DE60335685D1 - Abbildungsvorrichtung - Google Patents
AbbildungsvorrichtungInfo
- Publication number
- DE60335685D1 DE60335685D1 DE60335685T DE60335685T DE60335685D1 DE 60335685 D1 DE60335685 D1 DE 60335685D1 DE 60335685 T DE60335685 T DE 60335685T DE 60335685 T DE60335685 T DE 60335685T DE 60335685 D1 DE60335685 D1 DE 60335685D1
- Authority
- DE
- Germany
- Prior art keywords
- area
- refractive index
- light
- incident side
- formed closer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003384 imaging method Methods 0.000 title 1
- 238000006243 chemical reaction Methods 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14629—Reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002044806A JP4027116B2 (ja) | 2002-02-21 | 2002-02-21 | 撮像素子及び撮像装置 |
| JP2002044645A JP4027115B2 (ja) | 2002-02-21 | 2002-02-21 | 撮像素子及び撮像装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE60335685D1 true DE60335685D1 (de) | 2011-02-24 |
Family
ID=27667552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60335685T Expired - Lifetime DE60335685D1 (de) | 2002-02-21 | 2003-02-20 | Abbildungsvorrichtung |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7250973B2 (de) |
| EP (1) | EP1339225B1 (de) |
| KR (1) | KR100508068B1 (de) |
| AT (1) | ATE495548T1 (de) |
| DE (1) | DE60335685D1 (de) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7834927B2 (en) * | 2001-08-22 | 2010-11-16 | Florida Atlantic University | Apparatus and method for producing video signals |
| EP1341235A3 (de) * | 2002-02-28 | 2006-05-10 | Canon Kabushiki Kaisha | Bildaufnahmegerät |
| JP2004029554A (ja) * | 2002-06-27 | 2004-01-29 | Olympus Corp | 撮像レンズユニットおよび撮像装置 |
| JP3709873B2 (ja) * | 2003-02-19 | 2005-10-26 | ソニー株式会社 | 固体撮像装置及び撮像カメラ |
| JP2005079338A (ja) * | 2003-08-29 | 2005-03-24 | Matsushita Electric Ind Co Ltd | 固体撮像装置とその製造方法 |
| JP4322166B2 (ja) * | 2003-09-19 | 2009-08-26 | 富士フイルム株式会社 | 固体撮像素子 |
| JP4508619B2 (ja) * | 2003-12-03 | 2010-07-21 | キヤノン株式会社 | 固体撮像装置の製造方法 |
| WO2005101067A1 (ja) | 2004-04-13 | 2005-10-27 | Matsushita Electric Industrial Co., Ltd. | 集光素子および固体撮像装置 |
| KR100578644B1 (ko) * | 2004-05-06 | 2006-05-11 | 매그나칩 반도체 유한회사 | 프리즘을 구비한 시모스 이미지센서 및 그 제조방법 |
| US20060057765A1 (en) * | 2004-09-13 | 2006-03-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Image sensor including multiple lenses and method of manufacture thereof |
| JP2006237315A (ja) * | 2005-02-25 | 2006-09-07 | Matsushita Electric Ind Co Ltd | 固体撮像装置 |
| TWI288973B (en) * | 2005-09-27 | 2007-10-21 | Visera Technologies Co Ltd | Image sensing device and manufacture method thereof |
| JP5086535B2 (ja) * | 2005-11-21 | 2012-11-28 | オリンパスメディカルシステムズ株式会社 | ２板撮像装置 |
| JP2007180156A (ja) * | 2005-12-27 | 2007-07-12 | Fujifilm Corp | 固体撮像素子 |
| KR100795922B1 (ko) * | 2006-07-28 | 2008-01-21 | 삼성전자주식회사 | 이미지 픽업 소자 및 이미지 픽업 소자의 제조방법 |
| US20080173791A1 (en) * | 2007-01-19 | 2008-07-24 | Palum Russell J | Image sensor with three sets of microlenses |
| KR100913325B1 (ko) * | 2007-11-05 | 2009-08-20 | 주식회사 동부하이텍 | 듀얼 이미지 센서 및 그 제조 방법 |
| US8237121B2 (en) * | 2008-02-07 | 2012-08-07 | Omnivision Technologies, Inc. | Alternating row infrared filter for an image sensor |
| KR20110019724A (ko) * | 2008-06-18 | 2011-02-28 | 파나소닉 주식회사 | 고체 촬상 장치 |
| FR2950196B1 (fr) * | 2009-09-17 | 2012-08-03 | Commissariat Energie Atomique | Dispositif d'imagerie 3d equipe de nano-fils et procede de fabrication associe |
| US8633432B2 (en) * | 2009-09-21 | 2014-01-21 | California Institute Of Technology | Reflective focusing and transmissive projection device |
| WO2011047053A2 (en) * | 2009-10-13 | 2011-04-21 | California Institute Of Technology | Holographically illuminated imaging devices |
| JP5538811B2 (ja) * | 2009-10-21 | 2014-07-02 | キヤノン株式会社 | 固体撮像素子 |
| US8536545B2 (en) | 2010-09-09 | 2013-09-17 | California Institute Of Technology | Delayed emission detection devices and methods |
| TW201245768A (en) | 2011-03-29 | 2012-11-16 | Sony Corp | Image pickup apparatus, image pickup device, image processing method, aperture control method, and program |
| US8902338B2 (en) * | 2011-06-06 | 2014-12-02 | Panasonic Intellectual Property Corporation Of America | Color separation filter array, solid-state imaging element, imaging device, and display device |
| JP2013012506A (ja) * | 2011-06-28 | 2013-01-17 | Sony Corp | 固体撮像素子の製造方法、固体撮像素子、電子機器の製造方法、および電子機器。 |
| US20130094807A1 (en) * | 2011-10-12 | 2013-04-18 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Optical coupling system for use in an optical communications module, an optical communications module that incorporates the optical coupling system, and a method |
| WO2013065226A1 (ja) | 2011-10-31 | 2013-05-10 | パナソニック株式会社 | 固体撮像素子、撮像装置および信号処理方法 |
| US9392187B2 (en) | 2013-07-09 | 2016-07-12 | Samsung Electronics Co., Ltd. | Image generating apparatus including digital iris and method and non-transitory recordable medium |
| KR20150006755A (ko) * | 2013-07-09 | 2015-01-19 | 삼성전자주식회사 | 이미지 생성 장치, 이미지 생성 방법 및 비일시적 기록 매체 |
| KR102159166B1 (ko) | 2014-05-09 | 2020-09-23 | 삼성전자주식회사 | 색분리 소자 및 상기 색분리 소자를 포함하는 이미지 센서 |
| KR102276434B1 (ko) | 2014-07-03 | 2021-07-09 | 삼성전자주식회사 | 색분리 소자를 포함하는 이미지 센서 및 상기 이미지 센서를 포함하는 촬상 장치 |
| CN107785387B (zh) * | 2017-10-25 | 2020-05-05 | 德淮半导体有限公司 | 图像传感器及用于形成图像传感器的方法 |
| DE102020113591B4 (de) | 2020-05-19 | 2022-02-03 | Audi Aktiengesellschaft | Bildsensorvorrichtung einer Kamera zur Detektion von Licht |
| CN117146973B (zh) * | 2023-11-01 | 2023-12-26 | 长春理工大学 | 一种消球差大面阵探测器、消球差方法及探测器制作方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2869280B2 (ja) | 1993-01-27 | 1999-03-10 | シャープ株式会社 | 固体撮像素子及びその製造方法 |
| JP3402429B2 (ja) | 1996-11-22 | 2003-05-06 | ソニー株式会社 | 固体撮像素子及びその製造方法 |
| JPH1168074A (ja) | 1997-08-13 | 1999-03-09 | Sony Corp | 固体撮像素子 |
| JP3571909B2 (ja) | 1998-03-19 | 2004-09-29 | キヤノン株式会社 | 固体撮像装置及びその製造方法 |
| US6078429A (en) * | 1998-07-22 | 2000-06-20 | Foveon, Inc. | Color separating prism having violet light component in red channel |
| US6583438B1 (en) * | 1999-04-12 | 2003-06-24 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device |
| JP2001237405A (ja) | 2000-02-24 | 2001-08-31 | Victor Co Of Japan Ltd | 固体撮像装置および固体撮像装置の製造方法 |
| JP2001309395A (ja) * | 2000-04-21 | 2001-11-02 | Sony Corp | 固体撮像素子及びその製造方法 |
| JP4652634B2 (ja) * | 2001-08-31 | 2011-03-16 | キヤノン株式会社 | 撮像装置 |
-
2003
- 2003-02-19 US US10/369,938 patent/US7250973B2/en not_active Expired - Fee Related
- 2003-02-20 EP EP03003855A patent/EP1339225B1/de not_active Expired - Lifetime
- 2003-02-20 AT AT03003855T patent/ATE495548T1/de not_active IP Right Cessation
- 2003-02-20 DE DE60335685T patent/DE60335685D1/de not_active Expired - Lifetime
- 2003-02-21 KR KR10-2003-0010939A patent/KR100508068B1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1339225A3 (de) | 2005-07-13 |
| EP1339225A2 (de) | 2003-08-27 |
| KR20030069885A (ko) | 2003-08-27 |
| KR100508068B1 (ko) | 2005-08-19 |
| US7250973B2 (en) | 2007-07-31 |
| US20030179457A1 (en) | 2003-09-25 |
| ATE495548T1 (de) | 2011-01-15 |
| EP1339225B1 (de) | 2011-01-12 |
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