DE69734866T2 - Prüfadapter mit Kontaktstiftführung für bestückte Leiterplatten - Google Patents
Prüfadapter mit Kontaktstiftführung für bestückte Leiterplatten Download PDFInfo
- Publication number
- DE69734866T2 DE69734866T2 DE69734866T DE69734866T DE69734866T2 DE 69734866 T2 DE69734866 T2 DE 69734866T2 DE 69734866 T DE69734866 T DE 69734866T DE 69734866 T DE69734866 T DE 69734866T DE 69734866 T2 DE69734866 T2 DE 69734866T2
- Authority
- DE
- Germany
- Prior art keywords
- test
- probes
- probe
- board
- mounting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012360 testing method Methods 0.000 title claims description 327
- 239000000523 sample Substances 0.000 claims description 408
- 239000007787 solid Substances 0.000 claims description 34
- 238000004804 winding Methods 0.000 claims description 14
- 230000006835 compression Effects 0.000 description 37
- 238000007906 compression Methods 0.000 description 37
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 28
- 238000003754 machining Methods 0.000 description 12
- MPTQRFCYZCXJFQ-UHFFFAOYSA-L copper(II) chloride dihydrate Chemical compound O.O.[Cl-].[Cl-].[Cu+2] MPTQRFCYZCXJFQ-UHFFFAOYSA-L 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000010618 wire wrap Methods 0.000 description 7
- 238000011017 operating method Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011990 functional testing Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013468 resource allocation Methods 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- 235000012773 waffles Nutrition 0.000 description 2
- 241001474374 Blennius Species 0.000 description 1
- 206010026749 Mania Diseases 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/739,387 US5945836A (en) | 1996-10-29 | 1996-10-29 | Loaded-board, guided-probe test fixture |
| US739387 | 1996-10-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69734866D1 DE69734866D1 (de) | 2006-01-19 |
| DE69734866T2 true DE69734866T2 (de) | 2006-08-03 |
Family
ID=24972051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69734866T Expired - Fee Related DE69734866T2 (de) | 1996-10-29 | 1997-07-29 | Prüfadapter mit Kontaktstiftführung für bestückte Leiterplatten |
Country Status (4)
| Country | Link |
|---|---|
| US (4) | US5945836A (https=) |
| EP (5) | EP1512980A3 (https=) |
| JP (1) | JPH10186005A (https=) |
| DE (1) | DE69734866T2 (https=) |
Families Citing this family (122)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5345170A (en) | 1992-06-11 | 1994-09-06 | Cascade Microtech, Inc. | Wafer probe station having integrated guarding, Kelvin connection and shielding systems |
| US6380751B2 (en) | 1992-06-11 | 2002-04-30 | Cascade Microtech, Inc. | Wafer probe station having environment control enclosure |
| US6232789B1 (en) | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
| US5561377A (en) | 1995-04-14 | 1996-10-01 | Cascade Microtech, Inc. | System for evaluating probing networks |
| US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
| US6002263A (en) | 1997-06-06 | 1999-12-14 | Cascade Microtech, Inc. | Probe station having inner and outer shielding |
| US6194908B1 (en) * | 1997-06-26 | 2001-02-27 | Delaware Capital Formation, Inc. | Test fixture for testing backplanes or populated circuit boards |
| JPH1164426A (ja) * | 1997-08-25 | 1999-03-05 | I C T:Kk | プリント基板の検査装置およびプリント基板の検査 装置の組み立てキット |
| US6066957A (en) * | 1997-09-11 | 2000-05-23 | Delaware Capital Formation, Inc. | Floating spring probe wireless test fixture |
| JPH1197494A (ja) * | 1997-09-18 | 1999-04-09 | Hitachi Ltd | 半導体装置およびその製造方法 |
| US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
| IT1309343B1 (it) * | 1999-02-09 | 2002-01-22 | Tecno Test Di De Rossi Michele | Sistema di accoppiamento e centraggio particolarmente perl'allineamento di circuiti stampati durante le procedure |
| US6191601B1 (en) * | 1999-02-22 | 2001-02-20 | Delaware Capital Formation, Inc. | Test fixture for matched impedance testing |
| US6578264B1 (en) | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
| US6445202B1 (en) | 1999-06-30 | 2002-09-03 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
| US6838890B2 (en) | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
| US6650134B1 (en) * | 2000-02-29 | 2003-11-18 | Charles A. Schein | Adapter assembly for connecting test equipment to a wireless test fixture |
| US6424164B1 (en) * | 2000-06-13 | 2002-07-23 | Kulicke & Soffa Investment, Inc. | Probe apparatus having removable beam probes |
| US6965226B2 (en) | 2000-09-05 | 2005-11-15 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| US6914423B2 (en) | 2000-09-05 | 2005-07-05 | Cascade Microtech, Inc. | Probe station |
| DE10143173A1 (de) | 2000-12-04 | 2002-06-06 | Cascade Microtech Inc | Wafersonde |
| US6885205B2 (en) * | 2000-12-13 | 2005-04-26 | Seagate Technology Llc | Test fixture assembly for printed circuit boards |
| US6970634B2 (en) * | 2001-05-04 | 2005-11-29 | Cascade Microtech, Inc. | Fiber optic wafer probe |
| US20020180469A1 (en) * | 2001-05-31 | 2002-12-05 | Jichen Wu | Reusable test jig |
| US6628130B2 (en) * | 2001-07-18 | 2003-09-30 | Agilent Technologies, Inc. | Wireless test fixture for printed circuit board test systems |
| US7355420B2 (en) | 2001-08-21 | 2008-04-08 | Cascade Microtech, Inc. | Membrane probing system |
| EP1432546A4 (en) | 2001-08-31 | 2006-06-07 | Cascade Microtech Inc | OPTICAL TESTING APPARATUS |
| US6777964B2 (en) | 2002-01-25 | 2004-08-17 | Cascade Microtech, Inc. | Probe station |
| EP1491058A4 (en) * | 2002-04-04 | 2005-10-05 | MODULAR TELEVISION PRODUCTS | |
| EP1509776A4 (en) | 2002-05-23 | 2010-08-18 | Cascade Microtech Inc | PROBE TO TEST ANY TESTING EQUIPMENT |
| US7059046B2 (en) * | 2002-06-24 | 2006-06-13 | Delaware Capital Formation, Inc. | Method for producing a captive wired test fixture and fixture therefor |
| US6784675B2 (en) * | 2002-06-25 | 2004-08-31 | Agilent Technologies, Inc. | Wireless test fixture adapter for printed circuit assembly tester |
| US6677772B1 (en) | 2002-08-21 | 2004-01-13 | Micron Technology, Inc. | Contactor with isolated spring tips |
| US6847219B1 (en) | 2002-11-08 | 2005-01-25 | Cascade Microtech, Inc. | Probe station with low noise characteristics |
| US6724205B1 (en) | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
| US7250779B2 (en) | 2002-11-25 | 2007-07-31 | Cascade Microtech, Inc. | Probe station with low inductance path |
| US6861856B2 (en) | 2002-12-13 | 2005-03-01 | Cascade Microtech, Inc. | Guarded tub enclosure |
| US7100273B2 (en) * | 2003-03-03 | 2006-09-05 | Hewlett-Packard Development Company, L.P. | Interconnect validation instruments |
| US7221172B2 (en) | 2003-05-06 | 2007-05-22 | Cascade Microtech, Inc. | Switched suspended conductor and connection |
| US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
| US7492172B2 (en) | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
| US7250626B2 (en) | 2003-10-22 | 2007-07-31 | Cascade Microtech, Inc. | Probe testing structure |
| US7187188B2 (en) | 2003-12-24 | 2007-03-06 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
| WO2005065258A2 (en) | 2003-12-24 | 2005-07-21 | Cascade Microtech, Inc. | Active wafer probe |
| US8988091B2 (en) | 2004-05-21 | 2015-03-24 | Microprobe, Inc. | Multiple contact probes |
| US7659739B2 (en) | 2006-09-14 | 2010-02-09 | Micro Porbe, Inc. | Knee probe having reduced thickness section for control of scrub motion |
| US9476911B2 (en) | 2004-05-21 | 2016-10-25 | Microprobe, Inc. | Probes with high current carrying capability and laser machining methods |
| USRE43503E1 (en) | 2006-06-29 | 2012-07-10 | Microprobe, Inc. | Probe skates for electrical testing of convex pad topologies |
| US7733101B2 (en) * | 2004-05-21 | 2010-06-08 | Microprobe, Inc. | Knee probe having increased scrub motion |
| US7759949B2 (en) | 2004-05-21 | 2010-07-20 | Microprobe, Inc. | Probes with self-cleaning blunt skates for contacting conductive pads |
| US9097740B2 (en) | 2004-05-21 | 2015-08-04 | Formfactor, Inc. | Layered probes with core |
| DE202005021434U1 (de) | 2004-06-07 | 2008-03-20 | Cascade Microtech, Inc., Beaverton | Thermooptische Einspannvorrichtung |
| US7330041B2 (en) | 2004-06-14 | 2008-02-12 | Cascade Microtech, Inc. | Localizing a temperature of a device for testing |
| KR101157449B1 (ko) | 2004-07-07 | 2012-06-22 | 캐스케이드 마이크로테크 인코포레이티드 | 멤브레인 서스펜디드 프로브를 구비한 프로브 헤드 |
| KR20070058522A (ko) | 2004-09-13 | 2007-06-08 | 캐스케이드 마이크로테크 인코포레이티드 | 양측 프루빙 구조 |
| US7081869B2 (en) * | 2004-10-13 | 2006-07-25 | Research In Motion Limited | Test fixture for assembled wireless devices |
| US7071717B2 (en) * | 2004-10-28 | 2006-07-04 | Agilent Technologies, Inc. | Universal test fixture |
| US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
| US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
| US7030636B1 (en) | 2005-05-02 | 2006-04-18 | Fargo Assembly Company | Low pin testing system |
| US7298153B2 (en) * | 2005-05-25 | 2007-11-20 | Interconnect Devices, Inc. | Eccentric offset Kelvin probe |
| US7449899B2 (en) | 2005-06-08 | 2008-11-11 | Cascade Microtech, Inc. | Probe for high frequency signals |
| EP1932003A2 (en) | 2005-06-13 | 2008-06-18 | Cascade Microtech, Inc. | Wideband active-passive differential signal probe |
| US7511517B2 (en) * | 2005-11-08 | 2009-03-31 | Qualitau, Inc. | Semi-automatic multiplexing system for automated semiconductor wafer testing |
| US7649367B2 (en) | 2005-12-07 | 2010-01-19 | Microprobe, Inc. | Low profile probe having improved mechanical scrub and reduced contact inductance |
| US7312617B2 (en) | 2006-03-20 | 2007-12-25 | Microprobe, Inc. | Space transformers employing wire bonds for interconnections with fine pitch contacts |
| US7616019B2 (en) | 2006-05-08 | 2009-11-10 | Aspen Test Engineering, Inc. | Low profile electronic assembly test fixtures |
| US7609077B2 (en) | 2006-06-09 | 2009-10-27 | Cascade Microtech, Inc. | Differential signal probe with integral balun |
| US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
| US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
| US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
| US7443186B2 (en) | 2006-06-12 | 2008-10-28 | Cascade Microtech, Inc. | On-wafer test structures for differential signals |
| US8907689B2 (en) | 2006-10-11 | 2014-12-09 | Microprobe, Inc. | Probe retention arrangement |
| US7786740B2 (en) | 2006-10-11 | 2010-08-31 | Astria Semiconductor Holdings, Inc. | Probe cards employing probes having retaining portions for potting in a potting region |
| US20080106294A1 (en) * | 2006-11-02 | 2008-05-08 | Stephen William Smith | Apparatus and method for universal connectivity in test applications |
| US11378588B2 (en) | 2006-12-21 | 2022-07-05 | Essai, Inc. | Contactor with angled depressible probes in shifted bores |
| US9766268B2 (en) * | 2006-12-21 | 2017-09-19 | Essai, Inc. | Contactor with angled spring probes |
| US7479794B2 (en) * | 2007-02-28 | 2009-01-20 | Sv Probe Pte Ltd | Spring loaded probe pin assembly |
| US7514948B2 (en) | 2007-04-10 | 2009-04-07 | Microprobe, Inc. | Vertical probe array arranged to provide space transformation |
| JP4539681B2 (ja) * | 2007-06-04 | 2010-09-08 | 三菱電機株式会社 | ウエハテスト用プローブカード |
| CA2592901C (en) * | 2007-07-13 | 2012-03-27 | Martin Blouin | Semi-generic in-circuit test fixture |
| US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
| DE102007047269A1 (de) * | 2007-10-02 | 2009-04-09 | Atg Luther & Maelzer Gmbh | Vollrasterkassette für einen Paralleltester zum Testen einer unbestückten Leiterplatte, Federkontaktstift für eine solche Vollrasterkassette sowie Adapter für einen Paralleltester zum Testen einer unbestückten Leiterplatte |
| US7671610B2 (en) * | 2007-10-19 | 2010-03-02 | Microprobe, Inc. | Vertical guided probe array providing sideways scrub motion |
| US8723546B2 (en) | 2007-10-19 | 2014-05-13 | Microprobe, Inc. | Vertical guided layered probe |
| MY151561A (en) * | 2007-12-06 | 2014-06-13 | Test Tooling Solutions M Sdn Bhd | Eco contactor |
| US8230593B2 (en) | 2008-05-29 | 2012-07-31 | Microprobe, Inc. | Probe bonding method having improved control of bonding material |
| US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
| US8410806B2 (en) | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
| US8319503B2 (en) | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
| TWM378573U (en) * | 2009-09-15 | 2010-04-11 | Microelectronics Tech Inc | Low noise block converter |
| KR100994219B1 (ko) * | 2009-11-04 | 2010-11-12 | 리노공업주식회사 | 반도체 칩 검사용 소켓 |
| US8810460B2 (en) | 2009-11-05 | 2014-08-19 | Atc Logistics & Electronics, Inc. | Multidimensional RF test fixture and method for securing a wireless device for RF testing |
| US8907694B2 (en) * | 2009-12-17 | 2014-12-09 | Xcerra Corporation | Wiring board for testing loaded printed circuit board |
| US8829937B2 (en) | 2011-01-27 | 2014-09-09 | Formfactor, Inc. | Fine pitch guided vertical probe array having enclosed probe flexures |
| CN102495301B (zh) * | 2011-11-14 | 2014-07-09 | 福建联迪商用设备有限公司 | 一种pcb板上细间距排针的测试装置及其测试方法 |
| CN103837817B (zh) * | 2012-11-26 | 2016-08-10 | 昆山威典电子有限公司 | Pcb板推块两段式测试结构 |
| US20150054537A1 (en) * | 2013-08-22 | 2015-02-26 | Corad Technology Inc. | System and method for assembling a probe head |
| US9274166B2 (en) | 2013-08-26 | 2016-03-01 | Fujitsu Limited | Pin verification device and method |
| CN103529252B (zh) * | 2013-10-18 | 2016-09-28 | 上海华力微电子有限公司 | 直插式通用电气连接装置 |
| CN103792399A (zh) * | 2014-01-15 | 2014-05-14 | 中科华核电技术研究院有限公司北京分公司 | 多路输入输出电路板的测试夹具 |
| CN103983815A (zh) * | 2014-04-28 | 2014-08-13 | 昆山明创电子科技有限公司 | 一种pcb板小针测试治具 |
| WO2016043327A1 (ja) * | 2014-09-19 | 2016-03-24 | 日本発條株式会社 | プローブユニット |
| CN107003335B (zh) * | 2015-01-04 | 2020-05-22 | 金日 | 接触测试装置 |
| CN104931739B (zh) * | 2015-05-27 | 2017-12-12 | 苏州市职业大学 | 一种电路板测试接口的开合装置 |
| US10261108B2 (en) | 2016-07-12 | 2019-04-16 | International Business Machines Corporation | Low force wafer test probe with variable geometry |
| US10444260B2 (en) | 2016-07-12 | 2019-10-15 | International Business Machines Corporation | Low force wafer test probe |
| CN108427019B (zh) * | 2018-03-09 | 2020-06-09 | 梅州市展至电子科技有限公司 | 用于电路板故障检测的治具 |
| US10911841B2 (en) * | 2018-06-22 | 2021-02-02 | Kaydon Ring & Seal, Inc. | Telemetry unit for high speed shaft assemblies |
| CN109900932A (zh) * | 2019-03-06 | 2019-06-18 | 苏州世纪福智能装备股份有限公司 | 斜针式ict测试夹具及斜针式ict测试夹具中探针的布置方法 |
| CN109975692A (zh) * | 2019-04-01 | 2019-07-05 | 成都天创精密模具有限公司 | 一种基于机械手的pcb板取出方法及pcb板抓取治具 |
| CN110058148B (zh) * | 2019-05-29 | 2021-06-15 | 深圳市凯码时代科技有限公司 | 转接电路板、转接夹具架构以及相应的电路转接方法 |
| KR102193447B1 (ko) * | 2019-12-09 | 2020-12-21 | (주)티에스이 | 테스트 소켓 |
| US11619665B2 (en) * | 2020-01-07 | 2023-04-04 | International Business Machines Corporation | Electrical apparatus having tin whisker sensing and prevention |
| US11293976B1 (en) * | 2020-09-25 | 2022-04-05 | Essai, Inc. | Integrated circuit device test tooling with dual angle cavities |
| CN114019354B (zh) * | 2021-11-02 | 2025-01-07 | 环鸿电子(昆山)有限公司 | 电路板测试方法 |
| TWI831307B (zh) * | 2022-07-26 | 2024-02-01 | 思達科技股份有限公司 | 導板結構及探針陣列 |
| JP2024030660A (ja) * | 2022-08-24 | 2024-03-07 | イビデン株式会社 | 導通検査用治具とプリント配線板の製造方法 |
| KR102901238B1 (ko) * | 2022-12-16 | 2025-12-17 | 주식회사 피코프리시젼 | 테스트 장치 |
| US12174241B2 (en) | 2022-12-29 | 2024-12-24 | International Business Machines Corporation | Apparatus and method for tin whisker isolation and detection |
| CN117434314B (zh) * | 2023-09-11 | 2024-07-12 | 法特迪精密科技(苏州)有限公司 | 一种旋转探针与配套插座的适配装置及方法 |
| CN117330801B (zh) * | 2023-10-19 | 2024-02-20 | 深圳市兆兴博拓科技股份有限公司 | 电路板测试装置、调试方法及调试系统 |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4230985A (en) * | 1978-01-12 | 1980-10-28 | Fairchild Camera And Instrument Corporation | Fixturing system |
| US4321533A (en) * | 1979-04-19 | 1982-03-23 | Fairchild Camera & Instrument Corp. | Printed circuit board test fixture having interchangeable card personalizers |
| DE3143768C2 (de) * | 1981-11-04 | 1987-04-16 | Siemens AG, 1000 Berlin und 8000 München | Adapter zur Verbindung von in einer Ebene angeordneten Kontaktpunkten eines Prüflings mit den Anschlüssen einer Prüfeinrichtung |
| CH658319A5 (en) * | 1982-03-30 | 1986-10-31 | Fela E Uhlmann Ag Fuer Gedruck | Device for testing a circuit board and method for producing a device for the testing |
| FR2524649A1 (fr) * | 1982-04-02 | 1983-10-07 | Thomson Csf | Dispositif de controle de cartes de circuits imprimes |
| GB2146849B (en) | 1983-09-17 | 1987-08-05 | Marconi Instruments Ltd | Electrical test probe head assembly |
| US4535536A (en) | 1983-11-03 | 1985-08-20 | Augat Inc. | Method of assembling adaptor for automatic testing equipment |
| US4774462A (en) * | 1984-06-11 | 1988-09-27 | Black Thomas J | Automatic test system |
| US4724383A (en) | 1985-05-03 | 1988-02-09 | Testsystems, Inc. | PC board test fixture |
| US4799007A (en) * | 1985-11-01 | 1989-01-17 | Hewlett-Packard Company | Bendable pin board test fixture |
| DE3539720A1 (de) * | 1985-11-08 | 1987-05-14 | Martin Maelzer | Adapter fuer ein leiterplattenpruefgeraet |
| US4884024A (en) * | 1985-11-19 | 1989-11-28 | Teradyne, Inc. | Test pin assembly for circuit board tester |
| DE3630548A1 (de) * | 1986-09-08 | 1988-03-10 | Mania Gmbh | Vorrichtung zum elektronischen pruefen von leiterplatten mit kontaktpunkten im 1/20 zoll-raster |
| US4818933A (en) * | 1986-10-08 | 1989-04-04 | Hewlett-Packard Company | Board fixturing system |
| US4771234A (en) * | 1986-11-20 | 1988-09-13 | Hewlett-Packard Company | Vacuum actuated test fixture |
| US4935696A (en) * | 1987-04-16 | 1990-06-19 | Teradyne, Inc. | Test pin assembly for circuit board tester |
| US4963822A (en) * | 1988-06-01 | 1990-10-16 | Manfred Prokopp | Method of testing circuit boards and the like |
| WO1990006518A1 (en) * | 1988-11-28 | 1990-06-14 | Cimm, Inc. | Wireless test fixture |
| US4977370A (en) * | 1988-12-06 | 1990-12-11 | Genrad, Inc. | Apparatus and method for circuit board testing |
| US5399982A (en) * | 1989-11-13 | 1995-03-21 | Mania Gmbh & Co. | Printed circuit board testing device with foil adapter |
| US5157325A (en) * | 1991-02-15 | 1992-10-20 | Compaq Computer Corporation | Compact, wireless apparatus for electrically testing printed circuit boards |
| US5510722A (en) * | 1992-12-18 | 1996-04-23 | Tti Testron, Inc. | Test fixture for printed circuit boards |
| US5633598A (en) * | 1993-06-23 | 1997-05-27 | Everett Charles Technologies, Inc. | Translator fixture with module for expanding test points |
| US5500606A (en) * | 1993-09-16 | 1996-03-19 | Compaq Computer Corporation | Completely wireless dual-access test fixture |
| DE4335841C1 (de) * | 1993-10-20 | 1995-06-01 | Siemens Nixdorf Inf Syst | Vakuumadapter |
| US5450017A (en) * | 1993-12-03 | 1995-09-12 | Everett Charles Technologies, Inc. | Test fixture having translator for grid interface |
| US5493230A (en) * | 1994-02-25 | 1996-02-20 | Everett Charles Technologies, Inc. | Retention of test probes in translator fixtures |
| US5485096A (en) * | 1994-04-05 | 1996-01-16 | Aksu; Allen | Printed circuit board tester having a test bed with spring probes and easily replaceable switch cards |
| US5506510A (en) * | 1994-05-18 | 1996-04-09 | Genrad, Inc. | Adaptive alignment probe fixture for circuit board tester |
| SE504286C2 (sv) * | 1994-06-17 | 1996-12-23 | Reinhold Strandberg | Adapter för användning vid en apparat för testning av kretskort |
| DE19507127A1 (de) * | 1995-03-01 | 1996-09-12 | Test Plus Electronic Gmbh | Adaptersystem für Baugruppen-Platinen, zu verwenden in einer Prüfeinrichtung |
| US5663655A (en) | 1995-09-22 | 1997-09-02 | Everett Charles Technologies, Inc. | ESD protection for universal grid type test fixtures |
| US5764069A (en) * | 1995-10-30 | 1998-06-09 | International Faster Corporation | High density grid for testing circuit boards |
| US5883520A (en) * | 1996-06-14 | 1999-03-16 | Star Technology Group, Inc. | Retention of test probes in translator fixtures |
| US5818248A (en) * | 1996-07-29 | 1998-10-06 | Delaware Capital Formation, Inc | Loaded board test fixture with integral translator fixture for testing closely spaced test sites |
| US5773988A (en) * | 1996-10-29 | 1998-06-30 | Hewlett-Packard Company | Standard- and limited-access hybrid test fixture |
| US6047469A (en) * | 1997-11-12 | 2000-04-11 | Luna Family Trust | Method of connecting a unit under test in a wireless test fixture |
-
1996
- 1996-10-29 US US08/739,387 patent/US5945836A/en not_active Expired - Fee Related
-
1997
- 1997-07-29 EP EP04027687A patent/EP1512980A3/en not_active Withdrawn
- 1997-07-29 EP EP04027669A patent/EP1512978A3/en not_active Withdrawn
- 1997-07-29 EP EP97113043A patent/EP0840131B1/en not_active Expired - Lifetime
- 1997-07-29 DE DE69734866T patent/DE69734866T2/de not_active Expired - Fee Related
- 1997-07-29 EP EP04027668A patent/EP1512977A3/en not_active Withdrawn
- 1997-07-29 EP EP04027686A patent/EP1512979A3/en not_active Withdrawn
- 1997-10-29 JP JP9296507A patent/JPH10186005A/ja active Pending
-
1999
- 1999-07-07 US US09/348,523 patent/US6225817B1/en not_active Expired - Fee Related
-
2000
- 2000-06-02 US US09/586,928 patent/US6469531B1/en not_active Expired - Fee Related
- 2000-06-02 US US09/586,947 patent/US6414502B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE69734866D1 (de) | 2006-01-19 |
| EP0840131B1 (en) | 2005-12-14 |
| EP0840131A2 (en) | 1998-05-06 |
| EP1512980A2 (en) | 2005-03-09 |
| US6469531B1 (en) | 2002-10-22 |
| EP1512977A2 (en) | 2005-03-09 |
| EP0840131A3 (en) | 1999-06-09 |
| JPH10186005A (ja) | 1998-07-14 |
| US6225817B1 (en) | 2001-05-01 |
| EP1512979A2 (en) | 2005-03-09 |
| EP1512979A3 (en) | 2005-06-15 |
| US5945836A (en) | 1999-08-31 |
| EP1512977A3 (en) | 2005-06-15 |
| US6414502B1 (en) | 2002-07-02 |
| EP1512978A2 (en) | 2005-03-09 |
| EP1512980A3 (en) | 2005-06-15 |
| EP1512978A3 (en) | 2005-06-15 |
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