DE69404384D1 - Mittel zur Oberflächenbehandlung von Kupfer und Kupferlegierungen - Google Patents
Mittel zur Oberflächenbehandlung von Kupfer und KupferlegierungenInfo
- Publication number
- DE69404384D1 DE69404384D1 DE69404384T DE69404384T DE69404384D1 DE 69404384 D1 DE69404384 D1 DE 69404384D1 DE 69404384 T DE69404384 T DE 69404384T DE 69404384 T DE69404384 T DE 69404384T DE 69404384 D1 DE69404384 D1 DE 69404384D1
- Authority
- DE
- Germany
- Prior art keywords
- copper
- surface treatment
- treatment products
- alloys
- copper alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Chemical Treatment Of Metals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13299893A JP3277025B2 (ja) | 1993-05-10 | 1993-05-10 | 銅及び銅合金の表面処理剤 |
JP06550294A JP3367743B2 (ja) | 1994-03-08 | 1994-03-08 | 銅及び銅合金の表面処理剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69404384D1 true DE69404384D1 (de) | 1997-09-04 |
DE69404384T2 DE69404384T2 (de) | 1998-01-29 |
Family
ID=26406648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69404384T Expired - Lifetime DE69404384T2 (de) | 1993-05-10 | 1994-05-10 | Mittel zur Oberflächenbehandlung von Kupfer und Kupferlegierungen |
Country Status (7)
Country | Link |
---|---|
US (2) | US5498301A (de) |
EP (1) | EP0627499B1 (de) |
KR (1) | KR100298959B1 (de) |
CA (1) | CA2123183C (de) |
DE (1) | DE69404384T2 (de) |
MY (1) | MY116210A (de) |
TW (1) | TW270944B (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2781954B2 (ja) * | 1994-03-04 | 1998-07-30 | メック株式会社 | 銅および銅合金の表面処理剤 |
GB9425030D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Silver plating |
GB9425031D0 (en) * | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
JP2923524B2 (ja) * | 1995-08-01 | 1999-07-26 | メック株式会社 | 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法 |
AU5561696A (en) * | 1996-04-18 | 1997-11-07 | International Business Machines Corporation | Organic-metallic composite coating for copper surface protection |
CA2294898A1 (en) * | 1997-07-03 | 1999-01-14 | Neurogen Corporation | Certain diarylimidazole derivatives; a new class of npy specific ligands |
US6284309B1 (en) | 1997-12-19 | 2001-09-04 | Atotech Deutschland Gmbh | Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom |
US6036758A (en) * | 1998-08-10 | 2000-03-14 | Pmd (U.K.) Limited | Surface treatment of copper |
EP1008675B1 (de) * | 1998-12-10 | 2004-10-27 | International Business Machines Corporation | Vorbehandlung von Kupfer zum Abscheiden eines Zinnlegierungslotes |
US6524644B1 (en) | 1999-08-26 | 2003-02-25 | Enthone Inc. | Process for selective deposition of OSP coating on copper, excluding deposition on gold |
EP1237875B1 (de) | 1999-12-16 | 2005-08-31 | Schering Corporation | Substituierte imidazole als neuropeptide y y5 rezeptor antagonisten |
US6746547B2 (en) * | 2002-03-05 | 2004-06-08 | Rd Chemical Company | Methods and compositions for oxide production on copper |
DE602004028223D1 (de) * | 2003-03-19 | 2010-09-02 | Shikoku Chem | Lötverfahren unter verwendung einer imidazolverbindung |
CN1964949B (zh) * | 2004-06-10 | 2010-06-23 | 四国化成工业株式会社 | 在焊接过程中用于铜表面上的苯基萘基咪唑 |
BRPI0511916B1 (pt) * | 2004-06-10 | 2014-10-14 | Shikoku Chem | Fenilnaftilimidazóis para uso em superfícies de cobre durante soldagem |
US20070221503A1 (en) | 2006-03-22 | 2007-09-27 | Brian Larson | Precoat composition for organic solderability preservative |
CN100572362C (zh) * | 2006-10-24 | 2009-12-23 | 广东东硕科技有限公司 | 一种二苯基咪唑化合物及其制备方法 |
US7794531B2 (en) * | 2007-01-08 | 2010-09-14 | Enthone Inc. | Organic solderability preservative comprising high boiling temperature alcohol |
CN100516050C (zh) * | 2007-06-22 | 2009-07-22 | 广东东硕科技有限公司 | 一种含氟原子的二苯基咪唑化合物及其制备方法 |
CN101343252B (zh) * | 2008-01-25 | 2010-09-01 | 广州生产力促进中心 | 一种分离2,4-二苯基噁唑和2,4-二苯基咪唑混合物的方法 |
JP5313044B2 (ja) * | 2008-08-08 | 2013-10-09 | 四国化成工業株式会社 | 銅または銅合金の表面処理剤及びその利用 |
JP5301218B2 (ja) * | 2008-08-25 | 2013-09-25 | 四国化成工業株式会社 | 銅または銅合金の表面処理剤及びその利用 |
JP5321878B2 (ja) * | 2008-09-01 | 2013-10-23 | 四国化成工業株式会社 | 銅または銅合金の表面処理剤及びその利用 |
JP5484795B2 (ja) * | 2008-09-03 | 2014-05-07 | 四国化成工業株式会社 | 2−ベンジル−4−(3,4−ジクロロフェニル)−5−メチルイミダゾール化合物 |
KR101602985B1 (ko) * | 2008-10-06 | 2016-03-11 | 시코쿠가세이고교가부시키가이샤 | 2-벤질-4-(2,4-디클로로페닐)-5-메틸이미다졸 화합물 |
DE102009047043A1 (de) | 2009-10-19 | 2011-04-21 | Robert Bosch Gmbh | Lötfreie elektrische Verbindung |
CN101697662B (zh) * | 2009-10-29 | 2011-04-27 | 深圳市唯特偶新材料股份有限公司 | 一种高抗热性有机保焊剂 |
CN101758338B (zh) * | 2009-12-23 | 2012-02-29 | 长沙理工大学 | 一种有机保焊剂的低温增溶剂及其应用方法 |
CN101928248B (zh) * | 2010-08-04 | 2012-07-25 | 和夏化学(太仓)有限公司 | 一种2-苯基咪唑类化合物的制备方法 |
JP5615227B2 (ja) * | 2011-05-23 | 2014-10-29 | 四国化成工業株式会社 | 銅または銅合金の表面処理剤及びその利用 |
JP5615233B2 (ja) * | 2011-06-20 | 2014-10-29 | 四国化成工業株式会社 | 銅または銅合金の表面処理剤及びその利用 |
CN102873471A (zh) * | 2012-09-13 | 2013-01-16 | 广东达志环保科技股份有限公司 | 一种烷基苯骈咪唑衍生物的组合溶液和有机保焊剂的制备方法 |
US8961678B2 (en) | 2012-12-20 | 2015-02-24 | Rohm And Haas Electronic Materials Llc | Organic solderability preservative and method |
CN104918417A (zh) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | 一种在线路板表面制作有机保焊膜的方法 |
JP6402134B2 (ja) * | 2016-05-12 | 2018-10-10 | 株式会社タムラ製作所 | 水溶性プリフラックス、それを用いた表面処理方法 |
JP6779557B1 (ja) * | 2020-07-20 | 2020-11-04 | メック株式会社 | 被膜形成用組成物、表面処理金属部材の製造方法、および金属‐樹脂複合体の製造方法 |
CN112064003B (zh) * | 2020-08-20 | 2022-06-17 | 华帝股份有限公司 | 一种前处理剂及其制备方法和应用 |
CN115043779B (zh) * | 2022-06-14 | 2024-06-25 | 广东金柏化学有限公司 | 一种2,4-二苯基咪唑化合物及其制备方法与应用 |
CN115011956A (zh) * | 2022-06-28 | 2022-09-06 | 南通赛可特电子有限公司 | 一种有机铜面保护剂及其制备方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2089003A5 (de) * | 1970-04-02 | 1972-01-07 | Shikoku Chem | |
JPS5822545B2 (ja) * | 1979-10-22 | 1983-05-10 | 四国化成工業株式会社 | 銅および銅合金の表面処理方法 |
JPS5698479A (en) * | 1980-01-09 | 1981-08-07 | Shikoku Chem Corp | Method of coloring metal surface |
JPS6232113A (ja) * | 1985-08-05 | 1987-02-12 | Shikoku Chem Corp | ポリエポキシ樹脂の硬化方法 |
JPS62238383A (ja) * | 1986-04-07 | 1987-10-19 | Chiyoda Kagaku Kenkyusho:Kk | 防食剤 |
JPH04206681A (ja) * | 1990-11-30 | 1992-07-28 | Hitachi Ltd | 印刷配線板の表面処理方法及び印刷配線板 |
JPH04202780A (ja) * | 1990-11-30 | 1992-07-23 | Shikoku Chem Corp | 銅及び銅合金の表面処理方法並びに印刷配線板 |
-
1994
- 1994-05-05 TW TW083104080A patent/TW270944B/zh not_active IP Right Cessation
- 1994-05-09 CA CA002123183A patent/CA2123183C/en not_active Expired - Fee Related
- 1994-05-09 US US08/239,557 patent/US5498301A/en not_active Expired - Lifetime
- 1994-05-10 KR KR1019940010181A patent/KR100298959B1/ko not_active IP Right Cessation
- 1994-05-10 EP EP94303360A patent/EP0627499B1/de not_active Expired - Lifetime
- 1994-05-10 DE DE69404384T patent/DE69404384T2/de not_active Expired - Lifetime
- 1994-05-10 MY MYPI94001165A patent/MY116210A/en unknown
-
1995
- 1995-08-29 US US08/520,477 patent/US5560785A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TW270944B (de) | 1996-02-21 |
MY116210A (en) | 2003-12-31 |
CA2123183C (en) | 2006-07-25 |
EP0627499B1 (de) | 1997-07-23 |
US5560785A (en) | 1996-10-01 |
US5498301A (en) | 1996-03-12 |
KR100298959B1 (ko) | 2001-11-22 |
CA2123183A1 (en) | 1994-11-11 |
EP0627499A1 (de) | 1994-12-07 |
DE69404384T2 (de) | 1998-01-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69404384D1 (de) | Mittel zur Oberflächenbehandlung von Kupfer und Kupferlegierungen | |
DE69421193D1 (de) | Mittel und Verfahren zur Metallbehandlung | |
DE69312624D1 (de) | Vorrichtung zur unterscheidung von tachykardien und fibrillationen und zur entsprechenden behandlung | |
DE69421100D1 (de) | Aufbereitung von schweren endprodukten des fischer-tropsch-verfahrens | |
DE69432114D1 (de) | System zum Identifizieren und Verarbeiten von Formularen | |
DE69700266D1 (de) | Oberflächenbehandlungsmittel für Kupfer und Kupferlegierungen | |
EP0643196A3 (de) | Verfestigbares teilchenartiges Material und Verfahren zur Bohrlochbehandlung. | |
DE69739758D1 (de) | Vakzine zur behandlung von lymphomen und leukämie | |
DE69023477D1 (de) | Temperatur-geregelte nahrungsmittelbehandlungsvorrichtung und verfahren. | |
DE69003973D1 (de) | Mittel zur Oberflächenbehandlung von Kupfer oder Kupferlegierungen. | |
DE69423660D1 (de) | Zusammensetzung und Verfahren zur Oberflächenbehandlung von Kupfer und Kupferlegierungen | |
DE69427684D1 (de) | System zum Transport und zur Verarbeitung von Proben | |
DE69425764D1 (de) | Mittel zum Entfernen von Flussmittel und Einrichtung zum Reinigen | |
DE69713185D1 (de) | Zusammensetzung zum Mikroätzen von Kupfer und Kupferlegierungen | |
DE69714862D1 (de) | Lösungen und verfahren zur oberblächenbehandlung von metallen | |
DE69404785D1 (de) | Vorrichtung zur Behandlung von Oberflächen | |
DE69725664D1 (de) | Vorrichtung zur Erhöhung und Verringerung der Geschwindigkeit von Gegenständen | |
DE69422821D1 (de) | Verfahren und vorrichtung zur oberflächenbehandlung von teilen | |
DE69422716D1 (de) | Methode zur verbesserung der oxydation und ammoxydationskatalysatoren | |
DE69427846D1 (de) | Gerät und Methode zur Unterteilung von Festkörpern | |
DE69727240D1 (de) | Kombinationen enthaltend vx478, zidovudin und 3tc zur behandlung von hiv | |
GB9921225D0 (en) | Methods for treating aluminium substrates and products thereof | |
DE69520745D1 (de) | Vorrichtung und verfahren zur kontinuierlichen kühlung von nahrungsmitteln | |
DE59409387D1 (de) | Vorrichtung zur Wärmebehandlung von Werkstücken | |
ATE275347T1 (de) | Dragier-produkte und herstellungsverfahren |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |