DE602005003720D1 - Optisches Modul mit vereinfachtem elektrischem Verdrahtungsdesign - Google Patents

Optisches Modul mit vereinfachtem elektrischem Verdrahtungsdesign

Info

Publication number
DE602005003720D1
DE602005003720D1 DE602005003720T DE602005003720T DE602005003720D1 DE 602005003720 D1 DE602005003720 D1 DE 602005003720D1 DE 602005003720 T DE602005003720 T DE 602005003720T DE 602005003720 T DE602005003720 T DE 602005003720T DE 602005003720 D1 DE602005003720 D1 DE 602005003720D1
Authority
DE
Germany
Prior art keywords
optical module
electrical wiring
wiring design
simplified electrical
simplified
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005003720T
Other languages
English (en)
Other versions
DE602005003720T2 (de
Inventor
Naoki Matsushima
Kenji Yoshimoto
Hiroyasu Sasaki
Masanobu Okayasu
Toshiaki Takai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Opnext Japan Inc
Original Assignee
Opnext Japan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Opnext Japan Inc filed Critical Opnext Japan Inc
Publication of DE602005003720D1 publication Critical patent/DE602005003720D1/de
Application granted granted Critical
Publication of DE602005003720T2 publication Critical patent/DE602005003720T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4271—Cooling with thermo electric cooling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4272—Cooling with mounting substrates of high thermal conductivity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE602005003720T 2004-07-06 2005-04-29 Optisches Modul mit vereinfachtem elektrischem Verdrahtungsdesign Active DE602005003720T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004199346A JP4718135B2 (ja) 2004-07-06 2004-07-06 光モジュール
JP2004199346 2004-07-06

Publications (2)

Publication Number Publication Date
DE602005003720D1 true DE602005003720D1 (de) 2008-01-24
DE602005003720T2 DE602005003720T2 (de) 2009-01-02

Family

ID=34935993

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005003720T Active DE602005003720T2 (de) 2004-07-06 2005-04-29 Optisches Modul mit vereinfachtem elektrischem Verdrahtungsdesign

Country Status (5)

Country Link
US (1) US20060006403A1 (de)
EP (1) EP1615304B1 (de)
JP (1) JP4718135B2 (de)
CN (1) CN100470971C (de)
DE (1) DE602005003720T2 (de)

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US8652040B2 (en) * 2006-12-19 2014-02-18 Valencell, Inc. Telemetric apparatus for health and environmental monitoring
US20110304897A1 (en) * 2008-10-09 2011-12-15 Ntt Electronics Corporation Optical Semiconductor Module and Method for Assembling the Same
JP2010182801A (ja) * 2009-02-04 2010-08-19 Hitachi Cable Ltd 光送受信器
CN102709265B (zh) * 2012-05-18 2015-01-07 苏州旭创科技有限公司 半导体光器件表面贴装封装结构及其封装方法
CN102967906A (zh) * 2012-11-29 2013-03-13 中国电子科技集团公司第十三研究所 半导体光电模块用封装外壳
US9628185B2 (en) * 2014-10-17 2017-04-18 Cisco Technology, Inc. Optical transmitter with linear arrangement and stacked laser package and RF path
CN107534268A (zh) * 2015-04-24 2018-01-02 京瓷株式会社 光元件搭载用封装件、电子装置以及电子模块
US10205298B2 (en) * 2015-06-29 2019-02-12 Hebei Hymax Optoelectronics Inc. Packaging structure for four-channel integrated tunable laser array chip
CN107872004A (zh) * 2017-11-27 2018-04-03 温州大学 一种双光束激光输出装置
CN109586161B (zh) * 2018-07-03 2020-05-01 深圳朗光科技有限公司 基于to封装的半导体激光器及其封装方法
CN109586163B (zh) * 2018-07-04 2020-11-03 深圳朗光科技有限公司 多单管大功率半导体激光器封装结构及激光器
CN108873195B (zh) * 2018-08-01 2020-10-13 青岛海信宽带多媒体技术有限公司 光模块及其光发射器件
US11768341B2 (en) * 2019-09-18 2023-09-26 Nippon Telegraph And Telephone Corporation Package for optical module

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JP3250496B2 (ja) * 1997-09-19 2002-01-28 日本電気株式会社 光素子実装基板
KR920010947B1 (ko) * 1989-05-24 1992-12-24 가부시끼가이샤 히다찌세이사꾸쇼 광결합장치와 그 제조방법, 발광장치와 그 조립방법 및 렌즈홀더
SE468337B (sv) * 1991-05-08 1992-12-14 Radians Innova Ab Saett att anordna och justera in en laser samt laseranordning vilken genomfoer saettet
JPH07230032A (ja) * 1993-12-24 1995-08-29 Nikon Corp レンズ装置
JP3472660B2 (ja) * 1995-06-22 2003-12-02 日本オプネクスト株式会社 光半導体アレイモジュ−ルとその組み立て方法、及び外部基板実装構造
JPH1154806A (ja) * 1997-08-04 1999-02-26 Hitachi Ltd ペルチエクーラ及び光素子モジュール
JP2001085798A (ja) * 1999-09-10 2001-03-30 Hitachi Ltd 半導体レーザモジュールおよび波長分割多重光伝送システム
US6632029B1 (en) * 1999-12-22 2003-10-14 New Focus, Inc. Method & apparatus for packaging high frequency components
US6767140B2 (en) * 2000-05-09 2004-07-27 National Semiconductor Corporation Ceramic optical sub-assembly for opto-electronic module utilizing LTCC (low-temperature co-fired ceramic) technology
US6556599B1 (en) * 2000-10-17 2003-04-29 Bookham Technology Plc External cavity laser using angle-tuned filter and method of making same
JP3788232B2 (ja) * 2000-12-13 2006-06-21 日本電気株式会社 波長可変光送信器、その出力制御方法並及び光通信システム
CN1204662C (zh) * 2000-12-15 2005-06-01 古河电气工业株式会社 半导体激光器模块及其制造方法和光放大器
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JP3729167B2 (ja) * 2002-09-25 2005-12-21 住友電気工業株式会社 レーザモジュール
JP2004146468A (ja) * 2002-10-22 2004-05-20 Kyocera Corp 光モジュール及びそれを用いた光モジュールアセンブリ
JP2004152783A (ja) * 2002-10-28 2004-05-27 Toshiba Corp 半導体装置及びその製造方法
JP2004179273A (ja) * 2002-11-26 2004-06-24 Nec Corp 半導体レーザチップ部品及びこれを用いた半導体レーザモジュール
US7275877B2 (en) * 2003-04-30 2007-10-02 Sumitomo Electric Industries, Ltd. Optical module having individual housing for an optical processing unit and an optical sub-assembly

Also Published As

Publication number Publication date
CN100470971C (zh) 2009-03-18
EP1615304B1 (de) 2007-12-12
JP2006024623A (ja) 2006-01-26
CN1719675A (zh) 2006-01-11
EP1615304A1 (de) 2006-01-11
JP4718135B2 (ja) 2011-07-06
DE602005003720T2 (de) 2009-01-02
US20060006403A1 (en) 2006-01-12

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