DE4416583C1 - Chip card bus for connecting different card chips - Google Patents

Chip card bus for connecting different card chips

Info

Publication number
DE4416583C1
DE4416583C1 DE19944416583 DE4416583A DE4416583C1 DE 4416583 C1 DE4416583 C1 DE 4416583C1 DE 19944416583 DE19944416583 DE 19944416583 DE 4416583 A DE4416583 A DE 4416583A DE 4416583 C1 DE4416583 C1 DE 4416583C1
Authority
DE
Germany
Prior art keywords
chip
connections
chips
contact surfaces
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19944416583
Other languages
German (de)
Inventor
Hans-Diedrich Kreft
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Angewandte Digital Elektronik GmbH
Original Assignee
Angewandte Digital Elektronik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Angewandte Digital Elektronik GmbH filed Critical Angewandte Digital Elektronik GmbH
Priority to DE19944416583 priority Critical patent/DE4416583C1/en
Priority to AU24440/95A priority patent/AU2444095A/en
Priority to PCT/DE1995/000608 priority patent/WO1995031793A1/en
Priority to DE19580495T priority patent/DE19580495D2/en
Application granted granted Critical
Publication of DE4416583C1 publication Critical patent/DE4416583C1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts

Abstract

The description relates to a suitable bus system for chip cards fitted with several chips which makes use of the contact surfaces of the prior art chip card contacts.

Description

Die Erfindung bezieht sich auf eine elektronische Busanordnung, welche gemäß dem Oberbegriff des Patentanspruches in Chipkarten eingesetzt werden kann.The invention relates to an electronic bus arrangement, which according to the preamble of claim in smart cards can be used.

Es sind Plastikkarten als Chipkarten bekannt, welche kontaktfrei oder kontaktbehaftet mit ihren Schreib/Lesegeräten Energie und Daten austauschen. Diese Karten werden für vielfache Anwendungen wie beispielsweise Telefonkarten, Gesundheitskarten, Zutrittskontrollkarten eingesetzt. Einen Überblick über solche Karten und deren Anwendungen ist in drei Ausgaben der Elektronik Jahrgang 93 zusammengestellt.Plastic cards are known as chip cards, which are contactless or Exchange energy and data with their read / write devices. These cards are used for multiple applications such as Phonecards, health cards, access control cards used. One Overview of such cards and their uses is in three editions of electronics, year 93.

Der Erfindung liegt die Aufgabe zugrunde, unterschiedliche elektronische Chips auf einer Karte selektiv zu aktivieren und mit einem Schreib/Lesegerät außerhalb der Karte zu verbinden.The invention has for its object different electronic Selectively activate chips on a card and with one Connect read / write device outside the card.

Diese Aufgabe wird durch die im kennzeichnenden Teil des Anspruches 1 angegebenen Merkmale gelöst.This object is achieved by the in the characterizing part of the claim 1 specified features solved.

Fig. 1 zeigt schematisch in dem Teil 1 das Kontaktfeld mit den Kontakten K1 bis K8. Das Kontaktfeld ist bei herkömmlichen Chipkarten in seiner Lage und physikalischen Ausgestaltung in internationalen Normen (z. B. ISO 7816) beschrieben. Von diesem Kontaktfeld führen die elektrisch leitenden, galvanischen Verbindungen L1 bis L8 zu den Chips A, B, C. Fig. 1 shows schematically in part 1 the contact field with the contacts K1 to K8. With conventional chip cards, the position and physical configuration of the contact field is described in international standards (e.g. ISO 7816). The electrically conductive, galvanic connections L1 to L8 lead from this contact field to the chips A, B, C.

Zu Anspruch 1To claim 1

Die Erfindung betrifft Chipkarten, welche mehrere Chips (A, B, C) enthalten. Auf einem Träger, der in das Kartenmaterial eingebettet ist, sind elektrisch leitende galvanische Verbindungen (L1 bis L8) untergebracht. Diese Verbindungen führen zu den räumlich getrennten Chips und stellen eine elektrische Verbindung zwischen den Chips und den Kontaktflächen (K1 bis K8) her. Die Verbindungsleitungen sind jeweils ganz bestimmten Kontaktflächen zugeordnet (L1 mit K1, L2 mit K2 . . .). Von den Kontaktflächen K1 bis K8 sind nicht alle für die elektrische und kommunikative Anbindung einer Chipkarte mit einem Schreib/Lesegerät belegt. Sind beispielsweise K7, K8 nicht belegt, können die zugehörigen Leitungen L7, L8 zur chipspezifischen Übertragung von seriellen oder parallelen Informationen dienen. Werden mit dem Einschieben einer Karte in in Schreib/Lesegerät beispielsweise die Kontakte K1, K2 mit Spannung belegt, werden alle drei Chips A, B, C elektrisch aktiviert. Durch Anlegen einer Informationssequenz an die Kontakte K7, K8 wird den drei Chips an den Leitungen L7, L8 diese Informationssequenz zur Verfügung gestellt. Die Chips können nach bekannten Verfahren so aufgebaut werden, daß sie sich nur dann an die funktional noch freien Leitungen (in diesem Falle L3 bis L6) anschließen, wenn die über L7, L8 einlaufende Information mit einer chipintern gespeicherten übereinstimmt. Mit diesem Verfahren gelingt es, auf Chipkarten bei Verwendung von mehreren Chips einen einheitlichen Bus zu schaffen, der die in dem internationalen ISO Standard beschriebenen Funktionen zur Grundlage des Bussystems macht.The invention relates to chip cards which have several chips (A, B, C) included. On a support that is in the map material embedded are electrically conductive galvanic connections (L1 to L8). These connections lead to the spatially separated chips and establish an electrical connection between the chips and the contact surfaces (K1 to K8)  forth. The connecting lines are each very specific Contact areas assigned (L1 with K1, L2 with K2 ...). Not all of the contact surfaces K1 to K8 are for electrical and communicative connection of a chip card with a Read / write device occupied. For example, K7, K8 are not occupied, the associated lines L7, L8 for chip-specific Serve transmission of serial or parallel information. Become with the insertion of a card into a read / write device, for example the contacts K1, K2 are energized, all three chips A, B, C electrically activated. By creating an information sequence on the contacts K7, K8 the three chips on lines L7, L8 this information sequence made available. The chips can be made according to known Procedures should be set up so that they are only functional Connect any free lines (in this case L3 to L6) if the Information arriving via L7, L8 with a chip-internally stored matches. With this procedure it is possible to use smart cards on of multiple chips to create a uniform bus that the functions described in the international ISO standard The basis of the bus system.

Zu Anspruch 2To claim 2

In Anspruch 1 sind die Kontaktflächen (K1 bis K8) benannt. Diese Kontaktflächen können durch Anschlußflächen eines elektrischen Schaltkreises ersetzt werden. Dieser Schaltkreis kann seinerseits eine Verbindung zu Kontakten herstellen. Dieser Chip kann kontaktfreie Anschlüsse an seiner Eingangsseite in definierte, elektrische Kontaktanschlüsse an seiner Ausgangsseite wandeln und damit einen definierten elektrischen Bus (Leitungsverbindungen) in der Karte zur Verfügung stellen.In claim 1, the contact surfaces (K1 to K8) are named. These contact areas can by pads of an electrical circuit be replaced. This circuit can in turn connect to Make contacts. This chip can make contactless connections on its input side in defined electrical contact connections walk on its exit side and thus a defined one  Make the electrical bus (line connections) available in the card.

Zu Anspruch 3Regarding claim 3

Die Chips (A, B, C) können direkt auf der Unterseite von Kontakten durch Kleben aufgebracht werden. Die Verbindung kann durch Bonden oder leitende Klebemasse erfolgen. Durch diese Verfahren wären ein oder zwei Chips, sofern sie geometrisch nicht zu groß sind, unter der Kontaktfläche von Chipkarten unterzubringen.The chips (A, B, C) can be directly on the bottom of Contacts can be applied by gluing. The connection can by bonding or conductive adhesive. Through these procedures would be one or two chips, provided they are not geometrically too big, under to accommodate the contact area of chip cards.

Zu Anspruch 4To claim 4

Aus Kostegründen kann es sinnvoll sein, Verfahren auszuwählen, bei denen die Leiterbahnen direkt in das Plastikmaterial der Karte einzubringen sind. Es könnten in das Plastik der Karte leitende Bahnen eingebracht werden, an die die Chips direkt leitend anzubringen sind.For cost reasons, it may make sense to select processes in which insert the conductor tracks directly into the plastic material of the card are. Conductive tracks could be placed in the plastic of the card to which the chips are to be attached in a direct conductive manner.

Claims (4)

1. Busanordnung für eine Chipkarte mit Kontaktanschlüssen und/oder kontaktlosen Anschlüssen zur Energieübertragung und zum Datenaustausch mit einem Schreib/Lesegerät, wobei auf der Chipkarte mehrere elektronische Schaltkreise vorgesehen sind, dadurch gekennzeichnet,
  • - daß elektrisch leitende, galvanische Verbindungen (L1 bis L8) an der einen Seite an Kontaktflächen (K1 bis K8) und an der anderen Seite an jeden der elektronischen Schaltkreise (Chip A, Chip B, Chip C) anschließbar sind,
  • - daß eine oder mehrere der galvanischen Verbindungen (L1 bis L8), welche nicht zur Energieübertragung oder zum Datenaustausch vorgesehen sind, zur seriellen oder parallelen Übertragung von chipspezifischen Informationen dienen, und
  • - daß über diese chipspezifischen Informationen jeweils einer der Chips (A, B, C) ausgewählt wird, um mit dem Schreib/Lesegerät in Datenaustausch zu treten.
1. Bus arrangement for a chip card with contact connections and / or contactless connections for energy transmission and for data exchange with a read / write device, several electronic circuits being provided on the chip card, characterized in that
  • that electrically conductive, galvanic connections (L1 to L8) can be connected on one side to contact surfaces (K1 to K8) and on the other side to each of the electronic circuits (chip A, chip B, chip C),
  • - That one or more of the galvanic connections (L1 to L8), which are not intended for energy transmission or data exchange, are used for serial or parallel transmission of chip-specific information, and
  • - That one of the chips (A, B, C) is selected via this chip-specific information in order to start data exchange with the read / write device.
2. Busanordnung nach Anspruch 1, dadurch gekennzeichnet,
  • - daß die Kontaktflächen (K1 bis K8) durch Anschlüsse eines elektrischen Schaltkreises ersetzt werden, dessen Eingänge an kontaktfreie Anschlüsse geführt sind, und dessen Ausgänge den Anschlüssen an den Kontaktflächen (K1 bis K8) entsprechen.
2. Bus arrangement according to claim 1, characterized in
  • - That the contact surfaces (K1 to K8) are replaced by connections of an electrical circuit, the inputs of which are connected to non-contact connections, and the outputs of which correspond to the connections on the contact surfaces (K1 to K8).
3. Busanordnung nach Anspruch 1, dadurch gekennzeichnet, daß die Chips direkt mit den Kontaktflächen galvanisch leitend verbunden sind, und die Chips mechanisch oder chemisch an den Kontaktflächen befestigt sind.3. Bus arrangement according to claim 1, characterized in that the chips directly galvanically with the contact surfaces  are conductively connected, and the chips mechanically or chemically to the Contact surfaces are attached. 4. Busanordnung nach Anspruch 1, dadurch gekennzeichnet, daß die elektrisch leitenden Verbindungen auf physikalischen oder chemischem Wege durch Beschichten, Dotieren, Bedrucken, Implementieren, Einlegen, Diffundieren, Aufdampfen, Sputtern, Einschmelzen, Einbrennen, Gravieren oder ein anderes Verfahren eingebracht sind.4. Bus arrangement according to claim 1, characterized in that the electric conductive connections by physical or chemical means by coating, doping, printing, implementing, inserting, diffusing, Evaporation, sputtering, melting, baking, engraving or another method is introduced.
DE19944416583 1994-05-11 1994-05-11 Chip card bus for connecting different card chips Expired - Fee Related DE4416583C1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE19944416583 DE4416583C1 (en) 1994-05-11 1994-05-11 Chip card bus for connecting different card chips
AU24440/95A AU2444095A (en) 1994-05-11 1995-05-04 Chip card bus for connecting various card chips
PCT/DE1995/000608 WO1995031793A1 (en) 1994-05-11 1995-05-04 Chip card bus for connecting various card chips
DE19580495T DE19580495D2 (en) 1994-05-11 1995-05-04 Chip card bus for connecting different card chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19944416583 DE4416583C1 (en) 1994-05-11 1994-05-11 Chip card bus for connecting different card chips

Publications (1)

Publication Number Publication Date
DE4416583C1 true DE4416583C1 (en) 1995-12-07

Family

ID=6517839

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19944416583 Expired - Fee Related DE4416583C1 (en) 1994-05-11 1994-05-11 Chip card bus for connecting different card chips
DE19580495T Expired - Fee Related DE19580495D2 (en) 1994-05-11 1995-05-04 Chip card bus for connecting different card chips

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE19580495T Expired - Fee Related DE19580495D2 (en) 1994-05-11 1995-05-04 Chip card bus for connecting different card chips

Country Status (3)

Country Link
AU (1) AU2444095A (en)
DE (2) DE4416583C1 (en)
WO (1) WO1995031793A1 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0766199A3 (en) * 1995-08-24 1997-06-18 Angewandte Digital Elektronik Plastic IC card, galvanic contacts and coils and/or capacitors for exchanging power and data with a host
DE19611237A1 (en) * 1996-03-21 1997-09-25 Siemens Ag Multichip card e.g. telephone card
DE19705615A1 (en) * 1997-02-14 1998-06-04 Dirk Prof Dr Ing Jansen Chip-card for measuring and displaying temperature e.g. for monitoring foodstuffs cooling chain during transportation
EP0779598A3 (en) * 1995-12-14 1999-03-03 Hitachi, Ltd. Multichip IC card and IC card system using it
FR2771199A1 (en) * 1997-11-20 1999-05-21 Sagem Portable smart card and its operating system
DE19959364A1 (en) * 1999-12-09 2001-06-13 Orga Kartensysteme Gmbh Chip card has circuit unit electrically connected to contact areas on separate carrying body via conducting tracks in chip card body
FR2806821A1 (en) * 2000-03-21 2001-09-28 Sagem Chip card with large memory capacity, comprising chip and memory components mounted on lower surface of sticker with supplementary electrical connections
EP0883083B1 (en) * 1997-06-04 2004-08-18 Sony Corporation External storage apparatus having a circuit for selecting a communication protocol
WO2004095365A1 (en) * 2003-04-17 2004-11-04 Sandisk Corporation Memory cards including a standard security function
US7114659B2 (en) 2002-11-13 2006-10-03 Sandisk Corporation Universal non-volatile memory card used with various different standard cards containing a memory controller
US7209995B2 (en) 2003-12-09 2007-04-24 Sandisk Corporation Efficient connection between modules of removable electronic circuit cards
US7680974B2 (en) 2000-09-01 2010-03-16 Sandisk Corporation Cooperative interconnection and operation of a non-volatile memory card and an input-output card
US8037229B2 (en) 2002-11-21 2011-10-11 Sandisk Technologies Inc. Combination non-volatile memory and input-output card with direct memory access

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3173438B2 (en) 1997-06-04 2001-06-04 ソニー株式会社 Memory card and mounting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3935364C1 (en) * 1989-10-24 1990-08-23 Angewandte Digital Elektronik Gmbh, 2051 Brunstorf, De

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9100861U1 (en) * 1991-01-25 1991-07-04 Siemens Ag, 8000 Muenchen, De
FR2680262B1 (en) * 1991-08-08 1993-10-08 Gemplus Card International INTEGRATED CIRCUITS FOR CHIP CARD AND MULTIPLE CHIP CARD USING THESE CIRCUITS.
NL9301540A (en) * 1993-09-06 1995-04-03 Nedap Nv Chipcard with more than one chip and combined I/O line

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3935364C1 (en) * 1989-10-24 1990-08-23 Angewandte Digital Elektronik Gmbh, 2051 Brunstorf, De

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0766199A3 (en) * 1995-08-24 1997-06-18 Angewandte Digital Elektronik Plastic IC card, galvanic contacts and coils and/or capacitors for exchanging power and data with a host
EP0779598A3 (en) * 1995-12-14 1999-03-03 Hitachi, Ltd. Multichip IC card and IC card system using it
DE19611237A1 (en) * 1996-03-21 1997-09-25 Siemens Ag Multichip card e.g. telephone card
DE19705615A1 (en) * 1997-02-14 1998-06-04 Dirk Prof Dr Ing Jansen Chip-card for measuring and displaying temperature e.g. for monitoring foodstuffs cooling chain during transportation
EP0883083B1 (en) * 1997-06-04 2004-08-18 Sony Corporation External storage apparatus having a circuit for selecting a communication protocol
FR2771199A1 (en) * 1997-11-20 1999-05-21 Sagem Portable smart card and its operating system
DE19959364A1 (en) * 1999-12-09 2001-06-13 Orga Kartensysteme Gmbh Chip card has circuit unit electrically connected to contact areas on separate carrying body via conducting tracks in chip card body
FR2806821A1 (en) * 2000-03-21 2001-09-28 Sagem Chip card with large memory capacity, comprising chip and memory components mounted on lower surface of sticker with supplementary electrical connections
US7680974B2 (en) 2000-09-01 2010-03-16 Sandisk Corporation Cooperative interconnection and operation of a non-volatile memory card and an input-output card
US7114659B2 (en) 2002-11-13 2006-10-03 Sandisk Corporation Universal non-volatile memory card used with various different standard cards containing a memory controller
US7367503B2 (en) 2002-11-13 2008-05-06 Sandisk Corporation Universal non-volatile memory card used with various different standard cards containing a memory controller
US8752765B2 (en) 2002-11-13 2014-06-17 Sandisk Technologies Inc. Universal non-volatile memory card used with various different standard cards containing a memory controller
US8037229B2 (en) 2002-11-21 2011-10-11 Sandisk Technologies Inc. Combination non-volatile memory and input-output card with direct memory access
US8745299B2 (en) 2002-11-21 2014-06-03 Sandisk Technologies Inc. Combination non-volatile memory and input-output card with direct memory access
EP1679641A2 (en) * 2003-04-17 2006-07-12 SanDisk Corporation Memory cards including a standard security function
EP1679641A3 (en) * 2003-04-17 2006-11-02 SanDisk Corporation Memory cards including a standard security function
WO2004095365A1 (en) * 2003-04-17 2004-11-04 Sandisk Corporation Memory cards including a standard security function
EP2256669A3 (en) * 2003-04-17 2011-03-02 Sandisk Corporation Memory cards including a standard security function
US8019942B2 (en) 2003-04-17 2011-09-13 SanDisk Technologies, Inc. Memory cards including a standard security function
US8539183B2 (en) 2003-04-17 2013-09-17 Sandisk Technologies Inc. Memory cards including a standard security function
US7209995B2 (en) 2003-12-09 2007-04-24 Sandisk Corporation Efficient connection between modules of removable electronic circuit cards

Also Published As

Publication number Publication date
WO1995031793A1 (en) 1995-11-23
DE19580495D2 (en) 1998-01-08
AU2444095A (en) 1995-12-05

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