DE69107704D1 - Dynamisches Halbleiterbauteil. - Google Patents
Dynamisches Halbleiterbauteil.Info
- Publication number
- DE69107704D1 DE69107704D1 DE69107704T DE69107704T DE69107704D1 DE 69107704 D1 DE69107704 D1 DE 69107704D1 DE 69107704 T DE69107704 T DE 69107704T DE 69107704 T DE69107704 T DE 69107704T DE 69107704 D1 DE69107704 D1 DE 69107704D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- dynamic semiconductor
- dynamic
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17147690 | 1990-06-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69107704D1 true DE69107704D1 (de) | 1995-04-06 |
DE69107704T2 DE69107704T2 (de) | 1995-10-19 |
Family
ID=15923813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69107704T Expired - Lifetime DE69107704T2 (de) | 1990-06-29 | 1991-07-01 | Dynamisches Halbleiterbauteil. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5256892A (de) |
EP (1) | EP0464747B1 (de) |
KR (1) | KR950009894B1 (de) |
DE (1) | DE69107704T2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06349826A (ja) * | 1993-04-13 | 1994-12-22 | Toshiba Corp | 半導体装置およびその製造方法 |
US5455444A (en) * | 1994-04-22 | 1995-10-03 | United Microelectronics Corporation | Double polysilicon electrostatic discharge protection device for SRAM and DRAM memory devices |
JP4614481B2 (ja) * | 1999-08-30 | 2011-01-19 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置 |
DE102011079747A1 (de) | 2010-07-27 | 2012-02-02 | Denso Corporation | Halbleitervorrichtung mit Schaltelement und Freilaufdiode, sowie Steuerverfahren hierfür |
US8698222B2 (en) * | 2011-11-24 | 2014-04-15 | Macronix International Co., Ltd. | Memory device with charge storage layers at the gaps located both sides of the gate dielectric underneath the gate |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0789569B2 (ja) * | 1986-03-26 | 1995-09-27 | 株式会社日立製作所 | 半導体集積回路装置及びその製造方法 |
JP2723530B2 (ja) * | 1988-04-13 | 1998-03-09 | 日本電気株式会社 | ダイナミック型ランダムアクセスメモリ装置の製造方法 |
US5057449A (en) * | 1990-03-26 | 1991-10-15 | Micron Technology, Inc. | Process for creating two thicknesses of gate oxide within a dynamic random access memory |
-
1991
- 1991-06-28 US US07/722,847 patent/US5256892A/en not_active Expired - Lifetime
- 1991-06-29 KR KR1019910011009A patent/KR950009894B1/ko not_active IP Right Cessation
- 1991-07-01 EP EP91110877A patent/EP0464747B1/de not_active Expired - Lifetime
- 1991-07-01 DE DE69107704T patent/DE69107704T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR950009894B1 (ko) | 1995-09-01 |
EP0464747B1 (de) | 1995-03-01 |
EP0464747A1 (de) | 1992-01-08 |
US5256892A (en) | 1993-10-26 |
DE69107704T2 (de) | 1995-10-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: NEC CORP., TOKIO/TOKYO, JP Owner name: NEC ELECTRONICS CORP., KAWASAKI, KANAGAWA, JP |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: ELPIDA MEMORY, INC., TOKIO/TOKYO, JP |