DE60118276D1 - Wärmeleitendes Material und Verfahren zu seiner Herstellung - Google Patents

Wärmeleitendes Material und Verfahren zu seiner Herstellung

Info

Publication number
DE60118276D1
DE60118276D1 DE60118276T DE60118276T DE60118276D1 DE 60118276 D1 DE60118276 D1 DE 60118276D1 DE 60118276 T DE60118276 T DE 60118276T DE 60118276 T DE60118276 T DE 60118276T DE 60118276 D1 DE60118276 D1 DE 60118276D1
Authority
DE
Germany
Prior art keywords
preparation
conductive material
thermally conductive
thermally
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60118276T
Other languages
English (en)
Other versions
DE60118276T2 (de
Inventor
Yasuhiro Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Original Assignee
Kitagawa Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Industries Co Ltd filed Critical Kitagawa Industries Co Ltd
Application granted granted Critical
Publication of DE60118276D1 publication Critical patent/DE60118276D1/de
Publication of DE60118276T2 publication Critical patent/DE60118276T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE60118276T 2000-06-02 2001-05-31 Wärmeleitendes Material und Verfahren zu seiner Herstellung Expired - Lifetime DE60118276T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000166173A JP3340112B2 (ja) 2000-06-02 2000-06-02 熱伝導材及びその製造方法
JP2000166173 2000-06-02

Publications (2)

Publication Number Publication Date
DE60118276D1 true DE60118276D1 (de) 2006-05-18
DE60118276T2 DE60118276T2 (de) 2006-08-31

Family

ID=18669532

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60118276T Expired - Lifetime DE60118276T2 (de) 2000-06-02 2001-05-31 Wärmeleitendes Material und Verfahren zu seiner Herstellung

Country Status (4)

Country Link
US (1) US6890970B2 (de)
EP (1) EP1160862B1 (de)
JP (1) JP3340112B2 (de)
DE (1) DE60118276T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040195678A1 (en) * 2001-07-02 2004-10-07 Yoshinao Yamazaki Thermoconductive composition
CN101835365B (zh) * 2002-10-21 2013-03-27 莱尔德技术公司 导热的电磁干扰屏蔽
KR100704063B1 (ko) * 2003-07-07 2007-04-09 가부시키가이샤 고베 세이코쇼 수지도장금속판(樹脂塗裝金屬板)
KR100637435B1 (ko) * 2004-05-19 2006-10-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP4855040B2 (ja) * 2005-10-14 2012-01-18 富士フイルム株式会社 赤外線遮蔽フィルタ
US20100219369A1 (en) * 2005-12-20 2010-09-02 Industrial Technology Research Institute Composition of thermal interface material
KR101919052B1 (ko) * 2012-06-04 2018-11-16 삼성전자주식회사 좌표 표시 장치 및 좌표 표시 장치의 입력 좌표를 측정하는 좌표 측정 장치
US20160032166A1 (en) * 2014-01-22 2016-02-04 Zhejiang Saintyear Electronic Technologies Co., Ltd. Hot-melt adhesive composition and method for preparing the same, hot-melt adhesive thermal conductive sheet and method for preparing the same
KR101686989B1 (ko) 2014-08-07 2016-12-19 주식회사 모다이노칩 파워 인덕터
KR101662209B1 (ko) * 2014-09-11 2016-10-06 주식회사 모다이노칩 파워 인덕터 및 그 제조 방법
JP6403093B2 (ja) * 2015-02-04 2018-10-10 住友電気工業株式会社 複合材料、磁気部品用の磁性コア、リアクトル、コンバータ、及び電力変換装置
WO2018088318A1 (ja) * 2016-11-11 2018-05-17 三菱電機株式会社 半導体装置およびその製造方法ならびに無線通信機器
JP6363687B2 (ja) * 2016-12-26 2018-07-25 デクセリアルズ株式会社 半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4508640A (en) * 1981-11-24 1985-04-02 Showa Denko Kabushiki Kaisha Electromagnetic wave-shielding materials
US5177143A (en) * 1984-08-31 1993-01-05 Raychem Corporation Method of making heat stable polymeric gelloid composition
JP2604823B2 (ja) 1988-09-13 1997-04-30 株式会社フジクラ 半導電性樹脂組成物
ES2072351T3 (es) * 1990-01-09 1995-07-16 Rxs Schrumpftech Garnituren Procedimiento para la fabricacion de un forro de control del campo para guarniciones de cable para tension media.
AU4705096A (en) * 1995-01-27 1996-08-14 Raychem Corporation Gels from anhydride-containing polymers
US5569516A (en) * 1995-03-03 1996-10-29 Union Carbide Chem Plastic Membrane and mixture comprising a thermoplastic elastomer
EP0956590A1 (de) 1996-04-29 1999-11-17 Parker-Hannifin Corporation Anpassungsfähiges thermisches zwischenlagematerial für elektronischen komponenten
US5929138A (en) * 1996-11-05 1999-07-27 Raychem Corporation Highly thermally conductive yet highly comformable alumina filled composition and method of making the same
JP4077963B2 (ja) 1998-11-04 2008-04-23 日東電工株式会社 放熱シート
JP2992285B1 (ja) * 1998-11-10 1999-12-20 北川工業株式会社 熱伝導材
US6391442B1 (en) * 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
US6451422B1 (en) * 1999-12-01 2002-09-17 Johnson Matthey, Inc. Thermal interface materials

Also Published As

Publication number Publication date
EP1160862B1 (de) 2006-03-29
EP1160862A1 (de) 2001-12-05
JP3340112B2 (ja) 2002-11-05
US20020033561A1 (en) 2002-03-21
DE60118276T2 (de) 2006-08-31
US6890970B2 (en) 2005-05-10
JP2001345407A (ja) 2001-12-14

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