DE69313808D1 - Verfahren zur Regelung eines reaktiven Sputterprozesses - Google Patents

Verfahren zur Regelung eines reaktiven Sputterprozesses

Info

Publication number
DE69313808D1
DE69313808D1 DE69313808T DE69313808T DE69313808D1 DE 69313808 D1 DE69313808 D1 DE 69313808D1 DE 69313808 T DE69313808 T DE 69313808T DE 69313808 T DE69313808 T DE 69313808T DE 69313808 D1 DE69313808 D1 DE 69313808D1
Authority
DE
Germany
Prior art keywords
controlling
reactive sputtering
sputtering process
reactive
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69313808T
Other languages
English (en)
Other versions
DE69313808T2 (de
Inventor
Bruno Stauder
Frederic Perry
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HEF R&D(HYDROMECANIQUE ET FROTTEMENT), ANDREZIEUX-
Original Assignee
INST NATIONALE POLYTECHNIQUE D
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by INST NATIONALE POLYTECHNIQUE D filed Critical INST NATIONALE POLYTECHNIQUE D
Application granted granted Critical
Publication of DE69313808D1 publication Critical patent/DE69313808D1/de
Publication of DE69313808T2 publication Critical patent/DE69313808T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
DE69313808T 1992-12-30 1993-12-23 Verfahren zur Regelung eines reaktiven Sputterprozesses Expired - Fee Related DE69313808T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9215924A FR2699934B1 (fr) 1992-12-30 1992-12-30 Procédé de contrôle de la concentration en métalloïde d'un dépôt réalisés par voie physique en phase vapeur réactive à l'aide d'un plasma froid de pulvérisation.

Publications (2)

Publication Number Publication Date
DE69313808D1 true DE69313808D1 (de) 1997-10-16
DE69313808T2 DE69313808T2 (de) 1998-04-02

Family

ID=9437286

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69313808T Expired - Fee Related DE69313808T2 (de) 1992-12-30 1993-12-23 Verfahren zur Regelung eines reaktiven Sputterprozesses

Country Status (4)

Country Link
US (1) US5492606A (de)
EP (1) EP0605299B1 (de)
DE (1) DE69313808T2 (de)
FR (1) FR2699934B1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5942089A (en) * 1996-04-22 1999-08-24 Northwestern University Method for sputtering compounds on a substrate
US5693417A (en) * 1995-05-22 1997-12-02 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Vacuum-coated compound body and process for its production
US5698314A (en) * 1995-05-22 1997-12-16 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Compound body of vacuum-coated sintered material and process for its production
JP2904263B2 (ja) * 1995-12-04 1999-06-14 日本電気株式会社 スパッタ装置
DE19610012B4 (de) * 1996-03-14 2005-02-10 Unaxis Deutschland Holding Gmbh Verfahren zur Stabilisierung eines Arbeitspunkts beim reaktiven Zerstäuben in einer Sauerstoff enthaltenden Atmosphäre
US6071811A (en) * 1997-02-26 2000-06-06 Applied Materials, Inc. Deposition of titanium nitride films having improved uniformity
DE19711137C1 (de) * 1997-03-07 1998-08-13 Siemens Ag Verfahren zum Aufbringen texturierter YSZ-Schichten durch Sputter-Beschichten
SE9704607D0 (sv) * 1997-12-09 1997-12-09 Chemfilt R & D Ab A method and apparatus for magnetically enhanced sputtering
DE19956733A1 (de) 1999-11-25 2001-06-28 Fraunhofer Ges Forschung Verfahren zur Regelung von Sputterprozessen
SE521095C2 (sv) * 2001-06-08 2003-09-30 Cardinal Cg Co Förfarande för reaktiv sputtring
US6620670B2 (en) * 2002-01-18 2003-09-16 Applied Materials, Inc. Process conditions and precursors for atomic layer deposition (ALD) of AL2O3
DE10311466B4 (de) * 2003-03-15 2005-07-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum reaktiven Magnetron-Sputtern
SE0302045D0 (sv) 2003-07-10 2003-07-10 Chemfilt R & D Ab Work piece processing by pulsed electric discharges in solid-gas plasmas
GB2437080B (en) * 2006-04-11 2011-10-12 Hauzer Techno Coating Bv A vacuum treatment apparatus, a bias power supply and a method of operating a vacuum treatment apparatus
JP2011211168A (ja) * 2010-03-09 2011-10-20 Toshiba Corp 半導体装置の製造方法及び半導体製造装置
EP2484796A1 (de) 2011-02-04 2012-08-08 Pivot a.s. Magnetron-Sputterverfahren

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE262246C (de) *
JPS57161063A (en) * 1981-03-31 1982-10-04 Nippon Sheet Glass Co Ltd Method and device for sticking metallic oxide film on substrate
DE3700633C2 (de) * 1987-01-12 1997-02-20 Reinar Dr Gruen Verfahren und Vorrichtung zum schonenden Beschichten elektrisch leitender Gegenstände mittels Plasma
JPS63176466A (ja) * 1987-01-12 1988-07-20 Toyobo Co Ltd スパツタリング装置
DE3821207A1 (de) * 1988-06-23 1989-12-28 Leybold Ag Anordnung zum beschichten eines substrats mit dielektrika
JPH0238566A (ja) * 1988-07-27 1990-02-07 Hitachi Ltd スパッタ方法およびその装置
JPH0774445B2 (ja) * 1989-11-30 1995-08-09 アプライド マテリアルズ インコーポレーテッド 閉ループ制御反応スパッタリングにより所定成分比の金属化合物層を形成するプロセス及び装置
US5108569A (en) * 1989-11-30 1992-04-28 Applied Materials, Inc. Process and apparatus for forming stoichiometric layer of a metal compound by closed loop voltage controlled reactive sputtering
JP2936276B2 (ja) * 1990-02-27 1999-08-23 日本真空技術株式会社 透明導電膜の製造方法およびその製造装置
EP0508359B1 (de) * 1991-04-12 1996-10-09 Balzers Aktiengesellschaft Verfahren und Anlage zur Beschichtung mindestens eines Gegenstandes

Also Published As

Publication number Publication date
EP0605299A1 (de) 1994-07-06
US5492606A (en) 1996-02-20
EP0605299B1 (de) 1997-09-10
DE69313808T2 (de) 1998-04-02
FR2699934A1 (fr) 1994-07-01
FR2699934B1 (fr) 1995-03-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HEF R&D(HYDROMECANIQUE ET FROTTEMENT), ANDREZIEUX-

8339 Ceased/non-payment of the annual fee