DK2564975T3 - Markeringsapparat med en flerhed af lasere og sæt af afbøjningsmidler, der kan justeres individuelt - Google Patents
Markeringsapparat med en flerhed af lasere og sæt af afbøjningsmidler, der kan justeres individuelt Download PDFInfo
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- DK2564975T3 DK2564975T3 DK11007184.2T DK11007184T DK2564975T3 DK 2564975 T3 DK2564975 T3 DK 2564975T3 DK 11007184 T DK11007184 T DK 11007184T DK 2564975 T3 DK2564975 T3 DK 2564975T3
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- Prior art keywords
- marking
- laser beams
- laser
- mirrors
- marking apparatus
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0071—Beam steering, e.g. whereby a mirror outside the cavity is present to change the beam direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/355—Texturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/101—Lasers provided with means to change the location from which, or the direction in which, laser radiation is emitted
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
- H01S3/2383—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/03—Constructional details of gas laser discharge tubes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/07—Construction or shape of active medium consisting of a plurality of parts, e.g. segments
- H01S3/073—Gas lasers comprising separate discharge sections in one cavity, e.g. hybrid lasers
- H01S3/076—Folded-path lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/08059—Constructional details of the reflector, e.g. shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/22—Gases
- H01S3/223—Gases the active gas being polyatomic, i.e. containing two or more atoms
- H01S3/2232—Carbon dioxide (CO2) or monoxide [CO]
Claims (16)
1. Markeringsapparat til markering af en genstand (1) med laserlys, omfattende - en flerhed af lasere (10), især gaslasere (10), og - en styreenhed (20) til individuel aktivering af hver af laserne (10) til udsendelse af en laserstråle (90a - 90i) i henhold til et mærke, der skal markeres, kendetegnet ved, at - et sæt af afbøjningsmidler (30) til omflytning af laserstrålerne (90a - 90i) til en ønsket række af laserstråler (90a - 90i) er tilvejebragt, - sættet af afbøjningsmidler (30) omfatter mindst to afbøjningsmidler (33a -33i, 34a - 34i) pr. laserstråle (90a - 90i), især mindst to aftegningsspejle (33a - 33i, 34a - 34i) eller mindst en optisk bølgeleder og en linse pr. laserstråle (90a - 90i), - hvert afbøjningsmiddel (33a - 33i, 34a - 34i) kan justeres individuelt i sin afbøjningsretning og/eller kan forskydes individuelt, og - styreenheden (20) er indrettet til at forskyde afbøjningsmidlerne (33a - 33i, 34a - 34i) og/eller justere afbøjningsmidlernes (33a - 33i, 34a - 34i) afbøjningsretninger, - der er tilvejebragt mindst en scanningsspejlindretning (50), der omfatter et fælles spejl (50a), som alle laserstrålerne (90a - 90i), der kommer fra sættet af afbøjningsmidler (30), rammer, og - styreenheden (20) er indrettet til at dreje scanningsspejlindretningen (50).
2. Markeringsapparat ifølge krav 1, kendetegnet ved, at afbøjningsmidlerne (33a - 33i, 34a - 34i) er justeret således, at en stråleafstand mellem laserstrålerne (90a - 90i) reduceres.
3. Markeringsapparat ifølge krav 1 eller 2, kendetegnet ved, at styreenheden (20) er indrettet til at forskyde afbøjningsmidlerne (33a - 33i, 34a - 34i) og/eller justere afbøjningsmidlernes (33a - 33i, 34a - 34i) afbøjningsretninger via kardanske ophængning.
4. Markeringsapparat ifølge et af kravene 1 til 3, kendetegnet ved, at styreenheden (20) er indrettet til at forskyde afbøjningsmidlerne (33a - 33i, 34a - 34i) og/eller justere afbøjningsmidlernes (33a - 33i, 34a - 34i) afbøjningsretninger, især via kardanske ophængning, under en markeringsproces til udførelse af en scanningsbevægelse af laserstrålerne (90a - 90i).
5. Markeringsapparat ifølge et af kravene 1 til 4, kendetegnet ved, at styreenheden (20) er indrettet til at dreje scanningsspejlindretningen (50) ved hjælp af et galvanometer.
6. Markeringsapparat ifølge et af kravene 1 til 5, kendetegnet ved, at styreenheden (20) med henblik på markering af genstanden (1), mens den bevæger sig i forhold til markeringsapparatet (100), er indrettet til at justere afbøjningsmidlerne (33a - 33i, 34a - 34i) og/eller den mindst ene scanningsspejlindretning (50) i henhold til information om en bevægelse af genstanden (1)-
7. Markeringsapparat ifølge et af kravene 3 til 6, kendetegnet ved, at sættet af afbøjningsmidler (30) omfatter et første og andet sæt aftegningsspejle (33, 34), hvert sæt aftegningsspejle (33, 34) omfatter mindst et aftegningsspejl (33a -33i, 34a - 34i) pr. laserstråle (90a - 90i), det første sæt aftegningsspejle (33) retter laserstrålerne (90a - 90i) mod det andet sæt aftegningsspejle (34), det første og andet sæt aftegningsspejle (33, 34) hver især er anbragt på en lineær række (35, 36); og hvert aftegningsspejl (33a - 33i, 34a - 34i) kan vippes.
8. Markeringsapparat ifølge krav 7, kendetegnet ved, at der er tilvejebragt positioneringsmidler (60) til justering af positionen af mindst en af de lineære rækker af aftegningsspejle (35, 36).
9. Markeringsapparat ifølge et af kravene 1 til 8, kendetegnet ved, at styreenheden (20) er indrettet til at styre afbøjningsmidlerne (33a - 33i, 34a -34i) til at indstille en konvergens- eller divergensgrad af laserstrålerne (90a -90i), der udsendes fra afbøjningsmidlerne (33a - 33i, 34a - 34i).
10. Markeringsapparat ifølge et af kravene 1 til 9, kendetegnet ved, at styreenheden (20) er indrettet til at justere afbøjningsmidlerne (33a - 33i, 34a - 34i) på en sådan måde, at en lineær anordning af laserstråler (90a - 90i), der rammer afbøjningsmidlerne (33a - 33i), roteres med 90° omkring en akse parallelt med bevægelsesretningen af laserstrålerne (90a - 90i), der rammer.
11. Markeringsapparat ifølge et af kravene 1 til 10, kendetegnet ved, at der er tilvejebragt en teleskopindretning (45) med mindst to linser til global justering af laserstrålernes (90a - 90i) brændvidder.
12. Markeringsapparat ifølge et af kravene 1 til 11, kendetegnet ved, at styreenheden (20) er indrettet til at indstille teleskopindretningen (45) på en sådan måde, at laserstrålernes (90a - 90i) brændvidder svarer til en afstand fra genstanden (1), der skal markeres, især en genstand (1), der bevæger sig.
13. Markeringsapparat ifølge et af kravene 1 til 12, kendetegnet ved, at styreenheden (20) er indrettet til at forsinke aktiveringen af hver laser (10) individuelt således, at i det tilfælde, at en genstand (1) bevæger sig i forhold til markeringsapparatet (100) i en genstandsbevægelsesretning (2), mindst to laserstråler (90a - 90i) rammer genstanden (1) i sammen position i genstandsbevægelsesretningen (2).
14. Markeringsapparat ifølge et af kravene 1 til 13, kendetegnet ved, at der som afbøjningsmidler (33a - 33i, 34a - 34i) er tilvejebragt mindst en optisk bølgeleder og en linse pr. laserstråle (90a - 90i), og de optiske bølgeledere har samme længde.
15. Markeringsapparat ifølge et af kravene 1 til 14, kendetegnet ved, at et sæt stråleformningsmidler (40) er tilvejebragt til individuel formning af hver laserstråle (90a - 90i), især til indstilling af en konvergens- eller divergensgrad af hver laserstråle (90a - 90i).
16. Markeringssystem, omfattende et markeringsapparat (100) ifølge et af kravene 1 til 15, og drejemidler (110) til at vippe markeringsapparatet (100) i forhold til en genstandsbevægelsesretning (2) for genstanden (1), der skal markeres.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11007184.2A EP2564975B1 (en) | 2011-09-05 | 2011-09-05 | Marking apparatus with a plurality of lasers and individually adjustable sets of deflection means |
Publications (1)
Publication Number | Publication Date |
---|---|
DK2564975T3 true DK2564975T3 (da) | 2015-01-12 |
Family
ID=46679236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK11007184.2T DK2564975T3 (da) | 2011-09-05 | 2011-09-05 | Markeringsapparat med en flerhed af lasere og sæt af afbøjningsmidler, der kan justeres individuelt |
Country Status (8)
Country | Link |
---|---|
US (1) | US9577399B2 (da) |
EP (1) | EP2564975B1 (da) |
CN (1) | CN103781585B (da) |
BR (1) | BR112014003927A2 (da) |
DK (1) | DK2564975T3 (da) |
EA (1) | EA025906B1 (da) |
ES (1) | ES2530070T3 (da) |
WO (1) | WO2013034212A1 (da) |
Families Citing this family (7)
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CN103801838B (zh) * | 2014-01-28 | 2016-01-20 | 华中科技大学 | 一种变线宽激光振镜扫描快速刻蚀方法 |
CN107044619B (zh) * | 2016-02-05 | 2020-09-11 | 深圳光峰科技股份有限公司 | 光斑压缩结构和光源装置 |
CN113154336B (zh) * | 2016-02-05 | 2022-11-11 | 深圳光峰科技股份有限公司 | 光斑压缩结构和光源装置 |
JP2018065148A (ja) * | 2016-10-17 | 2018-04-26 | 株式会社ブイ・テクノロジー | レーザ照射装置及びそれを用いたレーザリフトオフ装置 |
CA172005S (en) * | 2016-12-01 | 2017-08-11 | Riegl Laser Measurement Systems Gmbh | Laser scanner for surveying, for topographical and distance measurement |
CN110722274B (zh) * | 2019-10-31 | 2021-07-16 | 台州知通科技有限公司 | 一种激光切割设备 |
CN113664391A (zh) * | 2021-09-03 | 2021-11-19 | 上海百琪迈科技(集团)有限公司 | 一种高效薄质材料组合式激光快速切割设备 |
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-
2011
- 2011-09-05 DK DK11007184.2T patent/DK2564975T3/da active
- 2011-09-05 EP EP11007184.2A patent/EP2564975B1/en active Active
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2012
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- 2012-07-19 WO PCT/EP2012/003067 patent/WO2013034212A1/en active Application Filing
- 2012-07-19 EA EA201490246A patent/EA025906B1/ru not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN103781585B (zh) | 2016-04-20 |
US9577399B2 (en) | 2017-02-21 |
EP2564975A1 (en) | 2013-03-06 |
EA201490246A1 (ru) | 2014-08-29 |
ES2530070T3 (es) | 2015-02-26 |
BR112014003927A2 (pt) | 2017-03-14 |
EA025906B1 (ru) | 2017-02-28 |
WO2013034212A1 (en) | 2013-03-14 |
US20140217073A1 (en) | 2014-08-07 |
CN103781585A (zh) | 2014-05-07 |
EP2564975B1 (en) | 2014-12-10 |
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