) are integrated, and an electricallyconductive base plate 3. The electrical connection between the radiator element and the The supply can take place, for example, by locally increasing ε r in thesubstrate 2 in the area between these two elements. The supportingstructure 4 is realized here in a box construction with thecavities 5.Electrical modules 6 andelectronic boards 7 can be contained in thecavities 5. The supportingstructure 4 is made of carbon fiber reinforced plastic, which is metallized on its upper side for electrical shielding. The heat-emitting components, such as theelectrical modules 6 and theelectronic boards 7, are preferably distributed over the entire antenna area and are connected in a heat-conducting manner to the carriers which lead to the antenna front. The arrows shown instructure 4 show the flow of heat through thecarrier material 4 made of thermally conductive plastic. - FIG. 2 shows an embodiment with the integration of electromagnetic wave-guiding elements in the
structure 4, which here can consist of CFRP, which is metallized on its top. Theantenna 8 is located on the outside of thestructure 4 and has, for example, substrate thicknesses in the range of one mm and elevations in the mm range.Electronic modules 6 andelectronic boards 7 are arranged within thestructure 4. Aphase shifter network 9 is also integrated into the supportingstructure 4 and is arranged directly under each individual radiator element (patch) of thegroup antenna 8. Also integrated is the supply line (microstrip) 10 to each individual radiator element (patch) or theelectrical supply line 12 to the 6 and 7. Also drawn is thecomponents glass fiber 11, which connects theelectrical module 6 as a signal line to central electronics (not shown).Line 11 is shown discretely here and then runs as a glass fiber integrated in structure 4 (indicated by the thicker line). The arrows instructure 4 indicate heat conduction.
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3738506 | 1987-11-13 | ||
DE19873738506 DE3738506A1 (en) | 1987-11-13 | 1987-11-13 | ANTENNA STRUCTURE |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0325701A1 true EP0325701A1 (en) | 1989-08-02 |
EP0325701B1 EP0325701B1 (en) | 1993-08-25 |
Family
ID=6340386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP88117439A Expired - Lifetime EP0325701B1 (en) | 1987-11-13 | 1988-10-19 | Antenna structure |
Country Status (4)
Country | Link |
---|---|
US (1) | US4987425A (en) |
EP (1) | EP0325701B1 (en) |
JP (1) | JPH01155702A (en) |
DE (1) | DE3738506A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0445694A1 (en) * | 1990-03-09 | 1991-09-11 | Alcatel Espace | Active printed circuit antenna system having high efficiency for a scanning radar for operation in space |
EP0497249A1 (en) * | 1991-02-01 | 1992-08-05 | Alcatel Espace | Array antenna, particularly for space application |
EP0523770A1 (en) * | 1991-07-15 | 1993-01-20 | Matsushita Electric Works, Ltd. | Low-noise-block downconverter for use with flat antenna receiving dual polarized electromagnetic waves |
EP0634808A1 (en) * | 1993-07-13 | 1995-01-18 | Ball Corporation | Raised patch antenna |
FR2710195A1 (en) * | 1993-09-14 | 1995-03-24 | Thomson Csf | Antenna-electronic circuit assembly |
EP0766336A1 (en) * | 1995-09-29 | 1997-04-02 | Telefonaktiebolaget Lm Ericsson | Device for cooling of electronics units |
Families Citing this family (35)
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US5128689A (en) * | 1990-09-20 | 1992-07-07 | Hughes Aircraft Company | Ehf array antenna backplate including radiating modules, cavities, and distributor supported thereon |
IT1241834B (en) * | 1990-11-22 | 1994-02-01 | Sma Segnalamento Marittimo Ed | VEHICLE RADAR SENSOR FOR SHORT DISTANCE APPLICATIONS |
US5247309A (en) * | 1991-10-01 | 1993-09-21 | Grumman Aerospace Corporation | Opto-electrical transmitter/receiver module |
US5327152A (en) * | 1991-10-25 | 1994-07-05 | Itt Corporation | Support apparatus for an active aperture radar antenna |
JP2606521Y2 (en) * | 1992-02-27 | 2000-11-27 | 株式会社村田製作所 | Antenna device |
US5438697A (en) * | 1992-04-23 | 1995-08-01 | M/A-Com, Inc. | Microstrip circuit assembly and components therefor |
US5349362A (en) * | 1992-06-19 | 1994-09-20 | Forbes Mark M | Concealed antenna applying electrically-shortened elements and durable construction |
US5255738A (en) * | 1992-07-16 | 1993-10-26 | E-Systems, Inc. | Tapered thermal substrate for heat transfer applications and method for making same |
US5325103A (en) * | 1992-11-05 | 1994-06-28 | Raytheon Company | Lightweight patch radiator antenna |
SE470520B (en) * | 1992-11-09 | 1994-06-27 | Ericsson Telefon Ab L M | Radio module included in a primary radio station and radio structure containing such modules |
US5293171A (en) * | 1993-04-09 | 1994-03-08 | Cherrette Alan R | Phased array antenna for efficient radiation of heat and arbitrarily polarized microwave signal power |
JP3185513B2 (en) * | 1994-02-07 | 2001-07-11 | 株式会社村田製作所 | Surface mount antenna and method of mounting the same |
JP3141692B2 (en) * | 1994-08-11 | 2001-03-05 | 松下電器産業株式会社 | Millimeter wave detector |
US5969680A (en) * | 1994-10-11 | 1999-10-19 | Murata Manufacturing Co., Ltd. | Antenna device having a radiating portion provided between a wiring substrate and a case |
US5608414A (en) * | 1995-06-30 | 1997-03-04 | Martin Marietta Corp. | Heat rejecting spacecraft array antenna |
US5870063A (en) * | 1996-03-26 | 1999-02-09 | Lockheed Martin Corp. | Spacecraft with modular communication payload |
US5666128A (en) * | 1996-03-26 | 1997-09-09 | Lockheed Martin Corp. | Modular supertile array antenna |
US5911454A (en) * | 1996-07-23 | 1999-06-15 | Trimble Navigation Limited | Microstrip manufacturing method |
US6356512B1 (en) * | 1998-07-20 | 2002-03-12 | Asulab S.A. | Subassembly combining an antenna and position sensors on a same support, notably for a horological piece |
JP3739230B2 (en) * | 1999-04-26 | 2006-01-25 | 株式会社日立製作所 | High frequency communication equipment |
NL1012278C2 (en) * | 1999-06-09 | 2000-12-12 | Libertel Netwerk Bv | Antenna module. |
US20040217472A1 (en) * | 2001-02-16 | 2004-11-04 | Integral Technologies, Inc. | Low cost chip carrier with integrated antenna, heat sink, or EMI shielding functions manufactured from conductive loaded resin-based materials |
JP3801884B2 (en) * | 2001-07-23 | 2006-07-26 | 株式会社日立製作所 | High frequency transmitter / receiver |
US6825817B2 (en) * | 2002-08-01 | 2004-11-30 | Raytheon Company | Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules |
US7391382B1 (en) | 2005-04-08 | 2008-06-24 | Raytheon Company | Transmit/receive module and method of forming same |
US7456789B1 (en) * | 2005-04-08 | 2008-11-25 | Raytheon Company | Integrated subarray structure |
US7511664B1 (en) | 2005-04-08 | 2009-03-31 | Raytheon Company | Subassembly for an active electronically scanned array |
DE102006005902B4 (en) * | 2006-02-09 | 2007-12-13 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Multilayer composite material structure and method for the production of this |
JP5123493B2 (en) * | 2006-05-30 | 2013-01-23 | 新光電気工業株式会社 | Wiring substrate and semiconductor device |
DE102007040011B4 (en) * | 2007-08-24 | 2015-12-10 | Bayerische Motoren Werke Aktiengesellschaft | Use of net-like arranged, electrically conductive fibers, which are integrated into a component made of a fiber composite material |
DE102010039709A1 (en) * | 2010-08-24 | 2012-01-19 | Continental Automotive Gmbh | Antenna module for a vehicle |
WO2016047005A1 (en) * | 2014-09-25 | 2016-03-31 | 日本電気株式会社 | Antenna system |
US10062950B2 (en) * | 2016-04-20 | 2018-08-28 | Chih-Yuan Wang | Heat dissipater with an antenna structure |
US11382205B2 (en) * | 2020-09-16 | 2022-07-05 | Aptiv Technologies Limited | Heatsink shield with thermal-contact dimples for thermal-energy distribution in a radar assembly |
CN113955081B (en) * | 2021-09-24 | 2023-11-28 | 中国航空工业集团公司西安飞机设计研究所 | Aircraft battery cabin structure |
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- 1988-11-14 JP JP63287500A patent/JPH01155702A/en active Pending
- 1988-11-14 US US07/271,037 patent/US4987425A/en not_active Expired - Lifetime
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0445694A1 (en) * | 1990-03-09 | 1991-09-11 | Alcatel Espace | Active printed circuit antenna system having high efficiency for a scanning radar for operation in space |
FR2659501A1 (en) * | 1990-03-09 | 1991-09-13 | Alcatel Espace | HIGH PERFORMANCE ACTIVE PRINTED ANTENNA SYSTEM FOR SPATIAL AGILE RADAR. |
US5206655A (en) * | 1990-03-09 | 1993-04-27 | Alcatel Espace | High-yield active printed-circuit antenna system for frequency-hopping space radar |
EP0497249A1 (en) * | 1991-02-01 | 1992-08-05 | Alcatel Espace | Array antenna, particularly for space application |
FR2672438A1 (en) * | 1991-02-01 | 1992-08-07 | Alcatel Espace | NETWORK ANTENNA, IN PARTICULAR FOR SPATIAL APPLICATION. |
EP0523770A1 (en) * | 1991-07-15 | 1993-01-20 | Matsushita Electric Works, Ltd. | Low-noise-block downconverter for use with flat antenna receiving dual polarized electromagnetic waves |
EP0634808A1 (en) * | 1993-07-13 | 1995-01-18 | Ball Corporation | Raised patch antenna |
FR2710195A1 (en) * | 1993-09-14 | 1995-03-24 | Thomson Csf | Antenna-electronic circuit assembly |
EP0766336A1 (en) * | 1995-09-29 | 1997-04-02 | Telefonaktiebolaget Lm Ericsson | Device for cooling of electronics units |
US5831830A (en) * | 1995-09-29 | 1998-11-03 | Telefonaktiebolaget Lm Ericsson | Device for cooling of electronics units |
Also Published As
Publication number | Publication date |
---|---|
JPH01155702A (en) | 1989-06-19 |
US4987425A (en) | 1991-01-22 |
DE3738506A1 (en) | 1989-06-01 |
EP0325701B1 (en) | 1993-08-25 |
DE3738506C2 (en) | 1991-05-02 |
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