DE69605337T2 - Positionierungssystem und Verfahren und Apparat zur Herstellung einer Vorrichtung - Google Patents

Positionierungssystem und Verfahren und Apparat zur Herstellung einer Vorrichtung

Info

Publication number
DE69605337T2
DE69605337T2 DE69605337T DE69605337T DE69605337T2 DE 69605337 T2 DE69605337 T2 DE 69605337T2 DE 69605337 T DE69605337 T DE 69605337T DE 69605337 T DE69605337 T DE 69605337T DE 69605337 T2 DE69605337 T2 DE 69605337T2
Authority
DE
Germany
Prior art keywords
manufacturing
positioning system
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69605337T
Other languages
English (en)
Other versions
DE69605337D1 (de
Inventor
Yukio Yamane
Eiji Osanai
Kotaro Akutsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69605337D1 publication Critical patent/DE69605337D1/de
Publication of DE69605337T2 publication Critical patent/DE69605337T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C29/00—Bearings for parts moving only linearly
    • F16C29/02—Sliding-contact bearings
    • F16C29/025—Hydrostatic or aerostatic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C32/00—Bearings not otherwise provided for
    • F16C32/06—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings
    • F16C32/0603—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings supported by a gas cushion, e.g. an air cushion
    • F16C32/0614—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings supported by a gas cushion, e.g. an air cushion the gas being supplied under pressure, e.g. aerostatic bearings
    • F16C32/0618—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings supported by a gas cushion, e.g. an air cushion the gas being supplied under pressure, e.g. aerostatic bearings via porous material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C2370/00—Apparatus relating to physics, e.g. instruments
    • F16C2370/20—Optical, e.g. movable lenses or mirrors; Spectacles
DE69605337T 1995-02-24 1996-02-21 Positionierungssystem und Verfahren und Apparat zur Herstellung einer Vorrichtung Expired - Fee Related DE69605337T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7036946A JPH08229759A (ja) 1995-02-24 1995-02-24 位置決め装置並びにデバイス製造装置及び方法

Publications (2)

Publication Number Publication Date
DE69605337D1 DE69605337D1 (de) 2000-01-05
DE69605337T2 true DE69605337T2 (de) 2000-05-11

Family

ID=12483927

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69605337T Expired - Fee Related DE69605337T2 (de) 1995-02-24 1996-02-21 Positionierungssystem und Verfahren und Apparat zur Herstellung einer Vorrichtung

Country Status (5)

Country Link
US (1) US5858587A (de)
EP (1) EP0729073B1 (de)
JP (1) JPH08229759A (de)
KR (1) KR100223624B1 (de)
DE (1) DE69605337T2 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016007114A1 (de) * 2016-06-13 2017-12-14 Rudolf Eitel Vorrichtung zur variablen und geführten Positionierung eines zu messenden und/oder zu bearbeitenden Objektes oder eines Objektträgers
EP3620257A1 (de) * 2018-08-13 2020-03-11 Branson Ultraschall Niederlassung der Emerson Technologies GmbH & Co. oHG Schweissanlagen-positionier-anordnung
CN112276384A (zh) * 2020-12-24 2021-01-29 苏州德龙激光股份有限公司 半导体晶圆激光切割用气浮平台

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JP3387809B2 (ja) * 1998-02-18 2003-03-17 キヤノン株式会社 露光装置及びデバイス製造方法
JP3356683B2 (ja) * 1998-04-04 2002-12-16 東京エレクトロン株式会社 プローブ装置
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JP3413122B2 (ja) 1998-05-21 2003-06-03 キヤノン株式会社 位置決め装置及びこれを用いた露光装置並びにデバイス製造方法
JP4428741B2 (ja) * 1998-09-04 2010-03-10 キヤノン株式会社 ガルバノミラーアクチュエータ
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CA2385993A1 (en) 2000-03-31 2001-10-04 Toto Ltd. Method for wet forming of powder, method for producing powder sintered compact, powdery sintered compact, and apparatus using powdery sintered compact
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JP4474020B2 (ja) * 2000-06-23 2010-06-02 キヤノン株式会社 移動装置及び露光装置
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JP2002252166A (ja) * 2001-02-27 2002-09-06 Canon Inc ステージ装置、露光装置およびデバイス製造方法ならびに移動案内方法
JP2002280283A (ja) * 2001-03-16 2002-09-27 Canon Inc 基板処理装置
KR100787469B1 (ko) * 2001-04-02 2007-12-26 삼성전자주식회사 액정표시장치 제조용 노광설비 및 이의 노광패턴얼라인먼트 방법
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JP4814438B2 (ja) * 2001-05-02 2011-11-16 日本トムソン株式会社 リニアモータを内蔵したステージ装置
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JP6040613B2 (ja) * 2012-07-25 2016-12-07 日本精工株式会社 位置決め装置、露光装置及び工作機械
CN103573815B (zh) * 2012-07-31 2017-02-22 上海微电子装备有限公司 微动台及气浮轴承
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JP6878605B2 (ja) * 2017-09-13 2021-05-26 キヤノンセミコンダクターエクィップメント株式会社 加工装置
CN108296800A (zh) * 2018-03-22 2018-07-20 广东工业大学 一种垂直解耦的xz高精运动平台
CN109249305B (zh) * 2018-09-30 2020-11-24 安徽安凯汽车股份有限公司 一种用于汽车零部件加工的辅助工装
CN112963450A (zh) * 2021-03-23 2021-06-15 西安工业大学 新型三坐标t型气浮工作台

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016007114A1 (de) * 2016-06-13 2017-12-14 Rudolf Eitel Vorrichtung zur variablen und geführten Positionierung eines zu messenden und/oder zu bearbeitenden Objektes oder eines Objektträgers
EP3620257A1 (de) * 2018-08-13 2020-03-11 Branson Ultraschall Niederlassung der Emerson Technologies GmbH & Co. oHG Schweissanlagen-positionier-anordnung
US11207750B2 (en) 2018-08-13 2021-12-28 Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co. Ohg Welding device positioning arrangement
CN112276384A (zh) * 2020-12-24 2021-01-29 苏州德龙激光股份有限公司 半导体晶圆激光切割用气浮平台

Also Published As

Publication number Publication date
KR100223624B1 (ko) 1999-10-15
DE69605337D1 (de) 2000-01-05
KR960032102A (ko) 1996-09-17
EP0729073B1 (de) 1999-12-01
EP0729073A1 (de) 1996-08-28
US5858587A (en) 1999-01-12
JPH08229759A (ja) 1996-09-10

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