DE4239439C2 - Automatisches Dünnfilm-Meßgerät - Google Patents

Automatisches Dünnfilm-Meßgerät

Info

Publication number
DE4239439C2
DE4239439C2 DE4239439A DE4239439A DE4239439C2 DE 4239439 C2 DE4239439 C2 DE 4239439C2 DE 4239439 A DE4239439 A DE 4239439A DE 4239439 A DE4239439 A DE 4239439A DE 4239439 C2 DE4239439 C2 DE 4239439C2
Authority
DE
Germany
Prior art keywords
semiconductor substrate
weight
thin film
precision balance
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE4239439A
Other languages
German (de)
English (en)
Other versions
DE4239439A1 (https=
Inventor
Masanori Obata
Jyunichi Arima
Yoshihiro Hirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE4239439A1 publication Critical patent/DE4239439A1/de
Application granted granted Critical
Publication of DE4239439C2 publication Critical patent/DE4239439C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G1/00—Weighing apparatus involving the use of a counterweight or other counterbalancing mass
    • G01G1/18—Balances involving the use of a pivoted beam, i.e. beam balances
    • G01G1/24—Platform-type scales, i.e. having the pans carried above the beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G9/00—Methods of, or apparatus for, the determination of weight, not provided for in groups G01G1/00 - G01G7/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Physical Vapour Deposition (AREA)
  • Length Measuring Devices By Optical Means (AREA)
DE4239439A 1991-11-28 1992-11-24 Automatisches Dünnfilm-Meßgerät Expired - Fee Related DE4239439C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3314851A JP2647585B2 (ja) 1991-11-28 1991-11-28 自動薄膜計測装置

Publications (2)

Publication Number Publication Date
DE4239439A1 DE4239439A1 (https=) 1993-06-03
DE4239439C2 true DE4239439C2 (de) 1995-03-09

Family

ID=18058378

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4239439A Expired - Fee Related DE4239439C2 (de) 1991-11-28 1992-11-24 Automatisches Dünnfilm-Meßgerät

Country Status (4)

Country Link
US (1) US5321634A (https=)
JP (1) JP2647585B2 (https=)
KR (1) KR960012745B1 (https=)
DE (1) DE4239439C2 (https=)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2576338B2 (ja) * 1992-07-31 1997-01-29 株式会社島津製作所 ウエハ自動秤量システム
US5625170A (en) * 1994-01-18 1997-04-29 Nanometrics Incorporated Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
FR2720824B1 (fr) * 1994-06-02 1997-01-24 Macofar Spa Procédé pour le contrôle en ligne du poids de capsules et appareil relatif.
US5801337A (en) * 1996-01-11 1998-09-01 Barnstead/Thermolyne Corporation Method of and apparatus for compensating for load/environment temperature differential-induced measured load weight error
US5924058A (en) * 1997-02-14 1999-07-13 Applied Materials, Inc. Permanently mounted reference sample for a substrate measurement tool
EP0864852B1 (de) * 1997-03-11 2005-06-15 Mettler-Toledo GmbH Elektronische Waage
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
US6023666A (en) * 1998-07-20 2000-02-08 Micron Technology, Inc. In-line method of monitoring die attach material adhesive weight
US6286685B1 (en) * 1999-03-15 2001-09-11 Seh America, Inc. System and method for wafer thickness sorting
GB0016562D0 (en) * 2000-07-05 2000-08-23 Metryx Limited Apparatus and method for investigating semiconductor wafers
US6902647B2 (en) * 2002-08-29 2005-06-07 Asm International N.V. Method of processing substrates with integrated weighing steps
US20050105997A1 (en) * 2003-09-11 2005-05-19 Englhardt Eric A. Methods and apparatus for carriers suitable for use in high-speed/high-acceleration transport systems
DE102004007952B3 (de) * 2004-02-18 2005-09-01 Infineon Technologies Ag Verfahren zum Bestimmen der Tiefe von in einem Trägersubstrat ausgebildeten Vertiefungen
US20060154385A1 (en) * 2005-01-07 2006-07-13 Ravinder Aggarwal Fabrication pathway integrated metrology device
US7740437B2 (en) * 2006-09-22 2010-06-22 Asm International N.V. Processing system with increased cassette storage capacity
GB0719469D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
GB0719460D0 (en) * 2007-10-04 2007-11-14 Metryx Ltd Measurement apparatus and method
GB0804499D0 (en) * 2008-03-11 2008-04-16 Metryx Ltd Measurement apparatus and method
PT2251454E (pt) 2009-05-13 2014-10-01 Sio2 Medical Products Inc Revestimento e inspeção de vaso
US9458536B2 (en) 2009-07-02 2016-10-04 Sio2 Medical Products, Inc. PECVD coating methods for capped syringes, cartridges and other articles
KR101181274B1 (ko) * 2009-12-31 2012-09-11 한국과학기술연구원 플렉서블 기판상의 금속층 두께 측정방법
US11624115B2 (en) 2010-05-12 2023-04-11 Sio2 Medical Products, Inc. Syringe with PECVD lubrication
JP5630093B2 (ja) * 2010-06-24 2014-11-26 株式会社島津製作所 電子天びん
US9878101B2 (en) 2010-11-12 2018-01-30 Sio2 Medical Products, Inc. Cyclic olefin polymer vessels and vessel coating methods
US9272095B2 (en) 2011-04-01 2016-03-01 Sio2 Medical Products, Inc. Vessels, contact surfaces, and coating and inspection apparatus and methods
US9004838B2 (en) * 2011-04-07 2015-04-14 Microtronic, Inc. Apparatus, system, and methods for weighing and positioning wafers
US11116695B2 (en) 2011-11-11 2021-09-14 Sio2 Medical Products, Inc. Blood sample collection tube
CA2855353C (en) 2011-11-11 2021-01-19 Sio2 Medical Products, Inc. Passivation, ph protective or lubricity coating for pharmaceutical package, coating process and apparatus
EP2846755A1 (en) 2012-05-09 2015-03-18 SiO2 Medical Products, Inc. Saccharide protective coating for pharmaceutical package
WO2013170044A1 (en) * 2012-05-09 2013-11-14 Sio2 Medical Products, Inc. Inspection methods for pecvd coatings
US20150297800A1 (en) 2012-07-03 2015-10-22 Sio2 Medical Products, Inc. SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS
US9664626B2 (en) 2012-11-01 2017-05-30 Sio2 Medical Products, Inc. Coating inspection method
WO2014078666A1 (en) 2012-11-16 2014-05-22 Sio2 Medical Products, Inc. Method and apparatus for detecting rapid barrier coating integrity characteristics
US9764093B2 (en) 2012-11-30 2017-09-19 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition
AU2013352436B2 (en) 2012-11-30 2018-10-25 Sio2 Medical Products, Inc. Controlling the uniformity of PECVD deposition on medical syringes, cartridges, and the like
US9354108B2 (en) * 2012-12-05 2016-05-31 Shimadzu Corporation Electronic balance
US9662450B2 (en) 2013-03-01 2017-05-30 Sio2 Medical Products, Inc. Plasma or CVD pre-treatment for lubricated pharmaceutical package, coating process and apparatus
CN105392916B (zh) 2013-03-11 2019-03-08 Sio2医药产品公司 涂布包装材料
US9937099B2 (en) 2013-03-11 2018-04-10 Sio2 Medical Products, Inc. Trilayer coated pharmaceutical packaging with low oxygen transmission rate
EP2971227B1 (en) 2013-03-15 2017-11-15 Si02 Medical Products, Inc. Coating method.
JP6160819B2 (ja) 2013-05-22 2017-07-12 株式会社タニタ 重量測定装置、生体測定装置及び重量測定プログラム
WO2015148471A1 (en) 2014-03-28 2015-10-01 Sio2 Medical Products, Inc. Antistatic coatings for plastic vessels
GB201405926D0 (en) * 2014-04-02 2014-05-14 Metryx Ltd Semiconductor wafer weighing apparatus and methods
US9478408B2 (en) 2014-06-06 2016-10-25 Lam Research Corporation Systems and methods for removing particles from a substrate processing chamber using RF plasma cycling and purging
US10047438B2 (en) 2014-06-10 2018-08-14 Lam Research Corporation Defect control and stability of DC bias in RF plasma-based substrate processing systems using molecular reactive purge gas
US10081869B2 (en) 2014-06-10 2018-09-25 Lam Research Corporation Defect control in RF plasma substrate processing systems using DC bias voltage during movement of substrates
KR102786617B1 (ko) 2015-08-18 2025-03-26 에스아이오2 메디컬 프로덕츠, 엘엘씨 산소 전달률이 낮은, 의약품 및 다른 제품의 포장용기
KR102063322B1 (ko) 2016-05-27 2020-01-08 세메스 주식회사 기판 처리 장치 및 방법
KR20170134094A (ko) * 2016-05-27 2017-12-06 세메스 주식회사 기판 처리 장치 및 방법
GB201815815D0 (en) * 2018-09-28 2018-11-14 Metryx Ltd Method and apparatus for controlling the temperature of a semiconductor wafer
CN109374467B (zh) * 2018-12-29 2024-08-09 无锡威孚环保催化剂有限公司 测定汽车尾气催化剂涂层均匀度的方法
CN113029070B (zh) * 2019-12-25 2023-04-18 中国科学院微电子研究所 一种监测原子层沉积薄膜生长厚度的方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59198325A (ja) * 1983-04-27 1984-11-10 Ishida Scales Mfg Co Ltd 自動零点調整方法
CH667921A5 (de) * 1985-09-18 1988-11-15 Mettler Instrumente Ag Analysenwaage.
US5104276A (en) * 1989-05-19 1992-04-14 Applied Materials, Inc. Robotically loaded epitaxial deposition apparatus

Also Published As

Publication number Publication date
JP2647585B2 (ja) 1997-08-27
KR930010535A (ko) 1993-06-22
US5321634A (en) 1994-06-14
DE4239439A1 (https=) 1993-06-03
JPH05149741A (ja) 1993-06-15
KR960012745B1 (ko) 1996-09-24

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee