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Verfahren zur Herstellung von mikromechanischen und mikrooptomechanischen Strukturen mit Freilegen von einkristallinem Silizium

Info

Publication number
DE60128529D1
DE60128529D1 DE2001628529 DE60128529A DE60128529D1 DE 60128529 D1 DE60128529 D1 DE 60128529D1 DE 2001628529 DE2001628529 DE 2001628529 DE 60128529 A DE60128529 A DE 60128529A DE 60128529 D1 DE60128529 D1 DE 60128529D1
Authority
DE
Grant status
Grant
Patent type
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE2001628529
Other languages
English (en)
Other versions
DE60128529T2 (de )
Inventor
Andrew J Zosel
Peter M Gulvin
Jingkuang Chen
Joel A Kubby
Chuang-Chia Lin
Alex T Tran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microscan Systems Inc
Xerox Corp
Original Assignee
Microscan Systems Inc
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/0065Mechanical properties
    • B81C1/00666Treatments for controlling internal stress or strain in MEMS structures
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B26/00Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating
    • G02B26/08Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating for controlling the direction of light
    • G02B26/0816Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/05Type of movement
    • B81B2203/058Rotation out of a plane parallel to the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/01Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128Processes for removing material
    • B81C2201/013Etching
    • B81C2201/0135Controlling etch progression
    • B81C2201/014Controlling etch progression by depositing an etch stop layer, e.g. silicon nitride, silicon oxide, metal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/01Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0161Controlling physical properties of the material
    • B81C2201/0163Controlling internal stress of deposited layers
    • B81C2201/0164Controlling internal stress of deposited layers by doping the layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/05Temporary protection of devices or parts of the devices during manufacturing
    • B81C2201/056Releasing structures at the end of the manufacturing process
DE2001628529 2000-11-27 2001-11-27 Verfahren zur Herstellung von mikromechanischen und mikrooptomechanischen Strukturen mit Freilegen von einkristallinem Silizium Active DE60128529D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US09724514 US6479315B1 (en) 2000-11-27 2000-11-27 Process for manufacturing micromechanical and microoptomechanical structures with single crystal silicon exposure step

Publications (1)

Publication Number Publication Date
DE60128529D1 true DE60128529D1 (de) 2007-07-05

Family

ID=24910720

Family Applications (2)

Application Number Title Priority Date Filing Date
DE2001628529 Active DE60128529T2 (de) 2000-11-27 2001-11-27 Verfahren zur Herstellung von mikromechanischen und mikrooptomechanischen Strukturen mit Freilegen von einkristallinem Silizium
DE2001628529 Active DE60128529D1 (de) 2000-11-27 2001-11-27 Verfahren zur Herstellung von mikromechanischen und mikrooptomechanischen Strukturen mit Freilegen von einkristallinem Silizium

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE2001628529 Active DE60128529T2 (de) 2000-11-27 2001-11-27 Verfahren zur Herstellung von mikromechanischen und mikrooptomechanischen Strukturen mit Freilegen von einkristallinem Silizium

Country Status (3)

Country Link
US (2) US6479315B1 (de)
DE (2) DE60128529T2 (de)
EP (1) EP1213259B1 (de)

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* Cited by examiner, † Cited by third party
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US6614110B1 (en) * 1994-12-22 2003-09-02 Benedict G Pace Module with bumps for connection and support
US6506620B1 (en) * 2000-11-27 2003-01-14 Microscan Systems Incorporated Process for manufacturing micromechanical and microoptomechanical structures with backside metalization
JP2002334927A (ja) * 2001-05-11 2002-11-22 Hitachi Ltd 半導体装置の製造方法
KR100456526B1 (ko) * 2001-05-22 2004-11-09 삼성전자주식회사 식각저지막을 갖는 에스오아이 기판, 그 제조방법, 그위에 제작된 에스오아이 집적회로 및 그것을 사용하여에스오아이 집적회로를 제조하는 방법
US20040240034A1 (en) * 2001-11-30 2004-12-02 Scharf Bruce R. Diffraction compensation using a patterned reflector
EP1483196B1 (de) * 2002-02-14 2016-02-03 Silex Microsystems AB Verfahren zur herstellung einer auslenkbaren mikrostruktur durch waferbonden
US6673697B2 (en) * 2002-04-03 2004-01-06 Intel Corporation Packaging microelectromechanical structures
US6858459B2 (en) * 2002-05-23 2005-02-22 Institute Of Microelectronics Method of fabricating micro-mirror switching device
KR100471153B1 (ko) * 2002-11-27 2005-03-10 삼성전기주식회사 Soi웨이퍼를 이용한 mems 디바이스의 제조 및 접지 방법
US6972255B2 (en) * 2003-07-28 2005-12-06 Freescale Semiconductor, Inc. Semiconductor device having an organic anti-reflective coating (ARC) and method therefor
US7056757B2 (en) * 2003-11-25 2006-06-06 Georgia Tech Research Corporation Methods of forming oxide masks with submicron openings and microstructures formed thereby
US7355793B2 (en) * 2004-05-19 2008-04-08 The Regents Of The University Of California Optical system applicable to improving the dynamic range of Shack-Hartmann sensors
US7067355B2 (en) * 2004-05-26 2006-06-27 Hewlett-Packard Development Company, L.P. Package having bond-sealed underbump
US20080119002A1 (en) * 2006-11-17 2008-05-22 Charles Grosjean Substrate contact for a MEMS device
US20080119001A1 (en) * 2006-11-17 2008-05-22 Charles Grosjean Substrate contact for a mems device
US20080119003A1 (en) * 2006-11-17 2008-05-22 Charles Grosjean Substrate contact for a MEMS device
US20080116534A1 (en) * 2006-11-17 2008-05-22 Charles Grosjean Substrate contact for a MEMS device
US7691746B2 (en) * 2007-07-31 2010-04-06 Hewlett-Packard Development Company, L.P. Formation of silicon nitride layer on back side of substrate
US20090088618A1 (en) 2007-10-01 2009-04-02 Arneson Michael R System and Method for Manufacturing a Swallowable Sensor Device
WO2009120900A4 (en) * 2008-03-26 2010-02-04 Endevco Corporation Interconnection system on a plane adjacent to a solid-state device structure
DE102016200494A1 (de) * 2016-01-15 2017-07-20 Robert Bosch Gmbh Verfahren zum Herstellen eines mehrschichtigen MEMS-Bauelements und entsprechendes mehrschichtiges MEMS-Bauelement

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Publication number Priority date Publication date Assignee Title
US6149190A (en) 1993-05-26 2000-11-21 Kionix, Inc. Micromechanical accelerometer for automotive applications
DE4318466B4 (de) 1993-06-03 2004-12-09 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Sensors
US5476819A (en) 1993-07-26 1995-12-19 Litton Systems, Inc. Substrate anchor for undercut silicon on insulator microstructures
DE4331798B4 (de) * 1993-09-18 2004-08-26 Robert Bosch Gmbh Verfahren zur Herstellung von mikromechanischen Bauelementen
US5589083A (en) 1993-12-11 1996-12-31 Electronics And Telecommunications Research Institute Method of manufacturing microstructure by the anisotropic etching and bonding of substrates
US5824186A (en) * 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5645684A (en) 1994-03-07 1997-07-08 The Regents Of The University Of California Multilayer high vertical aspect ratio thin film structures
US5660680A (en) 1994-03-07 1997-08-26 The Regents Of The University Of California Method for fabrication of high vertical aspect ratio thin film structures
US5484073A (en) 1994-03-28 1996-01-16 I/O Sensors, Inc. Method for fabricating suspension members for micromachined sensors
US5569355A (en) 1995-01-11 1996-10-29 Center For Advanced Fiberoptic Applications Method for fabrication of microchannel electron multipliers
US6084257A (en) 1995-05-24 2000-07-04 Lucas Novasensor Single crystal silicon sensor with high aspect ratio and curvilinear structures
JPH11508347A (ja) 1995-06-21 1999-07-21 フアーマシア・バイオテツク・アー・ベー 膜を含むマイクロストラクチャを製造する方法
DE19603829A1 (de) 1996-02-02 1997-08-07 Daimler Benz Ag Verfahren zur Herstellung von mikromechanischen Strukturen aus Silizium
US6074890A (en) 1998-01-08 2000-06-13 Rockwell Science Center, Llc Method of fabricating suspended single crystal silicon micro electro mechanical system (MEMS) devices
US5853960A (en) 1998-03-18 1998-12-29 Trw Inc. Method for producing a micro optical semiconductor lens
US6117344A (en) 1998-03-20 2000-09-12 Borealis Technical Limited Method for manufacturing low work function surfaces
US6014240A (en) 1998-12-01 2000-01-11 Xerox Corporation Method and apparatus for an integrated laser beam scanner using a carrier substrate
US6002507A (en) 1998-12-01 1999-12-14 Xerox Corpoation Method and apparatus for an integrated laser beam scanner
US6238581B1 (en) 1998-12-18 2001-05-29 Eastman Kodak Company Process for manufacturing an electro-mechanical grating device
US6379989B1 (en) 1998-12-23 2002-04-30 Xerox Corporation Process for manufacture of microoptomechanical structures
US6362512B1 (en) 1998-12-23 2002-03-26 Xerox Corporation Microelectromechanical structures defined from silicon on insulator wafers

Also Published As

Publication number Publication date Type
DE60128529T2 (de) 2008-01-24 grant
EP1213259A2 (de) 2002-06-12 application
JP2002301697A (ja) 2002-10-15 application
US6479315B1 (en) 2002-11-12 grant
EP1213259B1 (de) 2007-05-23 grant
EP1213259A3 (de) 2004-06-16 application
US6661070B2 (en) 2003-12-09 grant
US20020197762A1 (en) 2002-12-26 application

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