EP0144413A1 - Carte imprimee pour le montage en surface de circuits integres miniature et procede de fabrication de telles cartes imprimees - Google Patents

Carte imprimee pour le montage en surface de circuits integres miniature et procede de fabrication de telles cartes imprimees

Info

Publication number
EP0144413A1
EP0144413A1 EP84902450A EP84902450A EP0144413A1 EP 0144413 A1 EP0144413 A1 EP 0144413A1 EP 84902450 A EP84902450 A EP 84902450A EP 84902450 A EP84902450 A EP 84902450A EP 0144413 A1 EP0144413 A1 EP 0144413A1
Authority
EP
European Patent Office
Prior art keywords
connecting legs
printed circuit
soldering
circuit board
integrated miniature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP84902450A
Other languages
German (de)
English (en)
Inventor
Walter Kundler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP0144413A1 publication Critical patent/EP0144413A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a printed circuit board for soldering integrated miniature circuits / which have flat solderable connecting legs which are to be aligned for specific soldering positions on the printed circuit board, and it also relates to a method for producing such printed circuit boards.
  • the starting material plates made of electrically insulating material are used, which are coated on at least one side with a metallic conductive layer.
  • the known methods aim to produce large, medium or small quantities quickly and inexpensively.
  • a particular disadvantage of these prior art methods is that printed circuit boards which contain both integrated miniature circuits and normal components such as resistors and capacitors to be soldered in bores with solder eyes can hardly be processed using a uniform technology .
  • the invention has for its object to provide a printed circuit board which enables simplified assembly and soldering of integrated miniature circuits on the printed circuit board, and an improved method for producing such printed circuit boards is also to be created which is simple to carry out and for PCB leads, which can be easily equipped with miniature circuits. In this case, it should also be possible, in particular, to produce drilled circuit boards to be soldered from below.
  • claim 1 characterizes the solution of this task in general form.
  • DE-OS 3022 310 discloses a ceramic circuit board on which electrical module components are attached.
  • the circuit board for soldering each terminal lug of each module component has circuit elements in the form of blocks, which are formed, for example, by the deposition of an alloy of indium and lead on the ceramic plate. These blocks thus define the specific position in which each module component is to be aligned and soldered onto the ceramic plate.
  • positioning of the module components requires very careful and precise alignment work to ensure that the terminal lugs of the module components actually match the blocks provided on the ceramic plate.
  • DE-PS 878 979 which is about 3 decades older, and which deals with a method for producing soldered connections and has proposed a strip with two parallel metal strips, between which the capacitors and resistors customary at that time should be connected using a solder connection.
  • the switching strip was equipped with openings at the intended connection points of the capacitors and resistors for passing the connecting wires of the capacitors and resistors, and the metal strips each had depressions in the area of the openings for fixing the connecting wires.
  • Printed circuit boards produced by the method according to the invention can be equipped with flat solderable integrated circuits without special aids and their connecting legs can be soldered on manually or in a soldering bath in a simple manner.
  • the handling is integrated 5 -
  • Fig. 1 shows a section through a circuit board with attached miniature integrated circuit.
  • Fig. 2 shows an enlarged detail
  • 3 and 4 show individual sections turned through 90 °.
  • FIG. 5 shows a plan view of a printed circuit board " with capillary bores offset at adjacent engraved depressions.
  • the method according to the invention is based on plates 3 made of insulating material. These can either be copper-coated or uncoated.
  • plates 3 made of insulating material These can either be copper-coated or uncoated.
  • a suitable profile pattern ⁇ 9 from adjacent recesses 4 (FIG. 5) is made for each integrated circuit, corresponding to the number of connecting legs of the integrated circuit in the surface of the plate engraved.
  • This process can be combined in a variety of ways with known production processes for printed circuit boards. As an example of these possibilities, an example will be explained in detail, with the omission of insignificant steps, such as cleaning and rinsing steps.
  • the holes 8 for receiving the wire ends of resistors, capacitors, etc. are drilled in a copper-coated insulating material plate 3 and the profile patterns 9 consisting of the recesses 4 are engraved for inserting the integrated miniature circuits 1 which can be soldered flat. Subsequently, a thin copper layer 10 is metallized, even on the later insulating surfaces. The engraved inner surfaces become conductive and the holes 8 are metallized. Then the negative conductor pattern is printed on both sides with an insulating ink. The conductors and profile patterns on the component side and the conductors and solder eyes on the opposite side remain in copper color. Then all uncovered copper surfaces are tin-plated.
  • the printed ink is dissolved and in a further bath the copper surfaces previously covered with ink are removed by means of an etching solution which dissolves copper and does not attack tin.
  • the integrated miniature circuits 1 can now be inserted into the printed circuit board produced in this way and soldered on from above.
  • the connecting legs (not shown) of the other components can be inserted through the bores 8 and soldered on from below
  • capillary bores 5 with a diameter of approximately 0.6 mm are drilled in the recesses 4 of the profile pattern at the soldering points before the metallization.
  • a small pad 6 is attached to each capillary bore.
  • the depressions 4 of the profile pattern 9 are produced with an engraving stylus with a small tip angle.
  • the metallized conductive layer 10 is identified by thick lines.
  • the additional capillary bores 5 are also provided with a conductive layer and the small soldering eye 6 a closes on the side opposite the assembly.
  • the profile pattern consists of a number of engraved line-shaped depressions corresponding to the number of connecting legs of the integrated miniature circuit, the length and width of which are dimensioned such that the integrated miniature circuit can be used in a latching and precise position.
  • the profile pattern consists of a smaller number of engraved line-shaped depressions than the number of connecting legs of the integrated miniature circuit and part of the connecting legs of the integrated miniature circuit is bent out of the plane of the other connecting legs for the purpose of snapping into the profile pattern.
  • the method according to the invention can in principle be applied with the aid of an engraving machine (pantograph) and corresponding templates.
  • an engraving machine prograph

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Carte imprimée pour le montage en surface de circuits intégrés miniature possédant des bras de connexion pouvant être montés en surface à plat. La carte imprimée (3) possède un ou plusieurs évidements (4) pour accueillir par encliquetage le circuit intégré miniature (1) dans une position où les bras de connexion (2) du circuit intégré miniature sont orientés vers leurs points de montage (6). Les évidements métallisés (4) pour l'encliquetage des bras de connexion (2) peuvent également être dotés de trous capillaires métallisés traversant (5) pour les montages du dessous de la carte. Sont aussi décrits des procédés de fabrication d'une telle carte imprimée par gravage d'un modèle de profilage, puis métallisation d'au moins une couche électriquement conductrice. Le gravage d'un modèle de profilage suivi d'une métallisation permet en particulier le positionnement fixe des circuits intégrés miniature.
EP84902450A 1983-06-15 1984-06-15 Carte imprimee pour le montage en surface de circuits integres miniature et procede de fabrication de telles cartes imprimees Withdrawn EP0144413A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3321694A DE3321694A1 (de) 1983-06-15 1983-06-15 Leiterplatte zum aufloeten von integrierten miniaturschaltungen
DE3321694 1983-06-15

Publications (1)

Publication Number Publication Date
EP0144413A1 true EP0144413A1 (fr) 1985-06-19

Family

ID=6201603

Family Applications (1)

Application Number Title Priority Date Filing Date
EP84902450A Withdrawn EP0144413A1 (fr) 1983-06-15 1984-06-15 Carte imprimee pour le montage en surface de circuits integres miniature et procede de fabrication de telles cartes imprimees

Country Status (3)

Country Link
EP (1) EP0144413A1 (fr)
DE (1) DE3321694A1 (fr)
WO (1) WO1985000085A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62296495A (ja) * 1986-05-12 1987-12-23 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 部品を制御回路上の表面のはんだパツドに取付ける方法
DE3636817A1 (de) * 1986-10-29 1988-05-11 Mettler Instrumente Ag Mit bauteilen zum verloeten im loetbad bestueckte leiterplatte
FR2619276A1 (fr) * 1987-08-07 1989-02-10 Cit Alcatel Carte de circuit imprime mixte double face ou multicouches
FR2653601B1 (fr) * 1989-10-20 1993-10-22 Sgs Thomson Microelectronics Sa Electronique portable connectable a puces.
DE10008569B4 (de) * 2000-02-24 2014-02-13 Infineon Technologies Ag Substrat für eine Schaltungsanordnung
DE102021201100A1 (de) * 2021-02-05 2022-08-11 Brose Fahrzeugteile SE & Co. Kommanditgesellschaft, Würzburg Befestigungsanordnung eines leiterplattenmontierten Bauelements

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3293500A (en) * 1964-05-15 1966-12-20 Rca Corp Printed circuit board with semiconductor mounted therein
US3710196A (en) * 1970-04-27 1973-01-09 T Fifield Circuit board and method of making circuit connections
US3778530A (en) * 1971-04-01 1973-12-11 W Reimann Flatpack lead positioning device
DE2852753C3 (de) * 1978-12-06 1985-06-20 Württembergische Metallwarenfabrik, 7340 Geislingen Verfahren zum Befestigen von Bauelementen mit flächigen Anschlußkontakten auf einer Leiterplatte und Schablone zur Durchführung des Verfahrens
US4254448A (en) * 1979-05-14 1981-03-03 Western Electric Company, Inc. Techniques for assembling electrical components with printed circuit boards

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO8500085A1 *

Also Published As

Publication number Publication date
WO1985000085A1 (fr) 1985-01-03
DE3321694A1 (de) 1984-12-20

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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AK Designated contracting states

Designated state(s): DE FR GB

STAA Information on the status of an ep patent application or granted ep patent

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18W Application withdrawn

Withdrawal date: 19850829