DK348187D0 - PROCEDURE FOR MANUFACTURING GUIDE PLATES WITH A COPPER SURFACE - Google Patents

PROCEDURE FOR MANUFACTURING GUIDE PLATES WITH A COPPER SURFACE

Info

Publication number
DK348187D0
DK348187D0 DK348187A DK348187A DK348187D0 DK 348187 D0 DK348187 D0 DK 348187D0 DK 348187 A DK348187 A DK 348187A DK 348187 A DK348187 A DK 348187A DK 348187 D0 DK348187 D0 DK 348187D0
Authority
DK
Denmark
Prior art keywords
procedure
guide plates
copper surface
manufacturing guide
manufacturing
Prior art date
Application number
DK348187A
Other languages
Danish (da)
Other versions
DK348187A (en
Inventor
Reinhard De Boer
Original Assignee
Deutsche Telephonwerk Kabel
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Telephonwerk Kabel filed Critical Deutsche Telephonwerk Kabel
Publication of DK348187D0 publication Critical patent/DK348187D0/en
Publication of DK348187A publication Critical patent/DK348187A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
DK348187A 1986-07-09 1987-07-07 PROCEDURE FOR MANUFACTURING GUIDE PLATES WITH A COPPER SURFACE DK348187A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863623505 DE3623505A1 (en) 1986-07-09 1986-07-09 METHOD FOR PRODUCING CIRCUIT BOARDS WITH GALVANIC LEAD-TIN LAYERS SELECTIVELY APPLIED ON THE SOLUTION EYES AND HOLE WALLS

Publications (2)

Publication Number Publication Date
DK348187D0 true DK348187D0 (en) 1987-07-07
DK348187A DK348187A (en) 1988-01-10

Family

ID=6305010

Family Applications (1)

Application Number Title Priority Date Filing Date
DK348187A DK348187A (en) 1986-07-09 1987-07-07 PROCEDURE FOR MANUFACTURING GUIDE PLATES WITH A COPPER SURFACE

Country Status (4)

Country Link
EP (1) EP0252399A3 (en)
DE (1) DE3623505A1 (en)
DK (1) DK348187A (en)
PT (1) PT85287A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4978423A (en) * 1988-09-26 1990-12-18 At&T Bell Laboratories Selective solder formation on printed circuit boards
DE19619292A1 (en) * 1996-05-13 1997-11-20 Siemens Ag Circuit board mfg. technique for SMD
DE102007045930A1 (en) * 2007-09-24 2009-04-09 Rolf Bauer Partial galvanic pure tin-surface producing method for printed circuit board, involves stripping photo-layer by alkaline stripper, tin-plating and soldering solder pad, and covering regions provided as copper surfaces with solder resist

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2209178B2 (en) * 1972-02-26 1974-12-19 Robert Bosch Fernsehanlagen Gmbh, 6100 Darmstadt Process for the production of printed circuits
DE2241961C3 (en) * 1972-08-25 1981-06-25 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Process for the production of a surface protection for printed circuits
DE7529988U (en) * 1975-09-23 1976-02-12 Korsten & Goossens Ohg, 5657 Haan FINE CONDUCTOR PLATE WITH SELECTIVELY TINNED SOLDERING EYES AND HOLE WALLS
US4104111A (en) * 1977-08-03 1978-08-01 Mack Robert L Process for manufacturing printed circuit boards
GB2087157B (en) * 1980-11-05 1984-06-06 Quassia Electronics Ltd Solder plating printed circuit boards
DE3214807C1 (en) * 1982-04-21 1983-10-06 Siemens Ag Process for producing etched printed circuit boards
US4487828A (en) * 1983-06-03 1984-12-11 At&T Technologies, Inc. Method of manufacturing printed circuit boards
US4487654A (en) * 1983-10-27 1984-12-11 Ael Microtel Limited Method of manufacturing printed wiring boards
DE3408630A1 (en) * 1984-03-09 1985-09-12 Hoechst Ag, 6230 Frankfurt METHOD AND LAYER MATERIAL FOR THE PRODUCTION OF CONTACTED ELECTRICAL CIRCUITS
DE3412447A1 (en) * 1984-03-31 1985-11-28 Schering AG, 1000 Berlin und 4709 Bergkamen METHOD FOR PRODUCING PRINTED CIRCUITS

Also Published As

Publication number Publication date
DE3623505A1 (en) 1988-01-21
DE3623505C2 (en) 1988-04-28
EP0252399A2 (en) 1988-01-13
DK348187A (en) 1988-01-10
PT85287A (en) 1988-07-29
EP0252399A3 (en) 1989-06-28

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Legal Events

Date Code Title Description
AHB Application shelved due to non-payment