DE68924019D1 - Dichtstoff für elektronische Bauelemente und elektronische Bauelemente. - Google Patents

Dichtstoff für elektronische Bauelemente und elektronische Bauelemente.

Info

Publication number
DE68924019D1
DE68924019D1 DE68924019T DE68924019T DE68924019D1 DE 68924019 D1 DE68924019 D1 DE 68924019D1 DE 68924019 T DE68924019 T DE 68924019T DE 68924019 T DE68924019 T DE 68924019T DE 68924019 D1 DE68924019 D1 DE 68924019D1
Authority
DE
Germany
Prior art keywords
electronic components
weight
sealant
composition
mercapto
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68924019T
Other languages
English (en)
Other versions
DE68924019T2 (de
Inventor
Masato Togami
Toshio Kanoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyplastics Co Ltd
Original Assignee
Polyplastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co Ltd filed Critical Polyplastics Co Ltd
Publication of DE68924019D1 publication Critical patent/DE68924019D1/de
Application granted granted Critical
Publication of DE68924019T2 publication Critical patent/DE68924019T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)
  • Details Of Resistors (AREA)
DE68924019T 1988-08-04 1989-07-25 Dichtstoff für elektronische Bauelemente und elektronische Bauelemente. Expired - Fee Related DE68924019T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19474688 1988-08-04

Publications (2)

Publication Number Publication Date
DE68924019D1 true DE68924019D1 (de) 1995-10-05
DE68924019T2 DE68924019T2 (de) 1996-04-18

Family

ID=16329541

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68924019T Expired - Fee Related DE68924019T2 (de) 1988-08-04 1989-07-25 Dichtstoff für elektronische Bauelemente und elektronische Bauelemente.

Country Status (6)

Country Link
US (1) US5110861A (de)
EP (1) EP0353933B1 (de)
KR (1) KR900003290A (de)
AT (1) ATE127269T1 (de)
DE (1) DE68924019T2 (de)
HK (1) HK179195A (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995025142A1 (fr) * 1994-03-17 1995-09-21 Idemitsu Petrochemical Co., Ltd. Compositions a base de resine de sulfure de polyarylene
JPH09194614A (ja) * 1996-01-25 1997-07-29 Matsushita Electric Ind Co Ltd プラスチック成形体、およびプラスチック成形体の処理方法
US6042910A (en) * 1998-01-29 2000-03-28 Idemitsu Petrochemical Co., Ltd. Polyarylene sulfide resin composition
AU4857499A (en) * 1998-07-10 2000-02-01 Cookson Semiconductor Packaging Materials Liquid crystal polymer encapsulant
DE19833063A1 (de) * 1998-07-22 2000-02-03 Reinz Dichtungs Gmbh Lösemittelfreier applizierbarer wärmehärtender Beschichtungsstoff
US6162849A (en) * 1999-01-11 2000-12-19 Ferro Corporation Thermally conductive thermoplastic
KR100547123B1 (ko) 2003-06-19 2006-01-26 삼성전자주식회사 박형 트랜스
US8383716B2 (en) 2010-07-30 2013-02-26 E I Du Pont De Nemours And Company Polyester nanocomposites
JP2012092214A (ja) * 2010-10-27 2012-05-17 Sumitomo Chemical Co Ltd 液晶ポリエステル液状組成物
US8946333B2 (en) 2012-09-19 2015-02-03 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US9434870B2 (en) 2012-09-19 2016-09-06 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4179537A (en) * 1978-01-04 1979-12-18 Rykowski John J Silane coupling agents
US4719250A (en) * 1984-06-18 1988-01-12 Hoechst Celanese Corporation Encapsulation of electronic components
DE3565850D1 (en) * 1984-06-27 1988-12-01 Nitto Electric Ind Co Powdered coating composition of epoxy resin and filler
JPS6169866A (ja) * 1984-09-12 1986-04-10 Polyplastics Co 複合材料組成物
JPH0713186B2 (ja) * 1985-03-26 1995-02-15 大日本インキ化学工業株式会社 電子部品封止用樹脂組成物
JPH0717748B2 (ja) * 1986-12-19 1995-03-01 川崎製鉄株式会社 芳香族ポリエステルアミド
JPH0725996B2 (ja) * 1986-12-26 1995-03-22 ポリプラスチックス株式会社 ポリエステル樹脂組成物

Also Published As

Publication number Publication date
HK179195A (en) 1995-12-01
EP0353933B1 (de) 1995-08-30
EP0353933A2 (de) 1990-02-07
US5110861A (en) 1992-05-05
DE68924019T2 (de) 1996-04-18
ATE127269T1 (de) 1995-09-15
KR900003290A (ko) 1990-03-26
EP0353933A3 (de) 1991-10-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee