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DE69410739D1 - Klebeband für elektronische Bauteile und Flüssigklebstoff - Google Patents

Klebeband für elektronische Bauteile und Flüssigklebstoff

Info

Publication number
DE69410739D1
DE69410739D1 DE1994610739 DE69410739A DE69410739D1 DE 69410739 D1 DE69410739 D1 DE 69410739D1 DE 1994610739 DE1994610739 DE 1994610739 DE 69410739 A DE69410739 A DE 69410739A DE 69410739 D1 DE69410739 D1 DE 69410739D1
Authority
DE
Grant status
Grant
Patent type
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1994610739
Other languages
English (en)
Other versions
DE69410739T2 (de )
Inventor
Yukinori Sakumoto
Takeshi Hashimoto
Katsuji Nakaba
Masaharu Kobayashi
Takeshi Nishigaya
Fumiyoshi Yamanashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOMOEGAWA PAPER Manufacturing CO Ltd
Tomoegawa Paper Co Ltd
Original Assignee
TOMOEGAWA PAPER Manufacturing CO Ltd
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; MISCELLANEOUS COMPOSITIONS; MISCELLANEOUS APPLICATIONS OF MATERIALS
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/02Copolymers with acrylonitrile
    • C09J7/35
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415Five-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/544Silicon-containing compounds containing nitrogen
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826Connecting between the body and an opposite side of the item with respect to the body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73215Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/28Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31663As siloxane, silicone or silane
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31667Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31855Of addition polymer from unsaturated monomers
    • Y10T428/31931Polyene monomer-containing
DE1994610739 1993-10-22 1994-10-19 Klebeband für elektronische Bauteile und Flüssigklebstoff Expired - Fee Related DE69410739D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28620493A JP2732020B2 (ja) 1993-10-22 1993-10-22 電子部品用接着テープおよび液状接着剤

Publications (1)

Publication Number Publication Date
DE69410739D1 true DE69410739D1 (de) 1998-07-09

Family

ID=17701318

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1994610739 Expired - Fee Related DE69410739D1 (de) 1993-10-22 1994-10-19 Klebeband für elektronische Bauteile und Flüssigklebstoff
DE1994610739 Expired - Lifetime DE69410739T2 (de) 1993-10-22 1994-10-19 Klebeband für elektronische Bauteile und Flüssigklebstoff

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE1994610739 Expired - Lifetime DE69410739T2 (de) 1993-10-22 1994-10-19 Klebeband für elektronische Bauteile und Flüssigklebstoff

Country Status (4)

Country Link
US (3) US5494757A (de)
EP (1) EP0649892B1 (de)
JP (1) JP2732020B2 (de)
DE (2) DE69410739D1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996029730A1 (fr) 1994-12-26 1996-09-26 Hitachi Chemical Company, Ltd. Procede de stratification utilisant un film de stratification en un materiau organique adherant a la matrice, procede d'adhesion a la matrice, dispositif de stratification, dispositif d'adhesion a la matrice, dispositif semi-conducteur et procede pour fabriquer le dispositif semi-conducteur
US6099678A (en) * 1995-12-26 2000-08-08 Hitachi Chemical Company Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
JP2896751B2 (ja) * 1995-03-30 1999-05-31 株式会社巴川製紙所 電子部品用接着テープ
JP2896754B2 (ja) * 1995-06-08 1999-05-31 株式会社巴川製紙所 電子部品用接着テープ
EP0837498A4 (de) * 1995-07-06 1999-05-06 Hitachi Chemical Co Ltd Halbleiteranordnung und herstellungsverfahren
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
JP3535281B2 (ja) * 1995-08-31 2004-06-07 株式会社巴川製紙所 電子部品用接着テープ及び液状接着剤
KR100241567B1 (ko) 1996-04-19 2000-02-01 우찌가사끼 이사오 복합 필름 및 복합 필름이 부착된 리드 프레임
US5773113A (en) * 1996-11-21 1998-06-30 Brady Precision Tape Co. Adhesive compositions for electronic applications
US6512039B1 (en) * 2001-11-16 2003-01-28 Lord Corporation Adhesives for bonding peroxide-cured elastomers
US6751099B2 (en) * 2001-12-20 2004-06-15 Intel Corporation Coated heat spreaders
US20030232926A1 (en) * 2002-05-14 2003-12-18 Nikolic Nikola A. Thermoset adhesive films
KR100482665B1 (ko) 2004-04-19 2005-04-01 (주)새한마이크로닉스 카르복실 폴리아마이드 아미노카르보닐기 및 폴리실록산아미노카르보닐기를 함유하는 부타디엔-아크릴로니트릴공중합체 및 그 제조방법
KR100444925B1 (ko) * 2004-04-19 2004-08-09 (주)새한마이크로닉스 열경화성 접착제용 조성물 및 그를 이용한 전자부품용접착 테이프
CN100500785C (zh) 2006-11-06 2009-06-17 邢宏龙 织物用水性热红外隐身涂料粘合剂的制备方法
US9045685B2 (en) 2011-08-29 2015-06-02 Ticona Llc Cast molded parts formed from a liquid crystalline polymer
WO2013032975A1 (en) 2011-08-29 2013-03-07 Ticona Llc Thermotropic liquid crystalline polymer with improved low shear viscosity
WO2013032979A1 (en) 2011-08-29 2013-03-07 Ticona Llc Melt polymerization of low melt viscosity liquid crystalline polymers
JP2014525498A (ja) 2011-08-29 2014-09-29 ティコナ・エルエルシー 高流動性液晶ポリマー組成物
US9051514B2 (en) 2011-08-29 2015-06-09 Ticona Llc High flow liquid crystalline polymer composition
WO2013032977A1 (en) 2011-08-29 2013-03-07 Ticona Llc Heat-resistant liquid crystalline polymer composition having a low melting temperature
WO2013032971A1 (en) 2011-08-29 2013-03-07 Ticona Llc Melt-extruded substrate for use in thermoformed articles
JP2014529627A (ja) 2011-08-29 2014-11-13 ティコナ・エルエルシー 芳香族アミド化合物
WO2013032974A1 (en) 2011-08-29 2013-03-07 Ticona Llc Solid-state polymerization of a liquid crystalline polymer
WO2014130275A3 (en) 2013-02-22 2014-10-09 Ticona Llc High performance polymer composition with improved flow properties
WO2014197659A1 (en) 2013-06-07 2014-12-11 Ticona Llc High strength thermotropic liquid crystalline polymer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4145320A (en) * 1974-10-15 1979-03-20 Paolo Ferruti Polymers containing polyunsaturated acid radicals, process for their preparation and use thereof
US5298565A (en) * 1989-04-05 1994-03-29 The Lubrizol Corporation Graft copolymers and lubricants containing such as dispersant-viscosity improvers
DE4113316C2 (de) * 1991-04-24 2003-09-11 Bosch Gmbh Robert Anschlußschaltung für eine Lambdasonde und Prüfverfahren für eine solche Schaltung
JP2684004B2 (ja) * 1993-10-22 1997-12-03 株式会社巴川製紙所 ピペラジニルエチルアミノカルボニル基含有ブタジエン−アクリロニトリル共重合体およびその製造方法

Also Published As

Publication number Publication date Type
EP0649892B1 (de) 1998-06-03 grant
US5510189A (en) 1996-04-23 grant
US5512628A (en) 1996-04-30 grant
DE69410739T2 (de) 1998-10-01 grant
JPH07126591A (ja) 1995-05-16 application
EP0649892A1 (de) 1995-04-26 application
JP2732020B2 (ja) 1998-03-25 grant
US5494757A (en) 1996-02-27 grant

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