DE60210833D1 - Schleifmittelzusammensetzung und dieses gebrauchendes Polierverfahren - Google Patents

Schleifmittelzusammensetzung und dieses gebrauchendes Polierverfahren

Info

Publication number
DE60210833D1
DE60210833D1 DE60210833T DE60210833T DE60210833D1 DE 60210833 D1 DE60210833 D1 DE 60210833D1 DE 60210833 T DE60210833 T DE 60210833T DE 60210833 T DE60210833 T DE 60210833T DE 60210833 D1 DE60210833 D1 DE 60210833D1
Authority
DE
Germany
Prior art keywords
group
oxide
acid
metal salt
ammonium salt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60210833T
Other languages
English (en)
Other versions
DE60210833T8 (de
DE60210833T2 (de
Inventor
Hiroshi Asano
Kenji Sakai
Katsuyoshi Ina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Application granted granted Critical
Publication of DE60210833D1 publication Critical patent/DE60210833D1/de
Publication of DE60210833T2 publication Critical patent/DE60210833T2/de
Publication of DE60210833T8 publication Critical patent/DE60210833T8/de
Active legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Disintegrating Or Milling (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
DE60210833T 2001-01-31 2002-01-18 Polierzusammensetzung und diese verwendendes Polierverfahren Active DE60210833T8 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001023316 2001-01-31
JP2001023316A JP2002231666A (ja) 2001-01-31 2001-01-31 研磨用組成物およびそれを用いた研磨方法

Publications (3)

Publication Number Publication Date
DE60210833D1 true DE60210833D1 (de) 2006-06-01
DE60210833T2 DE60210833T2 (de) 2007-05-16
DE60210833T8 DE60210833T8 (de) 2007-09-06

Family

ID=18888615

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60210833T Active DE60210833T8 (de) 2001-01-31 2002-01-18 Polierzusammensetzung und diese verwendendes Polierverfahren

Country Status (7)

Country Link
US (1) US6679929B2 (de)
EP (1) EP1229093B1 (de)
JP (1) JP2002231666A (de)
CN (1) CN1369530A (de)
AT (1) ATE324415T1 (de)
DE (1) DE60210833T8 (de)
TW (1) TW555840B (de)

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Also Published As

Publication number Publication date
DE60210833T8 (de) 2007-09-06
US6679929B2 (en) 2004-01-20
JP2002231666A (ja) 2002-08-16
EP1229093A1 (de) 2002-08-07
DE60210833T2 (de) 2007-05-16
EP1229093B1 (de) 2006-04-26
TW555840B (en) 2003-10-01
ATE324415T1 (de) 2006-05-15
CN1369530A (zh) 2002-09-18
US20020139055A1 (en) 2002-10-03

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Inventor name: ASANO, HIROSHI, NISHIKASUGAI-GUN, AICHI, JP

Inventor name: SAKAI, KENJI, NISHIKASUGAI-GUN, AICHI, JP

Inventor name: INA, KATSUYOSHI, NISHIKASUGAI-GUN, AICHI, JP