DE60018873D1 - Verbindungsmaterial für anisotrope elektrisch leitende Verbindung - Google Patents
Verbindungsmaterial für anisotrope elektrisch leitende VerbindungInfo
- Publication number
- DE60018873D1 DE60018873D1 DE60018873T DE60018873T DE60018873D1 DE 60018873 D1 DE60018873 D1 DE 60018873D1 DE 60018873 T DE60018873 T DE 60018873T DE 60018873 T DE60018873 T DE 60018873T DE 60018873 D1 DE60018873 D1 DE 60018873D1
- Authority
- DE
- Germany
- Prior art keywords
- electrically conductive
- conductive connection
- connecting material
- anisotropic electrically
- anisotropic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01—Chemical elements
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- H01L2924/0105—Tin [Sn]
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- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0233—Deformable particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28980099 | 1999-10-12 | ||
JP28980099 | 1999-10-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60018873D1 true DE60018873D1 (de) | 2005-04-28 |
DE60018873T2 DE60018873T2 (de) | 2006-02-23 |
Family
ID=17747937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60018873T Expired - Lifetime DE60018873T2 (de) | 1999-10-12 | 2000-10-12 | Verbindungsmaterial für anisotrope elektrisch leitende Verbindung |
Country Status (5)
Country | Link |
---|---|
US (1) | US6451875B1 (de) |
EP (1) | EP1093160B1 (de) |
KR (1) | KR100861757B1 (de) |
DE (1) | DE60018873T2 (de) |
TW (1) | TW525252B (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050084536A (ko) * | 1997-04-17 | 2005-08-26 | 세키스이가가쿠 고교가부시키가이샤 | 도전성 미립자의 제조장치, 그 제조장치를 이용한 도전성미립자의 제조방법, 그 제조장치를 이용하여 이루어지는전자회로부품 |
JP3417354B2 (ja) * | 1999-08-19 | 2003-06-16 | ソニーケミカル株式会社 | 接着材料及び回路接続方法 |
JP3738655B2 (ja) * | 2000-03-31 | 2006-01-25 | ソニーケミカル株式会社 | 異方性導電接着材料及び接続方法 |
DE10059765A1 (de) * | 2000-11-30 | 2002-06-06 | Koninkl Philips Electronics Nv | Baugruppe mit Verbindungsstruktur |
EP2282374A1 (de) | 2003-06-25 | 2011-02-09 | Hitachi Chemical Company, Ltd. | Schaltkreissmaterial |
US8932632B2 (en) * | 2003-10-21 | 2015-01-13 | Ppg Industries Ohio, Inc. | Adhesives and sealants nanotechnology |
JP2005251654A (ja) * | 2004-03-05 | 2005-09-15 | Jst Mfg Co Ltd | 異方導電性シート及びその製造方法 |
DE102004029589A1 (de) * | 2004-06-18 | 2005-12-29 | Tesa Ag | Elektrisch anisotrop leitfähiger Schmelzkleber zur Implantierung von elektrischen Modulen in einen Kartenkörper |
TWI323901B (en) * | 2004-11-26 | 2010-04-21 | Hon Hai Prec Ind Co Ltd | Anisotropic conductive material |
KR101134168B1 (ko) * | 2005-08-24 | 2012-04-09 | 삼성전자주식회사 | 반도체 칩 및 그 제조 방법과, 그를 이용한 표시 패널 및그 제조 방법 |
KR100920612B1 (ko) * | 2007-11-08 | 2009-10-08 | 제일모직주식회사 | 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성필름 |
DE102009037627A1 (de) * | 2009-08-14 | 2011-02-17 | Giesecke & Devrient Gmbh | Portabler Datenträger |
US9070851B2 (en) | 2010-09-24 | 2015-06-30 | Seoul Semiconductor Co., Ltd. | Wafer-level light emitting diode package and method of fabricating the same |
KR101952844B1 (ko) * | 2011-09-14 | 2019-02-28 | 삼성전기주식회사 | 전력 모듈 패키지 및 그 제조방법 |
TWI467718B (zh) | 2011-12-30 | 2015-01-01 | Ind Tech Res Inst | 凸塊結構以及電子封裝接點結構及其製造方法 |
JP6085031B2 (ja) * | 2014-07-22 | 2017-02-22 | 積水化学工業株式会社 | 接続構造体の製造方法 |
FR3029530B1 (fr) * | 2014-12-05 | 2018-11-09 | Scapa Group Plc. | Ruban adhesif conducteur d'electricite |
CN205944139U (zh) | 2016-03-30 | 2017-02-08 | 首尔伟傲世有限公司 | 紫外线发光二极管封装件以及包含此的发光二极管模块 |
JP6945276B2 (ja) * | 2016-03-31 | 2021-10-06 | デクセリアルズ株式会社 | 異方性導電接続構造体 |
JP7185252B2 (ja) | 2018-01-31 | 2022-12-07 | 三国電子有限会社 | 接続構造体の作製方法 |
JP7046351B2 (ja) | 2018-01-31 | 2022-04-04 | 三国電子有限会社 | 接続構造体の作製方法 |
JP7160302B2 (ja) * | 2018-01-31 | 2022-10-25 | 三国電子有限会社 | 接続構造体および接続構造体の作製方法 |
TWI671921B (zh) * | 2018-09-14 | 2019-09-11 | 頎邦科技股份有限公司 | 晶片封裝構造及其晶片 |
KR102091938B1 (ko) * | 2018-10-01 | 2020-03-20 | 전자부품연구원 | 반도체소자 실장재 및 제조방법 |
GB2584106B (en) * | 2019-05-21 | 2024-03-27 | Pragmatic Printing Ltd | Flexible electronic structure |
CN116190337B (zh) * | 2023-04-23 | 2023-07-14 | 深圳平创半导体有限公司 | 电子器件及其制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2911927B2 (ja) | 1989-11-29 | 1999-06-28 | 株式会社町田製作所 | 可撓管の製造方法 |
JP2835145B2 (ja) * | 1990-05-28 | 1998-12-14 | 株式会社東芝 | 電子装置 |
CA2081222C (en) | 1991-10-24 | 1998-10-27 | Hiroaki Date | Method for production of microcapsule type conductive filler |
WO1996037913A1 (en) | 1995-05-22 | 1996-11-28 | Hitachi Chemical Company, Ltd. | Semiconductor device having a semiconductor chip electrically connected to a wiring substrate |
TW459032B (en) * | 1998-03-18 | 2001-10-11 | Sumitomo Bakelite Co | An anisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesive |
-
2000
- 2000-10-06 US US09/680,713 patent/US6451875B1/en not_active Expired - Lifetime
- 2000-10-09 TW TW089121104A patent/TW525252B/zh not_active IP Right Cessation
- 2000-10-11 KR KR1020000059839A patent/KR100861757B1/ko active IP Right Grant
- 2000-10-12 EP EP00308961A patent/EP1093160B1/de not_active Expired - Lifetime
- 2000-10-12 DE DE60018873T patent/DE60018873T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1093160A2 (de) | 2001-04-18 |
TW525252B (en) | 2003-03-21 |
US6451875B1 (en) | 2002-09-17 |
DE60018873T2 (de) | 2006-02-23 |
EP1093160A3 (de) | 2001-12-05 |
EP1093160B1 (de) | 2005-03-23 |
KR20010050963A (ko) | 2001-06-25 |
KR100861757B1 (ko) | 2008-10-06 |
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