EP0009806A1 - Electrical stacked capacitor and method for its production - Google Patents
Electrical stacked capacitor and method for its production Download PDFInfo
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- EP0009806A1 EP0009806A1 EP79103759A EP79103759A EP0009806A1 EP 0009806 A1 EP0009806 A1 EP 0009806A1 EP 79103759 A EP79103759 A EP 79103759A EP 79103759 A EP79103759 A EP 79103759A EP 0009806 A1 EP0009806 A1 EP 0009806A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/306—Stacked capacitors made by thin film techniques
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Definitions
- the invention relates to a regenerable electrical layer capacitor, in which metal layers of the coatings and insulating layers are arranged one above the other as dielectrics on a carrier made of insulating material, in which the metal layers of one coating on one side of the capacitor and that of the other coating on the other side of the capacitor Capacitor are applied above the dielectric layers, in which the protruding edge regions of the metal layers of the coverings are arranged one above the other without intervening insulating layers and in which the edge region of the coverings is electrically conductively connected to the associated connecting element.
- Such a capacitor structure is known from British Patent 970 865.
- a carrier is used, in which connection elements are used.
- the me the pads are evaporated so that they each include a connecting element.
- Metal connections that are produced on the respective metal layer serve as dielectric layers.
- connection elements have their greatest extension in the direction of the support and since the support must have an increased strength and thus thickness in order to be able to the connection elements occur during processing to absorb the mechanical forces.
- a flawless, highly disc layer can not be realized without difficulty on a thin metal coating by converting the metal into a metal compound.
- the object on which the present invention is based is that with a capacitor of the type described at the outset, much smaller dimensions can be achieved with little effort, that the capacitor is suitable for hybridization and that a high volume capacity is achieved.
- the carrier has end faces in the area of the edge areas of the coverings, that these end faces are covered with at least one contact layer of tall and that the edge areas of the coverings at least partially overlap the edges of these metal layers.
- the contact layers do not significantly increase the expansion of the capacitor and that the load on the contact layers and the carrier when handling the capacitor is extremely low, and thus the thickness of the carrier can also be chosen to be relatively small.
- the end faces are coated with a first layer of a solderable, high-melting metal and with a second layer of a solder, and the edge regions of the pads partially overlap the edges of at least one contact layer.
- a shape that is easy to produce is given in that the carrier has an at least approximately rectangular cross section in the direction perpendicular to the contact layers. Particularly reliable contacting is achieved when the contact layers completely cover the corresponding end faces.
- the dielectric layers consist of glow polymer.
- the use of glow polymer also achieves particularly advantageous values for the capacitor data, in particular a high volume capacity and a low loss factor.
- Dielectrics made of glow polymer can also be used to produce perfectly regenerating capacitors.
- a glow polymer of, for example, cyclohexane is suitable for this.
- the number of layers arranged one above the other can be varied within a wide range.
- the capacitor advantageously contains approximately one hundred glow polymerization layers and approximately one hundred aluminum layers, the aluminum layers having a thickness of approximately 30 nm. This embodiment is still flawless Can be regenerated and enables, for example, capacitor dimensions of only 3 mm x 1.3 mm x 1 mm.
- the dielectric layers can be less than 1 ⁇ m thick.
- Capacitors of the type described can advantageously be produced by a method which has the features that a carrier tape of the width desired in the capacitor is made from insulating material, that this carrier tape is provided with end faces on its narrow longitudinal side and with at least one contact layer from one end face at the temperature of the usual soldering process of components, non-melting material is provided, that at least one surface of this carrier tape is vapor-coated with a valve metal layer, that a glow polymerization layer is polymerized in a polymerizable gas by an electrical glow discharge onto this valve metal layer, that a second metal layer is evaporated onto this glow polymerization layer and polymerized over these further glow polymerization layers and metal layers are evaporated and that both during the vapor deposition of the metal layers and during the polymerisation of the polymer isations slaughter from the gas phase, the areas not to be coated are covered by screens and that the resulting capacitor strip is separated into individual capacitors.
- This separation can take place in deposit-free strips between capacitively active areas, but it can also take place through the deposits.
- the proposed invention offers simple installation options by coating the carrier tape on its end faces with a first layer of a high-melting metal and a second layer of a solder metal, and by melting connection wires into the solder metal layers after the application of the polymerization layers and the metal coatings. Tin is particularly suitable as the solder metal.
- a simple production of a large number of the proposed capacitors is made possible in that a film of high-melting metal is laminated on both sides to an insulating plastic plate, the thickness of which corresponds to the width of the support made of insulating material, that a coating of a solder metal is laminated onto this metal foil is applied that the plate is then cut into strips of the thickness of the support required in the capacitor, that the metal and glow polymer layers are applied to the cut surfaces and that the capacitors are then separated from the capacitor strips thus formed.
- high-melting-contact layer is a 35 / um thick copper foil. A tin layer is applied to this. This is sufficient to enable the capacitor to be connected correctly or to solder a connecting wire.
- carrier strips are placed next to one another and provided with the appropriate layers together.
- Aluminum is particularly suitable as a covering material.
- the tin layer can be applied, for example, electro-galvanically or by means of an immersion bath.
- an additional one can be used to protect the dielectric layers Insulating film or a layer of lacquer can be applied.
- Epoxy resin is suitable as the material for the carrier, since this plastic has sufficient heat resistance.
- a perfect, sharp delimitation of the applied layers is achieved by covering the surfaces to be coated with panels and by bringing the panels as close as possible to the surfaces to be coated. This is particularly important for the production of the polymerization layers, since even small layer thicknesses in the edge regions to be contacted would cause poor contact. Covering by screens which are in the immediate vicinity of the surface to be coated is also possible in the production of the relatively thick polymerization layers, since tapering polymer layers form in the vicinity of the screen edge. This means that panels that are directly on the surfaces to be coated can be easily removed after coating. This very precise and limited deckun g s equal superimposed layers can be produced, a production with very close tolerances is possible.
- a carrier 1 made of insulating material with the width L desired in the capacitor is coated on both sides with a higher-melting contact layer 5, 5 'and a solder layer 6, 6'.
- Metal layers 2 and 2 ', respectively, which form a covering, are arranged on this carrier 1. These are separated from one another by glow polymerization layers 3. The metal layers 2 and 2 'partially overlap the contact layers 5 and 6 or 5' and 6 '.
- a surface 7 to be covered with glow polmer is partially covered by an aperture 9.
- the glow polymer layer 8 becomes thinner in the area of the edge 10 of the screen 9. Its thickness goes to zero.
- the area influenced by the screen corresponds approximately to the thickness of the screen 9. As a result, the screen 9 can be lifted off without difficulty after the application of even thick polymer layers 8. There is no detachment of the glow polymer layers 8 from the surface 7 to be coated.
Abstract
Fur besonders kleine Abmessungen und eine hohe Volumenkapazität wird ein Schichtkondensator vorgeschlagen, bei dem ein Träger (1) an zwei Stirnseiten mit Kontaktmetallschichten (5, 5', 6, 6') beschichtet ist und auf diesen Träger Metallschichten der Beläge (2, 2') und Glimmpolymerisationsschichten (3, 3') übereinander angeordnet sind. Dabei reichen die Metallschichten (2 bzw. 2') jeweils eines Belages auf jeweils einer Stirnseite des Trägers bis zu den Stirnkontaktschichten (5, 6 bzw. 5', 6') und sind mit diesen elektrisch leitfähig verbunden.For particularly small dimensions and a high volume capacity, a layer capacitor is proposed, in which a carrier (1) is coated on two faces with contact metal layers (5, 5 ', 6, 6') and metal layers of the coatings (2, 2 ') on this carrier ) and glow polymerization layers (3, 3 ') are arranged one above the other. The metal layers (2 or 2 ') each extend from a covering on one end face of the carrier to the end contact layers (5, 6 or 5', 6 ') and are connected to them in an electrically conductive manner.
Description
Die Erfindung botrifft einen regenerierfähigen elektrischen Schichtkondensator, bei dem auf einen Träger aus Isolierstoff abwechselnd Metallschichten der Beläge und Isolierstoffschichten als Dielektrika übereinander angeordnet sind, bei dem die Metallschichten jeweils des einen Belages auf einer Seite des Kondensators und die des anderen Belages auf der anderen Seite des Kondensators über die Dielektrikumsschichten vorstehend aufgebracht sind, bei dem die vorstehenden Randbereiche der Metallschichten der Beläge ohne dazwischenliegende isolierende Schichten übereinander angeordnet sind und bei dem der Randbereich der Beläge mit dem zugehörigen Anschlußelement elektrisch leitend verbunden ist.The invention relates to a regenerable electrical layer capacitor, in which metal layers of the coatings and insulating layers are arranged one above the other as dielectrics on a carrier made of insulating material, in which the metal layers of one coating on one side of the capacitor and that of the other coating on the other side of the capacitor Capacitor are applied above the dielectric layers, in which the protruding edge regions of the metal layers of the coverings are arranged one above the other without intervening insulating layers and in which the edge region of the coverings is electrically conductively connected to the associated connecting element.
Ein derartiger Kondensatoraufbau ist aus der britischen Patentschrift 970 865 bekannt. Dort wird ein Träger verwendet, in den Anschlußelemente eingesetzt sind. Die Meder Beläge werden so aufgedampft, daß sie jeweils ein Anschlußelement umfassen. Als dielektrische Schichten dienen Metallverbindungen, die auf der jeweiligen Metallschicht erzeugt werden.Such a capacitor structure is known from British Patent 970 865. There a carrier is used, in which connection elements are used. The me the pads are evaporated so that they each include a connecting element. Metal connections that are produced on the respective metal layer serve as dielectric layers.
Der Aufbau gemäß dem Stand der Technik ist nicht regene rierfähig und für eine Miniaturisierung nicht geeignet, da die Anschlußelemente in der Richtung des Trägers ihr größte Ausdehnung besitzen und da der Träger eine erhe␣ li¸he Festigkeit und damit Dicke aufweisen muß, um die an den Anschlußelementen bei der Verarbeitung auftreten den mechanischen Kräfte aufzunehmen. Außerdem läßt sich auf einem dünnen Metallbelag eine einwandfreie, hochisc lierende Schicht durch Umwandlung des Metalls in eine Metallverbindung nicht ohne Schwierigkeiten realisierer Ein selbstheilender Kondensator kann so nicht hergestel werden.The structure according to the prior art is not capable of regeneration and is not suitable for miniaturization, since the connection elements have their greatest extension in the direction of the support and since the support must have an increased strength and thus thickness in order to be able to the connection elements occur during processing to absorb the mechanical forces. In addition, a flawless, highly disc layer can not be realized without difficulty on a thin metal coating by converting the metal into a metal compound.
Die Aufgabe, die der vorliegenden Erfindung zugrundeliegt, besteht darin, daß bei einem Kondensator der ein gangs beschriebenen Art mit geringem Aufwand wesentlich kleinere Abmessungen erreicht werden, daß der Kondensator hybridiergeeignet wird und daß eine hohe Volumenka pazität erreicht wird.The object on which the present invention is based is that with a capacitor of the type described at the outset, much smaller dimensions can be achieved with little effort, that the capacitor is suitable for hybridization and that a high volume capacity is achieved.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß der Träger im Bereich der Randbereiche der Beläge Stirnflächen aufweist, daß diese Stirnflächen mit zumindest einer Kontaktschicht aus tall überzogen sind und daß die Randbereiche der Beläg die Kanten dieser Metallschichten zumindest teilweise überlappen.This object is achieved in that the carrier has end faces in the area of the edge areas of the coverings, that these end faces are covered with at least one contact layer of tall and that the edge areas of the coverings at least partially overlap the edges of these metal layers.
Dieser Vorschlag hat den Vorteil, daß die Kontaktschichten die Ausdehnung das Kondensators nicht nennenswert vergrößern und daß die Belastung der Kontaktschichten sowie des Trägers bei der Handhabung des Kondensators äußerst gering ist und somit die Dicke des Trägers ebenfalls relativ gering gewählt werden kann. Um eine einfach zu verlötende und sicher hybridierfähige Ausführungsform zu erreichen, sind die Stirnflächen mit einer ersten Schicht aus einem lötbaren, hochschmelzenden Metall und mit einer zweiten aus einem Lötmittel überzogen und die Randbereiche der Beläge überlappen die Kanten zumindest einer Kontaktschicht teilweise. Eine einfach herzustellende Form ist gegeben, indem der Träger in Richtung senkrecht zu den Kcntaktschichten einen zumindest annähernd rechteckförmigen Querschnitt aufweist. Eine besonders sichere Kontaktierung ist erreicht, wenn die Kontaktschichten die entsprechenden Stirnflächen vollständig bedecken.This proposal has the advantage that the contact layers do not significantly increase the expansion of the capacitor and that the load on the contact layers and the carrier when handling the capacitor is extremely low, and thus the thickness of the carrier can also be chosen to be relatively small. In order to achieve an easily solderable and securely hybridizable embodiment, the end faces are coated with a first layer of a solderable, high-melting metal and with a second layer of a solder, and the edge regions of the pads partially overlap the edges of at least one contact layer. A shape that is easy to produce is given in that the carrier has an at least approximately rectangular cross section in the direction perpendicular to the contact layers. Particularly reliable contacting is achieved when the contact layers completely cover the corresponding end faces.
Eine ausreichende Hitzefestigkeit für das Hybridieren der Kondensatoren, beispielsweise mit einer reflow-Lötung, ist gewährleistet, wenn die Dielektrikumsschichten aus Glimmpolymerisat bestehen. Durch die Verwendung von Glimmpolymerisat werden außerdem besonders vorteilhafte Werte der Kondensatordaten, insbesondere eine hohe Volumenkapazität und ein geringer Verlustfaktor, erreicht. Mit Dielektrika aus Glimmpolymerisat können außerdem einwandfrei regenerierende Kondensatoren hergestellt werden. Hierzu eignet sich ein Glimmpolymerisat von z.B. Cyclohexan. Die Zahl der übereinander angeordneten Schichten kann in einem weiten Bereich variiert werden. Vorteilhaft enthält der Kondensator etwa hundert Glimmpolymerisationsschichten und etwa hundert Aluminiumschichten, wobei die Aluminiumschichten eine Stärke von etwa 30 nm aufweisen. Diese Ausführungsform ist noch einwandfrei regenerierfähig und ermöglicht beispielsweise Kondensatorabmessungen von nur 3 mm x 1,3 mm x 1 mm. Die Dielektrikumsschichten können dabei weniger als 1µm dick sein.Sufficient heat resistance for hybridizing the capacitors, for example with reflow soldering, is ensured if the dielectric layers consist of glow polymer. The use of glow polymer also achieves particularly advantageous values for the capacitor data, in particular a high volume capacity and a low loss factor. Dielectrics made of glow polymer can also be used to produce perfectly regenerating capacitors. A glow polymer of, for example, cyclohexane is suitable for this. The number of layers arranged one above the other can be varied within a wide range. The capacitor advantageously contains approximately one hundred glow polymerization layers and approximately one hundred aluminum layers, the aluminum layers having a thickness of approximately 30 nm. This embodiment is still flawless Can be regenerated and enables, for example, capacitor dimensions of only 3 mm x 1.3 mm x 1 mm. The dielectric layers can be less than 1 µm thick.
Kondensatoren der beschriebenen Art lassen sich vorteilhaft durch ein Verfahren herstellen, welches die Merkmale aufweist, daß ein Trägerband von der im Kondensator gewünschten Breite aus Isolierstoff hergestellt wird, daß dieses Trägerband auf seiner schmalen Längsseite Stirnflächen erhält und an den Stirnflächen mit zumindest einer Kontaktschicht aus einem bei der Temperatur des üblichen Einlötvorganges von Bauelementen nichtschmelzendem Material versehen wird, daß zumindest eine Oberfläche dieses Trägerbandes mit Ventilmetallschicht bedampft wird, daß auf diese Ventilsetallschicht eine Glimmpolymerisationsschicht in einem polymerisierbaren Gas durch eine elektrische Glimmentladung aufpolymerisiert wird, daß auf diese Glimmpolymerisationsschicht eine zweite Metallschicht aufgedampft und über diese weiteren Glimmpolymerisationsschichten aufpolymerisiert und Metallschichten aufgedampft werden und daß sowohl beim Aufdampfen der Metallschichten als auch beim Aufpolymerisieren der Polymerisationsschichten aus der Gasphase die jeweils nicht zu beschichtenden Bereiche durch Blenden abgedeckt werden und daß der so entstandene Kondensatorstreifen in Einzelkondensatoren zertrennt wird. Dieses Zertrennen kann in belagfreien Streifen zwischen kapazitiv wirksamen Bereichen erfolgen, es kann aber auch durch die Beläge hindurch erfolgen. Hierfür eignet sich beispielsweise ein Zerschneiden des Kondensatorstreifens mit einer Schere oder dergl. Auch beim Zerschneiden des Kondensatorstreifens ergibt sich eine einwandfreie Isolation der Beläge gegeneinander.Capacitors of the type described can advantageously be produced by a method which has the features that a carrier tape of the width desired in the capacitor is made from insulating material, that this carrier tape is provided with end faces on its narrow longitudinal side and with at least one contact layer from one end face at the temperature of the usual soldering process of components, non-melting material is provided, that at least one surface of this carrier tape is vapor-coated with a valve metal layer, that a glow polymerization layer is polymerized in a polymerizable gas by an electrical glow discharge onto this valve metal layer, that a second metal layer is evaporated onto this glow polymerization layer and polymerized over these further glow polymerization layers and metal layers are evaporated and that both during the vapor deposition of the metal layers and during the polymerisation of the polymer isationsschichten from the gas phase, the areas not to be coated are covered by screens and that the resulting capacitor strip is separated into individual capacitors. This separation can take place in deposit-free strips between capacitively active areas, but it can also take place through the deposits. For this purpose it is suitable, for example, to cut the capacitor strip with scissors or the like. Even when the capacitor strip is cut, the linings are perfectly insulated from one another.
Einfache Einbaumöglichkeiten bietet die vorgeschlagene Erfindung, indem das Trägerband auf seinen Stirnflächen mit einer ersten Schicht aus einem hochschmelzenden Metall und einer zweiten Schicht aus einem Lotmetall beschichtet wird und indem nach dem Aufbringen der Polymerisationsschichten und der Metallbeläge Anschlußdrähte in die Lotmetallschichten eingeschmolzen werden. Als Lotmetall ist insbesondere Zinn geeignet.The proposed invention offers simple installation options by coating the carrier tape on its end faces with a first layer of a high-melting metal and a second layer of a solder metal, and by melting connection wires into the solder metal layers after the application of the polymerization layers and the metal coatings. Tin is particularly suitable as the solder metal.
Eine einfache Herstellung einer großen Zahl der vorgeschlagenen Kondensatoren ist dadurch ermöglicht, daß auf eine isolierende Kunststoffplatte, deren Dicke der Breite des Trägers aus Isolierstoff entspricht, zu beiden Seiten eine Folie aus hochschmelzendem Metall aufkaschiert wird, daß auf diese aufkaschierte Metallfolie ein Überzug aus einem Lotmetall aufgebracht wird, daß die Platte dann in Streifen von der Dicke des im Kondensator benötigten Trägers zertrennt wird, daß auf die Schnittflächen die Metall- und Glimmpolymerisalionsschichten aufgebracht werden und daß dann die Kondensatoren von den so gebildeten Kondensatorstreifen abgetrennt werden. Als erste, hochschmelzende Kontaktschicht eignet sich eine 35/um dicke Kupferfolie. Auf diese wird eine Zinnschicht aufgebracht. Diese reicht aus, um eine einwandfreie Verschaltung des Kondensators oder das Einlöten eines Anschlußdrahtes zu ermöglichen. Zur Herstellung von großen Mengen von Kondensatoren ist es vorteilhaft, wenn mehrere Trägerstreifen nebeneinander gelegt und gemeinsam mit den entsprechenden Schichten versehen werden. Als Belagsmaterial eignet sich insbesondere Aluminium. Die Zinnschicht kann beispielsweise elektrogalvanisch oder durch ein Tauchbad aufgebracht werden. Vor dem Zerteilen der Kondensatorstreifen in Einzelkondensatoren kann zum Schutz der dielektrischen Schichten eine zusätzliche Isolierstoffolie oder eine Lackschicht aufgebracht werden. Als Material für den Träger eignet sich Epoxidharz, da dieser Kunststoff eine ausreichende Wämebeständigkeit aufweist.A simple production of a large number of the proposed capacitors is made possible in that a film of high-melting metal is laminated on both sides to an insulating plastic plate, the thickness of which corresponds to the width of the support made of insulating material, that a coating of a solder metal is laminated onto this metal foil is applied that the plate is then cut into strips of the thickness of the support required in the capacitor, that the metal and glow polymer layers are applied to the cut surfaces and that the capacitors are then separated from the capacitor strips thus formed. As the first, high-melting-contact layer is a 35 / um thick copper foil. A tin layer is applied to this. This is sufficient to enable the capacitor to be connected correctly or to solder a connecting wire. For the production of large quantities of capacitors, it is advantageous if several carrier strips are placed next to one another and provided with the appropriate layers together. Aluminum is particularly suitable as a covering material. The tin layer can be applied, for example, electro-galvanically or by means of an immersion bath. Before the capacitor strips are divided into individual capacitors, an additional one can be used to protect the dielectric layers Insulating film or a layer of lacquer can be applied. Epoxy resin is suitable as the material for the carrier, since this plastic has sufficient heat resistance.
Eine einwandfreie, scharfe Begrenzung der aufgebrachten Schichten wird erreicht, indem die zu beschichtenden Flächen durch Blenden abgedeckt werden und indem die Blenden möglichst nahe an die zu beschichtenden Flächen herangebracht werden. Dies ist insbesondere für die Herstellung der Polymerisationsschichten wichtig, da selbst geringe Schichtdicken in den zu kontaktierenden Randbereichen einen schlechten Kontakt hervorrufen würden. Die Abdeckung durch Blenden, die in unmittelbarer Nähe der zu beschichtenden Fläche liegen, ist auch bei der Herstellung der relativ dick auszubildenden Polymerisationsschichten möglich, da sich in der Nähe des Blendenrandes verjüngende Polymerisatschichten bilden. So können auch direkt auf den zu beschichtenden Oberflächen aufliegende Blenden ohne weiteres nach der Beschichtung entfernt werden. Dadurch können sehr genau begrenzte und deckungs-gleich übereinanderliegende Schichten erzeugt werden, eine Fertigung mit sehr engen Toleranzen ist möglich.A perfect, sharp delimitation of the applied layers is achieved by covering the surfaces to be coated with panels and by bringing the panels as close as possible to the surfaces to be coated. This is particularly important for the production of the polymerization layers, since even small layer thicknesses in the edge regions to be contacted would cause poor contact. Covering by screens which are in the immediate vicinity of the surface to be coated is also possible in the production of the relatively thick polymerization layers, since tapering polymer layers form in the vicinity of the screen edge. This means that panels that are directly on the surfaces to be coated can be easily removed after coating. This very precise and limited deckun g s equal superimposed layers can be produced, a production with very close tolerances is possible.
Die Erfindung wird anhand von zwei Figuren näher erläutert. Sie ist nicht auf die in den Figuren gezeigten Beispiele beschränkt.
- Fig. 1 zeigt einen erfindungsgemäßen Kondensator in geschnittener Ansicht schematisch.
- Fig. 2 zeigt das Profil einer Glimmpolymerisatschicht in der Nähe einer Blende schematisch.
- Fig. 1 shows a capacitor according to the invention in a sectional view schematically.
- Fig. 2 shows schematically the profile of a glow polymer layer in the vicinity of an aperture.
Ein Träger 1 aus Isolierstoff mit der im Kondensator gewünschten Breite L ist beidseitig mit einer höherschmelzenden Kontaktschicht 5, 5' und einer Lotschicht 6, 6' beschichtet. Auf diesem Träger 1 sind jeweils einen Belag bildende Metallschichten 2 bzw. 2' angeordnet. Diese sind voneinander durch Glimmpolymerisationsschichten 3 getrennt. Die Metallschichten 2 bzw. 2' überlappen die Kontaktschichten 5 und 6 bzw. 5' und 6' teilweise.A
Eine mit Glimmpolpmerisat zu überziehende Fläche 7 ist teilweise durch eine Blende 9 abgedeckt. Die Glimmpolymerisatschicht 8 wird im Bereich der Kante 10 der Blende 9 dünner. Ihre Dicke geht gegen Null. Der Bereich der Beeinflussung durch die Blende entspricht in etwa der Dicke der Blende 9. Dadurch läßt sich die Blende 9 nach dem Aufbringen auch dicker Polymerisatschichten 8 ohne Schwierigkeiten abheben. Es tritt keine Ablösung der Glimmpolymerisatschichten 8 von der zu beschichtenden Oberfläche 7 auf.A
Claims (13)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE2843581A DE2843581C2 (en) | 1978-10-05 | 1978-10-05 | Electric film capacitor and process for its manufacture |
DE2843581 | 1978-10-05 |
Publications (2)
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EP0009806A1 true EP0009806A1 (en) | 1980-04-16 |
EP0009806B1 EP0009806B1 (en) | 1984-07-25 |
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EP79103759A Expired EP0009806B1 (en) | 1978-10-05 | 1979-10-02 | Electrical stacked capacitor and method for its production |
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US (1) | US4376329A (en) |
EP (1) | EP0009806B1 (en) |
JP (1) | JPS5552213A (en) |
DE (1) | DE2843581C2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0041679A2 (en) * | 1980-06-10 | 1981-12-16 | Siemens Aktiengesellschaft | Method of making electrical components, particularly stacked capacitors |
EP0147696A2 (en) * | 1983-12-19 | 1985-07-10 | SPECTRUM CONTROL, INC. (a Pennsylvania corporation) | Miniaturized monolithic multi-layer capacitor and apparatus and method for making |
EP0186765A2 (en) * | 1984-11-19 | 1986-07-09 | SPECTRUM CONTROL, INC. (a Pennsylvania corporation) | End termination for chip capacitor |
US4842893A (en) * | 1983-12-19 | 1989-06-27 | Spectrum Control, Inc. | High speed process for coating substrates |
EP0339844A2 (en) * | 1988-04-29 | 1989-11-02 | SPECTRUM CONTROL, INC. (a Delaware corporation) | Multi layer structure and process for making same |
US5125138A (en) * | 1983-12-19 | 1992-06-30 | Spectrum Control, Inc. | Miniaturized monolithic multi-layer capacitor and apparatus and method for making same |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3040930C2 (en) * | 1980-10-30 | 1983-12-08 | Siemens AG, 1000 Berlin und 8000 München | Process for the serial production of electrical components or networks in chip design |
DE3110351A1 (en) * | 1981-03-17 | 1982-09-30 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR THE PRODUCTION OF ELECTRIC LAYER CAPACITORS WITH GLOW POLYMERIZED LAYERS AS DIELECTRICS |
DE3214991A1 (en) * | 1982-04-22 | 1983-11-03 | Siemens AG, 1000 Berlin und 8000 München | Semiconductor chip with discrete capacitor |
DE3231576A1 (en) * | 1982-08-25 | 1984-03-01 | Siemens AG, 1000 Berlin und 8000 München | REGENERABLE ELECTRIC LAYER CAPACITOR |
US4499520A (en) * | 1983-12-19 | 1985-02-12 | General Electric Company | Capacitor with dielectric comprising poly-functional acrylate polymer and method of making |
US5032461A (en) * | 1983-12-19 | 1991-07-16 | Spectrum Control, Inc. | Method of making a multi-layered article |
US5018048A (en) * | 1983-12-19 | 1991-05-21 | Spectrum Control, Inc. | Miniaturized monolithic multi-layer capacitor and apparatus and method for making |
US5097800A (en) * | 1983-12-19 | 1992-03-24 | Spectrum Control, Inc. | High speed apparatus for forming capacitors |
US4697159A (en) * | 1984-10-31 | 1987-09-29 | Rca Corporation | Tuning capacitors with selectable capacitance configurations for coupling between microwave circuits |
US4656557A (en) * | 1985-02-11 | 1987-04-07 | Siemens Aktiengesellschaft | Electrical layer capacitor and method for the manufacture thereof |
US4954371A (en) * | 1986-06-23 | 1990-09-04 | Spectrum Control, Inc. | Flash evaporation of monomer fluids |
US5339212A (en) * | 1992-12-03 | 1994-08-16 | International Business Machines Corporation | Sidewall decoupling capacitor |
US5576925A (en) * | 1994-12-27 | 1996-11-19 | General Electric Company | Flexible multilayer thin film capacitors |
JPH08203777A (en) * | 1995-01-24 | 1996-08-09 | Komatsu Ltd | Thin film battery, manufacture of thin film battery and thin film battery manufacture device |
US5774326A (en) * | 1995-08-25 | 1998-06-30 | General Electric Company | Multilayer capacitors using amorphous hydrogenated carbon |
US5736448A (en) * | 1995-12-04 | 1998-04-07 | General Electric Company | Fabrication method for thin film capacitors |
US10897974B2 (en) | 2011-07-28 | 2021-01-26 | Sparkly Soul, Inc. | Headband with 360-degree glitter pattern |
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DE1414281B1 (en) * | 1956-06-26 | 1969-10-23 | Radiation Res Corp | Process for forming closed layers from polymeric material |
FR2306513A1 (en) * | 1975-04-02 | 1976-10-29 | Radiotechnique Compelec | Discrete thin layer capacitor - has dielectric with minimal dielectric losses which can be used with voltages between 2 and 20 volts |
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US2731706A (en) * | 1950-12-13 | 1956-01-24 | Hunt Capacitors Ltd A | Manufacture of capacitors |
US3252830A (en) * | 1958-03-05 | 1966-05-24 | Gen Electric | Electric capacitor and method for making the same |
US3069283A (en) * | 1959-02-02 | 1962-12-18 | Radiation Res Corp | Polymerizing method and apparatus for carrying out the same |
US3102216A (en) * | 1959-12-23 | 1963-08-27 | Western Electric Co | Metallized capacitor |
NL6910723A (en) * | 1968-07-24 | 1970-01-27 | ||
FR2379889A1 (en) * | 1977-02-08 | 1978-09-01 | Thomson Csf | DIELECTRIC CONSTITUTED BY A THIN LAYER POLYMER, PROCESS FOR MANUFACTURING THE SAID LAYER, AND ELECTRIC CAPACITORS CONTAINING SUCH A DIELECTRIC |
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- 1978-10-05 DE DE2843581A patent/DE2843581C2/en not_active Expired
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1979
- 1979-10-02 EP EP79103759A patent/EP0009806B1/en not_active Expired
- 1979-10-03 JP JP12784579A patent/JPS5552213A/en active Pending
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1980
- 1980-11-17 US US06/207,699 patent/US4376329A/en not_active Expired - Lifetime
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US3330696A (en) * | 1967-07-11 | Method of fabricating thin film capacitors | ||
DE1414281B1 (en) * | 1956-06-26 | 1969-10-23 | Radiation Res Corp | Process for forming closed layers from polymeric material |
FR2306513A1 (en) * | 1975-04-02 | 1976-10-29 | Radiotechnique Compelec | Discrete thin layer capacitor - has dielectric with minimal dielectric losses which can be used with voltages between 2 and 20 volts |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0041679A2 (en) * | 1980-06-10 | 1981-12-16 | Siemens Aktiengesellschaft | Method of making electrical components, particularly stacked capacitors |
EP0041679B1 (en) * | 1980-06-10 | 1987-09-16 | Siemens Aktiengesellschaft | Method of making electrical components, particularly stacked capacitors |
EP0147696A2 (en) * | 1983-12-19 | 1985-07-10 | SPECTRUM CONTROL, INC. (a Pennsylvania corporation) | Miniaturized monolithic multi-layer capacitor and apparatus and method for making |
EP0147696A3 (en) * | 1983-12-19 | 1987-01-14 | Sfe Technologies | Miniaturized monolithic multi-layer capacitor and apparatus and method for making |
US4842893A (en) * | 1983-12-19 | 1989-06-27 | Spectrum Control, Inc. | High speed process for coating substrates |
US5125138A (en) * | 1983-12-19 | 1992-06-30 | Spectrum Control, Inc. | Miniaturized monolithic multi-layer capacitor and apparatus and method for making same |
EP0186765A2 (en) * | 1984-11-19 | 1986-07-09 | SPECTRUM CONTROL, INC. (a Pennsylvania corporation) | End termination for chip capacitor |
EP0186765A3 (en) * | 1984-11-19 | 1987-03-04 | Sfe Technologies | End termination for chip capacitor |
EP0339844A2 (en) * | 1988-04-29 | 1989-11-02 | SPECTRUM CONTROL, INC. (a Delaware corporation) | Multi layer structure and process for making same |
EP0339844A3 (en) * | 1988-04-29 | 1991-01-16 | SPECTRUM CONTROL, INC. (a Delaware corporation) | Multi layer structure and process for making same |
Also Published As
Publication number | Publication date |
---|---|
JPS5552213A (en) | 1980-04-16 |
DE2843581A1 (en) | 1980-04-10 |
EP0009806B1 (en) | 1984-07-25 |
US4376329A (en) | 1983-03-15 |
DE2843581C2 (en) | 1986-03-27 |
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