DE4416583C1 - Chipkartenbus for the connection of different card chip - Google Patents

Chipkartenbus for the connection of different card chip

Info

Publication number
DE4416583C1
DE4416583C1 DE19944416583 DE4416583A DE4416583C1 DE 4416583 C1 DE4416583 C1 DE 4416583C1 DE 19944416583 DE19944416583 DE 19944416583 DE 4416583 A DE4416583 A DE 4416583A DE 4416583 C1 DE4416583 C1 DE 4416583C1
Authority
DE
Grant status
Grant
Patent type
Prior art keywords
chip
contact
contacts
suitable
bus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19944416583
Other languages
German (de)
Inventor
Hans-Diedrich Kreft
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Angewandte Digital Elektronik
Original Assignee
Angewandte Digital Elektronik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts

Abstract

The description relates to a suitable bus system for chip cards fitted with several chips which makes use of the contact surfaces of the prior art chip card contacts.

Description

Die Erfindung bezieht sich auf eine elektronische Busanordnung, welche gemäß dem Oberbegriff des Patentanspruches in Chipkarten eingesetzt werden kann. The invention relates to an electronic bus arrangement, which can be used in smart cards according to the preamble of patent claim.

Es sind Plastikkarten als Chipkarten bekannt, welche kontaktfrei oder kontaktbehaftet mit ihren Schreib/Lesegeräten Energie und Daten austauschen. There are plastic cards known as smart cards, which exchange without contact or with contact with its read / write devices and energy data. Diese Karten werden für vielfache Anwendungen wie beispielsweise Telefonkarten, Gesundheitskarten, Zutrittskontrollkarten eingesetzt. These cards are used for multiple applications such as phone cards, health cards, access control cards. Einen Überblick über solche Karten und deren Anwendungen ist in drei Ausgaben der Elektronik Jahrgang 93 zusammengestellt. An overview of such cards and their applications is given in three editions of the Electronic Volume 93rd

Der Erfindung liegt die Aufgabe zugrunde, unterschiedliche elektronische Chips auf einer Karte selektiv zu aktivieren und mit einem Schreib/Lesegerät außerhalb der Karte zu verbinden. The invention has for its object to enable different electronic chips on a map and selectively connect with a reader / writer outside the map.

Diese Aufgabe wird durch die im kennzeichnenden Teil des Anspruches 1 angegebenen Merkmale gelöst. This object is achieved by the features specified in the characterizing part of claim 1.

Fig. 1 zeigt schematisch in dem Teil 1 das Kontaktfeld mit den Kontakten K1 bis K8. Fig. 1 shows schematically in the part 1, the contact pad with the contacts K1 to K8. Das Kontaktfeld ist bei herkömmlichen Chipkarten in seiner Lage und physikalischen Ausgestaltung in internationalen Normen (z. B. ISO 7816) beschrieben. The contact field is described in conventional smart card in its location and physical design in international standards (eg. As ISO 7816). Von diesem Kontaktfeld führen die elektrisch leitenden, galvanischen Verbindungen L1 bis L8 zu den Chips A, B, C. From this field, the electrically conductive contact, galvanic connections L1 to L8 result in the chips A, B, C.

Zu Anspruch 1 To claim 1

Die Erfindung betrifft Chipkarten, welche mehrere Chips (A, B, C) enthalten. The invention relates to chip cards, which contain a plurality of chips (A, B, C). Auf einem Träger, der in das Kartenmaterial eingebettet ist, sind elektrisch leitende galvanische Verbindungen (L1 bis L8) untergebracht. On a support, which is embedded in the card material, electrically conductive galvanic connections (L1 to L8) are housed. Diese Verbindungen führen zu den räumlich getrennten Chips und stellen eine elektrische Verbindung zwischen den Chips und den Kontaktflächen (K1 bis K8) her. These compounds lead to the spatially separate chips and provide electrical connection between the chip and the contact areas (K1 to K8) ago. Die Verbindungsleitungen sind jeweils ganz bestimmten Kontaktflächen zugeordnet (L1 mit K1, L2 mit K2 . . .). The connection lines are assigned to each specific contact surfaces (L1 K1, K2 L2...). Von den Kontaktflächen K1 bis K8 sind nicht alle für die elektrische und kommunikative Anbindung einer Chipkarte mit einem Schreib/Lesegerät belegt. Of the contact surfaces K1-K8 all are not used for electrical and communication connections of a smart card with a read / write device. Sind beispielsweise K7, K8 nicht belegt, können die zugehörigen Leitungen L7, L8 zur chipspezifischen Übertragung von seriellen oder parallelen Informationen dienen. For example, if K7, K8 is not in use, the associated lines L7, L8 are used for chip-specific transmission of serial or parallel information can. Werden mit dem Einschieben einer Karte in in Schreib/Lesegerät beispielsweise die Kontakte K1, K2 mit Spannung belegt, werden alle drei Chips A, B, C elektrisch aktiviert. With the insertion of a card in reader / writer, for example, the contacts K1, K2 assigned voltage, all three chips A, B, C are electrically activated. Durch Anlegen einer Informationssequenz an die Kontakte K7, K8 wird den drei Chips an den Leitungen L7, L8 diese Informationssequenz zur Verfügung gestellt. By applying an information sequence to the contacts K7, K8 is the three chips on the lines L7, L8 provided this information sequence are available. Die Chips können nach bekannten Verfahren so aufgebaut werden, daß sie sich nur dann an die funktional noch freien Leitungen (in diesem Falle L3 bis L6) anschließen, wenn die über L7, L8 einlaufende Information mit einer chipintern gespeicherten übereinstimmt. The chips can be constructed so that they only adjoin the functional remaining free lines (in this case, L3-L6) coincides when the on L7, L8 incoming information is stored to a chip internally by known methods. Mit diesem Verfahren gelingt es, auf Chipkarten bei Verwendung von mehreren Chips einen einheitlichen Bus zu schaffen, der die in dem internationalen ISO Standard beschriebenen Funktionen zur Grundlage des Bussystems macht. With this method, it is possible to create a single bus on chip cards with the use of multiple chips, which makes the functions described in the international ISO standard for the basis of the bus system.

Zu Anspruch 2 To claim 2

In Anspruch 1 sind die Kontaktflächen (K1 bis K8) benannt. In claim 1, the contact areas (K1 to K8) are named. Diese Kontaktflächen können durch Anschlußflächen eines elektrischen Schaltkreises ersetzt werden. These contact surfaces can be replaced by pads of an electrical circuit. Dieser Schaltkreis kann seinerseits eine Verbindung zu Kontakten herstellen. This circuit can in turn connect to contacts. Dieser Chip kann kontaktfreie Anschlüsse an seiner Eingangsseite in definierte, elektrische Kontaktanschlüsse an seiner Ausgangsseite wandeln und damit einen definierten elektrischen Bus (Leitungsverbindungen) in der Karte zur Verfügung stellen. This chip can convert non-contact connectors at its input side in defined, electrical contact terminals on its output side and thus a defined electrical bus (wiring) in the map to provide.

Zu Anspruch 3 To claim 3

Die Chips (A, B, C) können direkt auf der Unterseite von Kontakten durch Kleben aufgebracht werden. The chips (A, B, C) can be applied directly to the underside of contacts by bonding. Die Verbindung kann durch Bonden oder leitende Klebemasse erfolgen. The connection may be by bonding, or conductive adhesive. Durch diese Verfahren wären ein oder zwei Chips, sofern sie geometrisch nicht zu groß sind, unter der Kontaktfläche von Chipkarten unterzubringen. Through this process would be a chip or two, if they are geometrically not too large to accommodate under the contact surface of smart cards.

Zu Anspruch 4 To claim 4

Aus Kostegründen kann es sinnvoll sein, Verfahren auszuwählen, bei denen die Leiterbahnen direkt in das Plastikmaterial der Karte einzubringen sind. Koste of reasons it may be useful to select methods in which the conductor tracks are to be introduced directly into the plastic material of the card. Es könnten in das Plastik der Karte leitende Bahnen eingebracht werden, an die die Chips direkt leitend anzubringen sind. conductive traces it could be incorporated into the plastic of the card to which the chips are directly conductively to install.

Claims (4)

  1. 1. Busanordnung für eine Chipkarte mit Kontaktanschlüssen und/oder kontaktlosen Anschlüssen zur Energieübertragung und zum Datenaustausch mit einem Schreib/Lesegerät, wobei auf der Chipkarte mehrere elektronische Schaltkreise vorgesehen sind, dadurch gekennzeichnet, 1. bus arrangement for a chip card having contact pads and / or contactless connections for energy transmission and for data exchange with a read / write device, a plurality of electronic circuits are provided on the chip card, characterized in that
    • - daß elektrisch leitende, galvanische Verbindungen (L1 bis L8) an der einen Seite an Kontaktflächen (K1 bis K8) und an der anderen Seite an jeden der elektronischen Schaltkreise (Chip A, Chip B, Chip C) anschließbar sind, - that electrically conductive, electrical connections (L1 to L8) at the one side to contact areas (K1 to K8) and at the other side of each of the electronic circuits (Chip A Chip B Chip C) can be connected,
    • - daß eine oder mehrere der galvanischen Verbindungen (L1 bis L8), welche nicht zur Energieübertragung oder zum Datenaustausch vorgesehen sind, zur seriellen oder parallelen Übertragung von chipspezifischen Informationen dienen, und - that one or several galvanic links (L1 to L8) which are not provided for power transmission or for data exchange, used for serial or parallel transfer of chip-specific information, and
    • - daß über diese chipspezifischen Informationen jeweils einer der Chips (A, B, C) ausgewählt wird, um mit dem Schreib/Lesegerät in Datenaustausch zu treten. - that each one of the chips (A, B, C) is selected this chip-specific information in order to enter into data exchange with the read / write device.
  2. 2. Busanordnung nach Anspruch 1, dadurch gekennzeichnet, 2. Bus arrangement according to claim 1, characterized in that
    • - daß die Kontaktflächen (K1 bis K8) durch Anschlüsse eines elektrischen Schaltkreises ersetzt werden, dessen Eingänge an kontaktfreie Anschlüsse geführt sind, und dessen Ausgänge den Anschlüssen an den Kontaktflächen (K1 bis K8) entsprechen. - that the contact areas (K1 to K8) are replaced by connectors of an electrical circuit whose inputs are performed on non-contact terminals, and the outputs of which correspond to the terminals on the contact surfaces (K1 to K8).
  3. 3. Busanordnung nach Anspruch 1, dadurch gekennzeichnet, daß die Chips direkt mit den Kontaktflächen galvanisch leitend verbunden sind, und die Chips mechanisch oder chemisch an den Kontaktflächen befestigt sind. 3. Bus arrangement according to claim 1, characterized in that the chips are electrically conductively connected directly to the contact surfaces, and the chips are mechanically or chemically attached to the contact surfaces.
  4. 4. Busanordnung nach Anspruch 1, dadurch gekennzeichnet, daß die elektrisch leitenden Verbindungen auf physikalischen oder chemischem Wege durch Beschichten, Dotieren, Bedrucken, Implementieren, Einlegen, Diffundieren, Aufdampfen, Sputtern, Einschmelzen, Einbrennen, Gravieren oder ein anderes Verfahren eingebracht sind. 4. Bus arrangement according to claim 1, characterized in that the electrically conductive connections to physical or chemical means, by coating, doping, printing, implement, insertion, diffusion, vapor deposition, sputtering, melting, burning, engraving or other methods are introduced.
DE19944416583 1994-05-11 1994-05-11 Chipkartenbus for the connection of different card chip Expired - Fee Related DE4416583C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19944416583 DE4416583C1 (en) 1994-05-11 1994-05-11 Chipkartenbus for the connection of different card chip

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19944416583 DE4416583C1 (en) 1994-05-11 1994-05-11 Chipkartenbus for the connection of different card chip
PCT/DE1995/000608 WO1995031793A1 (en) 1994-05-11 1995-05-04 Chip card bus for connecting various card chips
DE1995180495 DE19580495D2 (en) 1994-05-11 1995-05-04 Chipkartenbus for the connection of different card chip

Publications (1)

Publication Number Publication Date
DE4416583C1 true DE4416583C1 (en) 1995-12-07

Family

ID=6517839

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19944416583 Expired - Fee Related DE4416583C1 (en) 1994-05-11 1994-05-11 Chipkartenbus for the connection of different card chip
DE1995180495 Expired - Lifetime DE19580495D2 (en) 1994-05-11 1995-05-04 Chipkartenbus for the connection of different card chip

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE1995180495 Expired - Lifetime DE19580495D2 (en) 1994-05-11 1995-05-04 Chipkartenbus for the connection of different card chip

Country Status (2)

Country Link
DE (2) DE4416583C1 (en)
WO (1) WO1995031793A1 (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0766199A3 (en) * 1995-08-24 1997-06-18 Angewandte Digital Elektronik Plastic IC card, galvanic contacts and coils and/or capacitors for exchanging power and data with a host
DE19611237A1 (en) * 1996-03-21 1997-09-25 Siemens Ag Multichip card e.g. telephone card
DE19705615A1 (en) * 1997-02-14 1998-06-04 Dirk Prof Dr Ing Jansen Chip-card for measuring and displaying temperature e.g. for monitoring foodstuffs cooling chain during transportation
EP0779598A3 (en) * 1995-12-14 1999-03-03 Hitachi, Ltd. Multichip IC card and IC card system using it
FR2771199A1 (en) * 1997-11-20 1999-05-21 Sagem Portable smart card and its operating system
DE19959364A1 (en) * 1999-12-09 2001-06-13 Orga Kartensysteme Gmbh Chip card has circuit unit electrically connected to contact areas on separate carrying body via conducting tracks in chip card body
FR2806821A1 (en) * 2000-03-21 2001-09-28 Sagem Chip card with large memory capacity, comprising chip and memory components mounted on lower surface of sticker with supplementary electrical connections
EP0883083B1 (en) * 1997-06-04 2004-08-18 Sony Corporation External storage apparatus having a circuit for selecting a communication protocol
WO2004095365A1 (en) * 2003-04-17 2004-11-04 Sandisk Corporation Memory cards including a standard security function
US7114659B2 (en) 2002-11-13 2006-10-03 Sandisk Corporation Universal non-volatile memory card used with various different standard cards containing a memory controller
US7209995B2 (en) 2003-12-09 2007-04-24 Sandisk Corporation Efficient connection between modules of removable electronic circuit cards
US7680974B2 (en) 2000-09-01 2010-03-16 Sandisk Corporation Cooperative interconnection and operation of a non-volatile memory card and an input-output card
US8037229B2 (en) 2002-11-21 2011-10-11 Sandisk Technologies Inc. Combination non-volatile memory and input-output card with direct memory access

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3173438B2 (en) 1997-06-04 2001-06-04 ソニー株式会社 Memory card and mounting apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3935364C1 (en) * 1989-10-24 1990-08-23 Angewandte Digital Elektronik Gmbh, 2051 Brunstorf, De

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9100861U1 (en) * 1991-01-25 1991-07-04 Siemens Ag, 8000 Muenchen, De
FR2680262B1 (en) * 1991-08-08 1993-10-08 Gemplus Card International card integrated circuits and chip card has several chips using these circuits.
NL9301540A (en) * 1993-09-06 1995-04-03 Nedap Nv Chip card with more than one chip and combined I / O line.

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3935364C1 (en) * 1989-10-24 1990-08-23 Angewandte Digital Elektronik Gmbh, 2051 Brunstorf, De

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0766199A3 (en) * 1995-08-24 1997-06-18 Angewandte Digital Elektronik Plastic IC card, galvanic contacts and coils and/or capacitors for exchanging power and data with a host
EP0779598A3 (en) * 1995-12-14 1999-03-03 Hitachi, Ltd. Multichip IC card and IC card system using it
DE19611237A1 (en) * 1996-03-21 1997-09-25 Siemens Ag Multichip card e.g. telephone card
DE19705615A1 (en) * 1997-02-14 1998-06-04 Dirk Prof Dr Ing Jansen Chip-card for measuring and displaying temperature e.g. for monitoring foodstuffs cooling chain during transportation
EP0883083B1 (en) * 1997-06-04 2004-08-18 Sony Corporation External storage apparatus having a circuit for selecting a communication protocol
FR2771199A1 (en) * 1997-11-20 1999-05-21 Sagem Portable smart card and its operating system
DE19959364A1 (en) * 1999-12-09 2001-06-13 Orga Kartensysteme Gmbh Chip card has circuit unit electrically connected to contact areas on separate carrying body via conducting tracks in chip card body
FR2806821A1 (en) * 2000-03-21 2001-09-28 Sagem Chip card with large memory capacity, comprising chip and memory components mounted on lower surface of sticker with supplementary electrical connections
US7680974B2 (en) 2000-09-01 2010-03-16 Sandisk Corporation Cooperative interconnection and operation of a non-volatile memory card and an input-output card
US7367503B2 (en) 2002-11-13 2008-05-06 Sandisk Corporation Universal non-volatile memory card used with various different standard cards containing a memory controller
US7114659B2 (en) 2002-11-13 2006-10-03 Sandisk Corporation Universal non-volatile memory card used with various different standard cards containing a memory controller
US8752765B2 (en) 2002-11-13 2014-06-17 Sandisk Technologies Inc. Universal non-volatile memory card used with various different standard cards containing a memory controller
US8037229B2 (en) 2002-11-21 2011-10-11 Sandisk Technologies Inc. Combination non-volatile memory and input-output card with direct memory access
US8745299B2 (en) 2002-11-21 2014-06-03 Sandisk Technologies Inc. Combination non-volatile memory and input-output card with direct memory access
US8539183B2 (en) 2003-04-17 2013-09-17 Sandisk Technologies Inc. Memory cards including a standard security function
EP2256669A3 (en) * 2003-04-17 2011-03-02 Sandisk Corporation Memory cards including a standard security function
US8019942B2 (en) 2003-04-17 2011-09-13 SanDisk Technologies, Inc. Memory cards including a standard security function
EP1679641A3 (en) * 2003-04-17 2006-11-02 SanDisk Corporation Memory cards including a standard security function
EP1679641A2 (en) * 2003-04-17 2006-07-12 SanDisk Corporation Memory cards including a standard security function
WO2004095365A1 (en) * 2003-04-17 2004-11-04 Sandisk Corporation Memory cards including a standard security function
US7209995B2 (en) 2003-12-09 2007-04-24 Sandisk Corporation Efficient connection between modules of removable electronic circuit cards

Also Published As

Publication number Publication date Type
DE19580495D2 (en) 1998-01-08 grant
WO1995031793A1 (en) 1995-11-23 application

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Legal Events

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8100 Publication of the examined application without publication of unexamined application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee