EP0096596B1 - Microelectronic device manufacture - Google Patents
Microelectronic device manufacture Download PDFInfo
- Publication number
- EP0096596B1 EP0096596B1 EP83303324A EP83303324A EP0096596B1 EP 0096596 B1 EP0096596 B1 EP 0096596B1 EP 83303324 A EP83303324 A EP 83303324A EP 83303324 A EP83303324 A EP 83303324A EP 0096596 B1 EP0096596 B1 EP 0096596B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- film
- copolymer
- etching
- micrometers
- resist film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000004377 microelectronic Methods 0.000 title claims description 4
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- 238000000034 method Methods 0.000 claims description 63
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- 239000000758 substrate Substances 0.000 claims description 55
- 238000005530 etching Methods 0.000 claims description 44
- 238000000992 sputter etching Methods 0.000 claims description 38
- -1 poly(trimethylsilylstyrene) Polymers 0.000 claims description 24
- 239000000178 monomer Substances 0.000 claims description 21
- 238000001312 dry etching Methods 0.000 claims description 18
- 239000004641 Diallyl-phthalate Substances 0.000 claims description 16
- 229920000620 organic polymer Polymers 0.000 claims description 15
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 claims description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 14
- 239000007789 gas Substances 0.000 claims description 14
- 239000001301 oxygen Substances 0.000 claims description 14
- 229910052760 oxygen Inorganic materials 0.000 claims description 14
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 11
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 6
- 238000000609 electron-beam lithography Methods 0.000 claims description 5
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- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 125000005369 trialkoxysilyl group Chemical group 0.000 claims description 4
- WUGOQZFPNUYUOO-UHFFFAOYSA-N 2-trimethylsilyloxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCO[Si](C)(C)C WUGOQZFPNUYUOO-UHFFFAOYSA-N 0.000 claims description 3
- ZDNFTNPFYCKVTB-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,4-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=C(C(=O)OCC=C)C=C1 ZDNFTNPFYCKVTB-UHFFFAOYSA-N 0.000 claims description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 2
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- 238000001015 X-ray lithography Methods 0.000 claims description 2
- 229910001882 dioxygen Inorganic materials 0.000 claims description 2
- IWTYTFSSTWXZFU-UHFFFAOYSA-N 3-chloroprop-1-enylbenzene Chemical compound ClCC=CC1=CC=CC=C1 IWTYTFSSTWXZFU-UHFFFAOYSA-N 0.000 claims 1
- FWGNVBNJIIHYAR-UHFFFAOYSA-N phenyl(3-phenylbut-2-en-2-yl)silane Chemical compound CC(=C([SiH2]C1=CC=CC=C1)C)C1=CC=CC=C1 FWGNVBNJIIHYAR-UHFFFAOYSA-N 0.000 claims 1
- FIONWRDVKJFHRC-UHFFFAOYSA-N trimethyl(2-phenylethenyl)silane Chemical compound C[Si](C)(C)C=CC1=CC=CC=C1 FIONWRDVKJFHRC-UHFFFAOYSA-N 0.000 claims 1
- HYWCXWRMUZYRPH-UHFFFAOYSA-N trimethyl(prop-2-enyl)silane Chemical compound C[Si](C)(C)CC=C HYWCXWRMUZYRPH-UHFFFAOYSA-N 0.000 claims 1
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- 238000011161 development Methods 0.000 description 32
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 28
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 20
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- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 15
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 15
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- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 229910001873 dinitrogen Inorganic materials 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- 239000012044 organic layer Substances 0.000 description 7
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- 230000035945 sensitivity Effects 0.000 description 7
- 125000000217 alkyl group Chemical group 0.000 description 6
- 239000012295 chemical reaction liquid Substances 0.000 description 6
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000001747 exhibiting effect Effects 0.000 description 5
- KZVVGZKAVZUACK-BJILWQEISA-N rilpivirine hydrochloride Chemical compound Cl.CC1=CC(\C=C\C#N)=CC(C)=C1NC1=CC=NC(NC=2C=CC(=CC=2)C#N)=N1 KZVVGZKAVZUACK-BJILWQEISA-N 0.000 description 5
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 229910052740 iodine Inorganic materials 0.000 description 4
- 239000011630 iodine Substances 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- CSDQQAQKBAQLLE-UHFFFAOYSA-N 4-(4-chlorophenyl)-4,5,6,7-tetrahydrothieno[3,2-c]pyridine Chemical compound C1=CC(Cl)=CC=C1C1C(C=CS2)=C2CCN1 CSDQQAQKBAQLLE-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- FUSUHKVFWTUUBE-UHFFFAOYSA-N buten-2-one Chemical compound CC(=O)C=C FUSUHKVFWTUUBE-UHFFFAOYSA-N 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 229920005565 cyclic polymer Polymers 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
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- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- ILZDNFLRZMGTEL-UHFFFAOYSA-N (1-methylcyclohexa-2,4-dien-1-yl)-[2-(4-methylphenyl)ethenyl]silane Chemical compound CC1(CC=CC=C1)[SiH2]C=CC1=CC=C(C=C1)C ILZDNFLRZMGTEL-UHFFFAOYSA-N 0.000 description 1
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
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- OXHSYXPNALRSME-UHFFFAOYSA-N (4-ethenylphenyl)-trimethylsilane Chemical compound C[Si](C)(C)C1=CC=C(C=C)C=C1 OXHSYXPNALRSME-UHFFFAOYSA-N 0.000 description 1
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- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 1
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- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
- H01L21/31138—Etching organic layers by chemical means by dry-etching
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
- H01L21/3121—Layers comprising organo-silicon compounds
Definitions
- This invention relates to a method of forming patterns in the manufacture of microelectronic devices such as LSI devices and bubble memory devices, and more particularly to a pattern forming method which employs a dry etching technique for the transfer of resist patterns and utilizes as resist material a polymer-containing silyl groups.
- a resist material is known, e.g. from CA vol. 93, No. 10, abstract 104849.
- the thickness of a resist layer is an important factor in realization of high resolution patterns.
- J.M. Moran et al have proposed a three-layer technique in Journal of Vacuum Science and Technology, Vol. 16, No. 6, pp. 1620-1624 (1979).
- the first layer which covers the substrate surface and provides a flat surface is a sufficiently thick layer of an organic material
- the intermediate layer is formed of an inorganic material that can not easily be etched by dry etching using oxygen, such as silicon dioxide or silicon nitride.
- the third or top layer is a thin resist layer. In the patterning process, first the resist layer is exposed to light, X-ray or electron-beam and developed to generate a high resolution pattern.
- the intermediate layer is subjected to dry etching with the resist pattern as a mask, and then the pattern of the intermediate layer is transferred into the thick organic layer by reactive sputter etching using oxygen gas.
- a high resolution pattern can be generated in the resist layer firstly because it is possible to use a desirably thin resist layer for pattern generation and secondly because unfavorable influences of backscattering of electrons from the substrate or reflection of light waves from the substrate can be avoided.
- the high resolution pattern can accurately be transferred into the thick organic layer by sequential etching.
- polydimethylsiloxane is unsuitable for practical use as a patterning resist material because this material is liquid at room temperature even in the form of coating film so that the film is liable to suffer from adhesion of dust particles, damages on the surface and/or inconvenience for handling attributed to its fluidity.
- a pattern forming method comprises the steps of forming on an etchable substrate an organic polymer layer which can be etched by dry etching; forming on the organic polymer layer a resist film comprising a polymer having at least one substituted silyl group selected from trialkylsilyl-, dimethylphenylsilyl- and trialkloxysilyl groups; forming a desired pattern in the resist film by optical lithography, X-ray lithography or electronic-beam lithography; etching the organic polymer layer by dry etching using an oxygen-containing gas with the patterned resist film as a mask; and etching the substrate with the unetched areas of the organic polymer layer as a mask.
- the number of the substituted silyl groups in the patterned resist film is at least 1 x 10" per 1 cm 2 .
- the primary feature of the invention resides in the resist film.
- the polymer as the resist material must comprise a monomer unit having a trialkylsilyl group, dimethylphenylsilyl group or trialkoxysilyl group; the composition of the resist material and the film thickness usually needs to be such that the number of the substituted silyl groups in 1 cm 2 of the film is not less than 10' 6 .
- the resist material be a polymer only of monomer(s) having substituted silyl group(s) and/or copolymer of such monomer with other monomer which need not have any silicon-containing group.
- a conventional polymer material such as novalak resin.
- a resist pattern formed in the method according to the invention exhibits sufficient endurance to serve as a mask for dry etching of the underlaying organic polymer layer which may be a relatively thick layer.
- the number of the substituted silyl groups in the resist film depends on the thickness of the resist film, but it is unsuitable to make the resist film unnecessarily thick because then it becomes difficult to form fine resist patterns by usual exposure and development processes.
- a fine pattern formed in a very thin resist film can accurately be transferred into a relatively thick organic polymer layer.
- Fine and high resolution patterns can easily be obtained firstly because the resist film can be made suffi- cently thin and secondly because the organic polymer layer directly covering the substrate surface can be made thick enough to completely cover possible steps on the substrate surface and to avoid unfavorable influences of backscattering from the substrate in the case of using electron-beam lithography and reflection from the substrate in the case of using optical lithography.
- the processing steps are simplified compared with the three-layer technique described hereinbefore.
- the single Figure is a graph showing the manner of changes in the thickness of resist film subjected to reactive sputter etching using oxygen with respect to some examples of the present invention and conventional materials for reference.
- the substituted silyl-containing monomers are preferably selected from ones represented by the following general formulae:
- a copolymer As the resist material, it is suitable to copolymerize an ethylenic unsaturated monomer with a monomer having a substituted silyl group.
- useful ethylenic unsaturated monomers are methyl, ethyl, propyl, glycidyl, vinyl and allyl esters of acrylic acid or methacrylic acid, derivatives of styrene such as divinylbenzene, o-, m-or p-chloromethylstyrene and a-methylstyrene, vinyl acetate, diallyl phthalate, diallyl terephthalate, methylvinyl ketone, N-vinylpyrrolidone and vinylpyridine.
- the resist materials according to the invention are soluble in a variety of familiar organic solvents and high in glass transition temperature and, therefore, can easily be formed into a film of good quality. These resist materials are highly endurant to oxygen plasma as described hereinbefore, and they are glassy at room temperature and hence convenient for practical uses.
- the substrate surface is covered with the organic polymer layer and then the resist film is formed usually by spinning of a solution of a selected resist material in an organic solvent and drying the applied solution by adequate heating. Then a desired pattern is delineated on the resist film by using electron-beam, X-ray or deep ultraviolet ray for example, and development is performed by using a suitable developer.
- the underlaying organic polymer layer is dry etched (preferably by reactive sputter etching) using oxygen.
- this polymer was confirmed to be poly(p-trimethylsilylstyrene) (abbreviated to PSiSt) of the structure of formula (1), having a weight average molecular weight (M w ) of 2.2 x 10 4 and a number average molecular weight (M n ) of 1.1 x 10 4 .
- PSiSt poly(p-trimethylsilylstyrene)
- a resist material solution was prepared by dissolving 0.46 g of PSiSt obtained by the above described process in 10 ml of xylene (to obtain 5 wt% solution) with sufficient stirring, followed by filtration with a 0.2 micrometers filter.
- This solution was applied to a silicon substrate and dried in vacuum at room temperature to form a PSiSt film having a thickness of about 0.2 micrometers.
- the film was subjected to reactive sputter etching with 0 2 gas to measure the rate of decrease in the film thickness.
- the etching conditions were 4 sccm, 1.06 Pa (8 mTorr) and 120 W (0.096) W/cm 2 ).
- the curve S-1 represents the result of this test. As can be seen, the etch rate was very low.
- the etch rate became gradually and slightly lower as the time elapsed, but after the lapse of about 5 min from the start of etching the film thickness became almost invariable, meaning that the film was etched no more. In the initial period of about 5 min the film thickness decreased by only 0.022 micrometers. In the PSiSt film etched by reactive sputter etching with 0 2 gas, the number of trimethysilyl groups was calculated to be 1 x 10 16 per 1 cm 2 .
- the novolak resin When an about 1.8 micrometers film of a novolak resin (tradename AZ-1350J of Shipley Co.; this resin will be referred to as "the novolak resin") was etched under the same etching conditions, the rate of decrease in the film thickness was as represented by the curve P in the drawing figure. In the case the film thickness continued to decrease in proportion to the etching time with no change in the rate of decrease, and in 22 min the amount of etch reached 1.5 micrometers. Accordingly it is generally preferred that a PSiSt film in which the number of trimethylsilyl groups is at least 1 x 10 16 per 1 cm 2 be used as a mask for etching of a layer of the novolak resin.
- the aformentioned solution of PSiSt was applied by spinning to a silicon substrate and dried for 30 min in vacuum at room temperature to form a PSiSt film having a thickness of 0.138 micrometers. Then patterns of various line and space widths were delineated on the PSiSt film by means of an electron-beam apparatus by varying the dose of irradiation, and development was performed by 1 min treatment with a mixed solution of tetrahydrofuran and ethanol in the proportion of 35:65 by volume, followed by rinsing with isopropyl alcohol for 30 sec. After drying the thickness of the film in the irradiated areas was measured by using a Taylor-Hobson "Tally Step" instrument.
- the resolving capability of the tested resist material was determined by observation of the respective patterns formed in the exposed and developed film with optical microscope and scanning electron microscope. It was found that the dose of irradiation sufficient to cause gelation of the PSiSt film (will be represented by D') was 240 microcoulombs/cm 2 and the dose that caused the film thickness to reduce to 50% of the initial thickness (will be represented by ) was 270 microcoublombs/cm 2 . It was confirmed that patterns of 0.5 micrometers lines and spaces were perfectly resolved as an evidence of excellence of the PSiSt resist film in resolution.
- the novolak resin was applied by spinning to a silicon substrate to form a 1.5 micrometers thick film, followed by prebaking at 250° for 1 hr, and then the aforementioned solution of PSiSt was applied by spinning onto the novolak resin film and dried.
- a submicron pattern was formed in the PSiSt film by the above described exposure and development process. After the development treatment the thickness of the PSiSt film was 0.10 micrometers, and the number of trimethylsilyl groups in the film was calculated to be 4.5 x 10 16 ./ cm 2 .
- the novolak resin film was etched for 25 min by reactive sputter etching with 0 2 gas under the conditions of 1.06 Pa (8 mTorr), 4 sccm (standard cubic centimeters per minute) and 120 W.
- a submicron pattern initially delineated in the PSiSt film with irradiation dose of 400 microcoulombs/cm z was transferred with high resolution into the 1.5 micrometers film of the novolak resin. Therefore, the thickness of the PSiSt film was proved to have been sufficient to provide a mask for etching 1.5 micrometers thickness of the novolak resin.
- the submicron pattern thus formed in the novolak resin film was high in aspect ratio and sufficient in the masking effect for subsequent etching of the substrate.
- Example 2 In the reactor mentioned in Example 1, 3.5 g (0.02 moles) of SiSt was mixed with 0.8 g (0.005 moles) of anhydrous chloromethystyrene (abbreviated to CMS), 30 ml of dehydrated benzene and 0.0087 g (0.3 mole% of the total of SISt and CMS) of BPO, and the mixture was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction the reaction solution was poured into a large volume of petroleum ether to precipitate a polymer in the form of white powder. This polymer was refined by the method described in Example 1.
- CMS anhydrous chloromethystyrene
- this polymer was confirmed to be a copolymer of SiSt with CMS at the copolymerization ratio of 9:1 by mole.
- This copolymer i.e. poly(p-trimethylsilylstyrene-chloromethylstyrene) of the structure of formula (2), will be referred to as P(SiSt 90 ⁇ CM 10 ).
- the weight average molecular weight M w of this copolymer was 5.5 x 10 4
- M n was 2.5 ⁇ 10 4 .
- a resist material solution was prepared by dissolving 0.8 g of P(SiSt 90 ⁇ CMS 10 ) in 17.5 ml of xylene, followed by filtration with 0.2 micrometers filter.
- a P(SiStg o -CMS 1o ) film having a thickness of about 0.2 micrometers was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 0 2 gas under the same conditions as in Example 1.
- the rate of decrease in the film thickness was as represented by the curve S-2 in the drawing figure. After the lapse of about 5 min from the start of etching, the film became almost invariable in its thickness and no longer underwent etching.
- the film thickness decreased by only 0.032 micrometers.
- the number of trimethylsilyl groups was calculated to be 1.2 ⁇ 10 16 /cm 2 .
- the aforementioned solution of P(SiSt 90 ⁇ CMS 10 ) was applied by spinning to a silicon substrate and dried for 30 min in vacuum at room temperature to form a copolymer film having a thickness of 0.185 micrometers.
- the novolak resin was applied by spinning to a silicon substrate to form a 1.5 micrometers thick film, followed by prebaking at 250°C for 1 hr, and then the aforementioned solution of P(SiSt 90 ⁇ CMS 10 ) was spun onto the novolak resin film and dried.
- a submicron pattern was formed in the copolymer film by the above described exposure and development process.
- the thickness of the copolymer film was 0.10 micrometers, and the number of trimethylsilyl groups in the film was calculated to be 3.7 x 10 16 /cm 2 .
- the novolak resin was subjected to reactive sputter etching under the same conditions as in Example 1.
- Example 2 In the reactor mentioned in Example 1, 3.5 g (0.02 moles) of SiSt was mixed with 4.3 g (0.03 moles) of anhydrous glycidyl methacrylate (GMA), 50 ml of dehydrated benzene and 0.036 g (0.03 mole% of the total of SiSt and GMA) of BPO, and the mixture was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction solution was poured into a large volume of petroleum ether to precipitate a polymer in powder form. This polymer was refined by the method described in Example 1.
- GMA anhydrous glycidyl methacrylate
- M w of this polymer was 3.5 x 10 4 and M n was 1.8 x 10 4 , and the polymer was confirmed to be a copolymer of SiSt with GMA at the copolymerization ratio of 4:6 by mole.
- This copolymer i.e. (p-trimethylsily- latyrene-glycidyl methacrylate) of the structure of formula (3), will be referred to as P(SiSt 40 ⁇ GMA 60 ).
- a solution was prepared by dissolving 2.4 g of P(SiSt 4o -GMA so ) in 28 ml of methyl cellosolve acetate (to obtain 8 wt% solution) with sufficient stirring, followed by filtration with 0.2 micrometers filters.
- a P(SiSt 4o -GMA so ) film having a thickness of about 0.45 micrometers was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 0 2 gas under the same conditions as in Example 1.
- the rate of decrease in the film thickness was as represented by the curve S-3 in the drawing figure. In about 30 min the film thickness decreased by 0.17 micrometers, and therefore the copolymer film was no longer etched.
- the aforementioned solution of was applied by spinning to a silicon substrate and prebaked in nitrogen gas stream at 80°C for 30 min to form a copolymer film having a thickness of 0.23 micrometer. Then patterns of various line and space width were delineated on the copolymer film by electron-beam irradiation, and development was performed by 1 min treatment with a mixed solution of trichoroethylene and acetone in the proportion of 3:1 by volume, followed by rinsing with ethanol for 30 sec. Then the thickness, sensitivity and resolving capability of the copolymer film were examined by the same methods as in Example 1.
- a submicron pattern formed in a P(SiSt 40 ⁇ GMA 60 ) film with electron-beam irradiation dose of 20 microcoulombs/cm 2 was transferred into an underlying 1.5 micrometers film of the novolak resin by reactive sputter etching carried out under the same conditions as in Example 1.
- the thickness of the patterned copolymer film was 0.20 micrometers, and the number of trimethylsilyl groups in the film was calculated to be 3.6 ⁇ 10 16 /cm 2 .
- the thickness of the copolymer film was proved to have been sufficient for etching 1.5 micrometers thickness of the novolak resin.
- Example 2 In the reactor mentioned in Example 1, 0.35 g (0.002 moles) of SiSt was mixed with 8.6 g (0.06 moles) of GMA, 50 ml of dehydrated benzene and 0.045 g (0.3 mole% of the total of SiSt and GMA) of BPO, and the mixture was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction solution was poured into a large volume of petroleum ether to precipitate a polymer in powder form. This polymer was refined by the method described in Example 1.
- M w of the polymer was 2.0 x 10 4 and M " , was 1.2 x 10 4 , and the polymer was confirmed to be a copolymer of SiSt with GMA at the copolymerization ratio of 1:30 by mole.
- a solution was prepared by dissolving 2.4 g of the obtained copolymer, which will be referred to as P(SiSt 3 ⁇ GMA 97 ), in 28 ml of methyl Cellosolve® acetate (to obtain 8 wt% solution) with sufficient stirring, followed by filtration with a 0.2 micrometers filter.
- P(SiSt 3 ⁇ GMA 97 ) film having a thickness of about 0.5 micrometers was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 0 2 gas under the same conditions as in Example 1. In this case the rate of decrease in the film thickness was as represented by the curve R in the drawing figure.
- the etch rate was considerably higher than in the case of P(SiSt 40 ⁇ GMA 60 ) of Example 3.
- the number of trimethylsilyl groups was calculated to be 0.8 x 10 16 /cm 2 . From the result of this experiment it is understood that this polymer film in which the number of trimethylsilyl groups was less than 10 16 /cm 2 is insufficient in its resistance to dry etching using oxygen to serve as a mask for etching of an underlying organic layer such as a novolak resin layer.
- Example 2 In the reactor mentioned in Example 1, 7.3 g (0.03 moles) of a hydrous diallyl phthalate (abbreviated to DAP) was mixed with 3.4 g (0.03 moles) of trimethylallysilane (abbreviated to TMASi), 10 ml of dehydrated benzene and 0.51 g (3 mole% of the total of DAP and TMASi) of BPO, and the mixture was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction solution was poured into a large volume of methanol to precipitate a polymer in the form of white powder.
- DAP hydrous diallyl phthalate
- TMASi trimethylallysilane
- a solution was prepared by dissolving 2.0 g of the obtained copolymer, which will be referred to as P(DAP 70 -TMASi 3o ), in 20 ml of methyl cellosolve acetate (to obtain 9.1 wt% solution) with sufficient stirring, followed by filtration with a 0.2 micrometers filter.
- P(DAP 70 ⁇ TMASi 30 ) film was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 0 2 gas under the same conditions as in Example 1. In 15 min the film thickness decreased by 0.12 micrometers, but thereafter the film thickness remained almost invariable.
- the number of trimethylsilyl groups in this etched film was calculated to be 1.3 x 10 16 / cm 2 .
- etch rate of the novolak resin mentioned in Example 1 it is understood that such a film of P(DAP 70 ⁇ TMASi 30 ) can be used as a mask for etching of the novolak resin.
- the aforementioned solution of was applied by spinning to a silicon substrate and dried for 30 min in vacuum at room temperature to form a copolymer film having a thickness of 0.233 micrometers. Then patterns of various line and space widths were delineated on the copolymer film by electron-beam irradiation, and development was performed by 90 sec treatment with a mixed solution of dioxane and methyl Cellosolve 0 in the proportion of 3:2 by volume, followed by rinsing with ethanol for 30 sec. Then the thickness, sensitivity and resolving capability of the copolymerfilm were examined by the same methods as in Example 1.
- Example 2 In the next experiment a 1.5 micrometers film of the novolak resin was formed on a silicon substrate by the method described in Example 1, and then the aforementioned solution of was spun onto the novolak resin film and dried. A submicron pattern was formed in the copolymer film by the aforementioned electron-beam irradiation and development process. After the development treatment the thickness of the copolymer film was 0.14 micrometers, and the number of trimethylsilyl groups in the film was calculated to be 1.48 x 10 16 /cm 2 . With the patterned copolymerfilm as a mask the novolakfilm was subjected to reactive sputter etching under the same conditions as in Example 1.
- a solution was prepared by dissolving 1.7 g of the obtained copolymer, which will be referred to as P(DAP 50 ⁇ TMASi 50 ), in 22 ml of methyl cellosolve acetate (to obtain 7 wt% solution) with sufficient stirring, followed by filtration with 0.2 micrometers filter.
- P(DAP 50 ⁇ TMASi 50 ) was formed on a silicon substrate, and the film was subjected to reactive sputter etching with O2 gas under the same conditions as in Example 1. In 10 min the film thickness decreased by 0.06 micrometers, but thereafter the film thickness remained almost invariable.
- the number of trimethylsilyl groups in this etched film was calculated to be 1.2 x 10 16 / cm 2 .
- etch rate of the novolak resin mentioned in Example 1 it is understood that such a film of P(DAP 50 ⁇ TMASi 50 ) can be used as a mask for etching of the novolak resin.
- a copolymer film having a thickness of 0.24 micrometers was formed on a silicon substrate by the same method as in Example 4.
- the patterns of various line and space widths were delineated on the copolymer film by the same electron-beam irradiation and development process as in Example 4, and the thickness, sensitivity and resolving capability of this copolymer film were examined by the same methods as in Example 1. It was found that D i g for this copolymer film was 7 microcoulombs/cm 2 , and D 50 g was 13 microcoulombs/cm 2.
- the copolymer film was excellent in resolution of the patterns, and it was confirmed that with irradiation dose of 15 microcoulombs/cm 2 patterns of 0.5 micrometers lines and spaces were perfectly resolved.
- Example 2 In the next experiment a 1.5 micrometers film of the novlak resin was formed on a silicon substrate by the method described in Example 1, and then the aforementioned solution of was spun onto the novolak resin film and dried. A submicron pattern was formed in the copolymer film by the aforementioned electron-beam irradiation and development process. After the development treatment the thickness of the copolymer film was 0.15 micrometers, and the number of trimethylsilyl groups in the film was calculated to be 3 ⁇ 10 16 /cm 2 . With the patterned copolymer film as a mask the novolak resin film was subjected to reactive sputter etching under the same conditions as in Example 1.
- Example 2 a mixture of 7.3 g (0.03 moles) of diallyl terephthalate (abbreviated to DATP), 3.4 g (0.03 moles) of TMASi, 10 ml of dehydrated benzene and 0.51 g (3 mole% of the total of DATP and TMASi) of BPO was subjected of polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction liquid was poured into a large volume of methanol to precipitate a polymer in powder form. The polymer was refined and dried in the same manner as in Example 4 to obtain 8.0 g of dry polymer.
- DATP diallyl terephthalate
- the symbol X represents a unit structure of a cyclic polymer, which is most probably of the following two formulas.
- a solution was prepared by dissolving 2.0 g of the obtained copolymer, which will be referred to as P(DATP 60 ⁇ TMASi 40 ), in 20 ml of methyl cellosolve acetate (to obtain 9.1 wt% solution) with sufficient stirring, followed by filtration with a 0.2 micrometers filter.
- P(DATP so -TMASi 4o ) was formed on a silicon substrate, and the film was subjected to reactive sputter etching with O2 gas under the same conditions as in Example 1.
- the novolak resin film was subjected to reactive sputter etching in the same manner as in Example 1 to result in that the submicron pattern was transferred into the novolak resin film. Therefore, the thicknes of the copolymer film was proved to have been sufficient to provide a mask for etching 1.0 micrometer thickness of the novolak resin.
- Example 2 In the reactor mentioned in Example 1, a mixture of 7.3 g (0.03 moles) of DAP, 0.6 g (0.005 moles) of TMASi, 10 ml of dehydrated benzene and 0.30 g (3 mole% of the total of DAP and TMASi) of BPO was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction solution was poured into a large volume of methanol to precipitate a polymer in powder form. The polymer was refined and dried in the same manner as in Example 4 to obtain 7.0 g of dry polymer. By analysis, M w of the obtained copolymer was 5.5 x 10 3 and M " was 3.9 x 10 3 .
- the copolymer had an iodine value of 46.4 and contained 0.65% by weight of Si. Therefore, the structure of this DAP-TMASi copolymer was presumed to be as represented by formula (4A).
- formula (4A) the symbol X represents the unit structure described in Example 4.
- a solution was prepared by dissolving 2.0 g of the obtained copolymer, which will be referred to as P(DAP 94 ⁇ TMASi 6 ), in 20 ml of methyl Cellosolve @ acetate, followed by filtration with a 0.2 micrometers filter.
- P(DAP 94 -TMASi s ) having a thickness of 0.45 micrometers was formed on a silicon substrate, and the film was subjected to reactive sputter etching under the same conditions as in Example 1.
- the copolymer film was etched to the extent of the 4.5 micrometers thickness without exhibiting a decrease in the etch rate.
- this copolymer film the number of trimethylsilyl groups was calculated to be 7.5 x 10 15 /cm 2 . From the result of the test it is understood that this copolymer film in which the number of trimethylsilyl groups was less than 10 16 /cm 2 is insufficient in its resistance to dry etching using oxygen to serve as a mask for etching of an underlying organic layer such as a novolak resin layer.
- Example 1 In the reactor mentioned in Example 1, a mixture of 10.6 g (0.1 moles) of a novolak-type phenolic resin (containing no photosensitive agent) and 4.8 g (0.03 moles) of hexamethyldisilazane was gradually heated from room temperature up to 150°C and maintained at 150°C for 3-4 hr so as to undergo copolymerization reaction. The reaction was terminated after confirming that the reaction system in the flask no longer emitted the odor of ammonia. The content of Si in the obtained copolymer was determined to be 6.1% by weight, and the copolymer was subjected to infrared absorption spectrum analysis. From the analytical results the structure of this copolymer was presumed to be as represented by formula (7).
- a solution was prepared by dissolving 2.0 g of the obtained copolymer, namely, trimethylsilyl- substituted phenolic resin which will be referred to as P(PhOH 70 ⁇ PhOSi 30 ), and 0.5 g of 3,3-diazido biphenyl sulfone in 20 ml of cellosolve acetate (to obtain 8.9 wt% solution) with sufficient stirring, followed by filtration with a 0.2 micrometers filter.
- P(PhOH 70 ⁇ PhOSi 30 ) trimethylsilyl- substituted phenolic resin which will be referred to as P(PhOH 70 ⁇ PhOSi 30 )
- P(PhOH 70 ⁇ PhOSi 30 ) trimethylsilyl- substituted phenolic resin which will be referred to as P(PhOH 70 ⁇ PhOSi 30 )
- 3,3-diazido biphenyl sulfone in 20 ml of cellosolve
- the number of trimethylsilyl groups in this etched copolymer film was calculated to be 1.6 x 10 16 /cm 2 .
- etch rate of the novolak resin (AZ-1350J) mentioned in Example 1 it is understood that such a film of this copolymer can be used as a mask for etching of the novolak resin.
- a 1.0 micrometer film of the novolak resin (AZ-1350J) was formed on a silicon substrate by the method described in Example 1, and then the solution of P(PhOH 7o -PhOSi 3o ) was spun onto the novolak resin film and dried.
- a submicron pattern was formed in the copolymer film by electron-beam irradiation and development, which was 1 min treatment with methyl cellosolve acetate followed by rinsing with isopropyl alcohol for 30 sec.
- the irradiation dose was 300 microcoulombs/cm 2.
- the thickness of the copolymer film was 0.22 micrometers, and the number of trimethylsilyl groups in the film was calculated to be 2.8 x 10' 6 /cm 2 . Then, the submicron pattern of negative type was accurately transferred from the copolymer film into the novolak resin film by reactive sputter etching with 0 2 . Accordingly the thickness of the copolymer film was sufficient to provide a mask for etching 1.0 micrometer thickness of the novolak resin.
- Example 7 The polymerization process in Example 7 was repeated by increasing the quantity of hexamethyldisilazane to 8.0 g (0.05 moles), and the obtained copolymer was subjected to chemical analysis and infrared absorption spectrum analysis.
- the content of Si in the copolymer was 8.0% by weight, and the structure of the copolymer was presumed to be as represented by formula (8).
- a solution was prepared by dissolving 2.0 g of the obtained copolymer, namely, trimethylsilyl- substituted phenolic resin which will be referred to as P(PhOH so -PhOSi 4o ), and 0.5 g of 3,3-diazido biphenyl sulfone in 20 ml of cellosolve acetate (to obtain 8.9 wt% solution), followed by filtration with a 0.2 micrometers filter.
- P(PhOH so -PhOSi 4o ) was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 0 2 under the same conditions as in Example 1.
- a 1.0 micrometer film of the novolak resin (AZ-1350J) was formed on a silicon substrate by the method described in Example 1, and then the solution of P(PhOH so -PhOSi 4o ) was spun onto the novolak resin film and dried.
- a submicron pattern was formed in the copolymer film by the electron-beam irradiation and development process mentioned in Example 7. In this case the irradiation dose was 350 microcoulombs/cm 2 .
- the thickness of the copolymer film was 0.20 micrometers, and the number of trimethylsilyl groups in the film was 3.3 x 10 16 /cm 2 .
- the submicron pattern was accurately transferred from the copolymer film into the novolak resin film by reactive sputter etching with 0 2 . Accordingly the thickness of the copolymer film was sufficient to provide a mask for etching 1.0 micrometer thickness of the novolak resin.
- a solution was prepared by dissolving 2.0 g of this copolymer, which will be referred to as P(PhOH 93 -PhOSi 7 ), and 0.5 g of 3,3-diazido biphenyl sulfone in 20 ml of cellosolve acetate (to obtain 6.2 wt% solution), followed by filtration with 0.2 micrometers filter.
- P(PhOH 93 -PhOSi 7 ) having a thickness of 0.28 micrometers was formed on a silicon substrate, and the film was subjected to reactive sputter etching under the same conditions as in Example 1.
- the copolymer film was etched to the extent of its 0.28 micrometers thickness without exhibiting a decrease in the etch rate.
- the number of trimethylsilyl groups was calculated to be 9.2 x 10 15 /cm 2 . This indicates that this copolymer film in which the number of trimethylsilyl groups is less than 10 16 /cm 2 is insufficient in its resistance to dry etching using oxygen to serve as a mask for etching of an underlying organic layer such as a novolak resin layer.
- Example 2 a mixture of 3.5 g of anhydrous p-triethylsilylstyrene (abbreviated to ESiSt), 30 ml of dehydrated benzene and 0.014 g of BPO was subjected to polymerization reaction for 8 hr at a reflux temperature, and a polymer formed by the reaction was refined and dried by the same methods as in Example 4.
- the polymer was poly(p-triethylsilylstyrene), which will be referred to as PESiSt, represented by formula (9).
- M of this polymer was 3.0 ⁇ 10 4
- M n was 1.7 ⁇ 10 4 .
- a solution was prepared by dissolving 1.0 g of PESiSt in 20 ml of xylene (to obtain 4.8 wt% solution) with sufficient stirring, followed by filtration with a 0.2 micrometers filter.
- a film of PESiSt was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 0 2 under the same conditions as in Example 1.
- the film thickness decreased by 0.032 micrometers, but thereafter the film thickness remained almost invariable.
- the number of triethylsilyl groups in this etched polymer film was calculated to be 1.0 x 10 16 /cm 2 .
- the etch rate of the novolak resin mentioned in Example 1 it is understood that such a film of PESiSt can be used as a mask for etching of the novolak resin.
- the aforementioned solution of PESiSt was applied by spinning to a silicon substrate and heated in nitrogen gas stream at 100°C for 30 min to thereby form a polymer film having a thickness of 0.190 micrometers.
- the patterns of various line and space widths were delineated on the polymer film electron-beam irradiation, and development was performed by 1 min treatment with a mixed solution of tetrahydrofuran and ethanol in the proportion of 4:1 by volume, followed by rinsing with isopropyl alcohol for 30 sec.
- the sensitivity and resolving capability of the polymer film were examined in the same manner as in Example 1. It was found that D9 for this polymer film was 210 microcoulombs/cm 2 and was 240 microcoulombs/cm 2 .
- the polymer film was excellent in resolution of the patterns, and it was confirmed that with irradiation dose of 270 microcoulombs/cm 2 submicron patterns were perfectly resolved.
- a film of PESiSt was formed on a 1.5 micrometers film of the novolak resin, and a submicron pattern was formed in the polymer layer with irradiation dose of 380 microcoulombs/cm 2 .
- the thickness of the polymer film was 0.15 micrometers, and the number of triethylsily groups in the polymer film was 5.0 ⁇ 10 16 /cm 2 .
- the submicron pattern was accurately transferred from the polymer film to the novolak resin film. Accordingly the thickness of the PESiSt film was sufficient to provide a mask for etching 1.5 micrometers thickness of the novolak resin.
- a solution was prepared by dissolving 2 g of P(HEMA-Si) in 23 ml of methyl cellosolve acetate (to obtain 8 wt% solution), followed by filtration with a 0.2 micrometers filter.
- a film of P(HEMA-Si) was formed on a silicon substrate, and the film was subjected to reactive sputter etching with O2 under the same conditions as in Example 1.
- the film thickness decreased by 0.039 micrometers, but thereafter the film thickness remained almost invariable.
- the number of trimethylsilyl groups in this etched polymer film was calculated to be 1.5 x 10 16 /cm 2 .
- the etch rate of the novolak resin mentioned in Example 1 it is understood that such a film of P(HEMA-Si) can be used as a mask for etching of the novolak resin.
- a 1.5 micrometers film of the novolak resin was formed on a silicon substrate by the method described in Example 1, and the aforementioned solution of P(HEMA-Si) was spun onto the novolak resin film and heated on nitrogen gas stream at 80°C for 30 min to thereby form a P(HEMA-Si) film.
- a submicron pattern was formed in the polymer film by electron-beam irradiation and development, which was 1 min treatment with a mixed solution of butyl Cellosolve@ and cyclohexane in the proportion of 1:19 by volume followed by 30 sec rinsing with cyclohexane.
- the irradiation dose was 50 microcoulombs/cm z .
- the thickness of the polymer film was 0.17 micrometers, and the number of trimethylsilyl groups in the film was 6.6 x 10 16 /cm 2 . Then the submicron pattern of positive type was accurately transferred from the P(HEMA-Si) film into the novolak resin film by reactive sputter etching with O2, Accordingly the thickness of the P(HEMA-Si) film was sufficient to provide a mask for etching 1.5 micrometers thickness of the novolak resin.
- a solution was prepared by dissolving 2.0 g of this copolymer, which will be referred to as P(HEMASi 50 -MMA 50 ), in 23 ml of methyl cellosolve acetate.
- P(HEMASi 50 -MMA 50 ) was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 0 2 under the same conditions as in Example 1.
- the film thickness decreased by 0.045 micrometers, but thereafter the film thickness remained almost invariable.
- the number of trimethylsilyl groups in the etched film was calculated to be 1.2 ⁇ 10 16 /cm 2 .
- the etch rate of the novolak resin mentioned in Example 1 it is understood that such a film of P(HEMASi 50 -MMA 50 ) can be used as a mask for etching of the novolak resin.
- a 1.5 micrometers film of the novolak resin was formed on a silicon substrate by the method described in Example 1, and the aforementioned solution of P(HEMASi so -MMA 50 ) was spun onto the novolak resin film and heated in nitrogen gas stream at 80°C for 30 min to thereby form a film of this copolymer.
- a submicron pattern was formed in the copolymer film by electron-beam irradiation and development, which was 1 min treatment with a mixed solution of methylisobutyl ketone and cyclohexane in the proportion of 1:1 by volume followed by 30 sec rinsing with cyclohexane.
- the irradiation dose was 100 microcoulombs/cm 2 .
- the thickness of the copolymer film was 0.20 micrometers, and the number of trimethylsilyl groups in the copolymer film was 5.1 x 10 16 /cm 2 . Then the submicron pattern of positive type was accurately transferred from the copolymer film to the novolak resin film by reactive sputter etching with O2. Accordingly the thickness of the P(HEMASi 50 -MMA 50 ) film was sufficient to provide a mask for etching 1.5 micrometers thickness of the novolak resin.
- a solution was prepared by dissolving 1 g of this copolymer, which will be referred to as SP(HEMASi 5 -MMA 95 ), in 9 ml of methyl Cellosolve@.
- SP(HEMASi 5 -MMA 95 ) a film of P(HEMASi 5 -MMA 95 ) having a thickness of 0.25 micrometers was formed on a silicon substrate, and the film was subjected to reactive sputter etching under the same conditions as in Example 1.
- the copolymer film was etched to the extent of its 0.25 micrometers thickness without exhibiting a decrease in the etch rate.
- the number of trimethylsilyl groups in this copolymer film was calculated to be 8.4 x 10 15 /cm 2 .
- this copolymer film in which the number of trimethylsilyl groups is less than 10 16 /cm 2 is insufficient in its resistance to dry etching using oxygen to serve as a mask for etching of an underlying organic layer such as a novolak resin layer.
- Example 2 a mixture of 4.8 g (0.02 moles) of p-dimethylphenylsilylstyrene (abbreviated to PhSiSt), 50 ml of dehydrated bensene and 0.036 g of BPO was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction liquid was poured into a large volume of methanol to precipitate a polymer. This polymer was refined and dried by the methods described in Example 1 to obtain 3.2 g of dry polymer. The polymer was poly(p-dimethylphenylsilylstyrene), which will be referred to as PPhSiSt, represented by formula (12). By analysis, M w of this polymer was 1.9 x 104 and M n was 6.3 x 10 3 .
- PhSiSt p-dimethylphenylsilylstyrene
- a solution was prepared by dissolving 2.4 g of PPhSiSt in 28 ml of methyl cellosolve acetate (to obtain 8 wt% solution) with sufficient stirring, followed by filtration with a 0.2 micrometers filter.
- a film of PPhSiSt was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 0 2 under the same conditions as in Example 1. In 5 min the film thickness decreased by 0.040 micrometers, but thereafter the film thickness remained almost invariable.
- the number of dimethylphenylsilyl groups in this etched film was calculated to be 1.2 ⁇ 10 16 /cm 2 .
- the etch rate of the novolak resin mentioned in Example 1 it is understood that such a film of PPhSiSt can be used as a mask for etching of the novolak resin.
- a 1.5 micrometers film of the novolak resin was formed on a silicon substrate by the method described in Example 1, and the aforementioned solution of PPhSiSt was spun onto the novolak resin film and heated in nitrogen gas stream at 100°C for 30 min to thereby form a film of the polymer.
- a submicron pattern was formed in the PPhSiSt film by electron-beam irradiation and development, which was 1 min treatment with a mixed solution of methylethyl ketone and isopropyl alcohol in the proportion of 5:1 by volume followed by 30 sec rinsing with isopropyl alcohol.
- the irradiation dose was 500 micrometers/cm 2 .
- the thickness of the polymer film was 0.18 micrometers, and the number of dimethylphenylsilyl groups in the polymer film was calculated to be 5.5 x 10 16 /cm 2 . Then the submicron pattern was accurately transferred from the PPhSiSt film into the novolak resin film by reactive sputter etching with 0 2 . Accordingly the thickness of the PPhSiSt film was sufficient to provide a mask for etching 1.5 micrometers thickness of the novolak resin.
- Example 2 In the reactor mentioned in Example 1, a mixture of 1.4 g (0.006 moles) of PhSiSt, 7.0 g (0.05 moles) of GMA, 50 ml of dehydrated benzene and 0.041 g of BPO was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction liquid was poured into a large volume of petroleum ether to precipitate a polymer. This polymer was refined and dried by the methods mentioned in Example 4. By analysis, M w of this polymer was 9.2 x 10 3 and M n was 4.3 x 10 3. The polymer was a copolymer of PhSiSt with GMA at the copolymerization ratio of 1:9 by mole.
- a solution was prepared by dissolving 2.4 g of the PhSiSt-GMA copolymer in 28 ml of methyl cellosolve acetate (to obtain 8 wt% solution) followed by filtration with a 0.2 micrometers filter.
- a film of the copolymer having a thickness of 0.2 micrometers was formed on a silicon substrate, and the film was subjected to reactive sputter etching under the same conditions as in Example 1.
- the copolymer film was etched to the extent of its 0.2 micrometers thickness without exhibiting a decrease in the etch rate.
- the number of dimethylphenylsilyl groups in this copolymer film was calculated to be 9.5 ⁇ 10 15 /cm 2 .
- this copolymer film in which the number of dimethylphenylsilyl groups is less than 10 16 /cm 2 is insufficient in its resistance to dry etching using oxygen to serve as a mask for etching of an underlying organic polymer layer such as a novolak resin layer.
- Example 2 In the reactor mentioned in Example 1, a mixture of 5.0 g (0.02 moles) of 3-trimethoxysilylpropyl methacrylate (abbreviated to SiMA), 2.8 g (0.02 moles) of GMA refined by distillation over calcium hydride, 50 ml of dehydrated benzene and 0.028 g of BPO was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction liquid was poured into a large volume of petroleum ether to precipitate a polymer in the form of white powder, and the polymer was refined and dried by same methods as in Example 1 to obtain 7.3 g of dry polymer. Analysis of this polymer gave the following values.
- SiMA 3-trimethoxysilylpropyl methacrylate
- the polymer was confirmed to be a copolymer of SiMA having the structure represented by formula (13). This copolymer will be referred to as P(SiMA 50 -GMAso).
- a solution was prepared by dissolving 1.0 g of P(SiMA 50 -GMA 50 ) in 19 ml of methyl cellosolve acetate (to obtain 5 wt% solution) with sufficient stirring, followed by filtration with 0.2 micrometers filter.
- the novolak resin (AZ-1350J) was applied by spinning to a silicon substrate and heated at 200°C for 1 hr to thereby form a 1.5 micrometers film. After cooling of the substrate to room temperature the solution of P(SiMA so -GMA 50 ) was spun onto the novolak resin film and heated in nitrogen gas stream at 80°C for 30 min to thereby form a P(SiMA so -GMA so ) film of which the thickness was estimated to be 0.22 micrometers.
- a submicron pattern was formed in the copolymer film by electron-beam irradiation with irradiation dose of 0.4 micrometers/cm 2 and development, which was performed by 1 min treatment with a mixed solution of trichloroethylene and acetone in the proportion of 3:1 by volume followed by 30 sec rinsing with ethanol. Then the submicron pattern was accurately transferred from the copolymer film into the novolak resin film by reactive sputter etching with O2 gas which was carried out for 25 min under the same conditions as in Example 1.
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Description
- This invention relates to a method of forming patterns in the manufacture of microelectronic devices such as LSI devices and bubble memory devices, and more particularly to a pattern forming method which employs a dry etching technique for the transfer of resist patterns and utilizes as resist material a polymer-containing silyl groups. Such a resist material is known, e.g. from CA vol. 93, No. 10, abstract 104849.
- In the manufacture of microelectronic devices such as semiconductor integrated circuit devices including LSI devices and bubble memory devices, optical lithography and electron-beam lithography are prevailing techniques to form fine patterns. With the recent tendency to make the patterns in such devices more and more fine, dry etching processes such as gas plasma etching, reactive sputter etching and ion milling have been employed in place of the conventional wet etching processes for transferring resist patterns obtained by an exposure and development process to the substrates with high accuracy. Accordingly there is a keen demand for improved resist materials that are sufficiently endurant to dry etching and high insensitivity and resolving capability.
- The thickness of a resist layer is an important factor in realization of high resolution patterns.
- However, in the industrial manufacturing processes it is not seldom that the surface of the substrate to be etched has steps, and in such cases it is required to form a considerably thick resist layer in order to accomplish complete coverage of the steps and to provide a flat surface. This is unfavorable for attaining high resolution. When using a negative type resist, it is very difficult to form a high resolution pattern in a thick resist layer because swelling of the resist during the development treatment becomes significantly detrimental to the precision of the pattern. Also when using a positive type resist, high resolution patterning of a thick resist layer is difficult due to adverse influences of backscattering from the substrate in the case of electron-beam lithography and reflection from the substrate in the case of optical lithography. Particularly over the stepped areas of the substrate, significant variations on the resist pattern lines width are liable to occur despite constancy of exposure by reason of extraordinarily strong proximity effects.
- To solve such difficulties, J.M. Moran et al have proposed a three-layer technique in Journal of Vacuum Science and Technology, Vol. 16, No. 6, pp. 1620-1624 (1979). According to this three-layer technique the first layer which covers the substrate surface and provides a flat surface is a sufficiently thick layer of an organic material, and the intermediate layer is formed of an inorganic material that can not easily be etched by dry etching using oxygen, such as silicon dioxide or silicon nitride. The third or top layer is a thin resist layer. In the patterning process, first the resist layer is exposed to light, X-ray or electron-beam and developed to generate a high resolution pattern. Next, the intermediate layer is subjected to dry etching with the resist pattern as a mask, and then the pattern of the intermediate layer is transferred into the thick organic layer by reactive sputter etching using oxygen gas. By employing this three-layer technique a high resolution pattern can be generated in the resist layer firstly because it is possible to use a desirably thin resist layer for pattern generation and secondly because unfavorable influences of backscattering of electrons from the substrate or reflection of light waves from the substrate can be avoided. The high resolution pattern can accurately be transferred into the thick organic layer by sequential etching.
- However, from an industrial point of view it is a disadvantage of the three-layer technique that the processing operations becomes complicated and time-consuming mainly because of the addition of the intermediate layer which is formed by vacuum deposition, sputtering or plasma CVD method.
- If it is practicable to use a resist material that is endurant to dry etching using oxygen, it becomes possible to etch a thick organic layer by directly using the resist layer for initial patterning as a mask, and hence the above described three-layer structure can be simplified to a two-layer structure. To our knowledge, however, such a con- veniant resist material is not available in the present state of the art. Polydimethylsiloxane is known as endurant to dry etching to such extent that the etch rate of this material by O2 plasma etching is nearly zero. However, polydimethylsiloxane is unsuitable for practical use as a patterning resist material because this material is liquid at room temperature even in the form of coating film so that the film is liable to suffer from adhesion of dust particles, damages on the surface and/or inconvenience for handling attributed to its fluidity.
- A pattern forming method according to the invention comprises the steps of forming on an etchable substrate an organic polymer layer which can be etched by dry etching; forming on the organic polymer layer a resist film comprising a polymer having at least one substituted silyl group selected from trialkylsilyl-, dimethylphenylsilyl- and trialkloxysilyl groups; forming a desired pattern in the resist film by optical lithography, X-ray lithography or electronic-beam lithography; etching the organic polymer layer by dry etching using an oxygen-containing gas with the patterned resist film as a mask; and etching the substrate with the unetched areas of the organic polymer layer as a mask. Preferably the number of the substituted silyl groups in the patterned resist film is at least 1 x 10" per 1 cm2.
- The primary feature of the invention resides in the resist film. The polymer as the resist material must comprise a monomer unit having a trialkylsilyl group, dimethylphenylsilyl group or trialkoxysilyl group; the composition of the resist material and the film thickness usually needs to be such that the number of the substituted silyl groups in 1 cm2 of the film is not less than 10'6. Insofar as these requirements are met, the resist material be a polymer only of monomer(s) having substituted silyl group(s) and/or copolymer of such monomer with other monomer which need not have any silicon-containing group. For the organic polymer layer that directly covers the substrate surface, one may use a conventional polymer material such as novalak resin.
- We have discovered that polymers formed by using monomer having a substituted silyl group as specified above are endurant to oxygen plasma. Furthermore, when such polymer is formed into a film such that the number of said substituted silyl groups in the film is at least 1 x 10'6/cm2 and the film is subjected to reactive sputter etching using oxygen, there occurs lowering in the etch rate with lapse of time and, in a short time, the etch rate drops below a few angstroms per minute so that in a practical sense the resist film does not undergo further etching. For comparison, in the case of widely used novolak resin film the etch rate remains constant at a relatively high level such as 70-80 nm/min (700-800AImin) with practically no change with etching time. Therefore, a resist pattern formed in the method according to the invention exhibits sufficient endurance to serve as a mask for dry etching of the underlaying organic polymer layer which may be a relatively thick layer. The number of the substituted silyl groups in the resist film depends on the thickness of the resist film, but it is unsuitable to make the resist film unnecessarily thick because then it becomes difficult to form fine resist patterns by usual exposure and development processes.
- By using the pattern forming method according to the invention, a fine pattern formed in a very thin resist film can accurately be transferred into a relatively thick organic polymer layer. Fine and high resolution patterns can easily be obtained firstly because the resist film can be made suffi- cently thin and secondly because the organic polymer layer directly covering the substrate surface can be made thick enough to completely cover possible steps on the substrate surface and to avoid unfavorable influences of backscattering from the substrate in the case of using electron-beam lithography and reflection from the substrate in the case of using optical lithography. As an additional advantage of this method, the processing steps are simplified compared with the three-layer technique described hereinbefore.
- The invention is further illustrated by the following detailed description with reference to the accompanying drawings.
- The single Figure is a graph showing the manner of changes in the thickness of resist film subjected to reactive sputter etching using oxygen with respect to some examples of the present invention and conventional materials for reference.
- The substituted silyl-containing monomers are preferably selected from ones represented by the following general formulae:
- Monomers having trialkylsilyl group:
- Monomers having dimethylphensilyl group:
- In the case of using a copolymer as the resist material, it is suitable to copolymerize an ethylenic unsaturated monomer with a monomer having a substituted silyl group. Examples of useful ethylenic unsaturated monomers are methyl, ethyl, propyl, glycidyl, vinyl and allyl esters of acrylic acid or methacrylic acid, derivatives of styrene such as divinylbenzene, o-, m-or p-chloromethylstyrene and a-methylstyrene, vinyl acetate, diallyl phthalate, diallyl terephthalate, methylvinyl ketone, N-vinylpyrrolidone and vinylpyridine.
- The resist materials according to the invention are soluble in a variety of familiar organic solvents and high in glass transition temperature and, therefore, can easily be formed into a film of good quality. These resist materials are highly endurant to oxygen plasma as described hereinbefore, and they are glassy at room temperature and hence convenient for practical uses.
- In the case of polymers having trialkoxysilyl groups, sometimes the resist film tends to undergo hydrolysis if left standing for a long time and consequently undergoes cross-linking to become less soluble in organic solvents. Polymers having trialkylsilyl group or dimethylphenylsilyl group do not exhibit such tendency and therefore are preferable.
- In the pattern forming method according to the present invention, first the substrate surface is covered with the organic polymer layer and then the resist film is formed usually by spinning of a solution of a selected resist material in an organic solvent and drying the applied solution by adequate heating. Then a desired pattern is delineated on the resist film by using electron-beam, X-ray or deep ultraviolet ray for example, and development is performed by using a suitable developer. By using the resist pattern obtained in this way as a mask, the underlaying organic polymer layer is dry etched (preferably by reactive sputter etching) using oxygen.
- The invention will further be illustrated by the following nonlimitative examples.
- In a three-neck flask equipped with a thermometer, reflux condenser and a nitrogen gas feed pipe, 3.5 g of anhydrous p-trimethylsilylstyrene (abbreviated to SiSt) refined by distillation over calcium hydride was mixed with 30 ml of benzene dehydrated by metallic sodium and 0.014 g (0.3 mole% of SiSt) of benzoyl peroxide (BPO) and subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction liquid was poured into a large volume of petroleum ether to precipitate a polymer in the form of white powder. After filtration the powder was again dissolved in 50 ml of benzene, and the solution was poured into petroleum ether to precipitate the refined polymer, which was separated from the solvent and dried for 8 hr at 50°C under reduced pressure. The dried polymer weighed 3.0 g. By analysis this polymer was confirmed to be poly(p-trimethylsilylstyrene) (abbreviated to PSiSt) of the structure of formula (1), having a weight average molecular weight (Mw) of 2.2 x 104 and a number average molecular weight (Mn) of 1.1 x 104.
- A resist material solution was prepared by dissolving 0.46 g of PSiSt obtained by the above described process in 10 ml of xylene (to obtain 5 wt% solution) with sufficient stirring, followed by filtration with a 0.2 micrometers filter.
- This solution was applied to a silicon substrate and dried in vacuum at room temperature to form a PSiSt film having a thickness of about 0.2 micrometers. The film was subjected to reactive sputter etching with 02 gas to measure the rate of decrease in the film thickness. The etching conditions were 4 sccm, 1.06 Pa (8 mTorr) and 120 W (0.096) W/cm2). In the drawing figure, the curve S-1 represents the result of this test. As can be seen, the etch rate was very low. During an initial phase of the etching operation the etch rate became gradually and slightly lower as the time elapsed, but after the lapse of about 5 min from the start of etching the film thickness became almost invariable, meaning that the film was etched no more. In the initial period of about 5 min the film thickness decreased by only 0.022 micrometers. In the PSiSt film etched by reactive sputter etching with 02 gas, the number of trimethysilyl groups was calculated to be 1 x 1016 per 1 cm2.
- When an about 1.8 micrometers film of a novolak resin (tradename AZ-1350J of Shipley Co.; this resin will be referred to as "the novolak resin") was etched under the same etching conditions, the rate of decrease in the film thickness was as represented by the curve P in the drawing figure. In the case the film thickness continued to decrease in proportion to the etching time with no change in the rate of decrease, and in 22 min the amount of etch reached 1.5 micrometers. Accordingly it is generally preferred that a PSiSt film in which the number of trimethylsilyl groups is at least 1 x 1016 per 1 cm2 be used as a mask for etching of a layer of the novolak resin.
- Next, the sensitivity and resolving power of PSiSt as a resist material in electron-beam lithography were examined by the following test method.
- The aformentioned solution of PSiSt was applied by spinning to a silicon substrate and dried for 30 min in vacuum at room temperature to form a PSiSt film having a thickness of 0.138 micrometers. Then patterns of various line and space widths were delineated on the PSiSt film by means of an electron-beam apparatus by varying the dose of irradiation, and development was performed by 1 min treatment with a mixed solution of tetrahydrofuran and ethanol in the proportion of 35:65 by volume, followed by rinsing with isopropyl alcohol for 30 sec. After drying the thickness of the film in the irradiated areas was measured by using a Taylor-Hobson "Tally Step" instrument. The resolving capability of the tested resist material was determined by observation of the respective patterns formed in the exposed and developed film with optical microscope and scanning electron microscope. It was found that the dose of irradiation sufficient to cause gelation of the PSiSt film (will be represented by D') was 240 microcoulombs/cm2 and the dose that caused the film thickness to reduce to 50% of the initial thickness (will be represented by
- To examine actual performance of PSiSt as a resist, the novolak resin was applied by spinning to a silicon substrate to form a 1.5 micrometers thick film, followed by prebaking at 250° for 1 hr, and then the aforementioned solution of PSiSt was applied by spinning onto the novolak resin film and dried. A submicron pattern was formed in the PSiSt film by the above described exposure and development process. After the development treatment the thickness of the PSiSt film was 0.10 micrometers, and the number of trimethylsilyl groups in the film was calculated to be 4.5 x 1016./ cm2. With the patterned PSiSt film as a mask the novolak resin film was etched for 25 min by reactive sputter etching with 02 gas under the conditions of 1.06 Pa (8 mTorr), 4 sccm (standard cubic centimeters per minute) and 120 W. As a result, a submicron pattern initially delineated in the PSiSt film with irradiation dose of 400 microcoulombs/cmz was transferred with high resolution into the 1.5 micrometers film of the novolak resin. Therefore, the thickness of the PSiSt film was proved to have been sufficient to provide a mask for etching 1.5 micrometers thickness of the novolak resin.
- The submicron pattern thus formed in the novolak resin film was high in aspect ratio and sufficient in the masking effect for subsequent etching of the substrate.
- In the reactor mentioned in Example 1, 3.5 g (0.02 moles) of SiSt was mixed with 0.8 g (0.005 moles) of anhydrous chloromethystyrene (abbreviated to CMS), 30 ml of dehydrated benzene and 0.0087 g (0.3 mole% of the total of SISt and CMS) of BPO, and the mixture was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction the reaction solution was poured into a large volume of petroleum ether to precipitate a polymer in the form of white powder. This polymer was refined by the method described in Example 1. By analysis this polymer was confirmed to be a copolymer of SiSt with CMS at the copolymerization ratio of 9:1 by mole. This copolymer, i.e. poly(p-trimethylsilylstyrene-chloromethylstyrene) of the structure of formula (2), will be referred to as P(SiSt90―CM10). The weight average molecular weight Mw of this copolymer was 5.5 x 104, and Mn was 2.5 × 104.
-
- A resist material solution was prepared by dissolving 0.8 g of P(SiSt90―CMS10) in 17.5 ml of xylene, followed by filtration with 0.2 micrometers filter. By using this solution a P(SiStgo-CMS1o) film having a thickness of about 0.2 micrometers was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 02 gas under the same conditions as in Example 1. In this case the rate of decrease in the film thickness was as represented by the curve S-2 in the drawing figure. After the lapse of about 5 min from the start of etching, the film became almost invariable in its thickness and no longer underwent etching. Until then, the film thickness decreased by only 0.032 micrometers. In the etched film the number of trimethylsilyl groups was calculated to be 1.2 × 1016/cm2. In view of the etch rate of the novolak resin described in Example 1, it is understood that such a film of P(SiSt90―CMS10) can be used as a mask for etching of a layer of the novolak resin. The aforementioned solution of P(SiSt90―CMS10) was applied by spinning to a silicon substrate and dried for 30 min in vacuum at room temperature to form a copolymer film having a thickness of 0.185 micrometers. Then patterns of various line and space widths were delineated on the copolymer film by electron-beam irradiation, and development was preferred by 1 min treatment with a mixed solution of isoamyl acetate and ethyl Cellosolve@ in the proportion of 1:4 by volume, followed by rinsing with ethanol for 30 sec. Then the thickness, sensitivity and resolving capability of the copolymerfilm were examined by the same methods as in Example 1. It is found that D9 for this copolymer film was 6.5 microcoulombs/cm2, and D50 g was 13 microcoulombs/cm2. The copolymer film was excellent in resolution of the patterns, and it was confirmed that with irradiation dose of 17 microcoulombs/cM 2 patterns of 0.5 micrometers lines and spaces were perfectly resolved.
- In the next experiment the novolak resin was applied by spinning to a silicon substrate to form a 1.5 micrometers thick film, followed by prebaking at 250°C for 1 hr, and then the aforementioned solution of P(SiSt90―CMS10) was spun onto the novolak resin film and dried. A submicron pattern was formed in the copolymer film by the above described exposure and development process. After the development treatment the thickness of the copolymer film was 0.10 micrometers, and the number of trimethylsilyl groups in the film was calculated to be 3.7 x 1016/cm2. With the patterned copolymer film as a mask the novolak resin was subjected to reactive sputter etching under the same conditions as in Example 1. As a result, a submicron pattern initially formed in the copolymer film with irradiation dose of 14 microcoulombs/cmz was transferred into the 1.5 micrometers film of the novolak resin. Therefore, the thickness of the copolymer film was proved to have been sufficient to provide a mask for etching 1.5 micrometers thickness of the novolak resin.
- In the reactor mentioned in Example 1, 3.5 g (0.02 moles) of SiSt was mixed with 4.3 g (0.03 moles) of anhydrous glycidyl methacrylate (GMA), 50 ml of dehydrated benzene and 0.036 g (0.03 mole% of the total of SiSt and GMA) of BPO, and the mixture was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction solution was poured into a large volume of petroleum ether to precipitate a polymer in powder form. This polymer was refined by the method described in Example 1. By analysis Mw of this polymer was 3.5 x 104 and Mn was 1.8 x 104, and the polymer was confirmed to be a copolymer of SiSt with GMA at the copolymerization ratio of 4:6 by mole. This copolymer, i.e. (p-trimethylsily- latyrene-glycidyl methacrylate) of the structure of formula (3), will be referred to as P(SiSt40―GMA60).
- A solution was prepared by dissolving 2.4 g of P(SiSt4o-GMAso) in 28 ml of methyl cellosolve acetate (to obtain 8 wt% solution) with sufficient stirring, followed by filtration with 0.2 micrometers filters. By using this solution a P(SiSt4o-GMAso) film having a thickness of about 0.45 micrometers was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 02 gas under the same conditions as in Example 1. In this case the rate of decrease in the film thickness was as represented by the curve S-3 in the drawing figure. In about 30 min the film thickness decreased by 0.17 micrometers, and therefore the copolymer film was no longer etched. In this etched film the number of trimethylsilyl groups was calculated to be 3 x 1016/cm2. In view of the etch rate of the novolak resin described in Example 1, it is understood that such a film of P(SiSt4o-GMAso) can be used as a mask for etching of the novolak resin.
- The aforementioned solution of
- In the next experiment, a submicron pattern formed in a P(SiSt40―GMA60) film with electron-beam irradiation dose of 20 microcoulombs/cm2 was transferred into an underlying 1.5 micrometers film of the novolak resin by reactive sputter etching carried out under the same conditions as in Example 1. After the development treatment the thickness of the patterned copolymer film was 0.20 micrometers, and the number of trimethylsilyl groups in the film was calculated to be 3.6 × 1016/cm2. The thickness of the copolymer film was proved to have been sufficient for etching 1.5 micrometers thickness of the novolak resin.
- In the reactor mentioned in Example 1, 0.35 g (0.002 moles) of SiSt was mixed with 8.6 g (0.06 moles) of GMA, 50 ml of dehydrated benzene and 0.045 g (0.3 mole% of the total of SiSt and GMA) of BPO, and the mixture was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction solution was poured into a large volume of petroleum ether to precipitate a polymer in powder form. This polymer was refined by the method described in Example 1. By analysis, Mw of the polymer was 2.0 x 104 and M", was 1.2 x 104, and the polymer was confirmed to be a copolymer of SiSt with GMA at the copolymerization ratio of 1:30 by mole.
- A solution was prepared by dissolving 2.4 g of the obtained copolymer, which will be referred to as P(SiSt3―GMA97), in 28 ml of methyl Cellosolve® acetate (to obtain 8 wt% solution) with sufficient stirring, followed by filtration with a 0.2 micrometers filter. By using this solution a P(SiSt3―GMA97) film having a thickness of about 0.5 micrometers was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 02 gas under the same conditions as in Example 1. In this case the rate of decrease in the film thickness was as represented by the curve R in the drawing figure. The etch rate was considerably higher than in the case of P(SiSt40―GMA60) of Example 3. In 5 min the 0.5 micrometers thick polymer film was completely etched without exhibiting a decrease in the etch rate. In this copolymer film the number of trimethylsilyl groups was calculated to be 0.8 x 1016/cm2. From the result of this experiment it is understood that this polymer film in which the number of trimethylsilyl groups was less than 1016/cm2 is insufficient in its resistance to dry etching using oxygen to serve as a mask for etching of an underlying organic layer such as a novolak resin layer.
- In the reactor mentioned in Example 1, 7.3 g (0.03 moles) of a hydrous diallyl phthalate (abbreviated to DAP) was mixed with 3.4 g (0.03 moles) of trimethylallysilane (abbreviated to TMASi), 10 ml of dehydrated benzene and 0.51 g (3 mole% of the total of DAP and TMASi) of BPO, and the mixture was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction solution was poured into a large volume of methanol to precipitate a polymer in the form of white powder. The powder was separated from the solution and dried for 8 hr at 50°C under reduced pressure to obtain 7.3 g of dry polymer. By analysis, Mw of this polymer was 7.3 x 104 and Mn was 8.2 x 103. The iodine value of the polymer was 49.2, and the content of Si in the polymer was 4.1 % by weight. Therefore, the structure of this DAP-TMASi copolymer was presumed to be as represented by formula (4).
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- A solution was prepared by dissolving 2.0 g of the obtained copolymer, which will be referred to as P(DAP70-TMASi3o), in 20 ml of methyl cellosolve acetate (to obtain 9.1 wt% solution) with sufficient stirring, followed by filtration with a 0.2 micrometers filter. By using this solution a P(DAP70―TMASi30) film was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 02 gas under the same conditions as in Example 1. In 15 min the film thickness decreased by 0.12 micrometers, but thereafter the film thickness remained almost invariable. The number of trimethylsilyl groups in this etched film was calculated to be 1.3 x 1016/ cm2. In view of the etch rate of the novolak resin mentioned in Example 1, it is understood that such a film of P(DAP70―TMASi30) can be used as a mask for etching of the novolak resin.
- The aforementioned solution of
- In the next experiment a 1.5 micrometers film of the novolak resin was formed on a silicon substrate by the method described in Example 1, and then the aforementioned solution of
- In the process of preparing the copolymer of Example 4, the quantities of DAP monomer and TMASi monomer were varied to 7.3 g (0.03 moles) and to 4.5 g (0.04 moles), respectively. In this case the refined and dried product weighed 7.6 g. By anaylsis, Mw of the obtained copolymer was 5.5 104 and Mn was 1.0 x 104. The iodine value of this copolymer was 42.3, and the content of Si in the copolymer was 7.8% by weight. Therefore; the structure of this DAP-TMASi copolymer was presumed to be as represented by formula (5).
- In formula (5) the symbol X represents the unit structure described in Example 4.
- A solution was prepared by dissolving 1.7 g of the obtained copolymer, which will be referred to as P(DAP50―TMASi50), in 22 ml of methyl cellosolve acetate (to obtain 7 wt% solution) with sufficient stirring, followed by filtration with 0.2 micrometers filter. By using this solution a film of P(DAP50―TMASi50) was formed on a silicon substrate, and the film was subjected to reactive sputter etching with O2 gas under the same conditions as in Example 1. In 10 min the film thickness decreased by 0.06 micrometers, but thereafter the film thickness remained almost invariable. The number of trimethylsilyl groups in this etched film was calculated to be 1.2 x 1016/ cm2. In view of the etch rate of the novolak resin mentioned in Example 1, it is understood that such a film of P(DAP50―TMASi50) can be used as a mask for etching of the novolak resin.
- Using the same solution of P(DAP50―TMASi50). a copolymer film having a thickness of 0.24 micrometers was formed on a silicon substrate by the same method as in Example 4. The patterns of various line and space widths were delineated on the copolymer film by the same electron-beam irradiation and development process as in Example 4, and the thickness, sensitivity and resolving capability of this copolymer film were examined by the same methods as in Example 1. It was found that Di g for this copolymer film was 7 microcoulombs/cm2, and D50 g was 13 microcoulombs/cm2. The copolymer film was excellent in resolution of the patterns, and it was confirmed that with irradiation dose of 15 microcoulombs/cm2 patterns of 0.5 micrometers lines and spaces were perfectly resolved.
- In the next experiment a 1.5 micrometers film of the novlak resin was formed on a silicon substrate by the method described in Example 1, and then the aforementioned solution of
- In the reactor mentioned in Example 1, a mixture of 7.3 g (0.03 moles) of diallyl terephthalate (abbreviated to DATP), 3.4 g (0.03 moles) of TMASi, 10 ml of dehydrated benzene and 0.51 g (3 mole% of the total of DATP and TMASi) of BPO was subjected of polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction liquid was poured into a large volume of methanol to precipitate a polymer in powder form. The polymer was refined and dried in the same manner as in Example 4 to obtain 8.0 g of dry polymer. By analysis Mw of the thus obtained copolymer was 8.0 x 104 and Mw was 9.0 x 103. The iodine value of the copolymer was 65.7, and the content of Si in the copolymer was 5.8% by weight. Therefore, the structure of this DATP-TMSAi copolymer was presumed to be as represented by formula (6).
- In formula (6) the symbol X represents a unit structure of a cyclic polymer, which is most probably of the following two formulas.
- Using the same solution a film of
- In the next experiment a 1.0 micrometer film of the novolak resin was formed on a silicon substrate by the method described in Example 1, and then the solution of P(DATP60―TMASi40) was spun onto the novolak resin film and dried. A submicron pattern was formed in the copolymer film by the same electron-beam irradiation and development process as in Example 4 with irradiation dose of 7.0 microcoulombs/cm2. After the development treatment the thickness of the copolymer film was 0.02 micrometers, and the number of trimethylsilyl groups in the film was calculated to be 3.1 x 1016/cm2. With the patterned copolymer film as a mask, the novolak resin film was subjected to reactive sputter etching in the same manner as in Example 1 to result in that the submicron pattern was transferred into the novolak resin film. Therefore, the thicknes of the copolymer film was proved to have been sufficient to provide a mask for etching 1.0 micrometer thickness of the novolak resin.
- In the reactor mentioned in Example 1, a mixture of 7.3 g (0.03 moles) of DAP, 0.6 g (0.005 moles) of TMASi, 10 ml of dehydrated benzene and 0.30 g (3 mole% of the total of DAP and TMASi) of BPO was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction solution was poured into a large volume of methanol to precipitate a polymer in powder form. The polymer was refined and dried in the same manner as in Example 4 to obtain 7.0 g of dry polymer. By analysis, Mw of the obtained copolymer was 5.5 x 103 and M" was 3.9 x 103. The copolymer had an iodine value of 46.4 and contained 0.65% by weight of Si. Therefore, the structure of this DAP-TMASi copolymer was presumed to be as represented by formula (4A). In formula (4A) the symbol X represents the unit structure described in Example 4.
- A solution was prepared by dissolving 2.0 g of the obtained copolymer, which will be referred to as P(DAP94―TMASi6), in 20 ml of methyl Cellosolve @ acetate, followed by filtration with a 0.2 micrometers filter. By using this solution a film of P(DAP94-TMASis) having a thickness of 0.45 micrometers was formed on a silicon substrate, and the film was subjected to reactive sputter etching under the same conditions as in Example 1. In 5 min the copolymer film was etched to the extent of the 4.5 micrometers thickness without exhibiting a decrease in the etch rate. In this copolymer film the number of trimethylsilyl groups was calculated to be 7.5 x 1015/cm2. From the result of the test it is understood that this copolymer film in which the number of trimethylsilyl groups was less than 1016/cm2 is insufficient in its resistance to dry etching using oxygen to serve as a mask for etching of an underlying organic layer such as a novolak resin layer.
- In the reactor mentioned in Example 1, a mixture of 10.6 g (0.1 moles) of a novolak-type phenolic resin (containing no photosensitive agent) and 4.8 g (0.03 moles) of hexamethyldisilazane was gradually heated from room temperature up to 150°C and maintained at 150°C for 3-4 hr so as to undergo copolymerization reaction. The reaction was terminated after confirming that the reaction system in the flask no longer emitted the odor of ammonia. The content of Si in the obtained copolymer was determined to be 6.1% by weight, and the copolymer was subjected to infrared absorption spectrum analysis. From the analytical results the structure of this copolymer was presumed to be as represented by formula (7).
- A solution was prepared by dissolving 2.0 g of the obtained copolymer, namely, trimethylsilyl- substituted phenolic resin which will be referred to as P(PhOH70―PhOSi30), and 0.5 g of 3,3-diazido biphenyl sulfone in 20 ml of cellosolve acetate (to obtain 8.9 wt% solution) with sufficient stirring, followed by filtration with a 0.2 micrometers filter. By using this solution a film of
- In the next experiment a 1.0 micrometer film of the novolak resin (AZ-1350J) was formed on a silicon substrate by the method described in Example 1, and then the solution of P(PhOH7o-PhOSi3o) was spun onto the novolak resin film and dried. A submicron pattern was formed in the copolymer film by electron-beam irradiation and development, which was 1 min treatment with methyl cellosolve acetate followed by rinsing with isopropyl alcohol for 30 sec. The irradiation dose was 300 microcoulombs/cm2. After the development treatment the thickness of the copolymer film was 0.22 micrometers, and the number of trimethylsilyl groups in the film was calculated to be 2.8 x 10'6/cm2. Then, the submicron pattern of negative type was accurately transferred from the copolymer film into the novolak resin film by reactive sputter etching with 02. Accordingly the thickness of the copolymer film was sufficient to provide a mask for etching 1.0 micrometer thickness of the novolak resin.
- The polymerization process in Example 7 was repeated by increasing the quantity of hexamethyldisilazane to 8.0 g (0.05 moles), and the obtained copolymer was subjected to chemical analysis and infrared absorption spectrum analysis. In this case the content of Si in the copolymer was 8.0% by weight, and the structure of the copolymer was presumed to be as represented by formula (8).
-
- A solution was prepared by dissolving 2.0 g of the obtained copolymer, namely, trimethylsilyl- substituted phenolic resin which will be referred to as P(PhOHso-PhOSi4o), and 0.5 g of 3,3-diazido biphenyl sulfone in 20 ml of cellosolve acetate (to obtain 8.9 wt% solution), followed by filtration with a 0.2 micrometers filter. By using this solution a film of P(PhOHso-PhOSi4o) was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 02 under the same conditions as in Example 1. In 5 min the film thickness decreased by 0.10 micrometers, but thereafter the film thickness remained almost invariable. The number of trimethylsilyl groups in this etched copolymer film was calculated to be 1.7 x 1016/cm2. In view of the etch rate of the novolak resin (AZ-1350J) mentioned in Example 1, it is understood that such a film of P(PhOHso-PhOSi4o) can be used as mask for etching of the novolak resin.
- In the next experiment a 1.0 micrometer film of the novolak resin (AZ-1350J) was formed on a silicon substrate by the method described in Example 1, and then the solution of P(PhOHso-PhOSi4o) was spun onto the novolak resin film and dried. A submicron pattern was formed in the copolymer film by the electron-beam irradiation and development process mentioned in Example 7. In this case the irradiation dose was 350 microcoulombs/cm2. After the development treatment the thickness of the copolymer film was 0.20 micrometers, and the number of trimethylsilyl groups in the film was 3.3 x 1016/cm2. Then the submicron pattern was accurately transferred from the copolymer film into the novolak resin film by reactive sputter etching with 02. Accordingly the thickness of the copolymer film was sufficient to provide a mask for etching 1.0 micrometer thickness of the novolak resin.
-
- A solution was prepared by dissolving 2.0 g of this copolymer, which will be referred to as P(PhOH93-PhOSi7), and 0.5 g of 3,3-diazido biphenyl sulfone in 20 ml of cellosolve acetate (to obtain 6.2 wt% solution), followed by filtration with 0.2 micrometers filter. By using this solution a film of P(PhOH93-PhOSi7) having a thickness of 0.28 micrometers was formed on a silicon substrate, and the film was subjected to reactive sputter etching under the same conditions as in Example 1. In 2 min, the copolymer film was etched to the extent of its 0.28 micrometers thickness without exhibiting a decrease in the etch rate. In this copolymer film the number of trimethylsilyl groups was calculated to be 9.2 x 1015/cm2. This indicates that this copolymer film in which the number of trimethylsilyl groups is less than 1016/cm2 is insufficient in its resistance to dry etching using oxygen to serve as a mask for etching of an underlying organic layer such as a novolak resin layer.
- In the reactor mentioned in Example 1, a mixture of 3.5 g of anhydrous p-triethylsilylstyrene (abbreviated to ESiSt), 30 ml of dehydrated benzene and 0.014 g of BPO was subjected to polymerization reaction for 8 hr at a reflux temperature, and a polymer formed by the reaction was refined and dried by the same methods as in Example 4. The polymer was poly(p-triethylsilylstyrene), which will be referred to as PESiSt, represented by formula (9). By analysis, M, of this polymer was 3.0 × 104, and Mn was 1.7 × 104.
- A solution was prepared by dissolving 1.0 g of PESiSt in 20 ml of xylene (to obtain 4.8 wt% solution) with sufficient stirring, followed by filtration with a 0.2 micrometers filter. By using this solution a film of PESiSt was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 02 under the same conditions as in Example 1. In 5 min the film thickness decreased by 0.032 micrometers, but thereafter the film thickness remained almost invariable. The number of triethylsilyl groups in this etched polymer film was calculated to be 1.0 x 1016/cm2. In view of the etch rate of the novolak resin mentioned in Example 1, it is understood that such a film of PESiSt can be used as a mask for etching of the novolak resin.
- The aforementioned solution of PESiSt was applied by spinning to a silicon substrate and heated in nitrogen gas stream at 100°C for 30 min to thereby form a polymer film having a thickness of 0.190 micrometers. The patterns of various line and space widths were delineated on the polymer film electron-beam irradiation, and development was performed by 1 min treatment with a mixed solution of tetrahydrofuran and ethanol in the proportion of 4:1 by volume, followed by rinsing with isopropyl alcohol for 30 sec. The sensitivity and resolving capability of the polymer film were examined in the same manner as in Example 1. It was found that D9 for this polymer film was 210 microcoulombs/cm2 and
- In the next experiment a film of PESiSt was formed on a 1.5 micrometers film of the novolak resin, and a submicron pattern was formed in the polymer layer with irradiation dose of 380 microcoulombs/cm2. After the aforementioned devolopment treatment the thickness of the polymer film was 0.15 micrometers, and the number of triethylsily groups in the polymer film was 5.0 × 1016/cm2. By reactive sputter etching with O2, the submicron pattern was accurately transferred from the polymer film to the novolak resin film. Accordingly the thickness of the PESiSt film was sufficient to provide a mask for etching 1.5 micrometers thickness of the novolak resin.
- In a three-neck flask having a capacity of 500 ml, 26 g (0.2 moles) of 2-hydroxyethyl methacrylate (abbreviated to HEMA) and 16 g of pyridine were dissolved in 200 ml of carbon tetrachloride. At room temperature, 107.5 g (0.2 moles) of trimethylchlorosilane was slowly dropped into the solution in the flask to complete the addition of the entire amount in 30 min. During this process precipitation of hydrochloric acid salt of pyridine took place. After filtration, carbon tetrachloride in the reaction liquid was distilled out by using an evaporator, and the remaining liquid was distilled under reduced pressure to obtain 37 g of 2-trimethylsiloxyethyl methacrylate (abbreviated to HEMA-Si).
- In a 100 ml three-neck flask, a mixture of 5.6 g (0.03 moles) of HEMA-Si, 30 ml of benzene and 0.021 g of BPO was subjected to polymerization reaction for 8 hr at a reflux temperature. Thereafter benzene was distilled out by using an evaporator, and the remaining product was dried for 8 hr at 80°C under reduced pressure. Obtained as the result was 4.3 g of poly(2-trimethylsiloxyethyl methacrylate), which will be referred to as P(HEMA-Si), represented by formula (10). By analysis, Mw of this polymer was 18 x 10°, and M" was 8.2 x 10 4.
- A solution was prepared by dissolving 2 g of P(HEMA-Si) in 23 ml of methyl cellosolve acetate (to obtain 8 wt% solution), followed by filtration with a 0.2 micrometers filter. By using this solution a film of P(HEMA-Si) was formed on a silicon substrate, and the film was subjected to reactive sputter etching with O2 under the same conditions as in Example 1. In 5 min the film thickness decreased by 0.039 micrometers, but thereafter the film thickness remained almost invariable. The number of trimethylsilyl groups in this etched polymer film was calculated to be 1.5 x 1016/cm2. In view of the etch rate of the novolak resin mentioned in Example 1, it is understood that such a film of P(HEMA-Si) can be used as a mask for etching of the novolak resin.
- In the next experiment a 1.5 micrometers film of the novolak resin was formed on a silicon substrate by the method described in Example 1, and the aforementioned solution of P(HEMA-Si) was spun onto the novolak resin film and heated on nitrogen gas stream at 80°C for 30 min to thereby form a P(HEMA-Si) film. A submicron pattern was formed in the polymer film by electron-beam irradiation and development, which was 1 min treatment with a mixed solution of butyl Cellosolve@ and cyclohexane in the proportion of 1:19 by volume followed by 30 sec rinsing with cyclohexane. The irradiation dose was 50 microcoulombs/cmz. After the development treatment the thickness of the polymer film was 0.17 micrometers, and the number of trimethylsilyl groups in the film was 6.6 x 1016/cm2. Then the submicron pattern of positive type was accurately transferred from the P(HEMA-Si) film into the novolak resin film by reactive sputter etching with O2, Accordingly the thickness of the P(HEMA-Si) film was sufficient to provide a mask for etching 1.5 micrometers thickness of the novolak resin.
- In a 100 ml three-neck flask, a mixture of 3.7 g (0.02 moles) of HEMA-Si, 2.0 g (0.02 moles) of methyl methacrylate (abbreviated to MMA), 30 ml of benzene and 0.028 g of BPO was subjected to polymerization reaction for 8 hr at a reflux temperature. A polymer formed by the reaction was refined and dried by the methods described in Example 1 to obtain 4.0 g of dry polymer. By analysis, Mw of this polymer was 16 x 104, and Mnwas 8.1 x 104. The polymer was confirmed to be a copolymer of HEMA-Si with MMA and the copolymerization ratio was presumed to be 1:1, so that the structure of the copolymer is represented by formula (11).
- A solution was prepared by dissolving 2.0 g of this copolymer, which will be referred to as P(HEMASi50-MMA50), in 23 ml of methyl cellosolve acetate. By using this solution a film of P(HEMASi50-MMA50) was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 02 under the same conditions as in Example 1. In 5 min the film thickness decreased by 0.045 micrometers, but thereafter the film thickness remained almost invariable. The number of trimethylsilyl groups in the etched film was calculated to be 1.2 × 1016/cm2. In view of the etch rate of the novolak resin mentioned in Example 1, it is understood that such a film of P(HEMASi50-MMA50) can be used as a mask for etching of the novolak resin.
- In the next experiment a 1.5 micrometers film of the novolak resin was formed on a silicon substrate by the method described in Example 1, and the aforementioned solution of P(HEMASiso-MMA50) was spun onto the novolak resin film and heated in nitrogen gas stream at 80°C for 30 min to thereby form a film of this copolymer. A submicron pattern was formed in the copolymer film by electron-beam irradiation and development, which was 1 min treatment with a mixed solution of methylisobutyl ketone and cyclohexane in the proportion of 1:1 by volume followed by 30 sec rinsing with cyclohexane. The irradiation dose was 100 microcoulombs/cm2. After the development treatment the thickness of the copolymer film was 0.20 micrometers, and the number of trimethylsilyl groups in the copolymer film was 5.1 x 1016/cm2. Then the submicron pattern of positive type was accurately transferred from the copolymer film to the novolak resin film by reactive sputter etching with O2. Accordingly the thickness of the P(HEMASi50-MMA50) film was sufficient to provide a mask for etching 1.5 micrometers thickness of the novolak resin.
- In the copolymerization process of Example 11, the quantity of HEMA-Si was decreased to 0.37 g (0.002 moles) and the quantity of BPO to 0.015 g. Obtained as the result was 1.5 g of a copolymer of HEMA-Si with MMA. In this case copolymerization ratio of HEMA-Si to MMA was judged to be 1:19. As to the molecular weight of this copolymer, Mw was 10 x 104 and Mn was 4.6 x 104.
- A solution was prepared by dissolving 1 g of this copolymer, which will be referred to as SP(HEMASi5-MMA95), in 9 ml of methyl Cellosolve@. By using this solution a film of P(HEMASi5-MMA95) having a thickness of 0.25 micrometers was formed on a silicon substrate, and the film was subjected to reactive sputter etching under the same conditions as in Example 1. In 5 min, the copolymer film was etched to the extent of its 0.25 micrometers thickness without exhibiting a decrease in the etch rate. The number of trimethylsilyl groups in this copolymer film was calculated to be 8.4 x 1015/cm2. Therefore, it is understood that this copolymer film in which the number of trimethylsilyl groups is less than 1016/cm2 is insufficient in its resistance to dry etching using oxygen to serve as a mask for etching of an underlying organic layer such as a novolak resin layer.
- In the reactor mentioned in Example 1, a mixture of 4.8 g (0.02 moles) of p-dimethylphenylsilylstyrene (abbreviated to PhSiSt), 50 ml of dehydrated bensene and 0.036 g of BPO was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction liquid was poured into a large volume of methanol to precipitate a polymer. This polymer was refined and dried by the methods described in Example 1 to obtain 3.2 g of dry polymer. The polymer was poly(p-dimethylphenylsilylstyrene), which will be referred to as PPhSiSt, represented by formula (12). By analysis, Mw of this polymer was 1.9 x 104 and Mn was 6.3 x 10 3 .
- A solution was prepared by dissolving 2.4 g of PPhSiSt in 28 ml of methyl cellosolve acetate (to obtain 8 wt% solution) with sufficient stirring, followed by filtration with a 0.2 micrometers filter. By using this solution a film of PPhSiSt was formed on a silicon substrate, and the film was subjected to reactive sputter etching with 02 under the same conditions as in Example 1. In 5 min the film thickness decreased by 0.040 micrometers, but thereafter the film thickness remained almost invariable. The number of dimethylphenylsilyl groups in this etched film was calculated to be 1.2 × 1016/cm2. In view of the etch rate of the novolak resin mentioned in Example 1, it is understood that such a film of PPhSiSt can be used as a mask for etching of the novolak resin.
- In the next experiment a 1.5 micrometers film of the novolak resin was formed on a silicon substrate by the method described in Example 1, and the aforementioned solution of PPhSiSt was spun onto the novolak resin film and heated in nitrogen gas stream at 100°C for 30 min to thereby form a film of the polymer. A submicron pattern was formed in the PPhSiSt film by electron-beam irradiation and development, which was 1 min treatment with a mixed solution of methylethyl ketone and isopropyl alcohol in the proportion of 5:1 by volume followed by 30 sec rinsing with isopropyl alcohol. The irradiation dose was 500 micrometers/cm2. After the development treatment the thickness of the polymer film was 0.18 micrometers, and the number of dimethylphenylsilyl groups in the polymer film was calculated to be 5.5 x 1016/cm2. Then the submicron pattern was accurately transferred from the PPhSiSt film into the novolak resin film by reactive sputter etching with 02. Accordingly the thickness of the PPhSiSt film was sufficient to provide a mask for etching 1.5 micrometers thickness of the novolak resin.
- In the reactor mentioned in Example 1, a mixture of 1.4 g (0.006 moles) of PhSiSt, 7.0 g (0.05 moles) of GMA, 50 ml of dehydrated benzene and 0.041 g of BPO was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction liquid was poured into a large volume of petroleum ether to precipitate a polymer. This polymer was refined and dried by the methods mentioned in Example 4. By analysis, Mw of this polymer was 9.2 x 103 and Mn was 4.3 x 103. The polymer was a copolymer of PhSiSt with GMA at the copolymerization ratio of 1:9 by mole.
- A solution was prepared by dissolving 2.4 g of the PhSiSt-GMA copolymer in 28 ml of methyl cellosolve acetate (to obtain 8 wt% solution) followed by filtration with a 0.2 micrometers filter. By using this solution a film of the copolymer having a thickness of 0.2 micrometers was formed on a silicon substrate, and the film was subjected to reactive sputter etching under the same conditions as in Example 1. In 5 min, the copolymer film was etched to the extent of its 0.2 micrometers thickness without exhibiting a decrease in the etch rate. The number of dimethylphenylsilyl groups in this copolymer film was calculated to be 9.5 × 1015/cm2. Therefore, it is understood that this copolymer film in which the number of dimethylphenylsilyl groups is less than 1016/cm2 is insufficient in its resistance to dry etching using oxygen to serve as a mask for etching of an underlying organic polymer layer such as a novolak resin layer.
- In the reactor mentioned in Example 1, a mixture of 5.0 g (0.02 moles) of 3-trimethoxysilylpropyl methacrylate (abbreviated to SiMA), 2.8 g (0.02 moles) of GMA refined by distillation over calcium hydride, 50 ml of dehydrated benzene and 0.028 g of BPO was subjected to polymerization reaction for 8 hr at a reflux temperature. Upon completion of the reaction, the reaction liquid was poured into a large volume of petroleum ether to precipitate a polymer in the form of white powder, and the polymer was refined and dried by same methods as in Example 1 to obtain 7.3 g of dry polymer. Analysis of this polymer gave the following values.
- Infrared Absorption Spectrum (KBr):
- 1730cm-1, 1250cm-1, 1090cm-1
- Magnetic Resonance Spectrum (CDC13, TMS):
- b0.5-1.3 (br. 6H, 2CH3), 1.4―2.2 (br, 10H,
- 5CH2), 2.5-2.7 (br, 1 H, Epoxy), 2.7-2.9 (br,
- 1 H, Epoxy), 3.1-3.3 (br, 1 H, Epoxy), 3.55 (S,
- 9H, 3CH30), 3.8-4.0 (br, 2H, CH20CO),
- 4.1-4.4 (br, 2H, CH20CO)
- Molecular Weight and Molecular Weight Distribution:
- Mw was 10.9 × 104, Mn was 5.1 x 104, Mw/Mn was 2.14.
- Content of Si; 7.30% by weight.
- From these analytical values, the polymer was confirmed to be a copolymer of SiMA having the structure represented by formula (13). This copolymer will be referred to as P(SiMA50-GMAso).
-
- A solution was prepared by dissolving 1.0 g of P(SiMA50-GMA50) in 19 ml of methyl cellosolve acetate (to obtain 5 wt% solution) with sufficient stirring, followed by filtration with 0.2 micrometers filter. The novolak resin (AZ-1350J) was applied by spinning to a silicon substrate and heated at 200°C for 1 hr to thereby form a 1.5 micrometers film. After cooling of the substrate to room temperature the solution of P(SiMAso-GMA50) was spun onto the novolak resin film and heated in nitrogen gas stream at 80°C for 30 min to thereby form a P(SiMAso-GMAso) film of which the thickness was estimated to be 0.22 micrometers. A submicron pattern was formed in the copolymer film by electron-beam irradiation with irradiation dose of 0.4 micrometers/cm2 and development, which was performed by 1 min treatment with a mixed solution of trichloroethylene and acetone in the proportion of 3:1 by volume followed by 30 sec rinsing with ethanol. Then the submicron pattern was accurately transferred from the copolymer film into the novolak resin film by reactive sputter etching with O2 gas which was carried out for 25 min under the same conditions as in Example 1.
Claims (10)
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57098090A JPS58214148A (en) | 1982-06-08 | 1982-06-08 | Resist material and formation of micropattern |
JP98089/82 | 1982-06-08 | ||
JP9808982A JPS58215409A (en) | 1982-06-08 | 1982-06-08 | Silicon atom-containing acrylic polymer |
JP98090/82 | 1982-06-08 | ||
JP123866/82 | 1982-07-16 | ||
JP12386682A JPS5915419A (en) | 1982-07-16 | 1982-07-16 | Silicon atom-containing styrenic polymer |
JP12386582A JPS5915243A (en) | 1982-07-16 | 1982-07-16 | Resist material |
JP123865/82 | 1982-07-16 | ||
JP19428682A JPS5984429A (en) | 1982-11-05 | 1982-11-05 | Fabrication of precise pattern |
JP194286/82 | 1982-11-05 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0096596A1 EP0096596A1 (en) | 1983-12-21 |
EP0096596B1 true EP0096596B1 (en) | 1986-06-04 |
EP0096596B2 EP0096596B2 (en) | 1994-03-23 |
Family
ID=27525903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP83303324A Expired - Lifetime EP0096596B2 (en) | 1982-06-08 | 1983-06-08 | Microelectronic device manufacture |
Country Status (5)
Country | Link |
---|---|
US (1) | US4551417A (en) |
EP (1) | EP0096596B2 (en) |
CA (1) | CA1207216A (en) |
DE (1) | DE3363914D1 (en) |
IE (1) | IE54731B1 (en) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4564576A (en) * | 1983-05-27 | 1986-01-14 | Nec Corporation | Resist material comprising polymer of allylsilyl compound and pattern forming method using the resist material |
US4624909A (en) * | 1984-04-27 | 1986-11-25 | Nec Corporation | Silicon-containing novolak resin and resist material and pattern forming method using same |
EP0163538B1 (en) * | 1984-05-30 | 1989-11-23 | Fujitsu Limited | Pattern-forming material and its production and use |
FR2566179B1 (en) * | 1984-06-14 | 1986-08-22 | Commissariat Energie Atomique | METHOD FOR SELF-POSITIONING OF A LOCALIZED FIELD OXIDE WITH RESPECT TO AN ISOLATION TRENCH |
US4892617A (en) * | 1984-08-22 | 1990-01-09 | American Telephone & Telegraph Company, At&T Bell Laboratories | Processes involving lithographic materials |
FR2570844B1 (en) * | 1984-09-21 | 1986-11-14 | Commissariat Energie Atomique | PHOTOSENSITIVE FILM BASED ON SILICON POLYMER AND ITS USE AS MASKING RESIN IN A LITHOGRAPHY PROCESS |
US4770977A (en) * | 1984-09-21 | 1988-09-13 | Commissariat A L'energie Atomique | Silicon-containing polymer and its use as a masking resin in a lithography process |
JPH067263B2 (en) * | 1985-08-19 | 1994-01-26 | 富士写真フイルム株式会社 | Photosolubilizing composition |
US4746596A (en) * | 1985-12-27 | 1988-05-24 | Mitsubishi Denki Kabushiki Kaisha | Method for microfabrication of pattern on substrate using X-ray sensitive resist |
EP0258317A4 (en) * | 1986-02-17 | 1990-01-23 | Commw Scient Ind Res Org | Implantable materials. |
US4701342A (en) * | 1986-03-06 | 1987-10-20 | American Telephone And Telegraph Company, At&T Bell Laboratories | Negative resist with oxygen plasma resistance |
EP0285797A3 (en) * | 1987-03-11 | 1989-01-04 | Siemens Aktiengesellschaft | Process for obtaining resist structures |
US4764247A (en) * | 1987-03-18 | 1988-08-16 | Syn Labs, Inc. | Silicon containing resists |
US4772539A (en) * | 1987-03-23 | 1988-09-20 | International Business Machines Corporation | High resolution E-beam lithographic technique |
JPH02500152A (en) * | 1987-05-21 | 1990-01-18 | ヒューズ・エアクラフト・カンパニー | Silicon-containing negative resist materials and processing methods for patterning substrates |
DE3811241A1 (en) * | 1988-04-02 | 1989-10-12 | Hoechst Ag | SILYLATING REAGENTS FOR THE PRODUCTION OF BINDERS CONTAINING SILANYL GROUPS IN THE SIDE CHAIN, SOLUBLE IN AQUEOUS ALKALI |
US5206111A (en) * | 1988-04-02 | 1993-04-27 | Hoechst Aktiengesellschaft | Binders soluble in aqueous alkali and containing silanyl groups in the side chain for a photosensitive mixture |
JPH02115853A (en) * | 1988-10-26 | 1990-04-27 | Fujitsu Ltd | Production of semiconductor device |
US5229251A (en) * | 1991-04-29 | 1993-07-20 | International Business Machines Corp. | Dry developable photoresist containing an epoxide, organosilicon and onium salt |
US5559057A (en) * | 1994-03-24 | 1996-09-24 | Starfire Electgronic Development & Marketing Ltd. | Method for depositing and patterning thin films formed by fusing nanocrystalline precursors |
US5981143A (en) * | 1997-11-26 | 1999-11-09 | Trw Inc. | Chemically treated photoresist for withstanding ion bombarded processing |
US6737356B1 (en) * | 2000-02-07 | 2004-05-18 | Micron Technology, Inc. | Method of fabricating a semiconductor work object |
US6444408B1 (en) * | 2000-02-28 | 2002-09-03 | International Business Machines Corporation | High silicon content monomers and polymers suitable for 193 nm bilayer resists |
KR100564565B1 (en) * | 2002-11-14 | 2006-03-28 | 삼성전자주식회사 | Silicon-containing polymer, negative type resist composition comprising the same, and patterning method for semiconductor device using the same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3758306A (en) * | 1971-03-25 | 1973-09-11 | Du Pont | Photopolymerizable compositions and elements containing organosilanes |
DE2217744A1 (en) * | 1972-04-13 | 1973-10-18 | Agfa Gevaert Ag | Photoresist material - with reactive side chains contg silicon on polymer chain, adhering well to oxides |
US3986912A (en) * | 1975-09-04 | 1976-10-19 | International Business Machines Corporation | Process for controlling the wall inclination of a plasma etched via hole |
US4208241A (en) * | 1978-07-31 | 1980-06-17 | Bell Telephone Laboratories, Incorporated | Device fabrication by plasma etching |
US4237208A (en) * | 1979-02-15 | 1980-12-02 | Rca Corporation | Silane electron beam resists |
US4370405A (en) * | 1981-03-30 | 1983-01-25 | Hewlett-Packard Company | Multilayer photoresist process utilizing an absorbant dye |
US4357369A (en) * | 1981-11-10 | 1982-11-02 | Rca Corporation | Method of plasma etching a substrate |
US4481049A (en) * | 1984-03-02 | 1984-11-06 | At&T Bell Laboratories | Bilevel resist |
-
1983
- 1983-06-06 US US06/501,201 patent/US4551417A/en not_active Expired - Lifetime
- 1983-06-07 IE IE1339/83A patent/IE54731B1/en not_active IP Right Cessation
- 1983-06-07 CA CA000429834A patent/CA1207216A/en not_active Expired
- 1983-06-08 EP EP83303324A patent/EP0096596B2/en not_active Expired - Lifetime
- 1983-06-08 DE DE8383303324T patent/DE3363914D1/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0096596A1 (en) | 1983-12-21 |
DE3363914D1 (en) | 1986-07-10 |
IE831339L (en) | 1983-12-08 |
IE54731B1 (en) | 1990-01-17 |
CA1207216A (en) | 1986-07-08 |
EP0096596B2 (en) | 1994-03-23 |
US4551417A (en) | 1985-11-05 |
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