DE60023320D1 - Kondensator-über-bitleitung speicher-schaltung - Google Patents

Kondensator-über-bitleitung speicher-schaltung

Info

Publication number
DE60023320D1
DE60023320D1 DE60023320T DE60023320T DE60023320D1 DE 60023320 D1 DE60023320 D1 DE 60023320D1 DE 60023320 T DE60023320 T DE 60023320T DE 60023320 T DE60023320 T DE 60023320T DE 60023320 D1 DE60023320 D1 DE 60023320D1
Authority
DE
Germany
Prior art keywords
capacitor
cell electrode
capacitor storage
electrode layer
formed over
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60023320T
Other languages
English (en)
Other versions
DE60023320T2 (de
Inventor
A Lowrey
C Tran
R Reinberg
Mark Durcan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micron Technology Inc
Original Assignee
Micron Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micron Technology Inc filed Critical Micron Technology Inc
Application granted granted Critical
Publication of DE60023320D1 publication Critical patent/DE60023320D1/de
Publication of DE60023320T2 publication Critical patent/DE60023320T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
    • H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
    • H01L28/84—Electrodes with an enlarged surface, e.g. formed by texturisation being a rough surface, e.g. using hemispherical grains
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
    • H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
    • H01L28/91—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions made by depositing layers, e.g. by depositing alternating conductive and insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/03—Making the capacitor or connections thereto
    • H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H10B12/315—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor with the capacitor higher than a bit line
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/09—Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
DE60023320T 1999-09-02 2000-08-30 Kondensator-über-bitleitung speicher-schaltung Expired - Lifetime DE60023320T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/389,532 US6312988B1 (en) 1999-09-02 1999-09-02 Methods of forming capacitors, methods of forming capacitor-over-bit line memory circuitry, and related integrated circuitry constructions
US389532 1999-09-02
PCT/US2000/040792 WO2001017016A2 (en) 1999-09-02 2000-08-30 Capacitor-over-bit line memory circuitry

Publications (2)

Publication Number Publication Date
DE60023320D1 true DE60023320D1 (de) 2006-03-02
DE60023320T2 DE60023320T2 (de) 2006-07-20

Family

ID=23538656

Family Applications (2)

Application Number Title Priority Date Filing Date
DE05015901T Pending DE05015901T1 (de) 1999-09-02 2000-08-30 Methode zur Herstellung von Kondensator-über-Bitleitung-Speicherschaltung
DE60023320T Expired - Lifetime DE60023320T2 (de) 1999-09-02 2000-08-30 Kondensator-über-bitleitung speicher-schaltung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE05015901T Pending DE05015901T1 (de) 1999-09-02 2000-08-30 Methode zur Herstellung von Kondensator-über-Bitleitung-Speicherschaltung

Country Status (9)

Country Link
US (4) US6312988B1 (de)
EP (4) EP1210734B1 (de)
JP (2) JP2003508913A (de)
KR (1) KR100621712B1 (de)
AT (1) ATE307391T1 (de)
AU (1) AU1249701A (de)
DE (2) DE05015901T1 (de)
TW (1) TW484200B (de)
WO (1) WO2001017016A2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4282245B2 (ja) * 2001-01-31 2009-06-17 富士通株式会社 容量素子及びその製造方法並びに半導体装置
JP3812645B2 (ja) * 2001-07-31 2006-08-23 セイコーエプソン株式会社 半導体装置
KR100446293B1 (ko) * 2002-01-07 2004-09-01 삼성전자주식회사 저항체를 포함하는 반도체 소자 제조 방법
US6894915B2 (en) 2002-11-15 2005-05-17 Micron Technology, Inc. Method to prevent bit line capacitive coupling
US6921692B2 (en) * 2003-07-07 2005-07-26 Micron Technology, Inc. Methods of forming memory circuitry
US20100012996A1 (en) * 2008-07-16 2010-01-21 Promos Technologies Inc. Dynamic random access memory structure
EP2392019A2 (de) * 2009-02-02 2011-12-07 Space Charge, LLC Kondensator mit kohlenstoffbasierten erweiterungen

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682800B2 (ja) * 1985-04-16 1994-10-19 株式会社東芝 半導体記憶装置
US5566045A (en) * 1994-08-01 1996-10-15 Texas Instruments, Inc. High-dielectric-constant material electrodes comprising thin platinum layers
US5614438A (en) 1995-03-15 1997-03-25 Radiant Technologies, Inc. Method for making LSCO stack electrode
US5866453A (en) 1995-09-14 1999-02-02 Micron Technology, Inc. Etch process for aligning a capacitor structure and an adjacent contact corridor
US5793076A (en) * 1995-09-21 1998-08-11 Micron Technology, Inc. Scalable high dielectric constant capacitor
US6284591B1 (en) 1995-11-02 2001-09-04 Samsung Electromics Co., Ltd. Formation method of interconnection in semiconductor device
DE19543539C1 (de) 1995-11-22 1997-04-10 Siemens Ag Verfahren zur Herstellung einer Speicherzellenanordnung
KR100224707B1 (ko) * 1995-12-23 1999-10-15 윤종용 반도체 장치 커패시터의 제조방법
JPH09298284A (ja) * 1996-05-09 1997-11-18 Nec Corp 半導体容量素子の形成方法
JP2930016B2 (ja) * 1996-07-04 1999-08-03 日本電気株式会社 半導体装置の製造方法
JP4056588B2 (ja) * 1996-11-06 2008-03-05 富士通株式会社 半導体装置及びその製造方法
US5770500A (en) 1996-11-15 1998-06-23 Micron Technology, Inc. Process for improving roughness of conductive layer
JPH10163451A (ja) * 1996-12-02 1998-06-19 Hitachi Ltd 半導体記憶装置
US5759893A (en) * 1996-12-05 1998-06-02 Powerchip Semiconductor Corp. Method of fabricating a rugged-crown shaped capacitor
US5918122A (en) * 1997-02-11 1999-06-29 Micron Technology, Inc. Methods of forming integrated circuitry, DRAM cells and capacitors
JP3962443B2 (ja) * 1997-03-05 2007-08-22 富士通株式会社 半導体装置とその製造方法
JP3060995B2 (ja) * 1997-05-29 2000-07-10 日本電気株式会社 半導体容量素子構造および製造方法
KR100274593B1 (ko) 1997-09-04 2000-12-15 윤종용 디램 셀 캐패시터 및 그의 제조 방법
US5903493A (en) * 1997-09-17 1999-05-11 Lucent Technologies Inc. Metal to metal capacitor apparatus and method for making
JPH11186515A (ja) * 1997-12-22 1999-07-09 Nippon Steel Corp 半導体装置及びその製造方法
TW427014B (en) * 1997-12-24 2001-03-21 United Microelectronics Corp The manufacturing method of the capacitors of DRAM
US6265263B1 (en) 1998-02-19 2001-07-24 Texas Instruments - Acer Incorporated Method for forming a DRAM capacitor with porous storage node and rugged sidewalls
US5858831A (en) * 1998-02-27 1999-01-12 Vanguard International Semiconductor Corporation Process for fabricating a high performance logic and embedded dram devices on a single semiconductor chip
JP3185747B2 (ja) 1998-03-20 2001-07-11 日本電気株式会社 半導体装置及びその製造方法
JP3230663B2 (ja) * 1998-03-27 2001-11-19 日本電気株式会社 円筒型スタック電極の製造方法
KR100301370B1 (ko) 1998-04-29 2001-10-27 윤종용 디램셀커패시터의제조방법
TW420871B (en) * 1999-01-08 2001-02-01 Taiwan Semiconductor Mfg Process for improving the characteristics of stack capacitors
US6159818A (en) * 1999-09-02 2000-12-12 Micron Technology, Inc. Method of forming a container capacitor structure
US6184081B1 (en) * 1999-10-08 2001-02-06 Vanguard International Semiconductor Corporation Method of fabricating a capacitor under bit line DRAM structure using contact hole liners

Also Published As

Publication number Publication date
DE05015901T1 (de) 2006-06-22
US20050191819A1 (en) 2005-09-01
KR100621712B1 (ko) 2006-09-13
JP2007053396A (ja) 2007-03-01
EP1210734A2 (de) 2002-06-05
EP1589575A2 (de) 2005-10-26
AU1249701A (en) 2001-03-26
EP1589575A3 (de) 2007-05-02
US20010001489A1 (en) 2001-05-24
TW484200B (en) 2002-04-21
WO2001017016A2 (en) 2001-03-08
DE60023320T2 (de) 2006-07-20
WO2001017016A3 (en) 2001-08-02
JP5181263B2 (ja) 2013-04-10
EP1589574A2 (de) 2005-10-26
US20020045313A1 (en) 2002-04-18
EP1589574A3 (de) 2007-05-02
US6599800B2 (en) 2003-07-29
EP1603152A2 (de) 2005-12-07
US6312988B1 (en) 2001-11-06
EP1210734B1 (de) 2005-10-19
EP1603152A3 (de) 2007-05-16
JP2003508913A (ja) 2003-03-04
ATE307391T1 (de) 2005-11-15
KR20020026002A (ko) 2002-04-04
US6600190B2 (en) 2003-07-29
US6995059B2 (en) 2006-02-07

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Legal Events

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8364 No opposition during term of opposition