DE8804742U1 - - Google Patents
Info
- Publication number
- DE8804742U1 DE8804742U1 DE8804742U DE8804742U DE8804742U1 DE 8804742 U1 DE8804742 U1 DE 8804742U1 DE 8804742 U DE8804742 U DE 8804742U DE 8804742 U DE8804742 U DE 8804742U DE 8804742 U1 DE8804742 U1 DE 8804742U1
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8804742U DE8804742U1 (fr) | 1988-04-11 | 1988-04-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8804742U DE8804742U1 (fr) | 1988-04-11 | 1988-04-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE8804742U1 true DE8804742U1 (fr) | 1988-06-09 |
Family
ID=6822794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8804742U Expired DE8804742U1 (fr) | 1988-04-11 | 1988-04-11 |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE8804742U1 (fr) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4131739A1 (de) * | 1991-09-24 | 1993-04-01 | Behr Industrietech Gmbh & Co | Kuehleinrichtung fuer elektrische bauelemente |
DE4301865A1 (de) * | 1993-01-25 | 1994-07-28 | Abb Management Ag | Kühldose |
DE4401607A1 (de) * | 1994-01-20 | 1995-07-27 | Siemens Ag | Kühleinheit für Leistungshalbleiter |
DE4421025A1 (de) * | 1994-06-16 | 1995-12-21 | Abb Patent Gmbh | Kühlkörper mit mindestens einem Kühlkanal |
WO1996013142A1 (fr) * | 1994-10-24 | 1996-05-02 | Siemens Aktiengesellschaft | Systeme de refroidissement pour sous-ensembles electriques |
DE19606972A1 (de) * | 1996-02-24 | 1997-08-28 | Daimler Benz Ag | Kühlkörper zum Kühlen von Leistungsbauelementen |
EP0810657A2 (fr) * | 1996-05-31 | 1997-12-03 | R-Theta Inc. | Dissipateur de chaleur avec accélérateur de refroidissement |
DE19747321A1 (de) * | 1997-10-27 | 1999-05-06 | Semikron Elektronik Gmbh | Flüssigkeitskühler für Leistungshalbleiterbauelemente |
DE19860415A1 (de) * | 1998-12-28 | 2000-06-29 | Abb Research Ltd | Halbleitermodul |
EP2684002A4 (fr) * | 2011-03-07 | 2015-03-11 | Aavid Thermalloy Llc | Dispositif de transfert de la chaleur avec voies de passage de fluide en spirale |
WO2017029211A1 (fr) * | 2015-08-14 | 2017-02-23 | Karlsruher Institut für Technologie | Éléments d'acheminement d'un flux dans un conduit |
WO2018189009A1 (fr) * | 2017-04-12 | 2018-10-18 | Abb Schweiz Ag | Agencement d'échange de chaleur et système électronique sous-marin |
EP4199667A1 (fr) * | 2021-12-17 | 2023-06-21 | Vitesco Technologies GmbH | Dispositif électronique de puissance et procédé de fabrication d'un système de refroidissement pour un dispositif électronique de puissance |
-
1988
- 1988-04-11 DE DE8804742U patent/DE8804742U1/de not_active Expired
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4131739A1 (de) * | 1991-09-24 | 1993-04-01 | Behr Industrietech Gmbh & Co | Kuehleinrichtung fuer elektrische bauelemente |
DE4301865A1 (de) * | 1993-01-25 | 1994-07-28 | Abb Management Ag | Kühldose |
US5526231A (en) * | 1994-01-20 | 1996-06-11 | Siemens Aktiengesellschaft | Cooling unit for power semiconductors |
DE4401607A1 (de) * | 1994-01-20 | 1995-07-27 | Siemens Ag | Kühleinheit für Leistungshalbleiter |
DE4421025C2 (de) * | 1994-06-16 | 1999-09-09 | Abb Patent Gmbh | Kühlkörper mit mindestens einem Kühlkanal |
DE4421025A1 (de) * | 1994-06-16 | 1995-12-21 | Abb Patent Gmbh | Kühlkörper mit mindestens einem Kühlkanal |
US5901036A (en) * | 1994-10-24 | 1999-05-04 | Siemens Aktiengesellschaft | Cooling device for electrical assemblies |
WO1996013142A1 (fr) * | 1994-10-24 | 1996-05-02 | Siemens Aktiengesellschaft | Systeme de refroidissement pour sous-ensembles electriques |
US6089314A (en) * | 1996-02-24 | 2000-07-18 | Daimler-Benz Aktiengesellschaft | Cooling body for cooling power gates |
DE19606972A1 (de) * | 1996-02-24 | 1997-08-28 | Daimler Benz Ag | Kühlkörper zum Kühlen von Leistungsbauelementen |
EP0810657A2 (fr) * | 1996-05-31 | 1997-12-03 | R-Theta Inc. | Dissipateur de chaleur avec accélérateur de refroidissement |
EP0810657A3 (fr) * | 1996-05-31 | 1999-09-15 | R-Theta Inc. | Dissipateur de chaleur avec accélérateur de refroidissement |
DE19747321A1 (de) * | 1997-10-27 | 1999-05-06 | Semikron Elektronik Gmbh | Flüssigkeitskühler für Leistungshalbleiterbauelemente |
DE19747321C2 (de) * | 1997-10-27 | 2002-08-01 | Semikron Elektronik Gmbh | Flüssigkeitskühler für Leistungshalbleiterbauelemente |
DE19860415A1 (de) * | 1998-12-28 | 2000-06-29 | Abb Research Ltd | Halbleitermodul |
EP2684002A4 (fr) * | 2011-03-07 | 2015-03-11 | Aavid Thermalloy Llc | Dispositif de transfert de la chaleur avec voies de passage de fluide en spirale |
US9568257B2 (en) | 2011-03-07 | 2017-02-14 | Aavid Thermalloy, Llc | Thermal transfer device with spiral fluid pathways |
WO2017029211A1 (fr) * | 2015-08-14 | 2017-02-23 | Karlsruher Institut für Technologie | Éléments d'acheminement d'un flux dans un conduit |
WO2018189009A1 (fr) * | 2017-04-12 | 2018-10-18 | Abb Schweiz Ag | Agencement d'échange de chaleur et système électronique sous-marin |
US11419241B2 (en) | 2017-04-12 | 2022-08-16 | Abb Schweiz Ag | Heat exchanging arrangement and subsea electronic system |
EP4199667A1 (fr) * | 2021-12-17 | 2023-06-21 | Vitesco Technologies GmbH | Dispositif électronique de puissance et procédé de fabrication d'un système de refroidissement pour un dispositif électronique de puissance |