EP0312528A1 - Multiple-plate hybrid device. - Google Patents

Multiple-plate hybrid device.

Info

Publication number
EP0312528A1
EP0312528A1 EP87902435A EP87902435A EP0312528A1 EP 0312528 A1 EP0312528 A1 EP 0312528A1 EP 87902435 A EP87902435 A EP 87902435A EP 87902435 A EP87902435 A EP 87902435A EP 0312528 A1 EP0312528 A1 EP 0312528A1
Authority
EP
European Patent Office
Prior art keywords
hybrid
metal
plate
hybrid device
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP87902435A
Other languages
German (de)
French (fr)
Other versions
EP0312528B1 (en
Inventor
Dieter Seipler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP0312528A1 publication Critical patent/EP0312528A1/en
Application granted granted Critical
Publication of EP0312528B1 publication Critical patent/EP0312528B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a multi-plate hybrid device with integrated heat dissipation according to the preamble of the main claim.
  • a hybrid circuit is understood to mean microcircuit integration in which passive components, the resistors, capacitors, small inductors, are produced with their wiring as a film circuit. The active components and sometimes simple integrated circuits are then used as semiconductor components in this subcircuit. While the modular design of devices has long established itself in printed circuit board technology, it has not yet found much use in hybrid technology. The most important obstacle is likely to be the heat development during the operation of hybrid substrates and their dissipation. This applies particularly to the arrangement of several hybrid substrates in a confined space.
  • the multi-plate hybrid device according to the invention Integrated heat dissipation with the features of the main claim has the advantage that several layers of hybrid substrates, especially thick-film hybrid substrates can be used, which have a favorable thermal dissipation, a very high component density and thus a modular system with almost any expansion possibilities.
  • Suitable metal frames for holding the thick-film hybrid substrates are those with heat dissipation and those without heat dissipation.
  • the metal frames with heat dissipation should have a metal plate for contact with the thick-film hybrid substrate and should overlap the thick-film hybrid substrates with lateral legs, forming guide grooves.
  • Such intermediate carriers consist of opposing frames, in the mutually facing end faces of guide grooves for inserting thick-film hybrid substrates are formed.
  • the back of this metal case is covered by a lid that has an annular projection in a correspondingly arranged sealing groove engages on the back of the metal housing.
  • connection lugs protruding from the thick-film hybrid substrates should be combined using a connecting board or lead frame.
  • This connection board is covered by a cover profile on the front of the metal housing, with a connector passing through this cover profile and engaging with connection pins in the connection board.
  • the contact pins end, for example, in contact bores of the plug, these contact bores being accessible from the outside. This creates a suitable connection between the hybrid circuit and the outside of the housing.
  • connection board or the lead frame for example a 1-wire plate, can be rigid or flexible.
  • Figure 1 is a partially shown longitudinal section through an inventive multi-plate hybrid device with integrated heat dissipation
  • FIG. 2 shows a cross section through the multi-plate hybrid device according to FIG. 1 along line II-II;
  • Figure 3 is a rear view of a metal housing for the Multi-plate hybrid device
  • Figure 4 shows a cross section through a cover profile to cover the back of the multi-plate hybrid device.
  • a multi-plate hybrid device with integrated heat dissipation has, according to FIGS. 1-3, a metal housing 1 which consists of metal frames 2-5 stacked one above the other.
  • a cover frame 2 and a base frame 5 are shown, between which intermediate supports 3 and a further intermediate support 4 with heat coupling are arranged.
  • Cover frame 2, base frame 5 and intermediate support 4 with heat coupling have an approximately U-shaped cross section
  • the intermediate carrier 3 lacks a metal plate, rather there are two opposing frames
  • the guide grooves 10, 13 serve to accommodate thick-film hybrid substrates 14, a thick-film hybrid substrate being held only in the guide grooves 13 by the intermediate carrier 3, while the thick-layer hybrid substrates 14 in the cover frame 2, the intermediate carrier 4 and the base frame 5 there also on the metal plates 6 and 7 concerns.
  • the thick-film hybrid substrates 14 can be glued to the metal plates 6 or 7, with for example the metal plate 6 of the base frame 5 also having an output stage, for example a transistor or Semiconductor output stage, or the like may be glued on with a convertible top.
  • the metal frames 2-5 are threaded through screw channels 15 into which screw bolts, not shown, are inserted, by means of which the metal frames 2-5 are clamped together to form the metal housing 1.
  • the rear of the metal housing 1 shown in FIG. 3 is provided with a sealing groove 16, into which in
  • Use position engages a projection 17 formed in a lid 17 shown in Figure 4 and is glued.
  • the front side of the metal housing 1 shown in FIG. 1 also has a sealing groove 19 into which a diaphragm profile 20 engages with a projection 21.
  • the aperture profile 20 is penetrated by a plug 22, in which contact holes 23 are formed.
  • the contact hole 23 is connected via a contact pin 24 to a connection board (printed circuit board) 25. Terminal lugs 26 from the thick-film hybrid substrates 14 open into this connection board 25.

Abstract

Appareil hybride à plaquettes multiples avec dissipation de chaleur intégrée pour substrats hybrides en couche épaisse (14) comportant des circuits hybrides. Dans cet appareil, les substrats hybrides en couche épaisse sont insérés dans les cadres métalliques (2, 5) d'un boîtier métallique (1) et couplés au moins partiellement avec des parties des cadres métalliques en vue de dissiper la chaleur engendrée. Des barettes de raccordement (26) dépassant des substrats hybrides en couche ßpaisse sont réunies au moyen d'une platine de connexion (25), laquelle coopère avec un connecteur (22).Hybrid multiple wafer apparatus with integrated heat dissipation for thick film hybrid substrates (14) having hybrid circuits. In this device, the thick-film hybrid substrates are inserted into the metal frames (2, 5) of a metal case (1) and at least partially coupled with parts of the metal frames in order to dissipate the heat generated. Connection bars (26) protruding from thick-layer hybrid substrates are joined by means of a connection plate (25), which cooperates with a connector (22).

Description

Mehrplatten-Hybridgerät mit integrierter Wärmeableitung Multi-plate hybrid device with integrated heat dissipation
Stand der TechnikState of the art
Die Erfindung geht aus von einem Mehrplatten-Hybridgerät mit integrierter Wärmeableitung gemäß Oberbegriff des Hauptanspruchs. Unter einer Hybridschaltung wird eine Mikro-Schaltungsintegration verstanden, bei der passive Bauelemente, die Widerstände, Kondensatoren, kleine Induktivitäten, mit ihren Verdrahtungen als Film- schaltung hergestellt werden. Der Einsatz der aktiven Bauelemente und gelegentlich auch einfacher integrierter Schaltungen erfolgt dann' als Halbleiterbauelemente in diese Teilschaltung. Während sich für die Leiterplattentechnik die module Bauweise von Geräten bereits seit langem durchgesetzt hat , hat sie in die Hybridtechnik noch wenig Eingang gefunden. Wesentlichstes Hindernis dürfte die Wärmeentwicklung beim Betrieb von Hybridsubstraten und deren Ableitung sein. Dies gilt im besonderem Maße für eine Anordung von mehreren Hybridsubstraten auf engem Raum.The invention relates to a multi-plate hybrid device with integrated heat dissipation according to the preamble of the main claim. A hybrid circuit is understood to mean microcircuit integration in which passive components, the resistors, capacitors, small inductors, are produced with their wiring as a film circuit. The active components and sometimes simple integrated circuits are then used as semiconductor components in this subcircuit. While the modular design of devices has long established itself in printed circuit board technology, it has not yet found much use in hybrid technology. The most important obstacle is likely to be the heat development during the operation of hybrid substrates and their dissipation. This applies particularly to the arrangement of several hybrid substrates in a confined space.
Vorteile der ErfindungAdvantages of the invention
Das erfindungsgemäße Mehrplatten-Hybridgerat mit integrierter Wärmeableitung mit den Merkmalen des Hauptanspruchs hat demgegenüber den Vorteil, daß mehrere Lagen von Hybridsubstraten, insbesondere von Dickschichthybridsubstraten genutzt werden können, die eine günstige termische Ableitung, eine sehr große Bauelementen-Dichte aufweisen und so ein modularer Baukasten mit fast beliebigen Erweiterungsmöglichkeiten entsteht.The multi-plate hybrid device according to the invention Integrated heat dissipation with the features of the main claim has the advantage that several layers of hybrid substrates, especially thick-film hybrid substrates can be used, which have a favorable thermal dissipation, a very high component density and thus a modular system with almost any expansion possibilities.
Als Metallrahmen zum Halten der Dickschichthybridsubstrate kommen einmal solche mit Wärmeableitung und solche ohne Wärmeableitung in Betracht. Dabei sollen die Metallrahmen mit Wärmeableitung eine Metallplatte zum Anlegen an das Dickschichthybridsubstrat aufweisen und mit seitlichen Schenkeln die Dickschichthybridsubstrate unter Ausbildung von Führungsnuten übergreifen. DerSuitable metal frames for holding the thick-film hybrid substrates are those with heat dissipation and those without heat dissipation. The metal frames with heat dissipation should have a metal plate for contact with the thick-film hybrid substrate and should overlap the thick-film hybrid substrates with lateral legs, forming guide grooves. The
Verbesserung der Wärmeableitung dient, wenn die Dickschichthybridsubstrate auf die Metallplatten aufgeklebt sind.Improvement of heat dissipation serves when the thick-film hybrid substrates are glued to the metal plates.
Je nach Bedarf kann es aber auch notwendig sein, Metallrahmen für Substrate anzuordnen, welche nicht mit metallischen Hüllflachen in Berührung kommen sollen. Solche Zwischenträger bestehen aus sich gegenüberliegenden Rahmen, in deren zueinanderweisenden Stirnflächen Führungsnuten zum Einsetzen von Dickschichthybridsubstraten eingeformt sind.Depending on requirements, it may also be necessary to arrange metal frames for substrates that should not come into contact with metallic enveloping surfaces. Such intermediate carriers consist of opposing frames, in the mutually facing end faces of guide grooves for inserting thick-film hybrid substrates are formed.
Auf diese Weise ist es möglich, im Baukastenprinzip ein gewünschtes Modul herzustellen, zu verkleinern oder zu erweitern. Die Anzahl der gewünschten Metallrahmen mit eingesetzten Dickschichthybridsubstraten werden dann miteinander verschraubt. Auf diese Weise entsteht ein kompaktes Metallgehäuse mit sehr guter Möglichkeit für eine thermische Ankopplung.In this way it is possible to manufacture, reduce or expand a desired module using the modular principle. The number of desired metal frames with thick-film hybrid substrates used are then screwed together. In this way, a compact metal housing is created with a very good possibility for thermal coupling.
Die Rückseite dieses Metallgehäuses wird durch einen Deckel abgedeckt, der mit einem ringförmigen Vorsprung in eine entsprechend angeordnete Abdichtungsrille auf der Rückseite des Metallgehäuses eingreift.The back of this metal case is covered by a lid that has an annular projection in a correspondingly arranged sealing groove engages on the back of the metal housing.
Ein weiteres wichtiges Merkmal der Erfindung ist die Lösung des Verbindungsproblems zwischen den im Metallgehäuse angeordneten Dickschichthybridsubstraten und der Gehäuseaußenseite. Hierzu sollen die von den Dickschichthybridsubstraten abragenden Anschlußfahnen mittels einer Verbindungsplatine oder Stanzgitter zusammengefaßt werden. Diese Verbindungsplatine wird von einem Blendenprofil auf der Vorderseite des Metallgehäuses überdeckt, wobei ein Stecker dieses Blendenprofil durchsetzt und mit Koritaktsteckstiften in die Verbindungsplatine eingreift. Die Kontaktstifte enden dabei beispielsweise in Kontaktbohrungen des Steckers wobei diese Kontaktbohrungen von außen her zugängig sind. Damit wird eine geeignete Verbindung zwischen Hybridschaltung und Gehäuseaußenseite geschaffen.Another important feature of the invention is the solution of the connection problem between the thick-film hybrid substrates arranged in the metal housing and the outside of the housing. For this purpose, the connection lugs protruding from the thick-film hybrid substrates should be combined using a connecting board or lead frame. This connection board is covered by a cover profile on the front of the metal housing, with a connector passing through this cover profile and engaging with connection pins in the connection board. The contact pins end, for example, in contact bores of the plug, these contact bores being accessible from the outside. This creates a suitable connection between the hybrid circuit and the outside of the housing.
Die Verbindungplatine oder das Stanzgitter, beispielsweise eine 1-eiterplatte, kann starr oder flexibel sein.The connection board or the lead frame, for example a 1-wire plate, can be rigid or flexible.
Zeichnungdrawing
Die Erfindung wird nachfolgend anhand der Zeichnung erläutert. Diese zeigt inThe invention is explained below with reference to the drawing. This shows in
Figur 1 einen teilweise dargestellten Längsschnitt durch ein erfindungsgemäßes Mehrplatten-Hybridgerat mit integrierter Wärmeableitung;Figure 1 is a partially shown longitudinal section through an inventive multi-plate hybrid device with integrated heat dissipation;
Figur 2 einen Querschnitt durch das Mehrplatten-Hybridgerät nach Figur 1 entlang Linie II - II;FIG. 2 shows a cross section through the multi-plate hybrid device according to FIG. 1 along line II-II;
Figur 3 eine Rückansicht eines Metallgehäuses für das Mehrplatten-Hybridgerat;Figure 3 is a rear view of a metal housing for the Multi-plate hybrid device;
Figur 4 einen Querschnitt durch ein Deckelprofil zum Abdecken der Rückseite des Mehrplatten-Hybridgeräts.Figure 4 shows a cross section through a cover profile to cover the back of the multi-plate hybrid device.
Ein Mehrplatten-Hybridgerat mit integrierter Wärmeableitung, weist gemäß den Figuren 1 - 3 ein Metallgehäuse 1 auf, welche aus übereinander gestapelten Metallrahmen 2 - 5 besteht. Im vorliegenden Ausführungsbeispiel ist ein Deckrahmen 2 und ein Bodenrahmen 5 gezeigt, zwischen denen Zwischenträger 3 sowie ein weiterer Zwischenträger 4 mit Wärmeankopplung angeordnet sind.A multi-plate hybrid device with integrated heat dissipation has, according to FIGS. 1-3, a metal housing 1 which consists of metal frames 2-5 stacked one above the other. In the present exemplary embodiment, a cover frame 2 and a base frame 5 are shown, between which intermediate supports 3 and a further intermediate support 4 with heat coupling are arranged.
Deckrahmen 2 , Bodenrahmen 5 und Zwischenträger 4 mit Wärmeankopplung weisen querschnittlich eine etwa U-förmigeCover frame 2, base frame 5 and intermediate support 4 with heat coupling have an approximately U-shaped cross section
Gestaltung auf, wobei jeweils seitlich von einer Metallplatte 6 bzw. 7 Schenkel 8 bzw. 9 abragen, welche mit der Metallplatte 6 bzw. 7 jeweils sich gegenüberliegende Führungsnuten 10 ausbilden.Design on, with each projecting laterally from a metal plate 6 or 7 legs 8 or 9, which each form opposite guide grooves 10 with the metal plate 6 or 7.
Beim Zwischenträger 3 fehlt dagegen eine Metallplatte, vielmehr sind hier zwei sich gegenüberliegende RahmenIn contrast, the intermediate carrier 3 lacks a metal plate, rather there are two opposing frames
11 vorgesehen, in deren zueinanderweisende Stirnflächen11 provided in their mutually facing end faces
12 jeweils Führungsnuten 13 eingeformt sind.12 each guide grooves 13 are formed.
Die Führungsnuten 10, 13 dienen der Aufnahme von Dickschichthybridsubstraten 14, wobei ein Dickschichthybridsubstrat durch den Zwischenträger 3 lediglich in den Führungsnuten 13 gehalten wird, während die Dickschichthybridsubstrate 14 in dem Deckrahmen 2 dem Zwischenträger 4 und dem Bodenrahmen 5 dort auch an den Metaϊlplatten 6 bzw. 7 anliegen. Die Dickschichthybridsubstrate 14 können den Metallplatten 6 bzw. 7 aufgeklebt sein, wobei beispielsweise der Metallplatte 6 des Bodenrahmens 5 auch eine Endstufe, beispeilsweise eine Transistor- bzw. Halbleiter-Endstufe, oder dergleichen eventuell gleich mit einer Verdeckplatte aufgeklebt wird.The guide grooves 10, 13 serve to accommodate thick-film hybrid substrates 14, a thick-film hybrid substrate being held only in the guide grooves 13 by the intermediate carrier 3, while the thick-layer hybrid substrates 14 in the cover frame 2, the intermediate carrier 4 and the base frame 5 there also on the metal plates 6 and 7 concerns. The thick-film hybrid substrates 14 can be glued to the metal plates 6 or 7, with for example the metal plate 6 of the base frame 5 also having an output stage, for example a transistor or Semiconductor output stage, or the like may be glued on with a convertible top.
Die Metallrahmen 2 - 5 sind, wie in Figur 2 dargestellt, von Verschraubungskanälen 15 durchzogen, in die nicht näher dargestellte Schraubenbolzen eingesetzt werden, mittels denen die Metallrahmen 2 - 5 zu dem Metallgehäuse 1 zusammengespannt werden.As shown in FIG. 2, the metal frames 2-5 are threaded through screw channels 15 into which screw bolts, not shown, are inserted, by means of which the metal frames 2-5 are clamped together to form the metal housing 1.
Die in Figur 3 gezeigte Rückseite des Metallgehäuses 1 ist mit einer Abdichtungsrille 16 versehen, in welche inThe rear of the metal housing 1 shown in FIG. 3 is provided with a sealing groove 16, into which in
Gebrauchslage ein einem in Figur 4 gezeigten Deckel 17 angeformter Vorsprung 18 eingreift und eingeklebt ist.Use position engages a projection 17 formed in a lid 17 shown in Figure 4 and is glued.
Auch die in Figur 1 gezeigte Vorderseite des Metallgehäuses 1 weist eine Abdichtungsrille 19 auf, in die ein Blendenprofil 20 mit einem Vorsprung 21 eingreift. Das Blendenprifil 20 wird von einem Stecker 22 durchsetzt, in den Kontaktbohrungen 23 eingeformt sind. Die Kontaktbohrung 23 steht über einen Kαntaktstift 24 mit einer Verbindungsplatine (Leiterplatte) 25 in Verbindung. In diese Verbindungsplatine 25 münden Anschlußfahnen 26 aus den Dickschichthybridsubstraten 14. The front side of the metal housing 1 shown in FIG. 1 also has a sealing groove 19 into which a diaphragm profile 20 engages with a projection 21. The aperture profile 20 is penetrated by a plug 22, in which contact holes 23 are formed. The contact hole 23 is connected via a contact pin 24 to a connection board (printed circuit board) 25. Terminal lugs 26 from the thick-film hybrid substrates 14 open into this connection board 25.

Claims

Patentansprüche Claims
1. Mehrplatten-Hybridgerat mit integrierter Wärmeableitung für Dickschichthybridsubstrate, welche Hybridschaltungen enthalten, dadurch gekennzeichnet, daß die Dickschichthybridsubstrate (14) in Metallrahmen (2 - 5) eines Metallgehäuses (1) eingesetzt und zumindest teilweise mit Teilen (6, 7) der Metallrahmen (2 - 5) zum Ableiten der entstehenden Wärme gekoppelt sind.1. Multi-plate hybrid device with integrated heat dissipation for thick-film hybrid substrates which contain hybrid circuits, characterized in that the thick-film hybrid substrates (14) in metal frames (2 - 5) of a metal housing (1) and at least partially with parts (6, 7) of the metal frame ( 2 - 5) are coupled to dissipate the heat generated.
2. Mehrplatten-Hybridgerat nach Anspruch 1, dadurch gekennzeichnet, daß die Metallrahmen (2, 3, 5) des Metallgehäuses (1) querschnittlich U- oder I-förmig geformt sind, wobei wenigstens ein Dickschichthybridsubstrat (14) an einer Metallplatte (6, 7) anliegt und von Schenkeln (8, 9) seitlich teilweise unter Ausb ildung von Führungsnuten (10) übergriffen ist.2. Multi-plate hybrid device according to claim 1, characterized in that the metal frames (2, 3, 5) of the metal housing (1) are U-shaped or I-shaped in cross-section, at least one thick-film hybrid substrate (14) on a metal plate (6, 7) rests and is partially overlapped laterally by legs (8, 9) with the formation of guide grooves (10).
3. Mehrplatten-Hybridgerat nach Anspruch 2, dadurch g eken n zeichnet , daß die Dic ks chichthybridsubstrate (14) auf die Metallplatten (6, 7) geklebt sind.3. Multi-plate hybrid device according to claim 2, characterized in that the thicknesses of the hybrid hybrid substrates (14) are glued to the metal plates (6, 7).
4. Mehrplatten-Hybridgerat nach einem der Ansprüche 1 - 3, dadurch gekennzeichnet, daß zusätzliche als Zwischenträger (3) ausgebildete Metallrahmen zwischen den übrigen Metallrahmen ( 2, 4 , 5 ) angeordnet sind, welche aus sich gegenüberliegenden Rahmen (11) bestehen, in deren zueinanderweisenden Stirnflächen (12) Führungsnuten4. Multi-plate hybrid device according to one of claims 1-3, characterized in that additional metal frames designed as intermediate supports (3) are arranged between the other metal frames (2, 4, 5), which consist of opposing frames (11), in their mutually facing end faces (12) guide grooves
(13) zum Einsetzen von Dickschichthybridsubstraten (14) eingeformt sind.(13) for inserting thick-film hybrid substrates (14) are formed.
5. Mehrplatten-Hybridgerat nach einem der Ansprüche 1 - 4, dadurch gekennzeichnet, daß die übereinander angeordneten Metallrahmen (2 - 5) von Verschraubungskanälen (15) durchsetzt sind.5. Multi-plate hybrid device according to one of claims 1-4, characterized in that the metal frames (2 - 5) arranged one above the other are penetrated by screw channels (15).
6. Mehrplatten-Hybridgerat nach einem der Ansprüche 1 - 5, dadurch gekennzeichnet, daß in die von deh Metallrahmen6. Multi-plate hybrid device according to one of claims 1-5, characterized in that in the von deh metal frame
(2 - 5) gebildeten Rück- bzw. Vorderseiten des Metallgehäuses (1) Abdichtungsrillen (16, 19) eingeformt sind.(2 - 5) formed rear or front sides of the metal housing (1) sealing grooves (16, 19) are formed.
7. Mehrplatten-Hybridgerat nach Anspruch 6, dadurch gekennzeichnet, daß in die Abdichtungsrille (16) ein7. Multi-plate hybrid device according to claim 6, characterized in that in the sealing groove (16)
Vorsprung (18) eines Deckels (17) eingreift.Projection (18) of a cover (17) engages.
8. Mehrplatten-Hybridgerat nach einem der Ansprüche 1 - 7, dadurch gekennzeichnet, daß von den Dickschichthybridsubstraten (14) Anschlußfahnen (26) abragen, welche mittels einer Verbindungsplatine (25) zusammengefaßt sind.8. Multi-plate hybrid device according to one of claims 1-7, characterized in that from the thick-film hybrid substrates (14) projecting lugs (26), which are combined by means of a connecting board (25).
9. Mehrplatten-Hybridgerat nach Anspruch 8, dadurch gekennzeichnet, daß Kontaktstifte (24) eines Steckers (22) in die Verbindungsplatine (25) eingesetzt und über Kontaktbohrungen (23) oder dergleichen von außen zugänglich sind.9. Multi-plate hybrid device according to claim 8, characterized in that contact pins (24) of a plug (22) are inserted into the connection board (25) and are accessible from the outside via contact bores (23) or the like.
10. Mehrplatten-Hybridgerat nach Anspruch 9, dadurch gekennzeichnet, daß der Stecker (22) ein Blendenprofil10. Multi-plate hybrid device according to claim 9, characterized in that the plug (22) has an aperture profile
(20) durchsetzt, welches die Vebindungsplatine (25) überdeckt und mit einem Vorsprung (21) in eine Abdichtungsrille (19) an der Gehäusevorderseite eingesetzt ist. (20) passes through, which covers the connection board (25) and is inserted with a projection (21) into a sealing groove (19) on the front side of the housing.
EP87902435A 1986-06-30 1987-05-09 Multiple-plate hybrid device Expired - Lifetime EP0312528B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19863621930 DE3621930A1 (en) 1986-06-30 1986-06-30 MULTI-PLATE HYDDRID DEVICE WITH INTEGRATED HEAT EXTRACTION
DE3621930 1986-06-30

Publications (2)

Publication Number Publication Date
EP0312528A1 true EP0312528A1 (en) 1989-04-26
EP0312528B1 EP0312528B1 (en) 1990-02-28

Family

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Application Number Title Priority Date Filing Date
EP87902435A Expired - Lifetime EP0312528B1 (en) 1986-06-30 1987-05-09 Multiple-plate hybrid device

Country Status (6)

Country Link
US (1) US4912601A (en)
EP (1) EP0312528B1 (en)
JP (1) JPH01503098A (en)
KR (1) KR950009627B1 (en)
DE (2) DE3621930A1 (en)
WO (1) WO1988000396A1 (en)

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Also Published As

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WO1988000396A1 (en) 1988-01-14
DE3621930A1 (en) 1988-01-07
KR950009627B1 (en) 1995-08-25
DE3761791D1 (en) 1990-04-05
US4912601A (en) 1990-03-27
JPH01503098A (en) 1989-10-19
EP0312528B1 (en) 1990-02-28
KR880701465A (en) 1988-07-27

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