DE69607569T3 - USE OF A PHOTO SENSITIVE PASTE, METHOD FOR PRODUCING A PLASMA DISPLAY PANEL, AND PLASMA DISPLAY PANEL WHICH CAN BE PRODUCED BY THIS METHOD - Google Patents

Description

technical area

The The present invention relates to the use of a photosensitive Paste, a plasma display made from it and a method for their manufacture.

The photosensitive paste according to the present Invention is used for pattern formation for various displays, including Plasma displays and matrix addressed plasma liquid crystal displays (LCDs) as well as circuit materials. Such a plasma display can Wholesale TV sets and Computer displays are used.

State of technology

in the Range of displays and circuit material is in the last one Time the need for techniques for the formation of high-precision patterns with inorganic materials has risen sharply.

There in the field of advertising ever smaller products with high resolution developed has been the need for advanced techniques for precise pattern formation got very high. For the manufacture of a separating fin, which is the pixels on the plasma display panel separates, it is necessary, for example, to develop a material that for pattern formation with an inorganic material, for example glass, serves with high accuracy and high aspect ratio.

On circuit materials are useful on the other hand Techniques for the precise Machining of ceramic substrates required on which ICs too are to be assembled. Screen printing is currently being used for pattern formation and stamping, with the development of ever smaller circuit devices but are more advanced techniques for creating high-precision patterns required.

To The state of the art is the pattern formation with inorganic material frequently carried out by screen printing using a paste that consists of inorganic particles and organic binder, followed by burning. However, screen printing has drawbacks in training more precise Template. Another disadvantage is that training of a pattern with a high aspect ratio many process steps required because multilayer printing is necessary.

Around to solve this problem, have US-A-4,885,963, US-A-5,209,688 and JP-A-05-342992 Photolithography methods proposed using a photosensitive Paste is used. Because the photosensitive paste low sensitivity and resolution however, it is impossible a high resolution High aspect ratio rib to manufacture, and therefore is a lengthy process that consists of consists of several steps (coating, exposure, developing, etc.), required to make a pattern on a separating rib up to a high one Form thickness of, for example, 80 µm or more.

The US-A-5,209,688 also proposed a method in which transfer paper with a photosensitive Paste is coated, followed by transfer film transfer on a glass substrate, and JP-A-03-57138 proposes a method in which Grooves on a layer of photoresist with a dielectric paste filled to form a separation rib. Furthermore, US-A-5,116,271 suggests the use of photosensitive organic film for formation a rib. However, these methods have disadvantages resulting from the use of transfer film, photoresist or organic Film reveal the additional Manufacturing processes require. It should also be noted that no high-resolution separating rib with high aspect ratio have been obtained.

Furthermore, it sometimes requires the production of plasma displays that in addition to Separating rib pattern of the insulator layer or dielectric layer be trained, leading to similar Problems such as those with rib machining.

Summary of the invention

The object of the present invention is to provide the use of a photosensitive paste which allows patterning with high precision and high aspect ratio, which is made possible by regulating the refractive index of the organic and inorganic components in the photosensitive paste in order to control the reflection and scattering the interface between the organic and anor reduce ganic components. Another object of the invention is to provide a high-resolution plasma display and a method for its production.

The objects of the invention are achieved by the use of a photosensitive paste which comprises, as base components, inorganic particles and an organic component which contains a photosensitive compound, in which the average refractive index N1 of the inorganic particles and the average refractive index N2 of the photosensitive organic component of the following equation correspond: -0.1 ≤ N1 - N2 ≤ 0.1

The Objects of the invention are also achieved through the use of a photosensitive Paste achieved as the basic components of inorganic particles and comprises an organic component which is a photosensitive compound contains where the average refractive index of the inorganic particles in Range is 1.5 to 1.7.

Furthermore, the objectives of the invention are also achieved by a plasma display as well achieved a process for their preparation, wherein the separating rib is made by using a glass substrate with such a paste is coated, followed by exposure, development and burning.

Best kind the implementation the invention

The The present invention provides the use of a photosensitive Paste ready which contains inorganic particles and an organic component, which contains a photosensitive compound, and an inorganic one during sintering Pattern forms after using photolithography with the photosensitive organic component has been patterned.

The The proportion of the inorganic particles in the paste is preferably in the range from 50 to 95% by weight, more preferably 70 to 95% by weight, to reduce the shrinkage in the firing process, to reduce the Burning to minimize deformation.

The Inventors of the present subject matter have detailed Investigations carried out and found that a pattern with a high aspect ratio is easy can be made by the difference between the mean Refractive index of the organic component and the average refractive index of the inorganic particles to 0.1 or less, more preferred 0.07 or less.

Furthermore, a pattern with a high aspect ratio can be precisely made by allowing the average refractive index N1 of the inorganic particles in the photosensitive paste and the average refractive index N2 of the photosensitive organic component to satisfy the following equation: -0.05 ≤ N1 - N2 ≤ 0.1 more preferred -0.01 ≤ N1 - N2 ≤ 0.07.

Furthermore, since the refractive index of the organic component may increase during polymerization, a pattern with a higher aspect ratio is generated if the following equation applies: 0 ≤ N1 - N2 ≤ 0.07 ,

A pattern with a higher aspect ratio can be produced if the refractive index N3 of the organic component polymerized by irradiation with light and the refractive index N1 of the inorganic particles correspond to the following equation: -0.03 ≤ N1 - N3 ≤ 0.03.

As inorganic particles can be any conventional inorganic material be used. Glass, ceramic materials (aluminum oxide, Cordylite etc.) and metals (gold, platinum, silver, copper, nickel, Palladium, tungsten, ruthenium oxide and alloys thereof). Glass- and ceramic materials, the basic component of which is silicon oxide, containing a boron oxide or an aluminum oxide are particularly preferred. Since these are insulators, they can be used effectively to produce patterned insulation materials, including separation ribs for plasma displays and matrix addressed plasma LCDs.

A suitable value is selected for the diameter of the inorganic particles in view of the shape of the pattern to be formed. For effective pattern formation, however, it is preferable to use inorganic particles in a proportion of 50% by weight with a particle diameter of 0.1 to 10 μm - 10% by weight with a particle diameter of 0.4 to 2 μm and 90% by weight. -% with a particle diameter of 4 to 10 μm - to be used, which have a specific surface area of 0.2 to 3 m ² / g.

The use of spherical organic particles enables patterning with a high aspect ratio. Specifically, the sphericity coefficient is preferably 80% or more. It is more preferable that the average particle diameter, the specific surface area and the sphericity coefficient are 1.5 to 4 μm, 0.5 to 1.5 m ² / g and 90% or more, respectively.

The Sphärizitätskoeffizient is defined as the proportion of those particles that pass under a microscope spherical or elliptical appear. This means, They are round or elliptical under an optical microscope Seen objects.

On Pattern with a more precise Shape can be obtained by crushing glass with a permeability for light with a wavelength glass particles obtained from 436 nm of 50% or more (3 mm thickness) be used.

Around a space plate for to generate a plasma display or a matrix-addressed plasma LCD preferably glass particles with a thermal softening temperature (Ts) from 350 to 600 ° C used in an amount of up to 60% by weight or more because of a pattern with a low thermal softening temperature on a glass substrate must be trained.

In order to prevent the glass substrate from being discarded during firing, the glass particles used preferably have a coefficient of linear thermal expansion of 50-90 × 10 ^-7 , more preferably 60-90 × 10 ^-7 .

What Concerning the composition of the glass particles, the content lies of silicon oxide, preferably in the range from 3 to 60% by weight. If it is less than 3% by weight, the density, strength and stability of the glass layer are impaired, and the coefficient of thermal expansion lies outside of the preferred range, which may be leads to poor contact with the glass substrate. Furthermore introduces Content of 60% by weight or less at a low softening temperature, which enables sintering on a glass substrate.

If it is present in an amount of 5 to 50% by weight, boron oxide cause some electrical, mechanical and thermal properties, such as B. electrical insulation, strength, coefficient of thermal expansion and Density of the insulation layer can be improved. The stability of the glass is impaired when the boron oxide content exceeds 50% by weight.

A Glass paste with thermal properties that are suitable for pattern formation on a glass substrate, can be made using glass particles are produced which contain at least one of bismuth oxide, lead oxide, lithium oxide, Contain sodium oxide or potassium oxide in an amount of 5 to 50 wt .-%. If the content exceeds 50% by weight, becomes the thermal resistance of the glass, making sintering on the glass substrate difficult. In particular is the use of glass that contains bismuth oxide in an amount of 5 contains up to 50% by weight, advantageous because the pot life of the paste is extended.

Such a glass containing bismuth oxide preferably contains 60% by weight or more of an oxide mixture with the following composition, based on the oxide content:
Bismuth oxide: 5 to 50% by weight
Silicon oxide: 3 to 60% by weight
Boron oxide: 5 to 50% by weight

Glass material, that usually used as insulation material has a refractive index in the range of 1.5 to 1.9. If the average refractive index of the organic component strongly from the average refractive index of the distinguishes inorganic particles, occurs at the interface between the inorganic particles and the photosensitive organic Component strong reflection and scattering, causing failure making a high resolution Pattern leads. Because a typical organic compound has a refractive index of 1.45 to 1.7 can the inorganic particles and the organic component on top of each other be tuned for refractive index when the inorganic particles have a refractive index of 1.5 to 1.7. Should be more preferred The latter range from 1.55 to 1.65 to the organic Being able to select components from a wide selection.

The Use of glass particles, the oxides of alkali metals, such as. B. lithium oxide, sodium oxide and potassium oxide, in a total amount contain from 3 to 20 wt .-%, not only facilitates the regulation of thermal softening temperature and the coefficient of thermal expansion, but also reduces the average refractive index of the glass, causing the difference in refractive index between the glass particles and the organic component can be easily reduced. Around the stability the paste should increase the content of the alkali metal oxide is preferably 20% by weight or less, more preferably 15% by weight or less.

In particular of the various alkali metals, the use of lithium oxide the stability increase the paste to a relatively high level, and potassium oxide even if it can be added in small amounts to regulate the refractive index serve. Therefore, among the alkali metals, lithium oxide and potassium oxide work very effectively.

As Can result inorganic particles are provided in a simple manner, which have a thermal softening temperature, that for sintering on a glass substrate, and a medium refractive index from 1.5 to 1.7, which is a decrease in the difference in Refractive index between the inorganic particles and the organic Component enables.

Glass, containing lead oxide or bismuth oxide is preferred because of this Oxides the thermal softening temperature and water resistance of the glass can. Glass particles containing lead oxide and / or bismuth in an amount of 10 % Or more can contain however often have a refractive index of more than 1.6. Therefore, the combined use of alkali metal oxides, such as. B. lithium oxide, Sodium oxide and potassium oxide, with lead oxide and / or bismuth oxide Regulation of the thermal softening temperature, the coefficient of thermal expansion, the water resistance and the refractive index.

The Hardness and Machinability of glass particles can be improved by adding alumina, Barium oxide, calcium oxide, magnesium oxide, titanium oxide, zinc oxide and / or Zirconium oxide can be added. In particular, aluminum oxide, barium oxide and zinc oxide effective. To a required thermal softening temperature, a required coefficient of thermal expansion and maintaining the required refractive index is their respective individual content preferably 40% by weight or less, more preferred 30% by weight or less, their total content being 50% by weight or less is.

The Shrink that while of burning can occur can be regulated by using the paste according to the present Invention glass particles or ceramic particles with a thermal Softening temperature of 600 to 900 ° C in an amount of 40% by weight or less can be added. To pattern formation with high precision guarantee, should be the difference in refractive index between those used Particles preferably 0.1 or less, more preferably 0.05 or be less.

For circuit materials, especially for Materials for Multilayer substrates, can Both ceramic and glass can be used as substrate material. Therefore, the thermal softening temperature is not essential 600 ° C or be less, so that a substrate with high strength can be produced can by using material with an alumina content of 25 to 75 % By weight is used.

The Becke's method can be used to determine the refractive index of to measure inorganic particles required for the present invention be used. To ensure high accuracy, the measurement should at one wavelength carried out that is equal to that of the light used for the exposure which is done after coating with the paste. In particular the measurement is preferably carried out using light with a wavelength performed in the range of 350 to 650 nm. Furthermore, it is preferred that the refractive index with i-rays (365 nm) or g-rays (436 nm) is measured.

On colored pattern can be obtained after burning by different Metal oxides are added. For example, a black one Patterns are created by making the photosensitive paste black Metal oxides are added in an amount of 1 to 10 wt .-%.

at the selection of black metal oxides for use in manufacturing such a black pattern should be at least one, preferably three or more, from the following group of oxides can be used: Cr, Fe, Co, Mn and Cu. In particular, a very black pattern can be obtained by adding Fe and Mn in an amount of up to to 0.5 wt .-% or more, are added.

Furthermore, can Patterns are created in various colors other than black, by using a paste that contains inorganic pigments, the coloring in red, blue, green etc. can cause. Such colored patterns can effectively used on products such as a color filter for a plasma display become.

particles the for The invention used can be a mixture of several records of particles with different compositions. In particular can do that during the shrinkage caused by burning by using several Sets of Glass particles and ceramic particles with different thermal Softening temperatures can be regulated.

University Pattern formation with large precision to ensure, is however, the difference in refractive index between the multiple sets of inorganic particles with different compositions, used in this case, preferably 0.1 or less, more preferably 0.05 or less.

With inorganic component, as described herein used is meant the organic component of the paste that contains light-sensitive organic material (i.e. the remainder that after the Removing the inorganic components from the paste is obtained).

Around to ensure high sensitivity to light makes the photosensitive component in the photosensitive Paste according to the present Invention is used, preferably 10 wt .-% or more, and more preferably 30% by weight or more of the organic component.

The organic component should be at least one of the following photosensitive Materials include: photosensitive monomers, photosensitive Oligomeric and photosensitive polymers. It can also be used as needed Additives such as binders, photopolymerization initiators, UV absorbers, Sensitizers, sensitization aids, polymerization inhibitors, Plasticizers, viscosity improvers, organic Solvent, Antioxidants, dispersants, organic or inorganic suspending agents and Leveling agents.

• (A) funktionelle Monomere, Oligomere oder Polymere, die eine oder mehrere ungesättigte Gruppe(n) pro Molekül aufweisen können,
• (B) eine lichtempfindliche Verbindung, wie z. B. eine aromatische Diazoverbindung, eine aromatische Azidverbindung oder eine organische Halogenverbindung, oder
• (C) ein sogenanntes Diazoharz, wie z. B. ein Kondensationsprodukt aus diazotiertem Amin und Formaldehyd. Ein photosolubilisierendes lichtempfindliches Material kann enthalten:
• (D) einen Komplex aus einem anorganischen Salz einer Diazoverbindung und einer organischen Säure, eine Chinondiazoverbindung usw., oder
• (E) ein Produkt einer Chinondiazoverbindung, die mit einem Polymerbindemittel gebunden ist, wie z. B. das Naphthochinon-1,2-diazid-5-sulfonat von Phenol oder eines Novolakharzes.

There are photoinsolubilizing and photosolubilizing photosensitive materials. A photoinsulubilizing photosensitive material can contain:

• (A) functional monomers, oligomers or polymers which can have one or more unsaturated groups per molecule,
• (B) a photosensitive compound such as e.g. B. an aromatic diazo compound, an aromatic azide compound or an organic halogen compound, or
• (C) a so-called diazo resin such as e.g. B. a condensation product of diazotized amine and formaldehyde. A photosolubilizing photosensitive material can contain:
• (D) a complex of an inorganic salt of a diazo compound and an organic acid, a quinone diazo compound, etc., or
• (E) a product of a quinone diazo compound bound with a polymer binder, such as e.g. B. the naphthoquinone-1,2-diazide-5-sulfonate of phenol or a novolak resin.

For the present Invention can be any of the photosensitive components listed above be used. In particular, those listed under (A) are as Component of a light-sensitive paste is preferred because it is useful in combination can be used with inorganic particles.

The useful photosensitive monomers include compounds having an unsaturated carbon-carbon bond, such as. B. methyl acrylate, ethyl acrylate, n-propyl acrylate, isopropyl acrylate, n-butyl acrylate, sec-butyl acrylate, isobutyl acrylate, tert-butyl acrylate, n-pentyl acrylate, allyl acrylate, benzyl acrylate, butoxyethyl acrylate, buloxytriethylene acrylate, cyclyl acrylate, cyclyl acrylate, cyclyl acrylate, 2-ethylhexyl acrylate, Glycerinacrylat, octafluoropentyl acrylate, phenoxyethyl acrylate, stearyl acrylate, trifluoroethyl acrylate, allylated Cyclohexyldiacrylat, 1,4-butanediol diacrylate, 1,3-butylene glycol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, dipentaerythritol hexacrylate, Dipentaerythritmonohydroxypentacrylat, ditrimethylolpropane tetraacrylate, glycerol diacrylate, methoxylated Cyclohexyldiacrylat, neopentyl glycol diacrylate, propylene glycol diacrylate, polypropylene glycol diacrylate, Propylene glycol diacrylate, polypropylene glycol diacrylate, triglycerol diacrylate, trimethylolpropane triacrylate, acrylamide, aminoethyl acrylate, phenyl acrylate, phenoxyethyl acrylate, benzil acrylate, 1-naphthyl acrylate, 2-naphthylacrylate, bisiaphenyl a-bis-bisphenol-a-bis Propylene oxide, thiophenol acrylate and benzil mercaptan acrylate; Monomers formed by replacing 1-5 of the hydrogen atoms in the aromatic ring of the above compounds with chlorine or bromine atoms; Styrene, p-methylstyrene, o-methylstyrene, m-methylstyrene, chlorinated styrene, brominated styrene, α-methylstyrene, chlorinated α-methylstyrene, brominated α-methylstyrene, chloromethylstyrene, hydroxymethylstyrene, carboxymethylstyrene, vinylnaphthalene, vinylanthracene and vinylcarbazole; the above-mentioned acrylates in which one or all of the acrylate part (s) is / are replaced by methacrylate part (s); γ-methacryloxypropyltrimethoxysilane and 1-vinyl-2-pyrrolidone. For the purposes of the present invention, these compounds can be used alone or in combination.

Additionally can be an unsaturated Acid, such as B. an unsaturated Carboxylic acid, be added to the development performance after irradiation with To improve light. Such unsaturated carboxylic acids include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, vinyl acetic acid and Anhydrides of these acids.

suitable Binders are polyvinyl alcohol, polyvinyl butyral, methacrylate polymers, Acrylate polymers, acrylate-methacrylate copolymers, α-methylstyrene polymers and butyl methacrylate resins.

Furthermore, can also oligomers and polymers can be used, which by polymerization of at least one of the compounds with a carbon-carbon bond were manufactured.

at their polymerization these monomers with other photosensitive monomers to those Be copolymerized in such a way that the content of the former 10% by weight or more, more preferably 35% by weight or more.

The Development performance after exposure to light can be improved be by an unsaturated Acid, such as B. an unsaturated Carboxylic acid, is used as a monomer for copolymerization. helpful unsaturated carboxylic acids are acrylic acid, methacrylic acid, itaconic, crotonic, maleic acid, fumaric acid, vinyl acetic acid and anhydrides of these acids.

The resulting polymers or oligomers with acid groups, such as. B. carboxylic acid groups, in their side chains preferably have an acid number in the range from 50 to 180, more preferably 70 to 140. The developable area is tight when the acid number is less than 50. On the other hand, if the acid number exceeds 180, the unexposed sections have poor solubility in the developing solution, but the use of a developing solution with an increased concentration causes the exposed portions to be removed, making it difficult will, high resolution pattern to create.

suitable Photosensitive polymers or photosensitive oligomers can be produced by adding to the side chains or the molecular ends of the above polymers or oligomeric photosensitive groups can be added.

Photosensitive Groups with an ethylenically unsaturated group are preferred. Such ethylenically unsaturated Groups are vinyl, allyl, acrylic and methacrylic.

The Such side chains can be added to oligomers or polymers done by allowing that a glycidyl or isocyanate-containing ethylenically unsaturated compound Acrylic acid chloride, methacrylic acid chloride or allyl chloride addition reaction with the mercapto group, amino group, Hydroxyl group or carboxyl group enters into the polymers.

Such ethylenically unsaturated Compounds with glycidyl groups are glycidyl acrylate, glycidyl methacrylate, Allyl glycidyl ether, glycidyl ethyl acrylate, croton glycidyl ether and Isocrotonglycidylether.

suitable ethylenically unsaturated Compounds with isocyanate groups are (meth) acryloyl isocyanate and (meth) acryloyl ethyl isocyanate.

A such glycidyl or isocyanate-containing ethylenically unsaturated compound, Acrylic chloride, methacrylic chloride and allyl chloride are preferred in an amount of 0.05 to 1 equivalent added to the mercapto, amino, hydroxy or carboxy group in the polymer.

suitable Photopolymerization initiators are benzophenone, o-methylbenzoyl benzoate, 4,4-bis (dimethylamine) benzophenone, 4,4-bis (diethylamino) benzophenone, 4,4-dichlorobenzophenone, 4-benzoyl-4-methyldiphenyl ketone, dibenzil ketone, Fluorenone, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenyl-2-phenylacetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, diethylthioxanthone, benzil, benzil dimethyl ketanol, Benzil methoxyethyl acetal, benzoin, benzoin methyl ether, benzoin butyl ether, Anthraquinone, 2-t-butylanthraquinone, 2-amylanthraquinone, β-chloroanthraquinone, Anthrone, benzanthrone, dibenzosuberon, methylene anthrone, 4-azidobenzalacetophenone, 2,6-bis (p-azidobenzylidene) cyclohexanone, 2,6-bis (p-azidobenzylidene) -4-methylcyclohexanone, 2-phenyl-1,2-butanedione-2- (o-ethoxycarbonyl) oxime, 1,3-diphenylpropanetrione-2- (o-ethoxycarbonyl) oxime, 1-phenyl-3-ethoxypropanetrione-2- (o-benzoyl) oxime, Michler's ketone, 2-methyl- [4- (methylthio) phenyl] -2-morpholino-1-hropanone, Naphthalene sulfonyl chloride, quinoline sulfonyl chloride, N-phenylthioacridone, 4,4-azobisisobutyronitrile, Diphenyl disulfide, benzothiazole disulfide, triphenylphosphine, camphorquinone, Carbon tetrabromide, tribromophenyl sulfone and benzoin peroxide; such as Combinations of photo-reducing pigments, such as. B. Eosin and methylene blue, with reducing agents such as. B. ascorbic acid and Triethanolamine. For the purposes of the invention can one or more of them can be used in combination. A photopolymerization initiator is preferably in an amount of 0.05 to 10% by weight, more preferred 0.1 to 5 wt .-%, the photosensitive component added. The Photosensitivity may become insufficient if the added one The amount of the polymerization initiator is too small, while the Persistence rate of the exposed sections may be too small if the amount of the polymerization initiator added is too large.

The Adding a UV absorber can be effective. A high one Aspect ratio high definition and high resolution can be achieved by using a compound with high UV absorption power is used. The preferred UV absorbers are organic Dyes and organic pigments, especially organic red pigments, the UV rays in the wavelength range absorb from 350 to 450 nm. Specifically, they include azo dyes, Aminoketone dyes, xanthene dyes, quinoline dyes, aminoketone dyes, Anthraquinone dyes, genzophenone dyes, diphenylcyanoacrylate dyes, Triazine dyes and p-aminobenzoic acid dyes. Organic dyes are preferred because they, even when added as a light absorber will not remain in the fired insulation film, causing the impairment the performance of the insulation film is minimized. Of the dyes listed above azo dyes and benzophenone dyes are particularly preferred. The content of such an organic dye is preferably 0.05 to 5 parts by weight. The effect of the UV absorber is not sufficient if the content is less than 0.05% by weight while the Fired insulation film performance is insufficient if the salary over 5 wt .-% is. It is more preferred that the content be in the range from 0.05 to 1% by weight. A typical addition procedure a UV absorber comprising an organic dye, is the following: the organic dye is dissolved in the organic solvent to make a solution to form, either followed by kneading into a paste, or by Add inorganic particles to the organic solvent and dry them. The latter process turns so-called encapsulated particles made in which the surface of any organic Particle is coated with the organic compound.

at some embodiments of the invention Metals, such as Pb, Fe, Cd, Mn, Co and Mg, or their oxides, which in the inorganic particles are included with the photosensitive Component of the paste react, causing rapid gelation of the paste is caused, making it impossible will use them for coating. To such a reaction To avoid it is preferred that a stabilizer is added to inhibit gelation. Preferred stabilizers are triazole compounds. In particular, preferred include triazole compounds Benzotriazole derivatives, of which benzotriazole is said to be effective can be. A typical surface treatment of glass particles with benzotriazole, as in the present Invention carried out is done as follows: the required amount of benzotriazole, based on the Amount of inorganic particles, is in an organic solvent, such as B. methyl acetate, ethyl acetate, ethyl alcohol or methyl alcohol, solved, and the particles are for Immersed in the solution for 1 to 24 h, for adequate To ensure immersion followed by air drying preferably at a temperature of 20 to 30 ° C, to the solvent evaporate to produce triazole treated particles. The amount of stabilizer used (stabilizer / inorganic Particles) should preferably be 0.05 to 5% by weight.

On Sensitizer is added to improve sensitivity. Particularly belong to these sensitizers 2,4-diethylthioxanthone, isopropylthioxanthone, 2,3-bis (4-diethylaminobenzal) cyclopentanone, 2,6-bis (4-dimethylaminobenzal) cyclohexanone, 2,6-bis (4-dimethylaminobenzal) -4-methylcyclohexanone, Michler's ketone, 4,4-bis (dimethlamino) benzophenone, 4,4-bis (dimethylamino) chalcon, 4,4-bis (diethylamino) chalcon, p-dimethylaminocinnamylidenindanone, p-dimethylaminobenzylidenindanone, 2- (p-dimethylaminophenylvinylene) isonaphthothiazole, 1,3-bis (4-dimethylaminobenzal) -acetone, 1,3-carbonyl-bis- (4-diethylaminobenzal) acetone, 3,3-carbonyl-bis- (7-diethylaminocoumarin), N-phenyl-N-ethylethanolamine, N-phenylethanolamine, N-tolyldiethanolamine, N-phenylethanolamine, dimethylaminoisoamylbenzoate, diethylaminoisoamylbenzoate, 3-phenyl-5-benzoylthiotetrazole and 1-phenyl-5-ethoxycarbonylthiotetrazole. For the Purposes of the invention can one or more of them can be used. Some sensitizers can also act as a photopolymerization initiator. If a sensitizer a photosensitive paste is added, as for the invention is used, its content should preferably 0.05 to 10 wt .-%, more preferably 0.1 to 10% by weight based on the photosensitive Component. The sensitivity to light cannot be significant be improved if the amount of the sensitizer is too small is while the persistence rate of four exposed sections may be too low if the amount of the sensitizer is too large.

On Polymerization inhibitor is added to improve thermal stability during the Improve storage. Such polymerization inhibitors in particular belong Hydroquinone, monoesterified compounds of hydroquinone, N-nitrosodiphenylamine, Phenothiazine, p-t-butylcatechol, N-phenylnapthylamine, 2,6-di-t-butyl-p-methylphenol, Chloranil and pyrogallol. When added a polymerization inhibitor , its content preferably makes 0.001 to 1% by weight of the photosensitive one Paste out.

suitable Plasticizers are dibutyl phthalate, dioctyl phthalate, polyethylene glycol and glycerin.

On Antioxidant is added to the oxidation of acrylate copolymers while to avoid storage. Such are antioxidants in particular 2,6-di-t-butyl-p-cresol, butylated hydroxyanisole, 2,6-di-t-4-ethylphenol, 2,2-methylene-bis- (4-methyl-6-t-butylphenol), 2,2-methylene-bis- (4-ethyl-6- t-butylphenol), 4,4-bis (3-methyl-6-t-butylphenol), 1,1,3-tris (2-methyl-6-t-butylphenol), 1,1,3-tris (2-methyl-4-hydroxy-t-butylphenyl) butane, bis- [3,3-bis- (4-hydroxy-3-t-butylphenyl) butyric acid] glycol ester, Dilauryl thiodipropionate and triphenyl phosphite. If an antioxidant added, its content preferably makes 0.001 to 1% by weight the paste.

If the viscosity the solution to be regulated, the photosensitive paste according to the present Invention an organic solvent be added. The suitable organic solvents for this are methyl cellosolve, Ethyl cellosolve, butyl cellosolve, methyl ethyl ketone, dioxane, acetone, Cyclohexanone, cyclopentanone, isobutyl alcohol, isopropyl alcohol, Tetrahydrofuran, dimethyl sulfoxide, γ-butyrolactone, bromobenzene, chlorobenzene, Dibromobenzene, dichlorobenzene, bromobenzoate, chlorobenzoate and mixtures of organic solvents, that contain one or more of them.

The Refractive index of the organic component is called the refractive index this organic component in the paste at the time of exposure of the photosensitive component. If the exposure after the operations coating with paste and drying , the refractive index as the refractive index is the organic Connection defined in the paste after the drying process. at A typical method is to paste the glass substrate coated and then dried at 50 to 100 ° C. for 1 to 3 minutes, followed by the measurement of the refractive index.

For the purpose General measurement methods for the refractive index, such as B. the ellipsometry method or the V-block method, preferred, and the measurement should be at the same wavelength as that of for the exposure used light can be performed. In particular the measurement preferably using light with a wavelength in the range from 350 to 650 nm. Furthermore, the measurement of the refractive index is preferably used by i-rays (365 nm) or g-rays (436 nm).

The Refractive index of organic polymerized by light irradiation Component can be measured by just the organic component is irradiated with the same light that is used for the light irradiation of the Paste is used.

10 Glass particles containing% by weight or more of bismuth oxide or lead oxide, that can be burned onto a glass substrate can have a refractive index of 1.6 or more, and in such a case, the organic Compound have a high refractive index.

In In such a case, the organic component should be a substance with a high refractive index. To the refractive index to increase is the addition of a compound effective, the sulfur atoms, bromine atoms, Iodine atoms, naphthalene rings, biphenyl rings, athracene rings or carbazole rings in an amount of 10% by weight or more of the organic component contains. The refractive index can also be increased be by adding up to 20 wt .-% benzene rings.

In particular the refractive index of the organic component can be increased slightly, by adding more than 10% by weight of sulfur atoms or naphthalene rings become. If the content is 60% by weight or more, the sensitivity may decrease for light undesirable impaired and therefore the total content of sulfur atoms and naphthalene rings preferably in the range of 10 to 60% by weight.

On effective method for introducing sulfur atoms, bromine atoms and naphthalene rings in the organic component is the use a compound made from photosensitive monomers or binders exists that contain sulfur atoms or naphthalene rings. typical Polymers made from monomers that contain sulfur atoms their molecular structure are those of the formulas below (a), (b) and (c), wherein R in the structural formula is a hydrogen atom or represents a methyl group.

On Sensitizer to be used should absorb light of the exposure wavelength. With such a sensitizer, the refractive index increases nearby the wavelength, when absorption occurs, considerable, so that the refractive index of the organic component through the The addition of a sensitizer can be increased in large quantities can. In such a case, the sensitizer can be used in an amount from 0.5 to 10% by weight, more preferably 1 to 6% by weight, added to the paste become.

Around To produce a paste, the necessary components, such as inorganic particles, UV absorber, light-sensitive polymer, photosensitive monomer, photopolymerization initiator, glass frit and solvents provided to a mixture with the required composition to form, followed by processing using a three - roll mill or Kneading machine to ensure homogeneous mixing and dispersing.

The viscosity The paste is made as needed by regulating the amounts of added inorganic particles, viscosity improvers, organic solvents, Plasticizers and suspending agents adjusted. Your area should 2,000 to 200,000 cp (centipoise). If the spin coating process is used to coat glass substrates, the viscosity is preferably 200 to 5,000 cp. It is preferably 50,000 to 200,000 cp if the screen printing process is used to make a single layer with a thickness of 10 up to 20 μm upset while it is preferably 1,000 to 20,000 cp when a knife coater or a paint coater is used.

Some examples for the use of photosensitive pastes for pattern formation described below, however, they do not constitute a limitation of the Invention.

A photosensitive paste is applied over the entire surface or a part of a glass substrate, a ceramic substrate or a polymer film. A common method, such as. B. screen printing, rod coating, roller coating, color coating or knife coating, can be used for coating be used. The coating thickness can be adjusted by using an appropriate number of layers, a suitable coater gap, a suitable screen size and paste viscosity.

If a paste over a substrate is applied, the surface of the substrate can be treated, to maintain close contact between the substrate and the coating achieve. Suitable means for one such surface treatment are silane coupling agents, such as. B. Vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, tris- (2-methoxyethoxy) vinylsilane, γ-glycidoxypropyltrimethoxysilane, γ- (methacryloxypropyl) trimethoxysilane, γ- (2-aminoethyl) aminopropyltrimethoxysuropaniloxypropyl-mercapto-siloxysilane, and γ-aminopropyltriethoxysilane; and organic metal compounds such as e.g. B. organic titanium compounds, organic aluminum compounds and organic zirconium compounds. Such silane coupling agents or organic metal compounds as a 0.1 to 5% solution in an organic solvent, such as B. ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, Methyl alcohol, ethyl alcohol, propyl alcohol and butyl alcohol are used. Then the surface treatment liquid with a slingshot etc. evenly over one Substrate applied, followed by drying at 80 to 140 ° C for 10 to 60 min to surface treatment to reach.

If a paste is applied to a film, the exposure either after the paste has dried on the film or after the Stick the film on a glass or Ceramic substrate can be performed.

A photosensitive green Web for Circuit materials or displays can be made by the photosensitive paste according to the present Invention over a material such as a polyester film is applied. A photosensitive Paste layer with uniform thickness can be made by transferring this green web to a glass substrate becomes.

To an exposure device is used to coat the To perform exposure. The Exposure is generally done using the masked method Exposure using a photomask as in the conventional one Photolithography. The mask used can vary depending on the photosensitive organic component can be a negative or a positive.

Instead of Using a photomask can result in direct patterning a red or blue visible laser beam or Ar-ion laser beam carried out become.

It can Exposure devices such as step imagesetters or a close imagesetter be used. For the Direction of a large one Flat can be a photosensitive paste on glass or another Be applied substrate, followed by the implementation of the Exposure while transported the substrate becomes. to enable a big area with an imagesetter using a small light source.

The active light source that can be used effectively includes visible light, light in the near UV range, UV light, electron beam, X-ray beam and laser beam. Of these, UV light is preferred, and sources such as a low pressure mercury lamp, high pressure mercury lamp, extra high pressure mercury lamp, halogen lamp and germicidal lamp can be used. Of these, the high pressure mercury vapor lamp is preferred. The optimal exposure conditions depend on the coating thickness, but an extra high pressure mercury lamp with a power of 1 to 100 mW / cm ² is preferred for exposure for 0.5 to 30 min.

On Oxygen barrier film can over the applied photosensitive paste can be provided to to improve the shape of the pattern. Suitable materials for such Oxygen barriers are PVA membranes, cellulose membranes and polyester films.

A PVA membrane can be made by using a substrate a slingshot etc. evenly 0.5 to 5.0 wt .-% aqueous solution is coated, followed by drying at 70 to 90 ° C for 10 to 60 min, and evaporate water. It is preferred that the aqueous solution a small amount of alcohol is added to make it wettable with the insulation film, which makes evaporation easier becomes. The PVA solution is more preferred for Concentration range from 1 to 3 wt .-%. A concentration in this area further improves sensitivity. It is believed, that the PVA coating has sensitivity due to the following Mechanism can improve: It is believed that oxygen in the atmosphere the sensitivity to photocuring reduced, but a PVA membrane can be undesirable Block oxygen, increasing sensitivity to exposure is improved with light.

If a transparent film, e.g. B. like a polyester, polypropylene or polyethylene film is used, such a film can be made over the applied photosensitive paste can be glued.

To exposure is done by developing the difference in solubility in the development solution between the exposed and unexposed sections becomes. For a method such as dipping, spraying or painting can serve this purpose be used.

As development solution can be an organic solvent be used, the organic component in the photosensitive Loosen the paste can. The organic solvent water can be added as long as its solvency is not significantly impaired. A watery one Base solution can be used when the photosensitive paste connects with an acid group, such as B. carboxyl contains. Although the watery Base solution a metal base solution, such as B. a sodium hydroxide solution, sodium or calcium hydroxide solution, the use of an organic base solution is preferred, because the basic components are easily removed when burning can be.

As such organic base compounds can be used conventional amine compounds. In particular belong with tetramethylammonium hydroxide, trimethylbenzylammonium hydroxide, monoethanolamine and diethanolamine. The concentration of the base solution should generally be 0.01 to 10% by weight, more preferably 0.1 to 5% by weight. The soluble Portions are not removed if the base concentration is too low is while an excessively high Base concentration a peeling patterned sections and the corrosion of the soluble parts caused.

At the Develop is the development temperature preferably 20 to 50 ° C to the Simplify process control.

The Firing is then carried out in an oven. The one used for burning the atmosphere and temperature depend on the paste and the substrate. The burning is common in an atmosphere such as air, nitrogen or hydrogen. The oven to use can be a batch furnace or a continuous belt furnace.

The Firing temperature should be 400 to 1,000 ° C. If the pattern formation done on a glass substrate, it should be at 520 to for 10 to 60 min Kept at 610 ° C to ensure burning.

each the processes for coating, exposing, developing and firing can for Purposes like drying and preparatory implementation of a heating step at 50 to 300 ° C include.

On Glass substrate with a spacer plate, as in the above procedures manufactured, can be on the front or back of a plasma display be used. It can also be used as a substrate in a matrix addressed plasma LCD for electrical discharge from the addressed sections is provided.

phosphorus is applied between the separating ribs made above, followed of sandwiching the same between a front and a rear glass substrate and sealing with an inert gas such as helium, Neon or xenon, which creates a plasma display panel.

Then driver ICs are built in to complete the plasma display.

The Size each Pixels must be reduced to improve the sharpness of the plasma display, d. H. increase the number of pixels in a constant size display. The Separation rib spacing must be reduced to achieve this, but a reduced distance causes a reduction in the unloading space and a reduction in the area coated with phosphorus what leads to reduced brightness. Specifically, a 42 inch high definition display requires for TV (1920 × 1035 pixels) or a 23 inch ad for Office devices (XGA: 1024 × 768 Pixels) a pixel size of 450 × 450 μm and one Distance of 150 μm for the Separation ribs to separate the pixels of each color. In this case makes it a large line width impossible in the rib, to maintain a sufficient final loading space and the one coated with phosphor area decrease, making it difficult to improve the brightness.

The Inventors of the subject matter of the present application have determined that the technique provided by the present invention serves to reduce the line width in the separating rib to enable.

In particular the technique serves to manufacture a plasma display enable, the one strip-shaped Separating rib with a spacer width of 20 to 40 μm. Therefore, with the Technology can effectively improve the brightness.

Furthermore, can be achieved by producing a high-resolution separating rib with a Height of 100 to 170 μm and a distance of 100 to 160 μm a high-resolution plasma display are manufactured for high-definition TV sets and computer screens can be provided.

below examples are given, to illustrate the invention more specifically. The examples however, do not pose a restriction of the invention. The concentrations (%) in the examples and Unless otherwise stated, comparative examples are in percent by weight specified.

In In each example, a photosensitive paste is made consists of inorganic particles and an organic component. The manufacturing process for it is the following: the materials of the organic component will be with γ-butyrolactone to 80 ° C heated to loosen to ensure, followed by the addition of inorganic particles and kneading in one Kneading machine to make a paste. Their viscosity is determined by Adjust the amount of solvent added. The Solvent (γ-butyrolactone) was added in an amount up to 10-40% of the paste.

thereupon were by screen printing on a soda-lime glass or quartz glass substrate with 30 × 30 cm several coatings up to a thickness of 100 μm, 150 μm or Applied 200 μm, followed by dry at 80 ° C for 30 minute

• (1) Chrom-Negativmaske mit einem Abstand von 220 μm und einer Linienbreite von 50 μm;
• (2) Chrom-Negativmaske mit einem Abstand von 150 μm und einer Linienbreite von 20 μm.

Then the substrates were exposed through one of the two photomasks listed below.

• (1) chrome negative mask with a pitch of 220 μm and a line width of 50 μm;
• (2) Chrome negative mask with a distance of 150 μm and a line width of 20 μm.

Exposure was carried out with 2-10 J / cm ² UV rays from an extra high pressure mercury lamp with an output of 50 mW / cm ² .

The resulting glass substrate was then dried at 80 ° C for 1 hour and at a maximum temperature of 560 ° C or 850 ° C burned (maintain maximum temperature for 30 min).

The resulting substrate was cut into samples, and their cross sections were viewed under a scanning electron microscope to determine whether a good pattern had been made on the separation rib. The Results are shown in Table 3, where "O" indicates that a good pattern has been created and displays "X" that due to missing / destroyed Sections in the pattern or due to underdevelopment, causing unexposed sections back left, no good separation rib was obtained.

The Refractive index of the organic component was adjusted by only the organic component in the paste was regulated, and it was applied and dried by the ellipsometry method measured using light with a wavelength of 436 nm at 25 ° C.

example 1

A Paste was made from 75 g of glass powder A1 and 25 g of organic component B3 as listed in Table 1 using 10 g of solvent manufactured.

On Pattern was formed and firing was carried out at 560 ° C for 30 minutes. The Results are shown in Table 3.

Using a light-sensitive silver paste, 3,072 silver wiring lines with a line width of 40 μm, a spacing of 150 μm and a thickness of 10 μm were produced in strips on a soda-lime glass substrate with 360 × 500 mm (2.8 mm thickness). The paste prepared above was then applied over the entire area to a thickness of 200 μm and exposed through a photomask with a distance of 150 μm, a line width of 20 μm, a total number of 3,080 lines and a line length of 350 mm, followed by Develop and burn to provide a separation rib. RGB phosphor pastes were then screen printed, followed by baking at 450 ° C for 20 minutes to provide a backplate for a 23 inch plasma display. A 23 inch XGA display (1024x768 pixels) can be made by gluing this back plate to a front plate and sealing it, whereby there is a gas in between.

Example 2

A Paste was made from 75 g of glass powder A2 and 25 g of organic component B3 as listed in Table 1 prepared using 15 g of solvent were used.

On Pattern was formed and firing was carried out at 560 ° C for 10 minutes long done. The results are shown in Table 3.

Example 3

A Paste was made from 70 g of glass powder using 15 g of solvent A3 and 30 g of organic component B4, as shown in Table 1, prepared.

It a pattern was formed and firing was carried out at 560 ° C for 10 min long done. The results are shown in Table 3.

Example 5 (process example; Comparative product)

A Paste was made from 80 g of A4 glass powder and 20 g of organic component B2 as listed in Table 1 prepared using 11 g of solvent were used.

It a pattern was formed and firing was carried out at 580 ° C for 15 min long done. The results are shown in Table 3.

Example 6

A Paste was made from 75 g of glass powder using 12 g of solvent A5 and 25 g of organic component B1, as listed in Table 1.

It a pattern was formed and firing was carried out at 580 ° C for 15 min long done. The results are shown in Table 3.

Example 7

A Paste was made from 75 glass powder using 10 g of solvent A6 and 25 g of organic component B3, as listed in Table 1, prepared.

It a pattern was formed and firing was carried out at 850 ° C for 15 min long done. The results are shown in Table 3.

Example 8

A Paste was made using 10 g of solvent by 60 g of glass powder A1 and 15 g of glass powder A6 were mixed, whereby 25 g of organic component B3, as listed in Table 1, used were.

On Pattern was formed and baking was carried out at 580 ° C for 30 minutes. The Results are shown in Table 3.

Comparative Example 1

A Paste was made from 75 g of glass powder using 10 g of solvent A3 and 25 g of organic component B2, as listed in Table 1, prepared.

It a pattern was formed and firing was carried out at 560 ° C for 10 min long done. The results are shown in Table 3.

Comparative Example 2

A Paste was made from 75 g of glass powder using 10 g of solvent A4 and 25 g of organic component B4, as listed in Table 1, prepared.

It a pattern was formed and firing was carried out at 580 ° C for 15 min long done. The results are shown in Table 3.

Table 1 Compositions of the glass particles used

Table 3 Results of separation rib formation

TMPA

Trimethylolpropantriacrylat

TBPMA

Tribromphenylmethacrylat

TBB-ADA

Tetrabrombisphenol-A-diacrylat

BMEXS-MA

MPS-MA

PVA

Polyvinylalkohol

Sudan

Roter Azo-Farbstoff (C₂₄H₂₀N₄O)

Yupinal D50

Benzophenon-Farbstoff (Yupinal D50) C₁₃H₁₀O-.

MTPMP

2-Methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1

EPA

p-Ethyldimethylaminobenzoat

DET

2,4-Diethylthioxanthon

γ-BL

γ-Butyrolacton

The abbreviations used in the tables have the following meaning (the numbers given in the formulas of polymers 1-3 show the molar fraction of each monomer):

TMPA

trimethylolpropane

TBPMA

tribromophenyl

TBB-ADA

Tetrabromobisphenol A diacrylate

BMEXS-MA

MPS-MA

PVA

polyvinyl alcohol

sudan

Red azo dye (C ₂₄ H ₂₀ N ₄ O)

Yupinal D50

Benzophenone dye (Yupinal D50) C ₁₃ H ₁₀ O-.

MTPMP

2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-1

EPA

p-ethyl dimethylaminobenzoate

DET

2,4-diethylthioxanthone

γ-BL

γ-butyrolactone

durchschnittliches Molekulargewicht: 43.000, Säurezahl : 90 Polymer-1

average molecular weight: 43,000, acid number: 90

durchschnittliches Molekulargewicht: 32.000, Säurezahl: 95 Polymer-2

average molecular weight: 32,000, acid number: 95

durchschnittliches Molekulargewicht: 30.000, Säurezahl: 101 Polymer 3

average molecular weight: 30,000, acid number: 101

Industrial applicability

The photosensitive paste according to the present Invention enables the implementation of pattern formation with a high aspect ratio and high precision. The invention also makes it possible Pattern formation with large Thick and high precision for ads and circuit materials and improve image sharpness and to simplify the manufacturing processes. In particular, on simple way high resolution Plasma display panels are manufactured.

Claims (27)

Use of a photosensitive paste which comprises, as base components, (a) inorganic particles, the glass particles in an amount of 60% by weight or more based on the weight of the inorganic particles, and (b) an organic component containing a photosensitive compound , wherein the average refractive index N1 of the inorganic particles and the average refractive index N2 of the organic component correspond to the following equation: -0.1 ≤ N1 - N2 ≤ 0.1 for forming separating ribs on a glass substrate in a method for producing a plasma display or matrix-addressed plasma liquid crystal display. Use according to claim 1, wherein the average refractive index N1 of the inorganic particles and the average refractive index N2 of the organic component correspond to the following equation: -0.05 ≤ N1 - N2 ≤ 0.1. Use according to claim 1, wherein the average refractive index of the inorganic particles is in the range of 1.5 to 1.7. Use according to claim 3, wherein the average refractive index the inorganic particles are in the range of 1.55 to 1.65. Use according to claim 1, wherein the photosensitive Paste 50 to 95 parts by weight of inorganic particles and 5 to 50 Parts by weight of an organic component. Use according to claim 1, wherein the glass particles have a thermal softening temperature (Ts) of 350 to 600 ° C. Use according to claim 1, wherein the glass particles have a linear coefficient of thermal expansion of 50-90 x ^10-7 . Use according to claim 1, wherein the glass particles a sphericity coefficient of 80% or more. Use according to claim 1, wherein the glass particles contain at least one of lithium oxide, sodium oxide or potassium oxide, the total content of which is 3 to 20% by weight. Use according to claim 5, wherein the glass particles Contain 3 to 20 wt .-% lithium oxide. Use according to claim 5, wherein the glass particles contain at least either bismuth oxide or lead oxide, their total content 5 to 50 wt .-% is. Use according to claim 5, wherein the glass particles at least either total bismuth oxide or lead oxide contain from 5 to 30 wt .-% and also one of lithium oxide, sodium oxide or contain potassium oxide in a total content of 3 to 15 wt .-%. Use according to claim 5, wherein the glass particles Contain 3 to 60 wt .-% silicon oxide, 5 to 50 wt .-% boron oxide. Use according to claim 5, wherein the glass particles 3 to 60% by weight of silicon oxide, 5 to 50% by weight of boron oxide, 1 to 30 % By weight of barium oxide and 1 to 30% by weight of aluminum oxide. Use according to claim 1, wherein the organic Component 10 to 90% by weight of an oligomer or a polymer with a weight average molecular weight of 500 to 100,000 contains wherein the oligomer or polymer has a carboxyl group in its molecular structure having. Use according to claim 1, wherein the organic component contains 10 to 90% by weight of an oligomer or a polymer having a weight average molecular weight of 500 to 100,000, wherein the Oligomer or polymer has an unsaturated double bond in its molecular structure. Use according to claim 1, wherein the organic Component 10 to 90% by weight of an oligomer or a polymer with a weight average molecular weight of 500 to 100,000 contains wherein the oligomer or polymer is a carboxyl group or an unsaturated double bond has in its molecular structure. Use according to claim 1, wherein the organic Component 10 to 80 wt .-% of a multifunctional acrylate compound and / or contains methacrylate compound. Use according to claim 1, wherein the organic Component at least one representative of the benzene ring, naphthalene ring and sulfur atom existing group in a total content of 10 contains up to 60 wt .-%. Use according to claim 1, wherein the organic Component contains 0.05 to 5 wt .-% of a compound which Can absorb UV rays. Use according to claim 20, wherein the compound which can absorb UV rays, an organic dye or is an organic pigment. Use according to claim 21, wherein the organic Dye or the organic pigment a red dye or a Is red pigment. Process for the production of a plasma display or a matrix addressed plasma liquid crystal display, wherein in separating ribs after a coating process on a glass substrate generated in which the glass substrate with a light-sensitive Paste according to claim 1 coated, exposed, developed and fired becomes. The method of claim 23, wherein the exposure in the exposure process in one step. Plasma display or matrix-addressed plasma liquid crystal display which is obtainable by a manufacturing process according to claim 23 or 24 and a separation rib formed on a glass substrate, wherein the rib is an inorganic component with a medium Refractive index ranges from 1.5 to 1.7. 26. The display of claim 25, wherein the separating rib created is in strip form with a line width of 20 to 35 μm. 26. The display of claim 25, wherein the separating rib produced in strip form with a line width of 20 to 40 μm, one Height of 100 to 170 μm and a distance of 100 to 160 microns.