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DE68926033T2 - Herstellungsverfahren für Gross-Matrix-Halbleiterbauelemente - Google Patents

Herstellungsverfahren für Gross-Matrix-Halbleiterbauelemente

Info

Publication number
DE68926033T2
DE68926033T2 DE1989626033 DE68926033T DE68926033T2 DE 68926033 T2 DE68926033 T2 DE 68926033T2 DE 1989626033 DE1989626033 DE 1989626033 DE 68926033 T DE68926033 T DE 68926033T DE 68926033 T2 DE68926033 T2 DE 68926033T2
Authority
DE
Grant status
Grant
Patent type
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1989626033
Other languages
English (en)
Other versions
DE68926033D1 (de )
Inventor
Almon P Fisher
Donald J Drake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/1626Production of nozzles manufacturing processes etching
    • B41J2/1629Production of nozzles manufacturing processes etching wet etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • B41J2/1604Production of bubble jet print heads of the edge shooter type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/1623Production of nozzles manufacturing processes bonding and adhesion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/1626Production of nozzles manufacturing processes etching
    • B41J2/1628Production of nozzles manufacturing processes etching dry etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/1631Production of nozzles manufacturing processes photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Production of nozzles manufacturing processes
    • B41J2/1635Production of nozzles manufacturing processes dividing the wafer into individual chips
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043Making grooves, e.g. cutting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604Chemical etching
    • H01L21/30608Anisotropic liquid etching
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/028Dicing
DE1989626033 1988-12-05 1989-12-05 Herstellungsverfahren für Gross-Matrix-Halbleiterbauelemente Expired - Lifetime DE68926033T2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US07280104 US4851371A (en) 1988-12-05 1988-12-05 Fabricating process for large array semiconductive devices

Publications (1)

Publication Number Publication Date
DE68926033T2 true DE68926033T2 (de) 1996-10-02

Family

ID=23071692

Family Applications (2)

Application Number Title Priority Date Filing Date
DE1989626033 Expired - Fee Related DE68926033D1 (de) 1988-12-05 1989-12-05 Herstellungsverfahren für Gross-Matrix-Halbleiterbauelemente
DE1989626033 Expired - Lifetime DE68926033T2 (de) 1988-12-05 1989-12-05 Herstellungsverfahren für Gross-Matrix-Halbleiterbauelemente

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE1989626033 Expired - Fee Related DE68926033D1 (de) 1988-12-05 1989-12-05 Herstellungsverfahren für Gross-Matrix-Halbleiterbauelemente

Country Status (4)

Country Link
US (1) US4851371A (de)
EP (1) EP0376514B1 (de)
JP (1) JP2806576B2 (de)
DE (2) DE68926033D1 (de)

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US5097274A (en) * 1990-06-18 1992-03-17 Xerox Corporation Overlapping chip replaceable subunits, methods of making same, and methods of making RIS or ROS array bars incorporating these subunits
US5068006A (en) * 1990-09-04 1991-11-26 Xerox Corporation Thermal ink jet printhead with pre-diced nozzle face and method of fabrication therefor
US5151389A (en) * 1990-09-10 1992-09-29 Rockwell International Corporation Method for dicing semiconductor substrates using an excimer laser beam
US5136310A (en) * 1990-09-28 1992-08-04 Xerox Corporation Thermal ink jet nozzle treatment
US5160945A (en) * 1991-05-10 1992-11-03 Xerox Corporation Pagewidth thermal ink jet printhead
US5192959A (en) * 1991-06-03 1993-03-09 Xerox Corporation Alignment of pagewidth bars
US5160403A (en) * 1991-08-09 1992-11-03 Xerox Corporation Precision diced aligning surfaces for devices such as ink jet printheads
US5218754A (en) * 1991-11-08 1993-06-15 Xerox Corporation Method of manufacturing page wide thermal ink-jet heads
JP2759165B2 (ja) * 1992-04-28 1998-05-28 カシオ計算機株式会社 ウェハ載置用シート拡張方法およびその装置
US5308442A (en) * 1993-01-25 1994-05-03 Hewlett-Packard Company Anisotropically etched ink fill slots in silicon
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US5461406A (en) * 1994-01-03 1995-10-24 Xerox Corporation Method and apparatus for elimination of misdirected satellite drops in thermal ink jet printhead
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US5511428A (en) * 1994-06-10 1996-04-30 Massachusetts Institute Of Technology Backside contact of sensor microstructures
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US5620614A (en) * 1995-01-03 1997-04-15 Xerox Corporation Printhead array and method of producing a printhead die assembly that minimizes end channel damage
US5729261A (en) * 1996-03-28 1998-03-17 Xerox Corporation Thermal ink jet printhead with improved ink resistance
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US5801727A (en) * 1996-11-04 1998-09-01 Xerox Corporation Apparatus and method for printing device
US5719605A (en) * 1996-11-20 1998-02-17 Lexmark International, Inc. Large array heater chips for thermal ink jet printheads
DE19720892C2 (de) * 1997-05-17 2002-08-08 Bosch Gmbh Robert Sensorelement
US6322201B1 (en) * 1997-10-22 2001-11-27 Hewlett-Packard Company Printhead with a fluid channel therethrough
US6339881B1 (en) 1997-11-17 2002-01-22 Xerox Corporation Ink jet printhead and method for its manufacture
US6293270B1 (en) 1998-06-17 2001-09-25 Canon Kabushiki Kaisha Manufacturing method of liquid jet recording head, liquid jet recording head manufactured by this manufacturing method, and manufacturing method of element substrate for liquid jet recording head
US6413839B1 (en) * 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
US6820966B1 (en) 1998-10-24 2004-11-23 Xaar Technology Limited Droplet deposition apparatus
JP2000195827A (ja) * 1998-12-25 2000-07-14 Oki Electric Ind Co Ltd Ledアレイチップおよびその製造方法ならびにダイシング装置
US6428883B1 (en) 1999-05-13 2002-08-06 Xerox Corporation Resinoid dicing blade including a dry lubricant
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US6291317B1 (en) 2000-12-06 2001-09-18 Xerox Corporation Method for dicing of micro devices
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US6871942B2 (en) * 2002-04-15 2005-03-29 Timothy R. Emery Bonding structure and method of making
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Also Published As

Publication number Publication date Type
US4851371A (en) 1989-07-25 grant
EP0376514A3 (en) 1990-11-22 application
EP0376514A2 (de) 1990-07-04 application
JP2806576B2 (ja) 1998-09-30 grant
JPH02212162A (en) 1990-08-23 application
EP0376514B1 (de) 1996-03-20 grant
DE68926033D1 (de) 1996-04-25 grant

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