DE69710089T2 - PRINTABLE COMPOSITIONS AND THEIR APPLICATION ON DIELECTRIC SURFACES FOR THE PRODUCTION OF PRINTED CIRCUITS - Google Patents

PRINTABLE COMPOSITIONS AND THEIR APPLICATION ON DIELECTRIC SURFACES FOR THE PRODUCTION OF PRINTED CIRCUITS

Info

Publication number
DE69710089T2
DE69710089T2 DE1997610089 DE69710089T DE69710089T2 DE 69710089 T2 DE69710089 T2 DE 69710089T2 DE 1997610089 DE1997610089 DE 1997610089 DE 69710089 T DE69710089 T DE 69710089T DE 69710089 T2 DE69710089 T2 DE 69710089T2
Authority
DE
Germany
Prior art keywords
dielectric
production
application
printed circuits
printable compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1997610089
Other languages
German (de)
Other versions
DE69710089D1 (en
Inventor
Hugh P Craig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Hugh P Craig
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US2404696P priority Critical
Application filed by Hugh P Craig filed Critical Hugh P Craig
Priority to PCT/IB1997/001033 priority patent/WO1998008362A1/en
Publication of DE69710089D1 publication Critical patent/DE69710089D1/en
Application granted granted Critical
Publication of DE69710089T2 publication Critical patent/DE69710089T2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/22Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0263Details about a collection of particles
    • H05K2201/0272Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0315Oxidising metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/0425Solder powder or solder coated metal powder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0522Using an adhesive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/121Metallo-organic compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
DE1997610089 1996-08-16 1997-08-15 PRINTABLE COMPOSITIONS AND THEIR APPLICATION ON DIELECTRIC SURFACES FOR THE PRODUCTION OF PRINTED CIRCUITS Expired - Lifetime DE69710089T2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US2404696P true 1996-08-16 1996-08-16
PCT/IB1997/001033 WO1998008362A1 (en) 1996-08-16 1997-08-15 Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards

Publications (2)

Publication Number Publication Date
DE69710089D1 DE69710089D1 (en) 2002-03-14
DE69710089T2 true DE69710089T2 (en) 2002-08-22

Family

ID=21818587

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1997610089 Expired - Lifetime DE69710089T2 (en) 1996-08-16 1997-08-15 PRINTABLE COMPOSITIONS AND THEIR APPLICATION ON DIELECTRIC SURFACES FOR THE PRODUCTION OF PRINTED CIRCUITS

Country Status (6)

Country Link
EP (1) EP0933010B1 (en)
JP (1) JP4368946B2 (en)
AU (1) AU3781797A (en)
DE (1) DE69710089T2 (en)
MY (1) MY130828A (en)
WO (1) WO1998008362A1 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6971163B1 (en) * 1998-04-22 2005-12-06 Dow Corning Corporation Adhesive and encapsulating material with fluxing properties
GB9808587D0 (en) * 1998-04-22 1998-06-24 Craig Hugh P Adhesive and encapsulating material with fluxing properties
TWI248384B (en) 2000-06-12 2006-02-01 Hitachi Ltd Electronic device
CN100578778C (en) * 2000-12-21 2010-01-06 株式会社日立制作所 Electronic device
US6802446B2 (en) * 2002-02-01 2004-10-12 Delphi Technologies, Inc. Conductive adhesive material with metallurgically-bonded conductive particles
JP4142312B2 (en) * 2002-02-28 2008-09-03 ハリマ化成株式会社 Precipitation solder composition and solder deposition method
US6791839B2 (en) * 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
AU2003289277A1 (en) * 2002-12-09 2004-06-30 Matsushita Electric Industrial Co., Ltd. Electronic part with external electrode
WO2004090942A2 (en) * 2003-04-01 2004-10-21 Aguila Technologies, Inc. Thermally conductive adhesive composition and process for device attachment
KR100907204B1 (en) * 2004-08-31 2009-07-10 센주긴조쿠고교 가부시키가이샤 Flux for soldering
US20060163744A1 (en) * 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
EP1850352A4 (en) * 2005-01-25 2012-11-28 Fujikura Kasei Kk Conductive paste
US7326369B2 (en) * 2005-03-07 2008-02-05 National Starch And Chemical Investment Holding Corporation Low stress conductive adhesive
WO2006130980A1 (en) * 2005-06-09 2006-12-14 National Starch And Chemical Company Aqueous printable electrical conductors
EP1965397B1 (en) * 2005-12-22 2019-03-20 Namics Corporation Thermosetting conductive paste and multilayer ceramic component having external electrode which is formed by using such thermosetting conductive paste
US20080023665A1 (en) * 2006-07-25 2008-01-31 Weiser Martin W Thermal interconnect and interface materials, methods of production and uses thereof
CN101506906A (en) 2006-08-28 2009-08-12 株式会社村田制作所 Conductive bonding material and electronic device
DE102007053277A1 (en) * 2007-11-08 2009-05-14 Robert Bosch Gmbh Method for increasing viscosity of a metal melt in a composition, comprises adding a powder from a material to the metal melt, where the powder has a melting point for superficially alloying with components of the metal melt
US8063774B2 (en) * 2008-06-05 2011-11-22 Deere & Company Non-toxic, biodegradable sensor nodes for use with a wireless network
JP2010219492A (en) * 2009-02-17 2010-09-30 Dainippon Printing Co Ltd Electronic module, and method of manufacturing electronic module
KR101225497B1 (en) * 2009-11-05 2013-01-23 (주)덕산테코피아 Conductive paste and the manufacturing method thereof and the electric device comprising thereof
JP4713682B1 (en) * 2010-02-25 2011-06-29 パナソニック株式会社 Multilayer wiring board and method for manufacturing multilayer wiring board
EP2557571B1 (en) * 2011-08-08 2014-07-02 Tyco Electronics Corporation Electrically conductive metal/plastic hybrid comprising a polymer material, a first metal and metal particles of a second metal embedded in the first metal and method of producing such
WO2013090570A1 (en) * 2011-12-13 2013-06-20 Dow Corning Corporation Composition and conductor formed therefrom
JP6486369B2 (en) * 2013-09-05 2019-03-20 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング Sintered metal film composition
JP2018505060A (en) 2015-02-11 2018-02-22 アルファ・アセンブリー・ソリューションズ・インコーポレイテッドAlpha Assembly Solutions Inc. Electrical connection tape
EP3284326A4 (en) 2015-04-13 2019-04-24 Printcb Ltd. Printing of multi-layer circuits
US10982109B2 (en) * 2018-03-15 2021-04-20 Printcb Ltd. Two-component printable conductive composition

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3915729A (en) * 1974-04-09 1975-10-28 Du Pont High temperature solder pastes
JPS53133799A (en) * 1977-04-27 1978-11-21 Idearisaachi Yuugen Electroconductive paint
JPS55160072A (en) * 1979-05-31 1980-12-12 Matsushita Electric Ind Co Ltd Electrically conductive adhesive
US4663079A (en) * 1984-07-31 1987-05-05 Mitsubishi Petrochemical Co., Ltd. Copper-type conductive coating composition
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
WO1995013901A1 (en) * 1993-11-19 1995-05-26 Cts Corporation Metallurgically bonded polymer vias
FR2726001B1 (en) * 1994-10-19 1996-11-29 Solaic Sa Conductive ink comprising metallic grains having different melting points
WO1996022670A1 (en) * 1995-01-18 1996-07-25 Coates Brothers Plc Production of electrical circuit boards
DE19511553C2 (en) * 1995-03-29 1997-02-20 Litton Precision Prod Int Method for producing electrically conductive structures, an electrically conductive structure obtained according to the method and combination for producing electrically conductive structures

Also Published As

Publication number Publication date
JP4368946B2 (en) 2009-11-18
AU3781797A (en) 1998-03-06
WO1998008362A1 (en) 1998-02-26
DE69710089D1 (en) 2002-03-14
MY130828A (en) 2007-07-31
JP2000517092A (en) 2000-12-19
EP0933010B1 (en) 2002-01-23
EP0933010A1 (en) 1999-08-04

Similar Documents

Publication Publication Date Title
DE69710089T2 (en) PRINTABLE COMPOSITIONS AND THEIR APPLICATION ON DIELECTRIC SURFACES FOR THE PRODUCTION OF PRINTED CIRCUITS
DE69510328T2 (en) Resin composition and its use for the production of multilayer printed circuit boards
DE69535768D1 (en) MULTILAYER CONDUCTOR PLATE AND METHOD FOR THE PRODUCTION THEREOF
DE69921714D1 (en) Photosensitive resin composition and photoresist ink for the production of printed circuit boards
DE69636010D1 (en) PRINTED CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF
DE69511434T2 (en) PRODUCTION OF PRINTED CIRCUITS
DE69934050D1 (en) Printed circuit board and method of making the same
DE69839882D1 (en) MULTILAYER PRINTED PCB AND METHOD FOR THE PRODUCTION THEREOF
DE69935009D1 (en) PRINTED PCB AND THEIR MANUFACTURING PROCESS
DE69331511T2 (en) Double-sided printed circuit board, multilayer printed circuit board and manufacturing method
DE69931212D1 (en) Printed circuit board and method for its production
DE69939221D1 (en) MULTILAYER CONDUCTOR PLATE AND METHOD FOR THE PRODUCTION THEREOF
DE69926864D1 (en) COLOR QUANTIZATION AND SIMILARITY FOR THE RECIPROCAL IMAGE BASED ON HIM
DE69529018D1 (en) Porous dielectric on semiconductor components and process for their production
DE69431723T2 (en) CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF
DE69938182D1 (en) MULTILAYER CONDUCTOR PLATE AND METHOD FOR THE PRODUCTION THEREOF
BR9507442A (en) Aqueous coating composition and process for forming an aqueous coating composition
DE69500584T2 (en) Flexible printed circuit board and its manufacturing process
DE69405074D1 (en) LABELS AND THEIR PRODUCTION
DE69707912D1 (en) LABELS AND THEIR PRODUCTION
DE69401195D1 (en) Laminar board for the manufacture of printed circuit boards, printed circuit board made therefrom and process for their manufacture
DE69929912D1 (en) THIN LAMINATE PLATES FOR CAPACITIVE PRINTED PCBS AND METHOD FOR THE PRODUCTION THEREOF
EP0735809A3 (en) Photodefinable dielectric composition useful in the manufacture of printed circuits
DE69737189D1 (en) ELECTRONIC DEVICES AND THEIR MANUFACTURE
DE69935566D1 (en) Printed circuit board and method of making the same

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: DOW CORNING CORP., MIDLAND, MICH., US

8381 Inventor (new situation)

Inventor name: CRAIG, HUGH P., USK, GB