DE69325123T2 - Verfahren zum Herstellen einer Platte aus einem elektrisch isolierenden Material mit einem Muster von Löchern oder Hohlräumen zum Gebrauch in Wiedergabeanordungen - Google Patents

Verfahren zum Herstellen einer Platte aus einem elektrisch isolierenden Material mit einem Muster von Löchern oder Hohlräumen zum Gebrauch in Wiedergabeanordungen

Info

Publication number
DE69325123T2
DE69325123T2 DE69325123T DE69325123T DE69325123T2 DE 69325123 T2 DE69325123 T2 DE 69325123T2 DE 69325123 T DE69325123 T DE 69325123T DE 69325123 T DE69325123 T DE 69325123T DE 69325123 T2 DE69325123 T2 DE 69325123T2
Authority
DE
Germany
Prior art keywords
cavities
pattern
holes
making
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69325123T
Other languages
English (en)
Other versions
DE69325123D1 (de
Inventor
Haas Franciscus Cupertinus De
Laarhoven Franicscus Marti Van
Beek Johannes Gerardus Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to EP92200829 priority Critical
Priority to EP93200420 priority
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of DE69325123D1 publication Critical patent/DE69325123D1/de
Application granted granted Critical
Publication of DE69325123T2 publication Critical patent/DE69325123T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C11/00Selection of abrasive materials or additives for abrasive blasts
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00Cathode ray tubes; Electron beam tubes
    • H01J31/08Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
    • H01J31/10Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
    • H01J31/12Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
    • H01J31/123Flat display tubes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00Cathode ray tubes; Electron beam tubes
    • H01J31/08Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
    • H01J31/10Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
    • H01J31/12Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
    • H01J31/123Flat display tubes
    • H01J31/124Flat display tubes using electron beam scanning
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02Manufacture of electrodes or electrode systems
    • H01J9/14Manufacture of electrodes or electrode systems of non-emitting electrodes
    • H01J9/148Manufacture of electrodes or electrode systems of non-emitting electrodes of electron emission flat panels, e.g. gate electrodes, focusing electrodes or anode electrodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02Manufacture of electrodes or electrode systems
    • H01J9/18Assembling together the component parts of electrode systems
    • H01J9/185Assembling together the component parts of electrode systems of flat panel display devices, e.g. by using spacers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00Electron emission display panels, e.g. field emission display panels
    • H01J2329/86Vessels
    • H01J2329/8625Spacing members
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00Electron emission display panels, e.g. field emission display panels
    • H01J2329/86Vessels
    • H01J2329/8625Spacing members
    • H01J2329/863Spacing members characterised by the form or structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
DE69325123T 1992-03-23 1993-03-16 Verfahren zum Herstellen einer Platte aus einem elektrisch isolierenden Material mit einem Muster von Löchern oder Hohlräumen zum Gebrauch in Wiedergabeanordungen Expired - Fee Related DE69325123T2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP92200829 1992-03-23
EP93200420 1993-02-16

Publications (2)

Publication Number Publication Date
DE69325123D1 DE69325123D1 (de) 1999-07-08
DE69325123T2 true DE69325123T2 (de) 1999-11-18

Family

ID=26131312

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69325123T Expired - Fee Related DE69325123T2 (de) 1992-03-23 1993-03-16 Verfahren zum Herstellen einer Platte aus einem elektrisch isolierenden Material mit einem Muster von Löchern oder Hohlräumen zum Gebrauch in Wiedergabeanordungen

Country Status (5)

Country Link
US (2) US5767621A (de)
JP (1) JPH0639717A (de)
KR (1) KR100309080B1 (de)
CN (2) CN1058581C (de)
DE (1) DE69325123T2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5769311A (en) * 1994-08-02 1998-06-23 Toppan Printing Co., Ltd. Heat insulating cup and method of manufacturing the same
DE69412609T2 (de) * 1994-09-06 1999-03-11 Koninkl Philips Electronics Nv Verfahren zur Herstellung eines Musters auf einem beschichteten Substrat
TW344696B (en) * 1996-11-22 1998-11-11 Philips Electronics Nv Powder-blasting method
US5883380A (en) * 1997-06-04 1999-03-16 Sinor; Timothy W. Night vision device, improved image intensifier tube for such a device having reduced particulate contamination and method of making
GB9915925D0 (en) * 1999-07-08 1999-09-08 Univ Loughborough Flow field plates
JP2003507198A (ja) * 1999-08-18 2003-02-25 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ プレートに凹所又は開孔のパターンを形成する方法
US6568994B1 (en) * 1999-08-24 2003-05-27 General Electric Company Shifting edge scrubbing
KR20020009828A (ko) * 2000-07-27 2002-02-02 윤종용 잉크 젯 프린트 헤드의 비아홀 형성방법
JP3788596B2 (ja) * 2001-10-22 2006-06-21 パイオニア株式会社 立体マスクを用いる加工方法及び該立体マスクの製造方法
US6769956B1 (en) * 2002-02-04 2004-08-03 Oberg Industries Apparatus and method for rapid, precise positioning of a grit-blasting nozzle
US6859343B1 (en) * 2002-03-19 2005-02-22 Western Digital, Inc. Hybrid diffuser for minimizing thermal pole tip protrusion and reader sensor temperature
KR100813832B1 (ko) * 2002-05-31 2008-03-17 삼성에스디아이 주식회사 증착용 마스크 프레임 조립체와 이의 제조방법
US6866561B2 (en) * 2003-04-01 2005-03-15 Anodizing Industries, Inc. Decorative bat
JP4921831B2 (ja) 2006-04-05 2012-04-25 株式会社神戸製鋼所 ウォータージェットによる溝加工方法、熱交換器部材および熱交換器
TW200828388A (en) * 2006-12-29 2008-07-01 Tatung Co Field emission display
JP5291307B2 (ja) * 2007-08-03 2013-09-18 株式会社不二製作所 スクリーン印刷用メタルマスクの製造方法
SG154342A1 (en) * 2008-01-08 2009-08-28 Opulent Electronics Internat P Insulated metal substrate fabrication
US8622784B2 (en) * 2008-07-02 2014-01-07 Huffman Corporation Method for selectively removing portions of an abradable coating using a water jet
JP5528262B2 (ja) * 2010-08-25 2014-06-25 株式会社不二製作所 サンドブラストによる切削加工方法
KR101377058B1 (ko) * 2012-02-16 2014-03-28 한양대학교 에리카산학협력단 분사된 고체상 기체입자의 압흔 형성장치 및 이를 포함하는 충돌력 분석시스템
JP6022862B2 (ja) * 2012-05-08 2016-11-09 株式会社不二製作所 硬質脆性基板の切り出し方法及び切り出し装置
CN103042375B (zh) * 2013-01-08 2016-03-16 中国人民解放军装甲兵工程学院 一种金属基体或涂层表面制备规则微织构的加工方法
CN104647219B (zh) * 2014-06-21 2017-11-17 广西柳州中嘉知识产权服务有限公司 加工弯曲板上蜂孔的方法
US9446501B2 (en) * 2014-12-31 2016-09-20 Spirit Aerosystems, Inc. Method and apparatus for abrasive stream perforation
US10556320B2 (en) * 2017-01-07 2020-02-11 James T. Carnathan Computerized method and apparatus for automated sand blasting
CN109227405B (zh) * 2018-09-26 2021-04-13 湖南环境生物职业技术学院 掩膜辅助高速可溶磨粒电液射流制造表面功能微结构装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1954672A (en) * 1934-01-11 1934-04-10 Robert H Kavanaugh Stencil
US2791289A (en) * 1952-12-10 1957-05-07 Simpson Timber Co Process of forming fissured fiber acoustical tile and product thereof
US3270464A (en) * 1964-04-28 1966-09-06 Pangborn Corp Abrasive blasting apparatus
DE2412869C3 (de) * 1974-03-18 1980-10-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen
JPS50135979A (de) * 1974-04-16 1975-10-28
US3935500A (en) * 1974-12-09 1976-01-27 Texas Instruments Incorporated Flat CRT system
DE2855090C2 (de) * 1978-12-20 1980-09-18 Siemens Ag, 1000 Berlin Und 8000 Muenchen
US4237209A (en) * 1979-05-09 1980-12-02 The United States Of America As Represented By The Secretary Of The Army Erosion lithography with high-aspect nozzle
US4405878A (en) * 1979-05-09 1983-09-20 The United States Of America As Represented By The Secretary Of The Army Bonded grid-cathode electrode structure
US4341976A (en) * 1980-03-05 1982-07-27 Alpha-Omega Development, Inc. Display system
US4409513A (en) * 1980-04-30 1983-10-11 Rca Corporation Electrode for an electron gun
JPH048182B2 (de) * 1983-07-12 1992-02-14 Asahi Chemical Ind
US4827186A (en) * 1987-03-19 1989-05-02 Magnavox Government And Industrial Electronics Company Alternating current plasma display panel
US5086297A (en) * 1988-06-14 1992-02-04 Dai Nippon Insatsu Kabushiki Kaisha Plasma display panel and method of forming fluorescent screen thereof
JP2814557B2 (ja) * 1989-05-16 1998-10-22 富士通株式会社 ガス放電パネルの製造方法
NL9000060A (nl) * 1989-06-01 1991-01-02 Philips Nv Beeldweergeefinrichting van het dunne type.
US5160871A (en) * 1989-06-19 1992-11-03 Matsushita Electric Industrial Co., Ltd. Flat configuration image display apparatus and manufacturing method thereof
JP2736267B2 (ja) * 1989-06-21 1998-04-02 株式会社日本紙パルプ研究所 パルプの製造方法
JP2964512B2 (ja) * 1989-12-18 1999-10-18 日本電気株式会社 カラープラズマディスプレイ
US5069004A (en) * 1990-02-27 1991-12-03 Gillenwater R Lee Abrasive engraving process
KR920004142B1 (ko) * 1990-07-03 1992-05-25 삼성전관 주식회사 플라즈마 표시소자
JPH05253841A (ja) * 1992-03-05 1993-10-05 Hitachi Ltd ファイングレインミリング加工装置及びその方法
BE1007894A3 (nl) * 1993-12-20 1995-11-14 Philips Electronics Nv Werkwijze voor het vervaardigen van een plaat van niet-metallisch materiaal met een patroon van gaten en/of holten.

Also Published As

Publication number Publication date
US5767621A (en) 1998-06-16
JPH0639717A (ja) 1994-02-15
CN1058581C (zh) 2000-11-15
US5833516A (en) 1998-11-10
KR100309080B1 (ko) 2002-03-21
KR930020494A (ko) 1993-10-19
CN1265517A (zh) 2000-09-06
DE69325123D1 (de) 1999-07-08
CN1079072A (zh) 1993-12-01

Similar Documents

Publication Publication Date Title
DE69025470D1 (de) Elektrische enzymfühlerelektrode sowie deren herstellungsverfahren
KR950013991B1 (en) Method and apparatus for electrostatic coating with conductive material
DE3569840D1 (en) Intermediate layer material of three-layer resist system and method of forming resist pattern
DE3856021T2 (de) Mehrschichtverbindung für integrierte Schaltungsstruktur mit zwei oder mehreren metallischen Leiterschichten und Verfahren zum Herstellen derselben
DE69203250D1 (de) Verfahren zum Steuern der Blutzirkulation in einem Einnadelkreislauf.
IT1093118B (it) Metodo ed apparecchio per fabbricare cablaggi elettrici
DE3580740D1 (de) Vorrichtung und verfahren zum gewinnen einer oberflaechenprofilometrie und von dreidimensionalen oberflaechenkonturen.
AT199992T (de) METHOD FOR FORMING AREAS OF SELECTED FERROELECTRIC POLARIZATION IN A BODY OF FERROELECTRIC MATERIAL
DE3509713A1 (de) Mitkopplungsschaltung und verfahren zum bilden derselben
DE3509714A1 (de) Mitkopplungsschaltung und verfahren zum bilden derselben
JPS6066426A (en) Improving method for bonding conductive metal material in preselected pattern on transparent conductive layer of semiconductor element
LV10219B (en) Multilayer material with diffraction structural layer and method of protection of certificate
DE2758147A1 (de) Verfahren und vorrichtung zum aufplattieren von nickel-eisen-schichten
DE3442131A1 (de) Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
DE69032793D1 (de) Verfahren zum Herstellen einer Karte
AT156960T (de) METHOD FOR ASSIGNING CHANNEL DISTRIBUTION PATTERNS IN A CELLULAR SYSTEM WITH REPEAT PATTERN
DE3437511A1 (de) Integrationsschaltung fuer grossschaltkreise, die in isochrone gebiete unterteilt ist, verfahren zum maschinengesteuerten entwerfen einer derartigen schaltung und verfahren zum maschinengesteuerten pruefen einer derartigen schaltung
DE69025886D1 (de) Verfahren zum teilweisen Anfüllen von Kontakten oder Durchführungen verschiedener Tiefe
DE69123216D1 (de) Verfahren und Gerät zum Schreiben oder Gravieren von feinen Linienmustern auf isolierenden Materialien
DE2915366A1 (de) Verfahren und vorrichtung zum bestuecken von platinen gedruckter schaltungen mit chipartigen schaltelementen
DE3009351A1 (de) Verfahren zur herstellung elektrische leitfaehiger heteropolyphenylene und deren verwendung in der elektrotechnik und zur antistatischen ausruestung von kunststoffen
DE69300988D1 (de) Verfahren und Vorrichtung zum elektroerosiven Herstellen hohler 3-D-Kontouren mit einer dünnen rotierenden Elektrode
DE3247344A1 (de) Verfahren zum herstellen von schaltungsplatten
DE2922416A1 (de) Schattenwurfmaske zum strukturieren von oberflaechenbereichen und verfahren zu ihrer herstellung
JPS5799797A (en) Circuit with printed conductive surface and method of producing same

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: VOLMER, G., DIPL.-ING., PAT.-ANW., 52066 AACHEN

8339 Ceased/non-payment of the annual fee