DE69127283D1 - Ausrichtsystem und -verfahren für eine prüfhalterung - Google Patents
Ausrichtsystem und -verfahren für eine prüfhalterungInfo
- Publication number
- DE69127283D1 DE69127283D1 DE69127283T DE69127283T DE69127283D1 DE 69127283 D1 DE69127283 D1 DE 69127283D1 DE 69127283 T DE69127283 T DE 69127283T DE 69127283 T DE69127283 T DE 69127283T DE 69127283 D1 DE69127283 D1 DE 69127283D1
- Authority
- DE
- Germany
- Prior art keywords
- board
- fixture
- test
- probes
- tooling pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US52895790A | 1990-05-25 | 1990-05-25 | |
US07/648,453 US5321351A (en) | 1990-05-25 | 1991-01-31 | Test fixture alignment system |
PCT/US1991/003688 WO1991019392A1 (en) | 1990-05-25 | 1991-05-24 | Test fixture alignment system |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69127283D1 true DE69127283D1 (de) | 1997-09-18 |
DE69127283T2 DE69127283T2 (de) | 1998-01-02 |
Family
ID=24107925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69127283T Expired - Fee Related DE69127283T2 (de) | 1990-05-25 | 1991-05-24 | Ausrichtsystem und -verfahren für eine prüfhalterung |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0531428B1 (de) |
JP (1) | JPH0833434B2 (de) |
AT (1) | ATE156958T1 (de) |
DE (1) | DE69127283T2 (de) |
WO (1) | WO1991019392A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5408189A (en) * | 1990-05-25 | 1995-04-18 | Everett Charles Technologies, Inc. | Test fixture alignment system for printed circuit boards |
FR2692048B1 (fr) * | 1992-06-09 | 1996-09-06 | Everett Charles Tech | Montage d'essai. |
US5416428A (en) * | 1993-02-09 | 1995-05-16 | Everett Charles Technologies, Inc. | Marker probe |
US5442299A (en) * | 1994-01-06 | 1995-08-15 | International Business Machines Corporation | Printed circuit board test fixture and method |
DE4406538A1 (de) | 1994-02-28 | 1995-08-31 | Mania Gmbh | Leiterplatten-Prüfeinrichtung mit Prüfadapter und Verfahren zum Einstellen desselben |
US9523735B2 (en) * | 2014-10-08 | 2016-12-20 | Eastman Kodak Company | Electrical test system with vision-guided alignment |
CN112649628B (zh) * | 2020-12-14 | 2024-07-23 | 华虹半导体(无锡)有限公司 | 探针卡的维护校正方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4668982A (en) * | 1985-06-17 | 1987-05-26 | The Perkin-Elmer Corporation | Misregistration/distortion correction scheme |
US4943767A (en) * | 1986-08-21 | 1990-07-24 | Tokyo Electron Limited | Automatic wafer position aligning method for wafer prober |
GB8700754D0 (en) * | 1987-01-14 | 1987-02-18 | Int Computers Ltd | Test apparatus for printed circuit boards |
JP2622573B2 (ja) * | 1988-01-27 | 1997-06-18 | キヤノン株式会社 | マーク検知装置及び方法 |
CA1314085C (en) * | 1988-05-25 | 1993-03-02 | Andras G. Fule | Linear interpolation for a component placement robot |
-
1991
- 1991-05-24 WO PCT/US1991/003688 patent/WO1991019392A1/en not_active Application Discontinuation
- 1991-05-24 DE DE69127283T patent/DE69127283T2/de not_active Expired - Fee Related
- 1991-05-24 EP EP91911016A patent/EP0531428B1/de not_active Revoked
- 1991-05-24 AT AT91911016T patent/ATE156958T1/de not_active IP Right Cessation
- 1991-05-24 JP JP3510460A patent/JPH0833434B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0531428A4 (en) | 1993-05-12 |
EP0531428A1 (de) | 1993-03-17 |
WO1991019392A1 (en) | 1991-12-12 |
JPH05506719A (ja) | 1993-09-30 |
ATE156958T1 (de) | 1997-08-15 |
EP0531428B1 (de) | 1997-08-13 |
DE69127283T2 (de) | 1998-01-02 |
JPH0833434B2 (ja) | 1996-03-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8339 | Ceased/non-payment of the annual fee |