DE69825138D1 - Verfahren und Vorrichtung zum Herstellen von dünnen Schichten einer Metallverbindung - Google Patents
Verfahren und Vorrichtung zum Herstellen von dünnen Schichten einer MetallverbindungInfo
- Publication number
- DE69825138D1 DE69825138D1 DE69825138T DE69825138T DE69825138D1 DE 69825138 D1 DE69825138 D1 DE 69825138D1 DE 69825138 T DE69825138 T DE 69825138T DE 69825138 T DE69825138 T DE 69825138T DE 69825138 D1 DE69825138 D1 DE 69825138D1
- Authority
- DE
- Germany
- Prior art keywords
- metal compound
- thin layers
- producing thin
- producing
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0047—Activation or excitation of reactive gases outside the coating chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0073—Reactive sputtering by exposing the substrates to reactive gases intermittently
- C23C14/0078—Reactive sputtering by exposing the substrates to reactive gases intermittently by moving the substrates between spatially separate sputtering and reaction stations
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7316698 | 1998-03-05 | ||
JP10073166A JPH11256327A (ja) | 1998-03-05 | 1998-03-05 | 金属化合物薄膜の形成方法および成膜装置 |
JP10197698A JP3735462B2 (ja) | 1998-03-30 | 1998-03-30 | 金属酸化物光学薄膜の形成方法および成膜装置 |
JP10197698 | 1998-03-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69825138D1 true DE69825138D1 (de) | 2004-08-26 |
DE69825138T2 DE69825138T2 (de) | 2004-11-18 |
Family
ID=26414322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1998625138 Expired - Lifetime DE69825138T2 (de) | 1998-03-05 | 1998-08-19 | Verfahren und Vorrichtung zum Herstellen von dünnen Schichten einer Metallverbindung |
Country Status (3)
Country | Link |
---|---|
US (2) | US6103320A (de) |
EP (1) | EP0940481B1 (de) |
DE (1) | DE69825138T2 (de) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6429120B1 (en) | 2000-01-18 | 2002-08-06 | Micron Technology, Inc. | Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals |
JP3735461B2 (ja) | 1998-03-27 | 2006-01-18 | 株式会社シンクロン | 複合金属の化合物薄膜形成方法及びその薄膜形成装置 |
US20070137653A1 (en) * | 2000-03-13 | 2007-06-21 | Wood Thomas J | Ventilation interface for sleep apnea therapy |
JP2001003166A (ja) * | 1999-04-23 | 2001-01-09 | Nippon Sheet Glass Co Ltd | 基体表面に被膜を被覆する方法およびその方法による基体 |
JP2001049428A (ja) * | 1999-08-05 | 2001-02-20 | Nippon Sheet Glass Co Ltd | 基体に被膜を被覆する方法およびその方法に用いるスパッタリング装置 |
US6733513B2 (en) | 1999-11-04 | 2004-05-11 | Advanced Bioprosthetic Surfaces, Ltd. | Balloon catheter having metal balloon and method of making same |
US7335426B2 (en) * | 1999-11-19 | 2008-02-26 | Advanced Bio Prosthetic Surfaces, Ltd. | High strength vacuum deposited nitinol alloy films and method of making same |
US6379383B1 (en) * | 1999-11-19 | 2002-04-30 | Advanced Bio Prosthetic Surfaces, Ltd. | Endoluminal device exhibiting improved endothelialization and method of manufacture thereof |
US7736687B2 (en) | 2006-01-31 | 2010-06-15 | Advance Bio Prosthetic Surfaces, Ltd. | Methods of making medical devices |
US8458879B2 (en) | 2001-07-03 | 2013-06-11 | Advanced Bio Prosthetic Surfaces, Ltd., A Wholly Owned Subsidiary Of Palmaz Scientific, Inc. | Method of fabricating an implantable medical device |
US6936066B2 (en) * | 1999-11-19 | 2005-08-30 | Advanced Bio Prosthetic Surfaces, Ltd. | Complaint implantable medical devices and methods of making same |
US7262130B1 (en) * | 2000-01-18 | 2007-08-28 | Micron Technology, Inc. | Methods for making integrated-circuit wiring from copper, silver, gold, and other metals |
US6376370B1 (en) * | 2000-01-18 | 2002-04-23 | Micron Technology, Inc. | Process for providing seed layers for using aluminum, copper, gold and silver metallurgy process for providing seed layers for using aluminum, copper, gold and silver metallurgy |
US6420262B1 (en) * | 2000-01-18 | 2002-07-16 | Micron Technology, Inc. | Structures and methods to enhance copper metallization |
US6527866B1 (en) * | 2000-02-09 | 2003-03-04 | Conductus, Inc. | Apparatus and method for deposition of thin films |
US8252044B1 (en) | 2000-11-17 | 2012-08-28 | Advanced Bio Prosthestic Surfaces, Ltd. | Device for in vivo delivery of bioactive agents and method of manufacture thereof |
US8632583B2 (en) | 2011-05-09 | 2014-01-21 | Palmaz Scientific, Inc. | Implantable medical device having enhanced endothelial migration features and methods of making the same |
US6494997B1 (en) * | 2000-08-18 | 2002-12-17 | General Electric Company | Radio frequency magnetron sputtering for lighting applications |
WO2002038080A2 (en) | 2000-11-07 | 2002-05-16 | Advanced Bio Prosthetic Surfaces, Ltd. | Endoluminal stent, self-fupporting endoluminal graft and methods of making same |
US6917158B2 (en) * | 2002-03-08 | 2005-07-12 | City University Of Hong Kong | High-qualty aluminum-doped zinc oxide layer as transparent conductive electrode for organic light-emitting devices |
US8679517B2 (en) | 2002-09-26 | 2014-03-25 | Palmaz Scientific, Inc. | Implantable materials having engineered surfaces made by vacuum deposition and method of making same |
US8268340B2 (en) | 2002-09-26 | 2012-09-18 | Advanced Bio Prosthetic Surfaces, Ltd. | Implantable materials having engineered surfaces and method of making same |
WO2004028340A2 (en) | 2002-09-26 | 2004-04-08 | Advanced Bio Prosthetic Surfaces, Ltd. | High strength vacuum deposited nitionol alloy films, medical thin film graft materials and method of making same |
AU2003272710B2 (en) * | 2002-09-26 | 2008-05-15 | Vactronix Scientific, Llc | Implantable materials having engineered surfaces and method of making same |
DE10347521A1 (de) * | 2002-12-04 | 2004-06-24 | Leybold Optics Gmbh | Verfahren zur Herstellung Multilayerschicht und Vorrichtung zur Durchführung des Verfahrens |
US20040182701A1 (en) * | 2003-01-29 | 2004-09-23 | Aashi Glass Company, Limited | Sputtering apparatus, a mixed film produced by the sputtering apparatus and a multilayer film including the mixed film |
CN100558320C (zh) * | 2003-03-19 | 2009-11-11 | 先进生物假体表面有限公司 | 具有支柱间相互连接单元的腔内支架 |
AU2004238270B2 (en) * | 2003-05-07 | 2011-02-03 | Advanced Bio Prosthetic Surfaces, Ltd. | Metallic implantable grafts and method of making same |
US6972136B2 (en) | 2003-05-23 | 2005-12-06 | Optima, Inc. | Ultra low residual reflection, low stress lens coating and vacuum deposition method for making the same |
US20060189046A1 (en) * | 2003-06-03 | 2006-08-24 | Yizhou Song | Thin film forming method and forming device therefor |
JP2005054220A (ja) * | 2003-08-01 | 2005-03-03 | Canon Inc | フッ化物薄膜の形成方法及びその形成装置 |
EP1680527B1 (de) * | 2003-10-07 | 2012-03-21 | Deposition Sciences, Inc. | Vorrichtung und verfahren zur schnellen abscheidung von rutil-titandioxid |
US20050281958A1 (en) * | 2004-06-22 | 2005-12-22 | Walton Scott G | Electron beam enhanced nitriding system (EBENS) |
JP3986513B2 (ja) * | 2004-08-05 | 2007-10-03 | 株式会社シンクロン | 薄膜形成装置 |
JP2008524442A (ja) * | 2004-12-15 | 2008-07-10 | エヌエックスピー ビー ヴィ | 薄膜音響積層反射体ならびにその製造方法および製造装置 |
US7833904B2 (en) * | 2005-06-16 | 2010-11-16 | The Trustees Of Columbia University In The City Of New York | Methods for fabricating nanoscale electrodes and uses thereof |
US20070061006A1 (en) * | 2005-09-14 | 2007-03-15 | Nathan Desatnik | Methods of making shape memory films by chemical vapor deposition and shape memory devices made thereby |
US7518880B1 (en) | 2006-02-08 | 2009-04-14 | Bi-Link | Shielding arrangement for electronic device |
US20090202807A1 (en) * | 2006-06-22 | 2009-08-13 | National Kuniversity Corporation Kitami Institue Of Technology | Method for producing metal nitride film, oxide film, metal carbide film or composite film of them, and production apparatus therefor |
JP5174825B2 (ja) * | 2006-10-26 | 2013-04-03 | ハウザー テクノ−コーティング ベー.フェー. | デュアルマグネトロンスパッタリング電源およびマグネトロンスパッタリング装置 |
TWI383059B (zh) * | 2007-02-12 | 2013-01-21 | Hon Hai Prec Ind Co Ltd | 濺鍍式鍍膜裝置及方法 |
US8974514B2 (en) | 2007-03-13 | 2015-03-10 | Abbott Cardiovascular Systems Inc. | Intravascular stent with integrated link and ring strut |
DE102007021896A1 (de) * | 2007-05-10 | 2008-11-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Flexibles Leiterplattenmaterial und Verfahren zum Herstellen desselben |
TWI381058B (zh) * | 2007-07-03 | 2013-01-01 | Univ Nat Chunghsing | A method for preparing a metal nitride film |
JP5101690B2 (ja) * | 2008-04-09 | 2012-12-19 | 株式会社アルバック | 成膜装置及び成膜方法 |
US20100257732A1 (en) * | 2009-04-14 | 2010-10-14 | Ziberna Frank J | Shielding Arrangement for Electronic Device |
US20120164051A1 (en) * | 2009-05-07 | 2012-06-28 | Stefan Bruns | Method for the production of oxide and nitride coatings and its use |
WO2010151339A1 (en) * | 2009-06-26 | 2010-12-29 | Sol Array Llc | In-line sputtering for improving thin film solar modules |
US8728563B2 (en) | 2011-05-03 | 2014-05-20 | Palmaz Scientific, Inc. | Endoluminal implantable surfaces, stents, and grafts and method of making same |
CN103038387B (zh) | 2011-08-02 | 2015-05-27 | 新柯隆株式会社 | 碳化硅薄膜的成膜方法 |
WO2013044402A1 (en) | 2011-09-26 | 2013-04-04 | Evatec Ag | Process of coating a substrate with a thin film of metal or semiconductor compound |
DE102013221029A1 (de) * | 2013-10-16 | 2015-04-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Herstellung uniformer Schichten auf bewegten Substraten und derart hergestellte Schichten |
CN103643204B (zh) * | 2013-11-10 | 2019-03-08 | 广东世创金属科技股份有限公司 | 柔性化多功能真空镀膜设备及其智能控制系统 |
WO2017070488A1 (en) * | 2015-10-22 | 2017-04-27 | Richard Devito | Deposition system with integrated cooling on a rotating drum |
US12057297B2 (en) * | 2015-10-22 | 2024-08-06 | Richard DeVito | Deposition system with integrated cooling on a rotating drum |
CN108690963B (zh) * | 2017-04-10 | 2020-06-23 | 株式会社新柯隆 | 成膜装置 |
CN111359447A (zh) * | 2020-03-17 | 2020-07-03 | 广州康滤净化科技有限公司 | 一种磁共溅射法制备的金属过滤膜及其制备方法 |
CN112410742A (zh) * | 2020-10-30 | 2021-02-26 | 东莞市烽元科技有限公司 | 一种在Al2O3陶瓷基体表面磁控溅射镀纳米级铜膜的方法 |
JP2023000829A (ja) * | 2021-06-18 | 2023-01-04 | 東京エレクトロン株式会社 | 成膜装置及び成膜方法 |
CN115029665B (zh) * | 2022-06-14 | 2023-08-25 | 浙江水晶光电科技股份有限公司 | 一种化合物薄膜及其制备方法 |
CN116180029B (zh) * | 2023-04-26 | 2023-07-21 | 电子科技大学 | 一种柔性薄膜的分层磁控溅射镀膜装置及其制备方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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US4431708A (en) * | 1979-12-19 | 1984-02-14 | The United States Of America As Represented By The United States Department Of Energy | Annealed CVD molybdenum thin film surface |
JPS56147829A (en) * | 1980-04-17 | 1981-11-17 | Asahi Glass Co Ltd | Improved method of forming hard coating film |
JPS56147830A (en) * | 1980-04-18 | 1981-11-17 | Asahi Glass Co Ltd | Formation of hard coating film |
JPS5940227B2 (ja) * | 1980-06-24 | 1984-09-28 | 富士通株式会社 | リアクティブスパッタリング方法 |
JPS63114966A (ja) * | 1986-10-31 | 1988-05-19 | Matsushita Electric Ind Co Ltd | 薄膜製造装置 |
US4793908A (en) * | 1986-12-29 | 1988-12-27 | Rockwell International Corporation | Multiple ion source method and apparatus for fabricating multilayer optical films |
US5618388A (en) * | 1988-02-08 | 1997-04-08 | Optical Coating Laboratory, Inc. | Geometries and configurations for magnetron sputtering apparatus |
US5234560A (en) * | 1989-08-14 | 1993-08-10 | Hauzer Holdings Bv | Method and device for sputtering of films |
JPH07110991B2 (ja) * | 1989-10-02 | 1995-11-29 | 株式会社日立製作所 | プラズマ処理装置およびプラズマ処理方法 |
US5346600A (en) * | 1992-08-14 | 1994-09-13 | Hughes Aircraft Company | Plasma-enhanced magnetron-sputtered deposition of materials |
DE69331538T2 (de) * | 1992-12-01 | 2002-08-29 | Matsushita Electric Industrial Co., Ltd. | Verfahren zur Herstellung einer elektrischen Dünnschicht |
JPH0756001A (ja) * | 1993-08-09 | 1995-03-03 | Shincron:Kk | 反射防止ハードコート層およびその製造方法 |
CH690511A5 (de) * | 1994-09-01 | 2000-09-29 | Balzers Hochvakuum | Optisches Bauteil und Verfahren zum Herstellen eines solchen. |
US5830331A (en) * | 1994-09-23 | 1998-11-03 | Seagate Technology, Inc. | Apparatus and method for sputtering carbon |
JPH08146358A (ja) * | 1994-11-25 | 1996-06-07 | Balzers Ag | 眼鏡用プラスチックレンズ |
JPH08176821A (ja) * | 1994-12-26 | 1996-07-09 | Shincron:Kk | 薄膜形成方法および装置 |
JPH08225932A (ja) * | 1995-02-16 | 1996-09-03 | Shincron:Kk | 電子線加熱蒸着方法およびその装置 |
JPH09134515A (ja) * | 1995-09-05 | 1997-05-20 | Kao Corp | 磁気記録媒体 |
JP3802127B2 (ja) * | 1996-03-26 | 2006-07-26 | 株式会社シンクロン | 薄膜形成方法 |
-
1998
- 1998-06-09 US US09/092,644 patent/US6103320A/en not_active Expired - Lifetime
- 1998-08-19 EP EP98115624A patent/EP0940481B1/de not_active Expired - Lifetime
- 1998-08-19 DE DE1998625138 patent/DE69825138T2/de not_active Expired - Lifetime
-
2000
- 2000-03-02 US US09/517,340 patent/US6274014B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0940481A1 (de) | 1999-09-08 |
DE69825138T2 (de) | 2004-11-18 |
US6274014B1 (en) | 2001-08-14 |
EP0940481B1 (de) | 2004-07-21 |
US6103320A (en) | 2000-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |