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Baugruppenlayout mit verbesserter Ableitung von Wärme produziert von elektronischen Hochleistungskomponenten

Info

Publication number
DE69208638D1
DE69208638D1 DE1992608638 DE69208638A DE69208638D1 DE 69208638 D1 DE69208638 D1 DE 69208638D1 DE 1992608638 DE1992608638 DE 1992608638 DE 69208638 A DE69208638 A DE 69208638A DE 69208638 D1 DE69208638 D1 DE 69208638D1
Authority
DE
Grant status
Grant
Patent type
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1992608638
Other languages
English (en)
Other versions
DE69208638T2 (de )
Inventor
Kaveh Azar
Richard Edward Caron
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance
DE1992608638 1991-12-16 1992-11-20 Baugruppenlayout mit verbesserter Ableitung von Wärme produziert von elektronischen Hochleistungskomponenten Expired - Fee Related DE69208638D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US07807688 US5294831A (en) 1991-12-16 1991-12-16 Circuit pack layout with improved dissipation of heat produced by high power electronic components

Publications (1)

Publication Number Publication Date
DE69208638D1 true DE69208638D1 (de) 1996-04-04

Family

ID=25196955

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1992608638 Expired - Fee Related DE69208638D1 (de) 1991-12-16 1992-11-20 Baugruppenlayout mit verbesserter Ableitung von Wärme produziert von elektronischen Hochleistungskomponenten
DE1992608638 Expired - Lifetime DE69208638T2 (de) 1991-12-16 1992-11-20 Baugruppenlayout mit verbesserter Ableitung von Wärme produziert von elektronischen Hochleistungskomponenten

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE1992608638 Expired - Lifetime DE69208638T2 (de) 1991-12-16 1992-11-20 Baugruppenlayout mit verbesserter Ableitung von Wärme produziert von elektronischen Hochleistungskomponenten

Country Status (3)

Country Link
US (1) US5294831A (de)
DE (2) DE69208638D1 (de)
EP (1) EP0551726B1 (de)

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* Cited by examiner, † Cited by third party
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US6705388B1 (en) 1997-11-10 2004-03-16 Parker-Hannifin Corporation Non-electrically conductive thermal dissipator for electronic components
US6253834B1 (en) 1998-10-28 2001-07-03 Hewlett-Packard Company Apparatus to enhance cooling of electronic device
US7028753B2 (en) * 2000-09-20 2006-04-18 Hewlett-Packard Development Company, L.P. Apparatus to enhance cooling of electronic device
US6330153B1 (en) 1999-01-14 2001-12-11 Nokia Telecommunications Oy Method and system for efficiently removing heat generated from an electronic device
US6456515B1 (en) 2000-11-27 2002-09-24 Briggs & Stratton Corporation Three-phase H-bridge assembly and method of assembling the same
DE10102621B4 (de) * 2001-01-20 2006-05-24 Conti Temic Microelectronic Gmbh Leistungsmodul
JP3513116B2 (ja) * 2001-03-22 2004-03-31 株式会社東芝 情報処理装置
US20040182542A1 (en) * 2001-04-23 2004-09-23 Koichiro Take Heat sink
DE10204200A1 (de) * 2002-02-01 2003-08-21 Conti Temic Microelectronic Leistungsmodul
CA2372399C (en) * 2002-02-19 2010-10-26 Long Manufacturing Ltd. Low profile finned heat exchanger
US7019971B2 (en) * 2003-09-30 2006-03-28 Intel Corporation Thermal management systems for micro-components
US7269005B2 (en) * 2003-11-21 2007-09-11 Intel Corporation Pumped loop cooling with remote heat exchanger and display cooling
US20050141195A1 (en) * 2003-12-31 2005-06-30 Himanshu Pokharna Folded fin microchannel heat exchanger
US20060154393A1 (en) * 2005-01-11 2006-07-13 Doan Trung T Systems and methods for removing operating heat from a light emitting diode
US20060157234A1 (en) * 2005-01-14 2006-07-20 Honeywell International Inc. Microchannel heat exchanger fabricated by wire electro-discharge machining
US20060252179A1 (en) * 2005-05-06 2006-11-09 Neobulb Technologies, Inc. Integrated circuit packaging structure and method of making the same
US7505884B2 (en) * 2006-04-07 2009-03-17 Delphi Technologies, Inc. Method for automatic generation of finite element mesh from IC layout data
US20080024997A1 (en) * 2006-07-28 2008-01-31 Apple Computer, Inc. Staggered memory layout for improved cooling in reduced height enclosure
US20080061430A1 (en) * 2006-09-07 2008-03-13 National Central University Structure of heat dissipated submount
US8238098B1 (en) * 2007-12-10 2012-08-07 Rivas Victor A Nano machined materials using femtosecond pulse laser technologies to enhanced thermal and optical properties for increased surface area to enhanced heat dissipation and emissivity and electromagnetic radiation
US8604923B1 (en) 2008-07-16 2013-12-10 Victor Rivas Alvarez Telemetric health monitoring devices and system
CN102906497B (zh) * 2010-01-27 2016-08-17 熔合Uv系统公司 微通道冷却的高热负荷发光装置
US20110232885A1 (en) * 2010-03-26 2011-09-29 Kaslusky Scott F Heat transfer device with fins defining air flow channels
US20150090435A1 (en) * 2013-09-29 2015-04-02 Huawei Technologies Co., Ltd. Support plateheat dissipation apparatus

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3961666A (en) * 1972-11-24 1976-06-08 Sony Corporation Heat dispersion device for use in an electronic apparatus
US4103737A (en) * 1976-12-16 1978-08-01 Marantz Company, Inc. Heat exchanger structure for electronic apparatus
US4620216A (en) * 1983-04-29 1986-10-28 International Business Machines Corporation Unitary slotted heat sink for semiconductor packages
DE3573137D1 (en) * 1984-10-03 1989-10-26 Sumitomo Electric Industries Material for a semiconductor device and process for its manufacture
DE3528291C2 (de) * 1985-08-07 1988-07-07 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De
US4823869A (en) * 1986-06-19 1989-04-25 International Business Machines Corporation Heat sink
US5031072A (en) * 1986-08-01 1991-07-09 Texas Instruments Incorporated Baseboard for orthogonal chip mount
US4922378A (en) * 1986-08-01 1990-05-01 Texas Instruments Incorporated Baseboard for orthogonal chip mount
US4682651A (en) * 1986-09-08 1987-07-28 Burroughs Corporation (Now Unisys Corporation) Segmented heat sink device
US4879891A (en) * 1987-04-27 1989-11-14 Thermalloy Incorporated Method of manufacturing heat sink apparatus
US4884631A (en) * 1988-03-17 1989-12-05 California Institute Of Technology Forced air heat sink apparatus
US4884630A (en) * 1988-07-14 1989-12-05 Microelectronics And Computer Technology Corporation End fed liquid heat exchanger for an electronic component
JP2507561B2 (ja) * 1988-10-19 1996-06-12 株式会社日立製作所 半導体の冷却装置
US4884168A (en) * 1988-12-14 1989-11-28 Cray Research, Inc. Cooling plate with interboard connector apertures for circuit board assemblies
US5166775A (en) * 1990-01-16 1992-11-24 Cray Research, Inc. Air manifold for cooling electronic devices
US4987478A (en) * 1990-02-20 1991-01-22 Unisys Corporation Micro individual integrated circuit package
US5014117A (en) * 1990-03-30 1991-05-07 International Business Machines Corporation High conduction flexible fin cooling module
US5003429A (en) * 1990-07-09 1991-03-26 International Business Machines Corporation Electronic assembly with enhanced heat sinking

Also Published As

Publication number Publication date Type
EP0551726A1 (de) 1993-07-21 application
US5294831A (en) 1994-03-15 grant
DE69208638T2 (de) 1996-09-19 grant
EP0551726B1 (de) 1996-02-28 grant

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee