DE69305634D1 - Verfahren zur herstellung von mikrostrukturen - Google Patents
Verfahren zur herstellung von mikrostrukturenInfo
- Publication number
- DE69305634D1 DE69305634D1 DE69305634T DE69305634T DE69305634D1 DE 69305634 D1 DE69305634 D1 DE 69305634D1 DE 69305634 T DE69305634 T DE 69305634T DE 69305634 T DE69305634 T DE 69305634T DE 69305634 D1 DE69305634 D1 DE 69305634D1
- Authority
- DE
- Germany
- Prior art keywords
- producing microstructures
- microstructures
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
- B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
- B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
- B81C1/00928—Eliminating or avoiding remaining moisture after the wet etch release of the movable structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0035—Testing
- B81C99/004—Testing during manufacturing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/13—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by measuring the force required to restore a proofmass subjected to inertial forces to a null position
- G01P15/131—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by measuring the force required to restore a proofmass subjected to inertial forces to a null position with electrostatic counterbalancing means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Micromachines (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/872,037 US5314572A (en) | 1990-08-17 | 1992-04-22 | Method for fabricating microstructures |
PCT/US1993/003179 WO1993021536A1 (en) | 1992-04-22 | 1993-04-05 | Method for fabricating microstructures |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69305634D1 true DE69305634D1 (de) | 1996-11-28 |
DE69305634T2 DE69305634T2 (de) | 1997-04-03 |
Family
ID=25358696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69305634T Expired - Lifetime DE69305634T2 (de) | 1992-04-22 | 1993-04-05 | Verfahren zur herstellung von mikrostrukturen |
Country Status (5)
Country | Link |
---|---|
US (1) | US5314572A (de) |
EP (1) | EP0637386B1 (de) |
JP (1) | JPH07505743A (de) |
DE (1) | DE69305634T2 (de) |
WO (1) | WO1993021536A1 (de) |
Families Citing this family (97)
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US6149190A (en) * | 1993-05-26 | 2000-11-21 | Kionix, Inc. | Micromechanical accelerometer for automotive applications |
US5610335A (en) * | 1993-05-26 | 1997-03-11 | Cornell Research Foundation | Microelectromechanical lateral accelerometer |
US5851851A (en) * | 1994-03-07 | 1998-12-22 | Nippondenso Co., Ltd. | Method for fabricating a semiconductor acceleration sensor |
JP3269274B2 (ja) * | 1994-03-15 | 2002-03-25 | 株式会社デンソー | 加速度センサ |
US5454906A (en) * | 1994-06-21 | 1995-10-03 | Texas Instruments Inc. | Method of providing sacrificial spacer for micro-mechanical devices |
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US5583290A (en) * | 1994-12-20 | 1996-12-10 | Analog Devices, Inc. | Micromechanical apparatus with limited actuation bandwidth |
US5621157A (en) * | 1995-06-07 | 1997-04-15 | Analog Devices, Inc. | Method and circuitry for calibrating a micromachined sensor |
US5578224A (en) * | 1995-06-07 | 1996-11-26 | Analog Devices, Inc. | Method of making micromachined device with ground plane under sensor |
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US6012336A (en) * | 1995-09-06 | 2000-01-11 | Sandia Corporation | Capacitance pressure sensor |
US5798283A (en) * | 1995-09-06 | 1998-08-25 | Sandia Corporation | Method for integrating microelectromechanical devices with electronic circuitry |
US5963788A (en) * | 1995-09-06 | 1999-10-05 | Sandia Corporation | Method for integrating microelectromechanical devices with electronic circuitry |
DE19600399C1 (de) * | 1996-01-08 | 1997-08-21 | Siemens Ag | Herstellverfahren für ein mikromechanisches Bauteil mit einer beweglichen Struktur |
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US5914553A (en) * | 1997-06-16 | 1999-06-22 | Cornell Research Foundation, Inc. | Multistable tunable micromechanical resonators |
DE69735806D1 (de) | 1997-10-29 | 2006-06-08 | St Microelectronics Srl | Verfahren zur Herstellung einer Halbleiter Microantrieb, insbesondere für Lese-Schreibekopf einem Festplattengerät, und so hergestellter Microantrieb |
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DE69826242D1 (de) * | 1998-05-05 | 2004-10-21 | St Microelectronics Srl | Herstellungsverfahren für eine Festplatten-Lese/Schreibeinheit, mit mikrometrischer Betätigung |
EP0975085B1 (de) | 1998-07-22 | 2005-02-09 | STMicroelectronics S.r.l. | Integrierte Anordnung mit einer Vorrichtung für den elektrostatischen Transport von dielektrischen Teilchen, die in einer Vorrichtung zum Betätigen von Festplatten erzeugt werden, und elektrostatisches Transportverfahren |
EP0977180B1 (de) | 1998-07-30 | 2005-02-09 | STMicroelectronics S.r.l. | Verfahren zur Herstellung eines Aktuators für eine Festplattenvorrichtung, mit einem Lese-/Schreibkopf, einem Microaktuator und einer Aufhängung und die so erhaltene Aktuatorvorrichtung |
DE69830789D1 (de) | 1998-07-30 | 2005-08-11 | St Microelectronics Srl | Fernbedienbarer integrierter Microantrieb, insbesondere für einen Lese/Schreibköpf einer Festplattenanlage |
EP0991175B1 (de) | 1998-09-30 | 2005-08-17 | STMicroelectronics S.r.l. | Integrierter Hochleistungs-Microantrieb insbesondere für einen Lese/Schreib-Kopf in Festplattenlaufwerken |
US6060336A (en) * | 1998-12-11 | 2000-05-09 | C.F. Wan Incorporated | Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore |
JP3527117B2 (ja) | 1998-12-24 | 2004-05-17 | 富士電機デバイステクノロジー株式会社 | 半導体力学量センサの製造方法およびその製造装置 |
JP4238437B2 (ja) | 1999-01-25 | 2009-03-18 | 株式会社デンソー | 半導体力学量センサとその製造方法 |
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-
1992
- 1992-04-22 US US07/872,037 patent/US5314572A/en not_active Expired - Lifetime
-
1993
- 1993-04-05 JP JP5518412A patent/JPH07505743A/ja active Pending
- 1993-04-05 EP EP93909256A patent/EP0637386B1/de not_active Expired - Lifetime
- 1993-04-05 WO PCT/US1993/003179 patent/WO1993021536A1/en active IP Right Grant
- 1993-04-05 DE DE69305634T patent/DE69305634T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH07505743A (ja) | 1995-06-22 |
EP0637386A1 (de) | 1995-02-08 |
DE69305634T2 (de) | 1997-04-03 |
US5314572A (en) | 1994-05-24 |
WO1993021536A1 (en) | 1993-10-28 |
EP0637386B1 (de) | 1996-10-23 |
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