DE69604940D1 - Strahlenhärtbare Zusammensetzungen - Google Patents

Strahlenhärtbare Zusammensetzungen

Info

Publication number
DE69604940D1
DE69604940D1 DE69604940T DE69604940T DE69604940D1 DE 69604940 D1 DE69604940 D1 DE 69604940D1 DE 69604940 T DE69604940 T DE 69604940T DE 69604940 T DE69604940 T DE 69604940T DE 69604940 D1 DE69604940 D1 DE 69604940D1
Authority
DE
Germany
Prior art keywords
radiation curable
curable compositions
compositions
radiation
curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69604940T
Other languages
English (en)
Other versions
DE69604940T2 (de
Inventor
Brian R Harkness
Manoru Tachikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Asia Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Asia Ltd filed Critical Dow Corning Asia Ltd
Publication of DE69604940D1 publication Critical patent/DE69604940D1/de
Application granted granted Critical
Publication of DE69604940T2 publication Critical patent/DE69604940T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/205—Compounds containing groups, e.g. carbamates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)
DE69604940T 1995-02-02 1996-01-31 Strahlenhärtbare Zusammensetzungen Expired - Lifetime DE69604940T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP01619395A JP3499032B2 (ja) 1995-02-02 1995-02-02 放射線硬化性組成物、その硬化方法及びパターン形成方法

Publications (2)

Publication Number Publication Date
DE69604940D1 true DE69604940D1 (de) 1999-12-09
DE69604940T2 DE69604940T2 (de) 2000-06-15

Family

ID=11909683

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69604940T Expired - Lifetime DE69604940T2 (de) 1995-02-02 1996-01-31 Strahlenhärtbare Zusammensetzungen

Country Status (6)

Country Link
US (2) US5789460A (de)
EP (1) EP0725106B1 (de)
JP (1) JP3499032B2 (de)
KR (1) KR100362619B1 (de)
DE (1) DE69604940T2 (de)
TW (1) TW397937B (de)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
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JP3628098B2 (ja) * 1996-03-29 2005-03-09 ダウ コーニング アジア株式会社 放射線硬化性組成物およびこれを用いた硬化物パターンの製造方法
US5861235A (en) * 1996-06-26 1999-01-19 Dow Corning Asia, Ltd. Ultraviolet-curable composition and method for patterning the cured product therefrom
US6087024A (en) * 1996-12-17 2000-07-11 Whinnery; Leroy Louis Method for forming porous sintered bodies with controlled pore structure
US6407146B1 (en) * 1997-07-28 2002-06-18 Kaneka Corporation Curable composition
CN1137938C (zh) * 1997-07-28 2004-02-11 钟渊化学工业株式会社 可固化的粘合剂组合物
US6177360B1 (en) * 1997-11-06 2001-01-23 International Business Machines Corporation Process for manufacture of integrated circuit device
GB9812425D0 (en) 1998-06-10 1998-08-05 Dow Corning Electroless metal disposition on silyl hyride functional resin
US6087064A (en) * 1998-09-03 2000-07-11 International Business Machines Corporation Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method
US6127086A (en) * 1998-10-01 2000-10-03 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
US6214516B1 (en) * 1998-10-01 2001-04-10 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
US6177143B1 (en) * 1999-01-06 2001-01-23 Allied Signal Inc Electron beam treatment of siloxane resins
US7175903B1 (en) 2000-11-17 2007-02-13 Pliant Corporation Heat sealable polyvinyl chloride films
US20030096090A1 (en) * 2001-10-22 2003-05-22 Boisvert Ronald Paul Etch-stop resins
TWI273352B (en) * 2002-01-24 2007-02-11 Jsr Corp Radiation sensitive composition for forming an insulating film, insulating film and display device
JP2004165613A (ja) * 2002-06-03 2004-06-10 Shipley Co Llc 電子デバイスの製造
SE521977C2 (sv) * 2002-06-20 2003-12-23 Mobile Media Group Stockholm A Metod och apparat för att formatera en webbtjänst
US7041748B2 (en) 2003-01-08 2006-05-09 International Business Machines Corporation Patternable low dielectric constant materials and their use in ULSI interconnection
EP1524247A1 (de) * 2003-10-15 2005-04-20 Asahi Glass Company, Limited Mit Infrarot Schutzfilm bechichtetes Glas und Verfahren zur Herstellung
JP2005243681A (ja) * 2004-02-24 2005-09-08 Tokyo Electron Ltd 膜改質方法、膜改質装置及びスリミング量の制御方法
JP4687250B2 (ja) * 2004-06-02 2011-05-25 東レ株式会社 感光性樹脂組成物
JP4639685B2 (ja) * 2004-07-26 2011-02-23 Ｊｓｒ株式会社 光硬化性組成物及びそれを用いた光導波路
WO2006049720A1 (en) * 2004-11-02 2006-05-11 Dow Corning Corporation Resist composition
US7756384B2 (en) * 2004-11-08 2010-07-13 Dow Corning Corporation Method for forming anti-reflective coating
ATE400672T1 (de) 2004-12-17 2008-07-15 Dow Corning Verfahren zur ausbildung einer antireflexionsbeschichtung
CN101073039B (zh) * 2004-12-17 2011-12-14 陶氏康宁公司 形成抗反射涂层的方法
US20090206328A1 (en) * 2005-01-05 2009-08-20 Kimihiro Matsukawa Silicon-Containing Photosensitive Composition, Method for Forming Thin Film Pattern Using Same, Protective Film for Electronic Device, Gate Insulating Film And Thin Film Transistor
JP2007187721A (ja) * 2006-01-11 2007-07-26 Sekisui Chem Co Ltd 感光性組成物及び半導体素子
WO2007094848A2 (en) 2006-02-13 2007-08-23 Dow Corning Corporation Antireflective coating material
JP5099301B2 (ja) * 2006-03-23 2012-12-19 Ｊｓｒ株式会社 絶縁膜形成用組成物、ポリマーおよびその製造方法、絶縁膜の製造方法、ならびにシリカ系絶縁膜
JP5099302B2 (ja) * 2006-03-23 2012-12-19 Ｊｓｒ株式会社 絶縁膜形成用組成物、ポリマーおよびその製造方法、絶縁膜の製造方法、ならびにシリカ系絶縁膜
JP2010503763A (ja) * 2006-09-18 2010-02-04 スターファイアー システムズ， インコーポレイテッド シロキサン系組成物の調製プロセス及びその誘導体組成物
US7867689B2 (en) * 2007-05-18 2011-01-11 International Business Machines Corporation Method of use for photopatternable dielectric materials for BEOL applications
US8470516B2 (en) * 2007-05-18 2013-06-25 International Business Machines Corporation Method of forming a relief pattern by e-beam lithography using chemical amplification, and derived articles
JP5587791B2 (ja) 2008-01-08 2014-09-10 東レ・ダウコーニング株式会社 シルセスキオキサン樹脂
KR20100114075A (ko) * 2008-01-15 2010-10-22 다우 코닝 코포레이션 실세스퀴옥산 수지
JP5581225B2 (ja) * 2008-03-04 2014-08-27 ダウ・コーニング・コーポレイション シルセスキオキサン樹脂
EP2250215B1 (de) * 2008-03-05 2020-03-25 Dow Silicones Corporation Silsesquioxanharze
US20110236835A1 (en) * 2008-12-10 2011-09-29 Peng-Fei Fu Silsesquioxane Resins
WO2010068336A1 (en) 2008-12-10 2010-06-17 Dow Corning Corporation Silsesquioxane resins
EP2588536A1 (de) * 2010-06-30 2013-05-08 3M Innovative Properties Company Bei bedarf härtbare polysiloxanbeschichtungszusammensetzung
CN102959024B (zh) 2010-06-30 2016-08-24 3M创新有限公司 可固化聚硅氧烷涂层组合物
JP5818890B2 (ja) 2010-06-30 2015-11-18 スリーエム イノベイティブ プロパティズ カンパニー 二重反応性シラン官能基を含む硬化性組成物
WO2013101477A1 (en) 2011-12-29 2013-07-04 3M Innovative Properties Company Curable polysiloxane coating composition
WO2013106193A1 (en) 2011-12-29 2013-07-18 3M Innovative Properties Company Curable polysiloxane composition
WO2013101742A1 (en) 2011-12-29 2013-07-04 3M Innovative Properties Company Curable-on-demand polysiloxane coating composition
US9428605B2 (en) * 2012-11-08 2016-08-30 Neo Sitech Llc Organic-inorganic hybrid material compositions and polymer composites
CN112292638B (zh) * 2018-04-24 2024-06-11 美国陶氏有机硅公司 正色调可光图案化有机硅
EP3817914A4 (de) * 2018-06-08 2022-04-20 Elkem Silicones Shanghai Co., Ltd. Härtbare silikonzusammensetzung
FI129480B (en) * 2018-08-10 2022-03-15 Pibond Oy Silanol-containing organic-inorganic hybrid coatings for high-resolution patterning
FI128886B (en) * 2019-02-25 2021-02-26 Pibond Oy Functional hydrogen silicon oxane polymers and their uses

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JPS58174418A (ja) * 1982-04-07 1983-10-13 Toshiba Corp 光重合組成物
JPH06148887A (ja) * 1991-01-28 1994-05-27 Oki Electric Ind Co Ltd 感光性樹脂組成物
US5238787A (en) * 1991-04-22 1993-08-24 Dow Corning Corporation Photodelineable coatings from hydrogen silsesquioxane resin
DE69324942T2 (de) * 1992-02-14 1999-10-07 Shipley Co., Inc. Strahlungsempfindliche Zusammensetzungen und Verfahren
JP2868672B2 (ja) * 1992-08-31 1999-03-10 沖電気工業株式会社 シリコーン樹脂組成物及びこれを用いたケイ酸ガラス薄膜の製造方法

Also Published As

Publication number Publication date
EP0725106B1 (de) 1999-11-03
JPH08211616A (ja) 1996-08-20
US5789460A (en) 1998-08-04
KR100362619B1 (ko) 2003-05-16
US5891529A (en) 1999-04-06
EP0725106A2 (de) 1996-08-07
DE69604940T2 (de) 2000-06-15
KR960032094A (ko) 1996-09-17
TW397937B (en) 2000-07-11
EP0725106A3 (de) 1997-07-23
JP3499032B2 (ja) 2004-02-23

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