DE60104007D1 - Stromlose plattierung einer platinum-rhodium-legierung - Google Patents

Stromlose plattierung einer platinum-rhodium-legierung

Info

Publication number
DE60104007D1
DE60104007D1 DE60104007T DE60104007T DE60104007D1 DE 60104007 D1 DE60104007 D1 DE 60104007D1 DE 60104007 T DE60104007 T DE 60104007T DE 60104007 T DE60104007 T DE 60104007T DE 60104007 D1 DE60104007 D1 DE 60104007D1
Authority
DE
Germany
Prior art keywords
platinum
rhodium alloy
rhodium
plating
electric plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60104007T
Other languages
English (en)
Other versions
DE60104007T2 (de
Inventor
S Kozlov
Dave Narasimhan
Thirumalai Palanisamy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of DE60104007D1 publication Critical patent/DE60104007D1/de
Application granted granted Critical
Publication of DE60104007T2 publication Critical patent/DE60104007T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component
DE60104007T 2000-07-06 2001-07-05 Stromlose plattierung einer platinum-rhodium-legierung Expired - Fee Related DE60104007T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/611,182 US6706420B1 (en) 2000-07-06 2000-07-06 Electroless platinum-rhodium alloy plating
US611182 2000-07-06
PCT/US2001/021257 WO2002004702A2 (en) 2000-07-06 2001-07-05 Electroless platinum-rhodium alloy plating

Publications (2)

Publication Number Publication Date
DE60104007D1 true DE60104007D1 (de) 2004-07-29
DE60104007T2 DE60104007T2 (de) 2005-07-07

Family

ID=24447950

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60104007T Expired - Fee Related DE60104007T2 (de) 2000-07-06 2001-07-05 Stromlose plattierung einer platinum-rhodium-legierung

Country Status (8)

Country Link
US (1) US6706420B1 (de)
EP (1) EP1297198B1 (de)
JP (1) JP2004502873A (de)
AT (1) ATE269912T1 (de)
AU (1) AU2001275865A1 (de)
CA (1) CA2415780A1 (de)
DE (1) DE60104007T2 (de)
WO (1) WO2002004702A2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7567781B2 (en) 2001-01-05 2009-07-28 Qualcomm, Incorporated Method and apparatus for power level adjustment in a wireless communication system
US7945266B2 (en) 2000-12-05 2011-05-17 Qualcomm Incorporated Method and apparatus for call recovery in a wireless communication system
US7314650B1 (en) 2003-08-05 2008-01-01 Leonard Nanis Method for fabricating sputter targets
CA2625777A1 (en) * 2005-10-13 2007-04-26 Velocys, Inc. Electroless plating in microchannels
KR100929339B1 (ko) * 2008-02-26 2009-12-03 창원대학교 산학협력단 무전해 도금에 의한 오믹 접촉용 백금증착 방법
US8317910B2 (en) 2010-03-22 2012-11-27 Unity Semiconductor Corporation Immersion platinum plating solution
DE102010026930A1 (de) * 2010-07-12 2012-01-12 C. Hafner Gmbh + Co. Kg Ideal-weiße, anlaufbeständige Edelmetall-Schmucklegierung
US20140170328A1 (en) * 2012-12-14 2014-06-19 Noram Engineering And Constructors Ltd. Electroless plating of ruthenium and ruthenium-plated products
LT6548B (lt) 2016-12-28 2018-08-10 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Platinos-rodžio lydinio cheminio nusodinimo tirpalas ir platinos-rodžio lydinio tolydžios dangos formavimo būdas
CN114408858B (zh) * 2022-01-05 2023-03-17 北京科技大学 一种室温可吸氢锆基复合材料的制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3486928A (en) * 1965-10-21 1969-12-30 Int Nickel Co Bath and process for platinum and platinum alloys
US3562911A (en) 1968-12-03 1971-02-16 Dentsply Int Inc Method and composition for platinum plating and articles plated therewith
CH606475A5 (de) 1976-02-05 1978-10-31 Bbc Brown Boveri & Cie
US4285784A (en) 1980-07-10 1981-08-25 The United States Of America As Represented By The Secretary Of The Interior Process of electroplating a platinum-rhodium alloy coating
JPS5751276A (en) 1980-09-13 1982-03-26 Agency Of Ind Science & Technol Manufacture of anode for electrolyzing water
JPS5939504B2 (ja) 1982-05-19 1984-09-25 工業技術院長 ロジウム又はロジウム合金の無電解メツキ浴
JPS5933667B2 (ja) 1982-10-28 1984-08-17 工業技術院長 白金又は白金−パラジウム合金の無電解メツキ浴
JPH02324A (ja) * 1987-12-18 1990-01-05 Mitsui Mining & Smelting Co Ltd 導電膜回路およびその製造方法
US5980345A (en) * 1998-07-13 1999-11-09 Alliedsignal Inc. Spark plug electrode having iridium based sphere and method for manufacturing same

Also Published As

Publication number Publication date
ATE269912T1 (de) 2004-07-15
JP2004502873A (ja) 2004-01-29
EP1297198A2 (de) 2003-04-02
CA2415780A1 (en) 2002-01-17
AU2001275865A1 (en) 2002-01-21
WO2002004702A2 (en) 2002-01-17
DE60104007T2 (de) 2005-07-07
WO2002004702A3 (en) 2002-07-18
EP1297198B1 (de) 2004-06-23
US6706420B1 (en) 2004-03-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee