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EMV-gerechte Schirmkappe für einer Leiterplatte

Info

Publication number
DE60028460D1
DE60028460D1 DE2000628460 DE60028460A DE60028460D1 DE 60028460 D1 DE60028460 D1 DE 60028460D1 DE 2000628460 DE2000628460 DE 2000628460 DE 60028460 A DE60028460 A DE 60028460A DE 60028460 D1 DE60028460 D1 DE 60028460D1
Authority
DE
Grant status
Grant
Patent type
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE2000628460
Other languages
English (en)
Other versions
DE60028460T2 (de )
Inventor
Eugen Koleda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Oy AB
Original Assignee
Nokia Oy AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans, caps, conformal shields
    • H05K9/0032Shield cases mounted on a PCB, e.g. cans, caps, conformal shields having multiple parts, e.g. frames mating with lids
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2201/00Articles made by soldering, welding or cutting by applying heat locally
    • B23K2201/36Electric or electronic devices
    • B23K2201/42Printed circuits
DE2000628460 1999-06-18 2000-06-16 EMV-gerechte Schirmkappe für einer Leiterplatte Expired - Fee Related DE60028460D1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9914263A GB2351183B (en) 1999-06-18 1999-06-18 Shielding can for a printed circuit board

Publications (1)

Publication Number Publication Date
DE60028460D1 true DE60028460D1 (de) 2006-07-20

Family

ID=10855613

Family Applications (2)

Application Number Title Priority Date Filing Date
DE2000628460 Active DE60028460T2 (de) 1999-06-18 2000-06-16 EMV-gerechte Schirmkappe für eine Leiterplatte
DE2000628460 Expired - Fee Related DE60028460D1 (de) 1999-06-18 2000-06-16 EMV-gerechte Schirmkappe für einer Leiterplatte

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE2000628460 Active DE60028460T2 (de) 1999-06-18 2000-06-16 EMV-gerechte Schirmkappe für eine Leiterplatte

Country Status (4)

Country Link
US (1) US6600663B1 (de)
DE (2) DE60028460T2 (de)
EP (1) EP1061789B1 (de)
GB (1) GB2351183B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3960115B2 (ja) * 2001-05-24 2007-08-15 松下電器産業株式会社 携帯用電力増幅器
WO2003045124A3 (en) * 2001-11-23 2003-08-28 Ericsson Telefon Ab L M A replaceable shield can
DE10231145A1 (de) 2002-07-10 2004-01-29 Siemens Ag Abschirmeinrichtung für elektronische Baugruppen auf einer Leiterplatte
US7580395B2 (en) * 2002-11-29 2009-08-25 Intermec Ip Corp. Information gathering apparatus and method having multiple wireless communication options
US7005573B2 (en) 2003-02-13 2006-02-28 Parker-Hannifin Corporation Composite EMI shield
US7326862B2 (en) 2003-02-13 2008-02-05 Parker-Hannifin Corporation Combination metal and plastic EMI shield
EP1738625B1 (de) * 2004-01-29 2010-11-10 Laird Technologies, Inc. Ultraniedriges elektromagnetische störungen abschirmendes gehäuse
US7362585B2 (en) * 2005-02-11 2008-04-22 Research In Motion Limited Frame for a device mounted above a printed circuit board in an electronic device
JP3875709B2 (ja) * 2005-03-22 2007-01-31 株式会社東芝 電子回路ユニットとそのシールド構造
US7508684B2 (en) * 2006-08-18 2009-03-24 Research In Motion Limited Handheld electronic device including multi-compartment shielding container and associated methods
US7952890B2 (en) 2008-04-30 2011-05-31 Apple Inc. Interlocking EMI shield
CN201336797Y (zh) * 2008-12-12 2009-10-28 鸿富锦精密工业(深圳)有限公司 屏蔽罩
US8093509B2 (en) * 2009-04-08 2012-01-10 Azurewave Technologies, Inc. Flexible thin image-sensing module with anti-EMI function and flexible thin PCB module with anti-EMI function
CN102300445B (zh) * 2010-06-23 2014-02-26 环旭电子股份有限公司 防止电磁波干扰的屏蔽装置
US8780004B1 (en) * 2012-01-31 2014-07-15 Western Digital Technologies, Inc. Dual configuration enclosure with optional shielding
US9521741B1 (en) 2014-06-04 2016-12-13 Amazon Technologies, Inc. Side surface mounting of shields for a circuit board assembly
KR20170039029A (ko) * 2015-09-30 2017-04-10 삼성디스플레이 주식회사 구동 회로 유닛 및 이를 포함하는 표시 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5536905A (en) * 1994-04-04 1996-07-16 Motorola, Inc. Self secured housing for electronics
JPH0818265A (ja) * 1994-06-29 1996-01-19 Molex Inc プリント回路基板上での電磁波等のシ−ルド方法 及びその為のシ−ルドカバ−
GB2297868B (en) * 1995-02-07 1999-04-28 Nokia Mobile Phones Ltd A shielding device
GB2297869B (en) * 1995-02-07 1999-03-31 Nokia Mobile Phones Ltd A shielding device
DE29505327U1 (de) * 1995-03-29 1995-08-03 Siemens Ag Abschirmung für Logik- und Hochfrequenzschaltkreise
US5774344A (en) * 1995-12-06 1998-06-30 Metricom, Inc. RF shield for circuit card having a solid first flange
JP2817702B2 (ja) * 1996-03-29 1998-10-30 日本電気株式会社 無線ユニットの取付け構造及びこの取付け構造を用いた無線ユニットの取付け方法
US6058018A (en) * 1996-04-05 2000-05-02 Berg Technology, Inc. Electronic card
US5748455A (en) * 1996-04-23 1998-05-05 Ericsson, Inc. Electromagnetic shield for a radiotelephone
GB2322012B (en) * 1997-02-05 2001-07-11 Nokia Mobile Phones Ltd Self securing RF screened housing
EP0866648B1 (de) * 1997-03-19 2005-01-05 Telefonaktiebolaget LM Ericsson (publ) Zweiteilige elektromagnetische Abschirmvorrichtung zur Befestigung auf einer Leiterplatte
US6121544A (en) * 1998-01-15 2000-09-19 Petsinger; Julie Ann Electromagnetic shield to prevent surreptitious access to contactless smartcards
US6137051A (en) * 1998-12-09 2000-10-24 Nortel Networks Corporation EMI shield/ gasket enclosure

Also Published As

Publication number Publication date Type
GB2351183A (en) 2000-12-20 application
EP1061789B1 (de) 2006-06-07 grant
GB2351183B (en) 2003-10-15 grant
EP1061789A3 (de) 2001-09-12 application
DE60028460T2 (de) 2007-03-01 grant
EP1061789A2 (de) 2000-12-20 application
US6600663B1 (en) 2003-07-29 grant
GB9914263D0 (en) 1999-08-18 grant

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee