DE69401453D1 - Zusammensetzung für die Behandlung von Kupfer oder Kupferlegierungen - Google Patents

Zusammensetzung für die Behandlung von Kupfer oder Kupferlegierungen

Info

Publication number
DE69401453D1
DE69401453D1 DE69401453T DE69401453T DE69401453D1 DE 69401453 D1 DE69401453 D1 DE 69401453D1 DE 69401453 T DE69401453 T DE 69401453T DE 69401453 T DE69401453 T DE 69401453T DE 69401453 D1 DE69401453 D1 DE 69401453D1
Authority
DE
Germany
Prior art keywords
copper
treatment
composition
alloys
copper alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69401453T
Other languages
English (en)
Other versions
DE69401453T2 (de
Inventor
Daisaku Akiyama
Yoshiro Maki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEC Co Ltd
Original Assignee
MEC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEC Co Ltd filed Critical MEC Co Ltd
Publication of DE69401453D1 publication Critical patent/DE69401453D1/de
Application granted granted Critical
Publication of DE69401453T2 publication Critical patent/DE69401453T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
DE69401453T 1993-04-05 1994-03-30 Zusammensetzung für die Behandlung von Kupfer oder Kupferlegierungen Expired - Fee Related DE69401453T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5100121A JPH06287774A (ja) 1993-04-05 1993-04-05 銅および銅合金の表面処理剤

Publications (2)

Publication Number Publication Date
DE69401453D1 true DE69401453D1 (de) 1997-02-27
DE69401453T2 DE69401453T2 (de) 1997-04-30

Family

ID=14265513

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69401453T Expired - Fee Related DE69401453T2 (de) 1993-04-05 1994-03-30 Zusammensetzung für die Behandlung von Kupfer oder Kupferlegierungen

Country Status (7)

Country Link
US (1) US5439783A (de)
EP (1) EP0620293B1 (de)
JP (1) JPH06287774A (de)
CN (1) CN1053233C (de)
DE (1) DE69401453T2 (de)
SG (1) SG47858A1 (de)
TW (1) TW256856B (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2923524B2 (ja) * 1995-08-01 1999-07-26 メック株式会社 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法
TW374802B (en) 1996-07-29 1999-11-21 Ebara Densan Ltd Etching composition, method for roughening copper surface and method for producing printed wiring board
AU6268198A (en) * 1997-01-31 1998-08-25 James M. Taylor Composition and method for priming substrate materials
US6284309B1 (en) 1997-12-19 2001-09-04 Atotech Deutschland Gmbh Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
JP2000064067A (ja) 1998-06-09 2000-02-29 Ebara Densan Ltd エッチング液および銅表面の粗化処理方法
US6524644B1 (en) 1999-08-26 2003-02-25 Enthone Inc. Process for selective deposition of OSP coating on copper, excluding deposition on gold
US6432826B1 (en) * 1999-11-29 2002-08-13 Applied Materials, Inc. Planarized Cu cleaning for reduced defects
US7220322B1 (en) 2000-08-24 2007-05-22 Applied Materials, Inc. Cu CMP polishing pad cleaning
WO2002061810A1 (en) * 2001-01-16 2002-08-08 Cabot Microelectronics Corporation Ammonium oxalate-containing polishing system and method
JP4309602B2 (ja) * 2001-04-25 2009-08-05 メック株式会社 銅または銅合金と樹脂との接着性を向上させる方法、ならびに積層体
US6783432B2 (en) 2001-06-04 2004-08-31 Applied Materials Inc. Additives for pressure sensitive polishing compositions
US20030221748A1 (en) * 2002-05-30 2003-12-04 Fry's Metals, Inc. Solder paste flux system
JP4018559B2 (ja) * 2003-02-27 2007-12-05 メック株式会社 電子基板の製造方法
US7232478B2 (en) 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
US7210988B2 (en) 2004-08-24 2007-05-01 Applied Materials, Inc. Method and apparatus for reduced wear polishing pad conditioning
TW200720493A (en) 2005-10-31 2007-06-01 Applied Materials Inc Electrochemical method for ecmp polishing pad conditioning
US7794531B2 (en) * 2007-01-08 2010-09-14 Enthone Inc. Organic solderability preservative comprising high boiling temperature alcohol
KR20100061731A (ko) * 2007-09-14 2010-06-08 퀄컴 엠이엠스 테크놀로지스, 인크. Ｍｅｍｓ 제조에 이용되는 에칭 방법
JP5363377B2 (ja) * 2010-02-19 2013-12-11 新光電気工業株式会社 配線基板及びその製造方法
CN102717161B (zh) * 2011-05-10 2014-09-03 中国科学院金属研究所 一种通过表面多孔结构实现钎焊性可调的工艺
US9644274B2 (en) 2011-07-04 2017-05-09 Mitsubishi Gas Chemical Company, Inc. Etching solution for copper or a compound comprised mainly of copper
JP5382892B2 (ja) * 2012-12-27 2014-01-08 メック株式会社 エッチング方法
KR101318733B1 (ko) * 2013-06-13 2013-10-18 주식회사 에이씨엠 구리 유기 착물을 이용한 에칭제 조성물
CN103441129A (zh) * 2013-08-23 2013-12-11 京东方科技集团股份有限公司 阵列基板及其制作方法和显示装置
US9735177B2 (en) 2013-08-23 2017-08-15 Boe Technology Group Co., Ltd. Array substrate, method for manufacturing the same and display device
JP6218000B2 (ja) 2016-02-19 2017-10-25 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
JP6710402B2 (ja) * 2017-10-23 2020-06-17 メック株式会社 膜形成基材の製造方法及び表面処理剤
CN109487257A (zh) * 2018-11-13 2019-03-19 南通赛可特电子有限公司 一种osp铜面抗氧化剂及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5221460B1 (de) * 1971-04-26 1977-06-10
JPS5120972B1 (de) * 1971-05-13 1976-06-29
JPS5332341B2 (de) * 1973-03-27 1978-09-07
US4264418A (en) * 1978-09-19 1981-04-28 Kilene Corp. Method for detersifying and oxide coating removal
US4319955A (en) * 1980-11-05 1982-03-16 Philip A. Hunt Chemical Corp. Ammoniacal alkaline cupric etchant solution for and method of reducing etchant undercut
JPH0249393B2 (ja) * 1983-05-31 1990-10-30 Yamatoya Shokai Dooyobidogokinnoetsuchingueki
JPS6190492A (ja) * 1984-10-11 1986-05-08 四国化成工業株式会社 銅スル−ホ−ルプリント配線板の製造方法
US4859281A (en) * 1987-06-04 1989-08-22 Pennwalt Corporation Etching of copper and copper bearing alloys
US5219484A (en) * 1991-04-25 1993-06-15 Applied Electroless Concepts Inc. Solder and tin stripper compositions

Also Published As

Publication number Publication date
EP0620293B1 (de) 1997-01-15
TW256856B (de) 1995-09-11
CN1053233C (zh) 2000-06-07
US5439783A (en) 1995-08-08
CN1120077A (zh) 1996-04-10
JPH06287774A (ja) 1994-10-11
SG47858A1 (en) 1998-04-17
EP0620293A1 (de) 1994-10-19
DE69401453T2 (de) 1997-04-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee