DE60140845D1 - Bildaufnahmegerät - Google Patents

Bildaufnahmegerät

Info

Publication number
DE60140845D1
DE60140845D1 DE60140845T DE60140845T DE60140845D1 DE 60140845 D1 DE60140845 D1 DE 60140845D1 DE 60140845 T DE60140845 T DE 60140845T DE 60140845 T DE60140845 T DE 60140845T DE 60140845 D1 DE60140845 D1 DE 60140845D1
Authority
DE
Germany
Prior art keywords
imaging device
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60140845T
Other languages
English (en)
Inventor
Tetsuya Itano
Hidekazu Takahashi
Tomoyuki Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000316646A external-priority patent/JP3495979B2/ja
Priority claimed from JP2000337900A external-priority patent/JP2002141488A/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE60140845D1 publication Critical patent/DE60140845D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B3/00—Focusing arrangements of general interest for cameras, projectors or printers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14629—Reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14645—Colour imagers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/41—Extracting pixel data from a plurality of image sensors simultaneously picking up an image, e.g. for increasing the field of view by combining the outputs of a plurality of sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
DE60140845T 2000-10-17 2001-10-16 Bildaufnahmegerät Expired - Lifetime DE60140845D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000316646A JP3495979B2 (ja) 2000-10-17 2000-10-17 固体撮像素子及び撮像装置
JP2000337900A JP2002141488A (ja) 2000-11-06 2000-11-06 固体撮像装置及び固体撮像システム

Publications (1)

Publication Number Publication Date
DE60140845D1 true DE60140845D1 (de) 2010-02-04

Family

ID=26602236

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60140845T Expired - Lifetime DE60140845D1 (de) 2000-10-17 2001-10-16 Bildaufnahmegerät

Country Status (5)

Country Link
US (1) US7139028B2 (de)
EP (2) EP1198126B1 (de)
KR (2) KR100488371B1 (de)
CN (2) CN1159904C (de)
DE (1) DE60140845D1 (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080128844A1 (en) * 2002-11-18 2008-06-05 Tessera North America Integrated micro-optical systems and cameras including the same
US7262799B2 (en) * 2000-10-25 2007-08-28 Canon Kabushiki Kaisha Image sensing apparatus and its control method, control program, and storage medium
JP3950665B2 (ja) * 2001-10-23 2007-08-01 キヤノン株式会社 放射線撮像装置及び放射線撮像装置の撮像方法
JP2003143459A (ja) * 2001-11-02 2003-05-16 Canon Inc 複眼撮像系およびこれを備えた装置
JP2003304544A (ja) * 2002-04-10 2003-10-24 Canon Inc 撮像装置
JP2004112768A (ja) * 2002-08-29 2004-04-08 Sanyo Electric Co Ltd 撮像装置
JP3658401B2 (ja) * 2002-09-20 2005-06-08 キヤノン株式会社 固体撮像装置及びそれを用いたカメラ
US20040223064A1 (en) * 2002-10-24 2004-11-11 Canon Kabushiki Kaisha Image pickup element, image pickup device, and differential amplifying circuit
JP4323772B2 (ja) * 2002-10-31 2009-09-02 キヤノン株式会社 固体撮像装置、カメラ及びカメラ制御システム
US7742088B2 (en) * 2002-11-19 2010-06-22 Fujifilm Corporation Image sensor and digital camera
US6979588B2 (en) * 2003-01-29 2005-12-27 Hynix Semiconductor Inc. Method for manufacturing CMOS image sensor having microlens therein with high photosensitivity
US7279353B2 (en) * 2003-04-02 2007-10-09 Micron Technology, Inc. Passivation planarization
CN1574370A (zh) * 2003-05-30 2005-02-02 松下电器产业株式会社 固体摄像器件
KR100539082B1 (ko) 2003-10-01 2006-01-10 주식회사 네패스 반도체 촬상소자의 패키지 구조 및 그 제조방법
JP4660086B2 (ja) * 2003-12-01 2011-03-30 三洋電機株式会社 固体撮像素子
JP4794821B2 (ja) 2004-02-19 2011-10-19 キヤノン株式会社 固体撮像装置および撮像システム
KR100674911B1 (ko) * 2004-08-06 2007-01-26 삼성전자주식회사 이미지 센서 카메라 모듈 및 그 제조방법
US7564019B2 (en) 2005-08-25 2009-07-21 Richard Ian Olsen Large dynamic range cameras
US7795577B2 (en) * 2004-08-25 2010-09-14 Richard Ian Olsen Lens frame and optical focus assembly for imager module
US8124929B2 (en) * 2004-08-25 2012-02-28 Protarius Filo Ag, L.L.C. Imager module optical focus and assembly method
EP1812968B1 (de) 2004-08-25 2019-01-16 Callahan Cellular L.L.C. Vorrichtung für mehrere kameraeinrichtungen und verfahren zu ihrem betrieb
US7916180B2 (en) * 2004-08-25 2011-03-29 Protarius Filo Ag, L.L.C. Simultaneous multiple field of view digital cameras
EP1670066A1 (de) * 2004-12-08 2006-06-14 St Microelectronics S.A. Herstellungsverfahren für eine integrierte Schaltung mit eingebettetem Spiegel und entsprechende Schaltung
JP4277216B2 (ja) * 2005-01-13 2009-06-10 ソニー株式会社 撮像装置及び撮像結果の処理方法
US7935994B2 (en) * 2005-02-24 2011-05-03 Taiwan Semiconductor Manufacturing Company, Ltd. Light shield for CMOS imager
JP5247007B2 (ja) 2005-06-09 2013-07-24 キヤノン株式会社 撮像装置及び撮像システム
JP2007012995A (ja) * 2005-07-01 2007-01-18 Toshiba Corp 超小型カメラモジュール及びその製造方法
US20070102622A1 (en) 2005-07-01 2007-05-10 Olsen Richard I Apparatus for multiple camera devices and method of operating same
US7964835B2 (en) 2005-08-25 2011-06-21 Protarius Filo Ag, L.L.C. Digital cameras with direct luminance and chrominance detection
US20070258006A1 (en) * 2005-08-25 2007-11-08 Olsen Richard I Solid state camera optics frame and assembly
US20070048343A1 (en) * 2005-08-26 2007-03-01 Honeywell International Inc. Biocidal premixtures
US7456044B2 (en) * 2005-12-28 2008-11-25 Dongbu Electronics Co., Ltd. Method for manufacturing image sensor
KR100795922B1 (ko) * 2006-07-28 2008-01-21 삼성전자주식회사 이미지 픽업 소자 및 이미지 픽업 소자의 제조방법
US7978243B2 (en) * 2007-02-28 2011-07-12 Canon Kabushiki Kaisha Imaging apparatus, driving method thereof, and imaging system
US7999340B2 (en) * 2007-03-07 2011-08-16 Altasens, Inc. Apparatus and method for forming optical black pixels with uniformly low dark current
JP4346655B2 (ja) 2007-05-15 2009-10-21 株式会社東芝 半導体装置
JP4480740B2 (ja) * 2007-07-03 2010-06-16 シャープ株式会社 固体撮像素子およびその製造方法、電子情報機器
JP2009252983A (ja) * 2008-04-04 2009-10-29 Canon Inc 撮像センサー、及び撮像センサーの製造方法
JP4582205B2 (ja) * 2008-06-12 2010-11-17 トヨタ自動車株式会社 電動車両
ATE515798T1 (de) 2008-08-19 2011-07-15 St Microelectronics Rousset Speicherung eines bildes in einem integrierten schaltkreis
US8130289B2 (en) * 2008-09-25 2012-03-06 Aptima Imaging Corporation System, method, and apparatus for correction of dark current error in semiconductor imaging devices
FR2941327B1 (fr) * 2009-01-22 2012-05-04 St Microelectronics Sa Dispositif de saisie d'images comprenant des moyens de rassemblement de pixels.
US8300108B2 (en) * 2009-02-02 2012-10-30 L-3 Communications Cincinnati Electronics Corporation Multi-channel imaging devices comprising unit cells
JP2010282992A (ja) * 2009-06-02 2010-12-16 Sony Corp 固体撮像装置、および、その製造方法、電子機器
JP2012059865A (ja) * 2010-09-08 2012-03-22 Sony Corp 撮像素子および撮像装置

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3132808C2 (de) * 1981-08-19 1984-01-26 Nukem Gmbh, 6450 Hanau "Vorrichtung zur zerstörungsfreien Prüfung ferromagnetischer Körper"
US4956313A (en) * 1987-08-17 1990-09-11 International Business Machines Corporation Via-filling and planarization technique
JPH035956A (ja) * 1989-06-02 1991-01-11 Canon Inc 静止画再生装置
US5262871A (en) * 1989-11-13 1993-11-16 Rutgers, The State University Multiple resolution image sensor
US5849632A (en) * 1991-08-30 1998-12-15 Micron Technology, Inc. Method of passivating semiconductor wafers
JP2566087B2 (ja) * 1992-01-27 1996-12-25 株式会社東芝 有色マイクロレンズアレイ及びその製造方法
JPH06260621A (ja) * 1993-03-03 1994-09-16 Hitachi Ltd カラー固体撮像素子及びその製造方法
US5949483A (en) * 1994-01-28 1999-09-07 California Institute Of Technology Active pixel sensor array with multiresolution readout
US5677200A (en) 1995-05-12 1997-10-14 Lg Semicond Co., Ltd. Color charge-coupled device and method of manufacturing the same
JP3393424B2 (ja) 1995-11-24 2003-04-07 ソニー株式会社 固体撮像装置の製造方法及び固体撮像装置
JPH09232551A (ja) 1996-02-26 1997-09-05 Toshiba Corp 光電変換装置
US5734190A (en) 1996-03-11 1998-03-31 Eastman Kodak Company Imager having a plurality of cylindrical lenses
US6137535A (en) * 1996-11-04 2000-10-24 Eastman Kodak Company Compact digital camera with segmented fields of view
US6337713B1 (en) * 1997-04-04 2002-01-08 Asahi Kogaku Kogyo Kabushiki Kaisha Processor for image-pixel signals derived from divided sections of image-sensing area of solid-type image sensor
WO1999002950A1 (en) * 1997-07-12 1999-01-21 Optical Insights, Llc Multi-spectral two-dimensional imaging spectrometer
NO305728B1 (no) * 1997-11-14 1999-07-12 Reidar E Tangen Optoelektronisk kamera og fremgangsmÕte ved bildeformatering i samme
JPH11196332A (ja) 1997-12-26 1999-07-21 Canon Inc 固体撮像装置
US6271900B1 (en) * 1998-03-31 2001-08-07 Intel Corporation Integrated microlens and color filter structure
TW369726B (en) 1998-05-04 1999-09-11 United Microelectronics Corp Structure and producing method of microlens on color filter of sensor device
TW396645B (en) 1998-06-16 2000-07-01 United Microelectronics Corp Manufacturing method of CMOS sensor devices
US5982497A (en) * 1998-07-09 1999-11-09 Optical Insights, Llc Multi-spectral two-dimensional imaging spectrometer
US6665010B1 (en) * 1998-07-21 2003-12-16 Intel Corporation Controlling integration times of pixel sensors
US6597398B1 (en) * 1999-06-02 2003-07-22 Intel Corporation Image sensor response enhancement using fluorescent phosphors
US6171885B1 (en) * 1999-10-12 2001-01-09 Taiwan Semiconductor Manufacturing Company High efficiency color filter process for semiconductor array imaging devices
US6974236B2 (en) 2002-02-05 2005-12-13 Canon Kabushiki Kaisha Illuminating apparatus

Also Published As

Publication number Publication date
CN100362665C (zh) 2008-01-16
US7139028B2 (en) 2006-11-21
KR100488371B1 (ko) 2005-05-11
EP1365581B1 (de) 2013-01-09
CN1349120A (zh) 2002-05-15
CN1159904C (zh) 2004-07-28
KR20030082508A (ko) 2003-10-22
KR100506440B1 (ko) 2005-08-05
EP1365581A1 (de) 2003-11-26
EP1198126B1 (de) 2009-12-23
EP1198126A3 (de) 2003-06-04
KR20020030724A (ko) 2002-04-25
US20020051071A1 (en) 2002-05-02
EP1198126A2 (de) 2002-04-17
CN1522057A (zh) 2004-08-18

Similar Documents

Publication Publication Date Title
DE60125133D1 (de) Bildaufnahmegerät
NO20011727D0 (no) Billeddannende anordning
DE60140845D1 (de) Bildaufnahmegerät
DE60229808D1 (de) Bildaufnahmevorrichtung
DE60208594D1 (de) Bildaufnahmegerät
DE60239305D1 (de) Bildaufnahmevorrichtung
DE60044482D1 (de) Bilderzeugungsvorrichtung
DE60016997D1 (de) Bilderzeugungsvorrichtung
DE60042857D1 (de) Bildaufnahmevorrichtung
DE60045785D1 (de) Bildaufnahmegerät
DE60105510D1 (de) Bilderzeugungsgerät
DE60037118D1 (de) Bilderzeugungsvorrichtung
DE60142999D1 (de) Bildaufnahmegerät
DE60224237D1 (de) Abbildungsvorrichtung
DE60234552D1 (de) Bildaufnahmevorrichtung
DE60019487D1 (de) Bildaufnahmevorrichtung
DE60231080D1 (de) Bilderzeugungsvorrichtung
DE60029880D1 (de) Abbildungsgerät
DE60228739D1 (de) Bilderzeugungsvorrichtung
DE60209270D1 (de) Bildaufnahmevorrichtung
DE60129656D1 (de) Bildaufnahmegerät
DE60100155D1 (de) Bilderzeugungsvorrichtung
DE60117069D1 (de) Augenbildaufnahmevorrichtung
DE60127017D1 (de) Aufschlämmungsrückfluss-Vorrichtung
DE60116547D1 (de) Bilderzeugungsvorrichtung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition