DE69211053T2 - Modul-Konstruktion einer Leistungsschaltungsanordnung von hoher Kompaktheit und Leistungsfähigkeit für Wärme-Zerstreuung - Google Patents
Modul-Konstruktion einer Leistungsschaltungsanordnung von hoher Kompaktheit und Leistungsfähigkeit für Wärme-ZerstreuungInfo
- Publication number
- DE69211053T2 DE69211053T2 DE69211053T DE69211053T DE69211053T2 DE 69211053 T2 DE69211053 T2 DE 69211053T2 DE 69211053 T DE69211053 T DE 69211053T DE 69211053 T DE69211053 T DE 69211053T DE 69211053 T2 DE69211053 T2 DE 69211053T2
- Authority
- DE
- Germany
- Prior art keywords
- printed circuit
- board
- metal plate
- thin metal
- circuit arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title description 4
- 238000010276 construction Methods 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 125000006850 spacer group Chemical group 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ITMI911180A IT1247304B (it) | 1991-04-30 | 1991-04-30 | Complesso circuitale di potenza a struttura modulare ad elevata compattezza e ad alta efficienza di dissipazione termica |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69211053D1 DE69211053D1 (de) | 1996-07-04 |
| DE69211053T2 true DE69211053T2 (de) | 1996-10-02 |
Family
ID=11359807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69211053T Expired - Fee Related DE69211053T2 (de) | 1991-04-30 | 1992-04-22 | Modul-Konstruktion einer Leistungsschaltungsanordnung von hoher Kompaktheit und Leistungsfähigkeit für Wärme-Zerstreuung |
Country Status (3)
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005026233A1 (de) * | 2005-06-07 | 2006-12-21 | Tyco Electronics Ec Kft | Elektrisches Leistungsmodul |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2858577C (en) | 2011-12-12 | 2018-05-29 | Verifi Llc | Multivariate management of entrained air and rheology in cementitious mixes |
-
1992
- 1992-04-22 DE DE69211053T patent/DE69211053T2/de not_active Expired - Fee Related
- 1992-04-25 TW TW081103255A patent/TW224192B/zh active
- 1992-04-30 KR KR1019920007372A patent/KR100284661B1/ko not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005026233A1 (de) * | 2005-06-07 | 2006-12-21 | Tyco Electronics Ec Kft | Elektrisches Leistungsmodul |
| DE102005026233B4 (de) * | 2005-06-07 | 2008-08-07 | Tyco Electronics Ec Kft | Elektrisches Leistungsmodul |
Also Published As
| Publication number | Publication date |
|---|---|
| KR920019885A (ko) | 1992-11-20 |
| DE69211053D1 (de) | 1996-07-04 |
| TW224192B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1994-05-21 |
| KR100284661B1 (ko) | 2001-03-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |