DE69604771T2 - Magnetisches kompositartikel und produkt zur unterdrückung von elektromagnetischen interferenzen - Google Patents

Magnetisches kompositartikel und produkt zur unterdrückung von elektromagnetischen interferenzen

Info

Publication number
DE69604771T2
DE69604771T2 DE69604771T DE69604771T DE69604771T2 DE 69604771 T2 DE69604771 T2 DE 69604771T2 DE 69604771 T DE69604771 T DE 69604771T DE 69604771 T DE69604771 T DE 69604771T DE 69604771 T2 DE69604771 T2 DE 69604771T2
Authority
DE
Germany
Prior art keywords
magnetic
soft magnetic
circuit board
printed circuit
composite material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69604771T
Other languages
German (de)
English (en)
Other versions
DE69604771D1 (de
Inventor
Mitsuharu Sato
Yutaka Shimada
Eishu Sugawara
Shigeyoshi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Application granted granted Critical
Publication of DE69604771D1 publication Critical patent/DE69604771D1/de
Publication of DE69604771T2 publication Critical patent/DE69604771T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
    • H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/281—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials
    • H10W42/287—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their materials materials for magnetic shielding, e.g. ferromagnetic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Soft Magnetic Materials (AREA)
  • Aerials With Secondary Devices (AREA)
DE69604771T 1995-07-20 1996-07-22 Magnetisches kompositartikel und produkt zur unterdrückung von elektromagnetischen interferenzen Expired - Lifetime DE69604771T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP7183911A JPH0935927A (ja) 1995-07-20 1995-07-20 複合磁性体及びそれを用いた電磁干渉抑制体
PCT/JP1996/002040 WO1997004469A1 (en) 1995-07-20 1996-07-22 Composite magnetic material and product for eliminating electromagnetic interference

Publications (2)

Publication Number Publication Date
DE69604771D1 DE69604771D1 (de) 1999-11-25
DE69604771T2 true DE69604771T2 (de) 2000-03-09

Family

ID=16143978

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69604771T Expired - Lifetime DE69604771T2 (de) 1995-07-20 1996-07-22 Magnetisches kompositartikel und produkt zur unterdrückung von elektromagnetischen interferenzen

Country Status (7)

Country Link
EP (1) EP0785557B1 (https=)
JP (1) JPH0935927A (https=)
KR (1) KR100267358B1 (https=)
CN (1) CN1135574C (https=)
DE (1) DE69604771T2 (https=)
TW (1) TW305048B (https=)
WO (1) WO1997004469A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011087263A1 (de) * 2011-11-28 2013-05-29 Lenze Drives Gmbh Abschirmvorrichtung für elektrische Einheiten

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JP3404618B2 (ja) * 1996-09-02 2003-05-12 エヌイーシートーキン株式会社 電磁干渉抑制体
JP3475386B2 (ja) * 1997-09-01 2003-12-08 Ｎｅｃトーキン株式会社 電磁干渉抑制体
US6284363B1 (en) 1998-03-23 2001-09-04 Fuji Polymer Industries Co., Ltd. Electromagnetic wave absorbing thermoconductive silicone gel molded sheet and method for producing the same
DK1097463T3 (da) * 1998-07-10 2003-02-17 Epcos Ag Magnetiserbart produkt, brugen af samme såvel som en fremgangsmåde til fremstilling af samme
JP2000058691A (ja) 1998-08-07 2000-02-25 Sharp Corp ミリ波半導体装置
JP2000133986A (ja) * 1998-10-27 2000-05-12 Murata Mfg Co Ltd 放射ノイズ抑制部品の取付構造
US6103134A (en) * 1998-12-31 2000-08-15 Motorola, Inc. Circuit board features with reduced parasitic capacitance and method therefor
EP1133780B1 (en) 1999-09-28 2003-05-02 NEC TOKIN Corporation Composite magnetic sheet and method of producing the same
DE19947130C1 (de) * 1999-09-30 2000-11-02 Siemens Ag Elektrisches Gerät mit in einem Gehäuse angeordneten und nach außen elektromagnetisch abgeschirmten Komponenten
JP2001126910A (ja) * 1999-10-25 2001-05-11 Tokin Corp 複合磁性体、複合磁性体シートおよびそれらの製造方法
DE10000523A1 (de) * 2000-01-08 2001-07-26 Inst Maschinen Antriebe Und El Ferrit-Compound-Material mit hoher elektromagnetischer Absorption im Frequenzbereich von 20 MHz bis 40 GHz
DE10016380C2 (de) * 2000-03-29 2002-01-24 Infineon Technologies Ag Gehäuse für ein elektrisches Bauteil
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JP4417377B2 (ja) 2004-02-24 2010-02-17 信越ポリマー株式会社 電磁波ノイズ抑制体、電磁波ノイズ抑制機能付構造体、およびそれらの製造方法
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US8466764B2 (en) 2006-09-12 2013-06-18 Cooper Technologies Company Low profile layered coil and cores for magnetic components
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US9859043B2 (en) 2008-07-11 2018-01-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
JP5161813B2 (ja) * 2008-10-10 2013-03-13 Ｄｏｗａエレクトロニクス株式会社 混合フェライト粉およびその製造方法、並びに、電波吸収体
JP5912278B2 (ja) * 2011-04-06 2016-04-27 Ｎｅｃトーキン株式会社 電磁干渉抑制体
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CN102892279B (zh) * 2012-09-06 2015-09-02 刘伟德 一种电磁屏蔽材料、应用及其制造方法
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CN108476604B (zh) 2015-10-27 2020-11-03 汉高股份有限及两合公司 用于低频emi屏蔽的导电组合物
WO2017078404A1 (ko) * 2015-11-02 2017-05-11 주식회사 아모그린텍 형상 이방성 자성 입자, 이를 포함하는 전자파 흡수시트 및 이를 포함하는 안테나 모듈
JP6407186B2 (ja) * 2016-03-23 2018-10-17 Tdk株式会社 電子回路パッケージ
CN106229104A (zh) * 2016-08-31 2016-12-14 北京康普锡威科技有限公司 一种软磁复合粉末及其磁粉芯制备方法
JP6934660B2 (ja) * 2017-07-31 2021-09-15 北川工業株式会社 電磁波抑制シート
EP3439438B1 (en) * 2017-08-02 2024-10-09 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Non-uniform magnetic foil embedded in component carrier
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JPWO2019235539A1 (ja) * 2018-06-08 2021-07-08 マクセルホールディングス株式会社 電磁波吸収体、および、電磁波吸収体用組成物
CN109411887B (zh) * 2018-12-07 2024-04-05 厦门大学嘉庚学院 三维镜像工型缝隙分形偶极子超宽频带天线及终端
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JPH0993034A (ja) * 1995-09-22 1997-04-04 Tokin Corp 複合磁性体及びその製造方法ならびに電磁干渉抑制体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011087263A1 (de) * 2011-11-28 2013-05-29 Lenze Drives Gmbh Abschirmvorrichtung für elektrische Einheiten

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CN1165579A (zh) 1997-11-19
KR100267358B1 (ko) 2000-10-16
KR970706588A (ko) 1997-11-03
JPH0935927A (ja) 1997-02-07
EP0785557A4 (https=) 1997-07-30
EP0785557B1 (en) 1999-10-20
WO1997004469A1 (en) 1997-02-06
HK1001438A1 (en) 1998-06-19
EP0785557A1 (en) 1997-07-23
DE69604771D1 (de) 1999-11-25
CN1135574C (zh) 2004-01-21
TW305048B (https=) 1997-05-11

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Owner name: NEC TOKIN CORP., SENDAI, MIYAGI, JP