DE50014719D1 - Method for generating an intensity distribution via a working laser beam and device for this purpose - Google Patents

Method for generating an intensity distribution via a working laser beam and device for this purpose

Info

Publication number
DE50014719D1
DE50014719D1 DE50014719T DE50014719T DE50014719D1 DE 50014719 D1 DE50014719 D1 DE 50014719D1 DE 50014719 T DE50014719 T DE 50014719T DE 50014719 T DE50014719 T DE 50014719T DE 50014719 D1 DE50014719 D1 DE 50014719D1
Authority
DE
Germany
Prior art keywords
generating
laser beam
intensity distribution
distribution via
working laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50014719T
Other languages
German (de)
Inventor
Guido Dr Hennig
Max Daetwyler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daetwyler Graphics AG
Original Assignee
MDC Max Daetwyler AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MDC Max Daetwyler AG filed Critical MDC Max Daetwyler AG
Application granted granted Critical
Publication of DE50014719D1 publication Critical patent/DE50014719D1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
DE50014719T 1999-07-12 2000-06-23 Method for generating an intensity distribution via a working laser beam and device for this purpose Expired - Lifetime DE50014719D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP99810623A EP1072350A1 (en) 1999-07-12 1999-07-12 Method and device for distributing the intensity in a laser beam

Publications (1)

Publication Number Publication Date
DE50014719D1 true DE50014719D1 (en) 2007-11-29

Family

ID=8242919

Family Applications (1)

Application Number Title Priority Date Filing Date
DE50014719T Expired - Lifetime DE50014719D1 (en) 1999-07-12 2000-06-23 Method for generating an intensity distribution via a working laser beam and device for this purpose

Country Status (5)

Country Link
US (1) US6462307B1 (en)
EP (1) EP1072350A1 (en)
JP (1) JP2001105166A (en)
DE (1) DE50014719D1 (en)
ES (1) ES2156842T1 (en)

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US8217304B2 (en) 2001-03-29 2012-07-10 Gsi Group Corporation Methods and systems for thermal-based laser processing a multi-material device
US20040029048A1 (en) * 2000-11-15 2004-02-12 Jakob Frauchiger Method for the production of screen cavities in a rotogravure form and base body applicable in said method
US7642484B2 (en) * 2001-06-13 2010-01-05 Orbotech Ltd Multiple beam micro-machining system and method
WO2003043070A1 (en) * 2001-11-12 2003-05-22 Sony Corporation Laser annealing device and thin-film transistor manufacturing method
US6951995B2 (en) 2002-03-27 2005-10-04 Gsi Lumonics Corp. Method and system for high-speed, precise micromachining an array of devices
EP1369230A1 (en) * 2002-06-05 2003-12-10 Kba-Giori S.A. Method of manufacturing an engraved plate
JP2004066327A (en) 2002-08-09 2004-03-04 Tdk Corp Laser machining apparatus, machining method, and method of manufacturing circuit board using this machining method
CN100563903C (en) * 2003-08-19 2009-12-02 电子科学工业公司 Utilize laser instrument to carry out the method for link process
US7491909B2 (en) * 2004-03-31 2009-02-17 Imra America, Inc. Pulsed laser processing with controlled thermal and physical alterations
US7486705B2 (en) 2004-03-31 2009-02-03 Imra America, Inc. Femtosecond laser processing system with process parameters, controls and feedback
US7885311B2 (en) * 2007-03-27 2011-02-08 Imra America, Inc. Beam stabilized fiber laser
US7820937B2 (en) * 2004-10-27 2010-10-26 Boston Scientific Scimed, Inc. Method of applying one or more electromagnetic beams to form a fusion bond on a workpiece such as a medical device
ES2313806B1 (en) * 2004-12-30 2009-12-17 Universidad De Granada LASER CALIBRATION PROCEDURE CONSIDERING PULSE SOLUTION.
DE502006001300D1 (en) 2005-05-03 2008-09-25 Merck Patent Gmbh Use of laser-engraved printing forms
WO2007088795A1 (en) 2006-02-03 2007-08-09 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of memory element, laser irradiation apparatus, and laser irradiation method
US8580700B2 (en) 2006-02-17 2013-11-12 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US7532378B2 (en) 2006-02-21 2009-05-12 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus, method of laser irradiation, and method for manufacturing semiconductor device
US7522642B2 (en) * 2006-03-29 2009-04-21 Amo Development Llc Method and system for laser amplification using a dual crystal Pockels cell
SE531975C2 (en) 2007-04-23 2009-09-22 Anders Bjurstedt Device for printing in gravure
GB0804955D0 (en) * 2008-03-18 2008-04-16 Rumsby Philip T Method and apparatus for laser processing the surface of a drum
JP4523978B2 (en) * 2008-03-28 2010-08-11 株式会社日立製作所 Engine system
US8309885B2 (en) * 2009-01-15 2012-11-13 Electro Scientific Industries, Inc. Pulse temporal programmable ultrafast burst mode laser for micromachining
US10307862B2 (en) * 2009-03-27 2019-06-04 Electro Scientific Industries, Inc Laser micromachining with tailored bursts of short laser pulses
KR20120113245A (en) * 2009-12-30 2012-10-12 지에스아이 그룹 코포레이션 Link processing with high speed beam deflection
TW201204497A (en) * 2010-07-30 2012-02-01 Hon Hai Prec Ind Co Ltd Laser processing device and method for manufacturing light guide plate
CN102343480A (en) * 2010-08-04 2012-02-08 鸿富锦精密工业（深圳）有限公司 Laser processing device and method for manufacturing light guide plate
US9715950B2 (en) * 2015-04-14 2017-07-25 Honeywell International Inc. Single cell apparatus and method for single ion addressing

Family Cites Families (6)

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Publication number Priority date Publication date Assignee Title
US4958900A (en) * 1989-03-27 1990-09-25 General Electric Company Multi-fiber holder for output coupler and methods using same
DE4212390A1 (en) * 1992-04-13 1993-10-14 Baasel Carl Lasertech Laser engraving machine for print rollers - has beam guide for several laser beams to generate variable beam spot configuration on work surface
US5279775A (en) * 1992-06-10 1994-01-18 Iomega Corporation Acousto-optical intensity control of laser beam during etching of optical servo information of magnetic media
US5386221A (en) * 1992-11-02 1995-01-31 Etec Systems, Inc. Laser pattern generation apparatus
CH689917A5 (en) * 1995-05-03 2000-01-31 Daetwyler Ag Method and apparatus for producing wells in the surface of a gravure cylinder.
US5834094A (en) * 1996-09-30 1998-11-10 Surface Technologies Ltd. Bearing having micropores and design method thereof

Also Published As

Publication number Publication date
ES2156842T1 (en) 2001-08-01
JP2001105166A (en) 2001-04-17
US6462307B1 (en) 2002-10-08
EP1072350A1 (en) 2001-01-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: DAETWYLER GRAPHICS AG, BLEIENBACH, CH