DE69905280D1 - Verfahren zur herstellung einer chipkarte - Google Patents
Verfahren zur herstellung einer chipkarteInfo
- Publication number
- DE69905280D1 DE69905280D1 DE69905280T DE69905280T DE69905280D1 DE 69905280 D1 DE69905280 D1 DE 69905280D1 DE 69905280 T DE69905280 T DE 69905280T DE 69905280 T DE69905280 T DE 69905280T DE 69905280 D1 DE69905280 D1 DE 69905280D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- chip card
- sheet
- card
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004831 Hot glue Substances 0.000 abstract 1
- 239000011229 interlayer Substances 0.000 abstract 1
- 229920002635 polyurethane Polymers 0.000 abstract 1
- 239000004814 polyurethane Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
- B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
- B32B37/185—Laminating sheets, panels or inserts between two discrete plastic layers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q20/00—Payment architectures, schemes or protocols
- G06Q20/08—Payment architectures
- G06Q20/10—Payment architectures specially adapted for electronic funds transfer [EFT] systems; specially adapted for home banking systems
- G06Q20/105—Payment architectures specially adapted for electronic funds transfer [EFT] systems; specially adapted for home banking systems involving programming of a portable memory device, e.g. IC cards, "electronic purses"
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/12—Pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/14—Corona, ionisation, electrical discharge, plasma treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2425/00—Cards, e.g. identity cards, credit cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2519/00—Labels, badges
- B32B2519/02—RFID tags
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Business, Economics & Management (AREA)
- Accounting & Taxation (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Finance (AREA)
- General Business, Economics & Management (AREA)
- Economics (AREA)
- Strategic Management (AREA)
- Development Economics (AREA)
- Credit Cards Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32347398A JP2000148959A (ja) | 1998-11-13 | 1998-11-13 | Icカードの製造法 |
PCT/EP1999/008414 WO2000030031A1 (en) | 1998-11-13 | 1999-11-04 | A process for producing ic card |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69905280D1 true DE69905280D1 (de) | 2003-03-13 |
DE69905280T2 DE69905280T2 (de) | 2003-11-13 |
Family
ID=18155088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69905280T Expired - Fee Related DE69905280T2 (de) | 1998-11-13 | 1999-11-04 | Verfahren zur herstellung einer chipkarte |
Country Status (10)
Country | Link |
---|---|
US (1) | US6649014B1 (de) |
EP (1) | EP1131786B1 (de) |
JP (1) | JP2000148959A (de) |
KR (1) | KR20010080992A (de) |
AT (1) | ATE232323T1 (de) |
BR (1) | BR9915278A (de) |
CA (1) | CA2350496A1 (de) |
DE (1) | DE69905280T2 (de) |
ES (1) | ES2192410T3 (de) |
WO (1) | WO2000030031A1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6537682B2 (en) † | 2001-03-27 | 2003-03-25 | The Boeing Company | Application of friction stir welding to superplastically formed structural assemblies |
DE10130887A1 (de) * | 2001-06-27 | 2003-01-16 | Henkel Kgaa | PUR-Schmelzklebstoffe zur Herstellung von Korkstopfen |
US6586078B2 (en) * | 2001-07-05 | 2003-07-01 | Soundcraft, Inc. | High pressure lamination of electronic cards |
KR100434945B1 (ko) * | 2001-07-11 | 2004-06-12 | 소프트픽셀(주) | 스마트 ic카드의 패키징 구조 및 그의 패키징 방법 |
JP4904647B2 (ja) * | 2001-08-27 | 2012-03-28 | 凸版印刷株式会社 | 非接触式ic記録媒体の製造方法 |
ATE371228T1 (de) * | 2001-10-18 | 2007-09-15 | Trueb Ag | Verfahren zur herstellung eines datenträgers sowie nach diesem verfahren hergestellter datenträger |
CN1618080A (zh) * | 2001-11-29 | 2005-05-18 | 因特洛克公开股份有限公司 | 应答器标签 |
CA2601512A1 (en) * | 2005-03-23 | 2006-09-28 | Cardxx, Inc. | Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces |
JP2007000815A (ja) * | 2005-06-24 | 2007-01-11 | Miyako Roller Industry Co | 基板への塗膜形成方法及び基板への塗膜形成装置 |
KR100791196B1 (ko) * | 2007-04-11 | 2008-01-03 | 주식회사 하이스마텍 | 접촉 또는 비접촉 아이씨 카드 및 이의 제조방법 |
JP5566051B2 (ja) | 2009-05-28 | 2014-08-06 | ヘンケルジャパン株式会社 | Icカード用湿気硬化型ホットメルト接着剤 |
KR20140044866A (ko) * | 2011-07-22 | 2014-04-15 | 에이치. 비. 풀러, 컴퍼니 | 전자장치 상에 사용하기 위한 반응성 고온용융 접착제 |
CN103165708A (zh) * | 2011-12-09 | 2013-06-19 | 纳幕尔杜邦公司 | 用于光伏模块的可交联边缘密封剂 |
US9439334B2 (en) | 2012-04-03 | 2016-09-06 | X-Card Holdings, Llc | Information carrying card comprising crosslinked polymer composition, and method of making the same |
US9122968B2 (en) | 2012-04-03 | 2015-09-01 | X-Card Holdings, Llc | Information carrying card comprising a cross-linked polymer composition, and method of making the same |
WO2014149926A1 (en) | 2013-03-15 | 2014-09-25 | X-Card Holdings, Llc | Methods of making a core layer for an information carrying card, and resulting products |
US11361204B2 (en) | 2018-03-07 | 2022-06-14 | X-Card Holdings, Llc | Metal card |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4080401A (en) * | 1976-08-04 | 1978-03-21 | Henkel Kgaa | Heat-resistant adhesives and process for improving the thermal stability of adhesive bonds |
JPS56129650A (en) * | 1980-03-14 | 1981-10-09 | Mitsubishi Monsanto Chem Co | Manufacture of laminated plate containing patterned body |
DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
JPS5914084A (ja) * | 1982-07-15 | 1984-01-24 | Toppan Printing Co Ltd | Ic等を内蔵するカ−ドの製造方法 |
FR2659157B2 (fr) | 1989-05-26 | 1994-09-30 | Lemaire Gerard | Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede. |
JPH04248353A (ja) | 1991-01-24 | 1992-09-03 | Toshiba Corp | 回転電機の固定子ケースの製造方法 |
JPH05270173A (ja) * | 1992-03-24 | 1993-10-19 | Mitsubishi Plastics Ind Ltd | カード基材 |
GB2279610A (en) * | 1993-07-02 | 1995-01-11 | Gec Avery Ltd | A method of manufacturing a laminated integrated circuit or smart card. |
FR2716555B1 (fr) | 1994-02-24 | 1996-05-15 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
JP2915327B2 (ja) * | 1995-07-19 | 1999-07-05 | キヤノン株式会社 | 太陽電池モジュール及びその製造方法 |
JPH11340934A (ja) | 1998-05-28 | 1999-12-10 | Matsushita Electric Ind Co Ltd | 時分割多重アクセス通信装置 |
-
1998
- 1998-11-13 JP JP32347398A patent/JP2000148959A/ja active Pending
-
1999
- 1999-11-04 CA CA002350496A patent/CA2350496A1/en not_active Abandoned
- 1999-11-04 AT AT99963286T patent/ATE232323T1/de not_active IP Right Cessation
- 1999-11-04 US US09/831,719 patent/US6649014B1/en not_active Expired - Fee Related
- 1999-11-04 KR KR1020017005937A patent/KR20010080992A/ko not_active Application Discontinuation
- 1999-11-04 DE DE69905280T patent/DE69905280T2/de not_active Expired - Fee Related
- 1999-11-04 EP EP99963286A patent/EP1131786B1/de not_active Revoked
- 1999-11-04 BR BR9915278-9A patent/BR9915278A/pt not_active IP Right Cessation
- 1999-11-04 WO PCT/EP1999/008414 patent/WO2000030031A1/en not_active Application Discontinuation
- 1999-11-04 ES ES99963286T patent/ES2192410T3/es not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CA2350496A1 (en) | 2000-05-25 |
EP1131786B1 (de) | 2003-02-05 |
KR20010080992A (ko) | 2001-08-25 |
JP2000148959A (ja) | 2000-05-30 |
ATE232323T1 (de) | 2003-02-15 |
DE69905280T2 (de) | 2003-11-13 |
ES2192410T3 (es) | 2003-10-01 |
BR9915278A (pt) | 2001-08-07 |
WO2000030031A1 (en) | 2000-05-25 |
EP1131786A1 (de) | 2001-09-12 |
US6649014B1 (en) | 2003-11-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8339 | Ceased/non-payment of the annual fee |